JP2000174074A - Method for coating with electronic material adhesive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To completely evaporate and remove an organic solvent included in an adhesive coated film of an adhesive coated plastic base material film by a method wherein, after the adhesive coated plastic base material film is passed through a hot wind drying furnace, after the adhesive coated plastic base material film is passed through a distant infrared rays drying furnace. SOLUTION: A polyimide film 2 is mounted on a feed-out device 1 as a plastic base material film to be an insulation layer. Next, a polyimide system adhesive 6 containing a solvent is applied onto the polyimide film 2 at a uniform thickness by a coating roller 5. Continuously, after the resultant adhesive coated polyimide film 7 is passed through the interior of a hot wind drying furnace 8 and dried, the adhesive coated polyimide film 7 is passed through the interior of a distant infrared rays drying furnace 9 to be completely dried. Thus, it is possible to completely evaporate and remove an organic solvent included in the adhesive coated polyimide film 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for applying an adhesive for electronic materials. More specifically, the present invention relates to a method for applying an electronic material adhesive to electronic component materials such as a TAB tape (tape automated bonding tape) and a BGA tape (ball grid array tape).

[0002]

2. Description of the Related Art TAB tapes, BGA tapes, and the like are widely used as materials for electronic components such as semiconductor devices.

Conventionally, this TAB tape has been manufactured as follows.

Preparation of Plastic Base Film First, a plastic base film to be an insulating layer is prepared.

[0005] Examples of the plastic substrate film include a polyimide film.

A sprocket hole is previously opened in this polyimide film.

Preparation of Adhesive Next, an adhesive containing a solvent is prepared.

As the adhesive, an epoxy resin adhesive, a polyimide resin adhesive, a polyamide resin adhesive, a resin blend adhesive, etc., which are dissolved in a solvent to form a varnish, are used.

Here, the epoxy resin adhesive is produced by dissolving a base epoxy resin and a curing agent in an organic solvent.

The polyimide resin adhesive can be obtained by reacting tetracarboxylic anhydride, aromatic diamine and the like in an organic solvent.

Adhesive coating on polyimide film
Work will be painted adhesive prepared above onto a polyimide film to a uniform thickness.

Drying of adhesive-coated polyimide film
Work then dried by passing hot air drying oven adhesive coating polyimide films obtained in the above.

By this drying operation, the organic solvent in the adhesive applied on the polyimide film evaporates and volatilizes, thereby solidifying the adhesive on the polyimide film.
By solidifying the adhesive, an adhesive-coated polyimide film is obtained.

Copper on polyimide film coated with adhesive
Bonding the foil then bonding the copper foil or lead frame to the adhesive coated surface of the adhesive-coated polyimide film obtained above.

[0015] Copper foil bonded polyimide film
Circuit patterns formed Next, a photoresist to the copper foil side of a copper foil bonded polyimide film obtained in the above.

Next, the surface of the copper foil-bonded polyimide film coated with the photoresist on the copper foil side is exposed through a circuit pattern mask, and then developed and washed to form a circuit pattern.

Production of TAB Tape Next, a backing agent is applied to the copper foil-bonded polyimide film obtained as described above, on which a circuit pattern is formed on the copper foil side, followed by etching, and then stripping the resist. Next, a TAB tape is manufactured by printing a solder resist and then plating a predetermined portion.

[0018]

Now, such a TA
An adverse effect on the electrical properties, mechanical properties and chemical properties of the B tape is the amount of residual organic solvent in the adhesive coating applied on the polyimide film.

The amount of the residual organic solvent in the adhesive film coated on the polyimide film increases as the boiling point of the organic solvent in the adhesive used increases, and the drying temperature in the drying operation of the adhesive-coated polyimide film increases. The lower the, the greater.

In this case, the organic solvent in the adhesive may have a low boiling point. In this case, however, a large amount of the low-boiling organic solvent evaporates from the working adhesive, and as a result, the resin of the adhesive is removed. Minute fluctuations and increased workplace fire danger.

On the other hand, the drying temperature can be increased,
In this case, there are problems such as the thermal deterioration of the polyimide film, the swelling of the adhesive coating film, and the like, the increase in the thickness of the heat insulating material of the drying oven, and the decrease in the thermal efficiency.

The present invention has been made in view of such a point, and an object of the present invention is to solve the above-mentioned disadvantages of the prior art and to provide an adhesive for a plastic substrate film coated with an adhesive containing a solvent. An object of the present invention is to provide a method for applying an adhesive for electronic materials, which can completely evaporate and remove an organic solvent contained in a coating film.

[0023]

The gist of the present invention is that a plastic substrate film coated with an adhesive containing a solvent is passed through a hot-air drying oven to form an adhesive-coated plastic substrate film. And then passing the adhesive-coated plastic substrate film through a far-infrared drying oven.

In the present invention, a polyimide film is preferable as the plastic substrate film from the viewpoint of heat resistance.

That is, in the present invention, first, a polyimide film coated with an adhesive containing a solvent is passed through a hot-air drying device to evaporate and volatilize most of the organic solvent. There is provided a method for applying an adhesive for electronic materials, characterized by completely evaporating and volatilizing the remaining trace amount of organic solvent by passing the same.

[0026]

Next, an embodiment of a method for applying an adhesive for electronic materials according to the present invention will be described.

In the present invention, any commercially available hot air drying device may be used as long as it is commercially available.

In the present invention, the far-infrared ray drying device may be any commercially available one, and may be, for example, an explosion-proof far-infrared ray drying device or a non-explosion-proof far-infrared ray drying device. The non-explosion-proof far-infrared drying device may be used because most of the organic solvent in the adhesive coating film is evaporated and volatilized by the first drying operation by the hot air drying device, so that no explosion occurs.

Moreover, the far-infrared ray drying device requires less power consumption than the hot-air drying device and transmits heat to the inside of the adhesive coating film, so that the organic solvent can be efficiently evaporated and volatilized. .

[0030]

Next, an embodiment of a method for applying an adhesive for electronic materials according to the present invention will be described with reference to the drawings.

FIG. 1 is an explanatory front view showing an embodiment of a method for applying an adhesive for electronic materials according to the present invention.

In FIG. 1, 1 is a feeding device, 2 is a polyimide film, 3 is a guide pulley, 4 is an adhesive coating tank, 5 is a coating roller, 6 is a varnish-like polyimide adhesive containing a solvent, and 7 is an adhesive. 8 is a hot-air drying oven, 9 is a far-infrared drying oven, 10 is an adhesive-coated polyimide film, and 11 is a winding device.

Preparation of Plastic Base Film First, a polyimide film was prepared as a plastic base film to be an insulating layer. A sprocket hole was previously opened in this polyimide film.

The polyimide film 2 thus prepared
Is attached to the sending device 1.

Preparation of Adhesive Next, a polyimide adhesive obtained by reacting an acid component and a polyamine component in N-methylpyrrolidone as an adhesive containing a solvent was prepared.

The polyimide adhesive 6 was put in the adhesive coating tank 4.

Adhesive coating on polyimide film
Work was then painted a uniform thickness by painting roller 5 a polyimide adhesive 6 onto the polyimide film 2 was prepared prepared by the above.

Hot air of adhesive-coated polyimide film
Wherein drying oven drying operations Next, the adhesive coated polyimide film 7 obtained above was dried by passing through a hot air drying oven 8.

Here, the boiling point of the organic solvent N-methylpyrrolidone in the polyimide adhesive is 252 ° C. Therefore, the temperature of the hot-air drying furnace was set to 200 to 300 ° C. Here, if the temperature becomes 300 ° C. or more, measures such as increasing the thickness of the heat insulating layer are required, and the heat dissipation increases, and the heating efficiency decreases.

By this drying operation, most of the organic solvent in the adhesive coating film coated on the polyimide film was evaporated.
It volatilized, thereby solidifying the adhesive on the polyimide film.

Far Infrared of Adhesive Coated Polyimide Film
External drying oven drying operations were then completely dried by passing a far-infrared drying oven 9 adhesive coating polyimide film 7 obtained above.

In the case of the far-infrared drying oven 9, since the heating can be performed in a spot manner, the power consumption can be reduced to about one tenth of that of the hot air type, and most of the solvent is removed in the preceding stage. Therefore, there is no need to use an explosion-proof structure, and the residual solvent can be completely removed.

As a result, an adhesive-coated polyimide film 10 having no residual organic solvent in the adhesive coating film was obtained.

Winding of the adhesive-coated polyimide film The adhesive-coated polyimide film 10 completely dried as described above is wound by a winding device 11.

The adhesive-coated polyimide film 10 having no residual organic solvent in the thus obtained adhesive coating film.
Is processed as a TAB tape.

To process as TAB tape, first,
A copper foil or a lead frame is attached to the adhesive applied surface side, and then a sprocket hole is provided. This sprocket hole is omitted when it is formed before the application of the adhesive as described above.

Next, a circuit pattern is formed on the copper foil by applying, exposing and developing a photoresist.

Next, a TAB tape is manufactured through steps such as application of a backing agent, etching, resist stripping, solder resist printing, and plating.

In one embodiment of the method of applying the adhesive for electronic materials of the present invention, a TAB tape has been described. However, the present invention can also be applied to a BGA tape, a LOC tape and the like.

[0050]

According to the method of applying the adhesive for electronic materials of the present invention, the organic solvent contained in the adhesive coating of the polyimide film coated with the adhesive containing the solvent is completely evaporated and removed. Can be used, so that TAB tape, B
Electrical properties, mechanical properties and chemical properties of GA tapes, LOC tapes and the like can be remarkably improved.

Further, according to the method for applying an adhesive for electronic materials of the present invention, the effect of reducing power consumption in the drying operation and suppressing an increase in the drying temperature is great.

[Brief description of the drawings]

FIG. 1 is an explanatory front view showing one embodiment of a method for applying an adhesive for electronic materials of the present invention.

[Explanation of symbols]

 Reference Signs List 1 delivery device 2 polyimide film 3 guide pulley 4 adhesive coating tank 5 coating roller 6 polyimide-based adhesive 7 adhesive-coated polyimide film 8 hot-air drying oven 9 far-infrared drying oven 10 adhesive-coated polyimide film 11 winding device

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Masahiro Okabe 5-1-1, Hidaka-cho, Hitachi City, Ibaraki Prefecture F-term in Power Systems Research Laboratory, Hitachi Cable, Ltd. 5F044 MM03 MM06 MM11 MM48

Claims (2)

[Claims] 1. A plastic substrate film coated with an adhesive containing a solvent is passed through a hot-air drying oven to form an adhesive-coated plastic substrate film. A method for applying an adhesive for electronic materials, wherein the method is passed through an infrared drying oven. 2. The method according to claim 1, wherein the plastic substrate film used is a polyimide film.