JP2000171629A - Color filter and its manufacture, liquid crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly put ink in opening parts and besides to prevent mixing of ink colors between adjacent opening parts in manufacture of a color filter in which a light shielding layer made of resin is formed on a transparent substrate and ink is provided in their opening parts to form colored parts. SOLUTION: The method for manufacturing the color filter comprises forming a photocatalyst semiconductor material layer 2 on a transparent substrate 1, forming a light shielding layer 3 thereon, optically pumping the photocatalyst semiconductor material layer 2 with UV rays irradiation so as to make the surface energy of the photocatalyst semiconductor material layer 2 drastically larger than the surface energy of the light shielding layer 3 and to increase its wettability toward ink 4, subsequently putting the ink 4 quickly in the opening parts by providing the ink 4 in the opening parts of the light shielding layer 3, and forming uniform colored parts 5 in the opening parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color filter constituting a liquid crystal element for color display used for a display of a color television or a personal computer, etc. The present invention relates to a liquid crystal element formed using a color filter.

[0002]

2. Description of the Related Art In recent years, the development of personal computers,
In particular, with the development of portable personal computers, acceptance of liquid crystal displays, especially color liquid crystal displays, has been increasing. However, significant cost reduction is required for further widespread use, and in particular, cost reduction of a color filter having a high specific gravity is required.

As a method of manufacturing a color filter at low cost, a light-shielding black matrix is formed on a glass substrate, ink is ejected to an opening of the black matrix using an ink jet recording apparatus, and the ink is cured. There has been proposed a method of forming a colored portion by using the method. In this manufacturing method, in order to make the ink fit in the opening of the black matrix favorably, a material that is hardly wetted by the ink and easily repells the ink is studied as a material of the black matrix.

For example, Japanese Patent Application Laid-Open No. 7-35917 proposes a method of forming a black matrix using a material having a contact angle of 20 ° or more with ink. Japanese Patent Application Laid-Open No. 7-35915 proposes a material having a contact angle of 40 ° or more with water as a black matrix material. Further, Japanese Unexamined Patent Publication No.
No. 47637 discloses that the critical surface tension of each material is defined as substrate surface>ink> black matrix surface,
Black matrix surface <35 dyne / cm, substrate surface ≧ 35 dyne / cm, ink 5 dyne from both
/ Cm has been proposed to have a difference of not less than / cm. In these proposals, it is proposed that a material of the black matrix contains a fluorine compound or a silicon compound in order to impart water repellency.

Japanese Patent Application Laid-Open No. HEI 4-121702 proposes a method in which a bank having an affinity for a substrate opposite to that of a substrate is formed, and ink is injected into the gap between the banks. Absent.

[0006]

However, when a fluorine compound or a silicon compound as a water repellent is mixed with the material of the black matrix as described above, post-baking, which is the final step for forming a black matrix pattern, is performed. At this time, the water repellent in the black matrix material is volatilized and thinly adheres to the surface of the glass substrate exposed at the opening of the black matrix. Therefore, the glass substrate surface becomes water-repellent, and there is a problem that the ink does not adhere well to the glass substrate surface when the ink is applied to the opening.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a color filter in which a colored portion is formed by applying ink to an opening of a black matrix. Is to produce a high-contrast color filter free of defects such as ink repellency, containing ink effectively, forming a uniform colored portion, and having no defects or unevenness. To provide a liquid crystal element having excellent color display characteristics at a low cost.

[0008]

A first aspect of the present invention is a light-shielding layer having an opening on a transparent substrate and made of a black resin composition, and a photocatalytic semiconductor on at least the transparent substrate exposed at the opening of the light-shielding layer. Providing a material layer, photo-exciting the photocatalytic semiconductor material layer in the opening of the light-shielding layer to make the surface energy of the photocatalytic material layer higher than the surface energy of the light-shielding layer, and Apply ink,
Curing the ink to form a colored portion.

In the production of a color filter, R (red), G (green), and B (blue) inks are applied to openings of a light-shielding layer (black matrix, black stripe), and the ink is cured to form a colored portion. In order to prevent the ink from climbing over the light-shielding layer and causing color mixing with the ink applied to the adjacent opening, the light-shielding layer is made of a material that is hardly wetted by the ink, that is, the surface energy is reduced. It is necessary to be smaller than the surface energy of the ink. On the other hand, in order for the ink to spread sufficiently in the opening of the light-shielding layer and obtain a color filter with good contrast, the surface of the substrate exposed to the opening must be sufficiently wettable with the ink, that is, the surface energy of the substrate surface Needs to be larger than the surface energy of the ink. Therefore, it is necessary that the ink wettability has a certain difference between the light-shielding layer and the substrate exposed at the light-shielding layer opening. Also,
The wettability can be represented by surface energy or contact angle with water.

In the present invention, even if the difference in surface energy between the light-shielding layer and the substrate is reduced by the step of heating the resin composition at a high temperature such as post baking when forming the light-shielding layer, By providing a photocatalytic semiconductor material layer and photoexciting only the photocatalytic semiconductor material layer located at the opening of the light-shielding layer, the contact angle with respect to the ink at the bottom of the opening is reduced, and the ink at the bottom of the light-shielding layer and the ink at the bottom of the opening are reduced. Even if the contrast of the contact angle becomes very large, for example, even if the ink ejected by the ink jet recording device lands on the light-shielding layer, the ink is drawn into the opening having a large surface energy, and spreads uniformly in the opening,
Uniform colored portions without color unevenness can be formed.

In the method of manufacturing a color filter according to the present invention, as a specific means for providing a photocatalytic semiconductor material layer at the bottom of the opening of the light-shielding layer so that the surface energy of the bottom is higher than the surface energy of the light-shielding layer. First,
After forming a light-blocking layer having an opening on a transparent substrate, a photocatalytic semiconductor material layer is provided only in the opening of the light-blocking layer, and light is excited by exposure from at least one of the front side and the back side of the photocatalytic semiconductor material layer. The surface energy of the photocatalytic semiconductor material layer is higher than the surface energy of the light-shielding layer. Second, after forming a light-shielding layer having an opening on a transparent substrate, a photocatalytic semiconductor material layer is provided on the entire surface of the substrate. By exposing from the back side of the photocatalytic semiconductor material layer, only the photocatalytic semiconductor material layer at the opening of the light-shielding layer is photoexcited to make the surface energy of the photocatalytic semiconductor material layer higher than the surface energy of the light-shielding layer. Third, after forming a photocatalytic semiconductor material layer on a transparent substrate and forming a light-shielding layer having an opening thereon, from the front side and the back side of the photocatalytic semiconductor material layer, By light, higher than the surface energy of the light shielding layer of the surface energy of the photocatalyst semiconductor material layer by photoexcitation of the photocatalyst semiconductor material layer, a method is preferably used.

In the method of manufacturing a color filter according to the present invention, as a means for applying ink to the opening of the light shielding layer, an ink jet method is preferably applied.

Further, the present invention is a color filter comprising a transparent substrate, a light-shielding layer having an opening on the transparent substrate, and a colored portion formed in the opening of the light-shielding layer. A color filter manufactured by the method for manufacturing a color filter of the present invention, and a liquid crystal sandwiched between a pair of substrates, and one of the substrates is configured using the color filter of the present invention. And a liquid crystal element characterized by the following.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a process chart of a preferred embodiment of a method for manufacturing a color filter of the present invention. (A) to (f) in the figure are schematic sectional views respectively corresponding to the following steps (a) to (f). Hereinafter, each step will be described.

Step (a) A photocatalytic semiconductor material layer 2 is formed on a transparent substrate 1. The photocatalytic semiconductor material used in the present invention is disclosed in
As disclosed in -57912, specifically, anatase-type titanium oxide, rutile-type titanium oxide, zinc oxide, strontium titanate, tin oxide, bismuth oxide, and anatase titanium oxide is particularly preferable. Used. As a method for forming the photocatalytic semiconductor material layer, the photocatalytic semiconductor material may be directly formed on the transparent substrate 1 or particles of the photocatalytic semiconductor material may be mixed with a binder component such as a resin to form a coating. Examples of the binder component at this time include a silicone resin, an acrylic resin, an epoxy resin, polycarbonate, polystyrene, and a linear olefin resin. The application method is appropriately selected from a spin coater, a slit coater, a spray method and the like. Further, the thickness of the photocatalytic semiconductor material layer is preferably 0.02 to 2.0 μm.
m.

As the transparent substrate 1 used in the present invention, a glass substrate is usually used, but a plastic substrate or the like may be used as long as necessary characteristics such as transparency and mechanical strength as a color filter are satisfied. Further, a thin film for improving adhesion to a light-shielding layer or a photocatalytic semiconductor material layer may be formed on the surface.

Step (b) A light-shielding layer 3 having an opening is formed on the photocatalytic semiconductor material layer 2 using a black resin composition. This light shielding layer 3
Usually, it is called a black matrix or a black stripe.

In the present invention, the black resin composition forming the light shielding layer 3 may be either photosensitive or non-photosensitive. As a photosensitive black resin composition, if a black pigment or dye is mixed with a normal negative photoresist, as long as it does not hinder the subsequent steps and reliability,
If necessary, additives such as a surfactant may be added.
When the composition is applied to a transparent substrate, it is dispersed in an appropriate solvent.

As the above black pigment, carbon black, black organic pigment and the like are used.

The negative photoresist can be appropriately selected from UV resist, DEEP-UV resist, ultraviolet curable resin and the like. Examples of the UV resist include negative resists such as a cyclized polyisoprene-aromatic bis azide-based resist and a phenol resin-aromatic azide compound-based resist. Also, D
Examples of the EEP-UV resist include polyvinylphenol-3,3'-diazidophenylsulfone and polyglycidyl methacrylate.

A commercially available black resist can also be preferably used. For example, "V2" manufactured by Nippon Steel Chemical Co., Ltd.
59-BK739P ", Tokyo Ohka Kogyo Co., Ltd." CFP
R-BK-416 "and" CK-S171X "manufactured by Fuji Film Orin Co., Ltd. are preferably used.

When the above-described photosensitive black resin composition is used, the resin composition is coated on the transparent substrate 1 by using a spin coater, a die coater, a dip coater, or the like so as to have a required thickness. I do. In the present invention, the thickness of the light shielding layer 3 is preferably about 1 μm. The resin composition layer formed by application is prebaked using a hot plate or the like, and temporarily cured, and is exposed using an exposure machine having a wavelength matching the sensitivity of the material and a mask having a predetermined pattern. After exposure, development, and rinsing, post-baking is performed to fully cure.

The non-photosensitive black resin composition capable of forming the light-shielding layer 3 includes, for example, resin components such as polyimide, acrylic acid monomer, and urethane acrylate, and the same black pigment as the above-mentioned photosensitive resin composition. A dye or dye containing various additives as necessary is dissolved or dispersed in an appropriate solvent before use. When using such a non-photosensitive resin composition, after forming a coating film by applying the non-photosensitive resin composition on a transparent substrate in the same manner as when using the above-described photosensitive resin composition, The coating can be etched using a photoresist as a mask to form a pattern. Alternatively, a pattern may be formed by lift-off using a photoresist.

Step (c) The photocatalytic semiconductor material layer 2 is photo-excited by exposing from both sides of the substrate so that the surface energy becomes higher than that of the light shielding layer 3.

Step (d) R (red), G (green), and B (blue) inks 4 are applied to the openings of the light shielding layer 3. As a method of applying ink, a general printing method such as offset printing, gravure printing, or screen printing can be used.However, according to a printing method using an inkjet recording apparatus, since a plate is not used, the ink liquid is not used. Manipulating the droplets is preferable in that high-precision patterning becomes possible. The ink used here is the light shielding layer 2
A material which is easy to be repelled on the upper surface and easily wetted on the side surface of the opening and the surface of the transparent substrate 1 is appropriately selected and used.

Such an ink may be either a dye-based ink or a pigment-based ink. The solvent may contain pure water (ion-exchanged water) as a main component and may contain a hydrophilic organic solvent or the like.
Examples of the dye used include, for example, C.I. I. Acid Red 18, C.I. I. Acid Red 254, C.I. I. Acid Green 25, C.I. I. Acid blue 13,
C. I. Acid Blue 185, C.I. I. Acid Blue 7 and the like, but are not limited thereto. Examples of the pigment used include, for example, C.I. I.
Pigment Red 177, C.I. I. Pigment Red 5, C.I. I. Pigment Red 12, C.I. I. Pigment Green 36, C.I. I. Pigment Blue 209,
C. I. Pigment Blue 16 and the like, but are not limited thereto. The above-mentioned dye or pigment contained in the inkjet ink is preferably used in a proportion of about 0.1 to 20% by weight in the ink, but is not limited thereto.

Examples of the hydrophilic organic solvent include alkyl alcohols having 1 to 4 carbon atoms such as methyl alcohol and ethyl alcohol; amides such as dimethylformamide and dimethylacetamide; ketones such as acetone and diacetone alcohol; Keto alcohols; ethers such as tetrahydrofuran and dioxane; polyalkylene glycols such as polyethylene glycol and polypropylene glycol; alkylene groups such as ethylene glycol, propylene glycol, butylene glycol, thiodiglycol and diethylene glycol having 2 to 6 carbon atoms Alkylene glycols containing; glycerin; ethylene glycol monomethyl (or ethyl) ether;
Lower alkyl ethers of polyhydric alcohols such as diethylene glycol monomethyl (or ethyl) ether and triethylene glycol monomethyl (or ethyl) ether; N-methyl-2-pyrrolidone, 2-pyrrolidone;
Examples include, but are not limited to, 1,3-dimethyl-2-imidazolidinone.

Further, these inks may contain monomers or oligomers such as polyester acrylate, epoxy acrylate and urethane acrylate as binder components. In addition, by lowering the surface energy by adding a surfactant internally, it is possible to improve the leakage to the black matrix.
In this case, the surfactant used is not particularly limited as long as it does not adversely affect the ink. For example, fatty acid salts, higher alcohol sulfates, liquid fatty oil sulfates, anionic surfactants such as alkyl allyl sulfonates, polyoxyethylene alkyl ethers, polyoxyethylene alkyl esters, polyoxyethylene sorbitan alkyl There are nonionic surfactants such as esters, acetylene alcohol, acetylene glycol and the like, and one or more of them can be appropriately selected and used, but particularly limited to these. is not.
The surface energy (surface tension) is usually 30 to 70
dyne / cm.

Further, as the ink jet recording apparatus, a bubble jet type using an electrothermal converter or a piezo jet type using a piezoelectric element can be used as an energy generating element. Can be set.

Step (e) If necessary, a treatment such as drying and heat curing is performed, and the ink 4 is cured to form the colored portion 5.

Step (f) If necessary, a protective layer 6 is formed. As the protective layer 6,
A photo-curing type, thermo-setting type or photo-heating type resin layer, an inorganic film formed by vapor deposition, sputtering or the like can be used. Any material that can withstand the alignment film forming process or the like can be used.

It is sufficient that the photocatalytic semiconductor material layer 2 is formed only in the opening of the light-shielding layer 3. As shown in FIG. 2, the light-shielding layer 3 is formed, and the photocatalytic semiconductor material layer is formed only in the opening. 2 and exposure may be performed from both sides of the substrate. However, as in the above-described embodiment, forming the light-shielding layer 3 on the photocatalytic semiconductor material layer 2 facilitates the process of forming each layer. Further, as shown in FIG. 3, the photocatalytic semiconductor material layer 2 is formed on the entire surface on which the light-shielding layer 3 is formed, and the light-shielding layer 3 is formed by exposing only the back surface of the substrate.
Only the photocatalytic semiconductor material layer 2 in the opening can be photo-excited to increase the surface energy only in the opening. However, in the embodiment of FIG. 3, since exposure is performed from only one side, it is better to expose from both sides as shown in FIG. 1 or FIG.
It is desirable to effectively excite the photocatalytic semiconductor material layer 2 with light. In the steps of FIGS. 1 and 2, exposure may be performed from one of the front side and the back side.

Next, a liquid crystal device constituted by using the color filter of the present invention will be described. FIG. 4 is a schematic sectional view of an embodiment of an active matrix type liquid crystal element incorporating the color filter formed in the step of FIG. In FIG. 4, 12 is a common electrode, 13 is an alignment film, 15 is a substrate,
17 is a pixel electrode, 18 is an alignment film, 14 is a liquid crystal compound, 1
Reference numeral 9 denotes backlight, and reference numeral 20 denotes emitted light. The same members as those in FIG. 1 are denoted by the same reference numerals.

A liquid crystal element for color display is generally formed by fitting a color filter side substrate (1) and a TFT substrate (15) and enclosing a liquid crystal compound 14. A TFT (not shown) is provided inside one substrate of the liquid crystal element.
And transparent pixel electrodes 17 are formed in a matrix. A color filter layer is provided inside the other substrate 1 so that the R, G, and B colored portions 5 are arranged at positions facing the pixel electrodes 17, and a transparent common electrode 1 is formed thereon.
2 are formed on one side. Further, alignment films 13 and 18 are formed in the planes of both substrates, and by subjecting them to rubbing treatment, liquid crystal molecules can be arranged in a certain direction.

A polarizing plate (not shown) is bonded to the outside of each of the substrates 1 and 15, and a combination of a fluorescent lamp (not shown) and a scattering plate (not shown) is generally used as a backlight, and the liquid crystal compound is backed up. Display is performed by functioning as an optical shutter that changes the transmittance of the light 19.

The liquid crystal element is of a transmissive type. However, a reflective material may be used for the pixel electrode 17 and the substrate 15 or a reflective layer may be separately provided on the substrate 15 side. It is also possible to construct the polarizing plate, in which case the polarizing plate is used only on the observer side.

In the liquid crystal device of the present invention, it is only necessary to use the color filter of the present invention. For the other components, the techniques of the conventional liquid crystal device such as the material and manufacturing method can be applied. It is possible.

[0038]

(Example 1) A black resist ("V259-BK" manufactured by Nippon Steel Chemical Co., Ltd.) was formed on an alkali-free glass substrate.
739P ") layer was formed and patterned to form a black matrix. On this substrate, a photocatalytic semiconductor material layer was formed using a silicone resin. Specifically, an anatase type titanium oxide sol ("TA-1" manufactured by Nissan Chemical Industries, Ltd.)
5)) A mixed solution obtained by mixing 56 parts by weight of silica sol ("Glaska A solution" manufactured by Nippon Synthetic Rubber Co., Ltd.) and trimethoxysilane ("Glaska B solution" manufactured by Japan Synthetic Rubber Co., Ltd.) at a weight ratio of 3: 1. 33 parts by weight, and 11 parts by weight of the above trimethoxysilane were further added to prepare a titanium oxide-containing silicone coating composition. After spin-coating this composition on a substrate, it was cured at a temperature of 150 ° C. to obtain a 0.1 μm-thick photocatalytic semiconductor material layer composed of anatase-type titanium oxide particles and a silicone resin.

Next, from the back surface of the substrate, 15 mW / cm ² was obtained using eight light sources of 20 W ultraviolet light source (manufactured by Mitsui Electric Co., Ltd., black light blue (BLB) fluorescent lamp).
For 10 minutes. When the contact angle with water was measured after the exposure, the surface of the photocatalytic semiconductor material layer at the opening of the black matrix was 6 ° and the angle on the black matrix was 48 °.

Using an ink jet recording apparatus, R, having the following composition,
G and B inks were applied.

(Ink Composition) Dye 5 parts by weight R: C.I. I. Acid Red 118 G: C.I. I. Acid Green 25 B: C.I. I. Acid Blue 113 Ethylene glycol 10 parts by weight Isopropyl alcohol 3 parts by weight Hydroxypropylcellulose 10 parts by weight (solid content) (Nippon Soda Co., Ltd. "HDC-L") 72 parts by weight ion exchange water

As a result, the ink that has landed over the black matrix and across the opening is instantaneously drawn into the opening, and is cured by heating the ink in an atmosphere furnace at 220 ° C. for 60 minutes. A good color filter without color unevenness such as color mixing or white spots was obtained.

Example 2 Titanium oxide was formed on an alkali-free glass substrate by sputtering to a thickness of 0.15 μm, and the substrate was heated to 500 ° C. in an air atmosphere, left for 60 minutes, and then cooled. Thus, an anatase type titanium oxide layer was obtained.

A black resist ("CFPR-BK-416" manufactured by Tokyo Ohka Kogyo Co., Ltd.) layer was formed on the above substrate and patterned to obtain a black matrix. The contact angle of this substrate with water was 8 on the black matrix.
0 °, and the surface of the titanium oxide layer exposed at the black matrix opening was 45 °.

Then, 15 m from the back surface as in Example 1.
Exposure was performed for 10 minutes with an ultraviolet illuminance of W / cm ^{2, and} the contact angle with water was measured again. As a result, the angle was 80 ° on the black matrix and 6 ° on the titanium oxide layer surface.

The same R, G, and B inks as in Example 1 were applied to the openings of the black matrix of the substrate using an ink jet recording apparatus. As a result, ink that has landed over the black matrix and across the opening is instantly drawn into the opening, and is heated and cured, so that there is no color unevenness such as color mixing or white spots. was gotten.

Example 3 The composition for titanium oxide-containing silicone coating used in Example 1 was spray-coated on an alkali-free glass substrate and cured to form a photocatalytic semiconductor material layer having a thickness of 0.1 μm. did. Next, a black resist (“CK-S171” manufactured by Fuji Film Orin Co., Ltd.)
X ") layer was formed and patterned to form a black matrix. The contact angle of the substrate to water was 75 ° on the black matrix, and 40 ° for the photocatalytic semiconductor material layer exposed at the opening of the black matrix.

Next, using the same light source as in the first embodiment,
Exposure was performed for 5 minutes from the surface of the photocatalytic semiconductor material layer at an ultraviolet illuminance of 5 mW / cm ² . When the contact angle to water after exposure was measured, the photocatalytic semiconductor material layer was 4 °,
70 ° on the black matrix.

The same R, G, and B inks as in Example 1 were applied to the openings of the black matrix of the substrate using an ink jet recording apparatus. As a result, ink that has landed over the black matrix and across the opening is instantly drawn into the opening, and is heated and cured, so that there is no color unevenness such as color mixing or white spots. was gotten.

(Comparative Example 1) The same R, G, and B as in Example 1 were formed in the openings of the black matrix of the substrate obtained in the same manner as in Example 2 except that no ultraviolet irradiation was performed, using an ink jet recording apparatus. Of each ink was applied. As a result, the ink that landed on the black matrix and across the opening remained on the black matrix without being drawn into the opening and mixed with the ink that landed on the adjacent opening. In other openings, the ink was repelled in the openings, resulting in white spots.

(Comparative Example 2) The same R, G, and B as in Example 1 were formed in the openings of the black matrix of the substrate obtained in the same manner as in Example 3 except that no ultraviolet irradiation was performed, using an ink jet recording apparatus. Of each ink was applied. As a result, the ink that landed on the black matrix and across the opening remained on the black matrix without being drawn into the opening and mixed with the ink that landed on the adjacent opening. In other openings, the ink was repelled in the openings, resulting in white spots.

Comparative Example 3 A black resist (“V259-BK73” manufactured by Nippon Steel Chemical Co., Ltd.) was formed on a transparent glass substrate.
9P ") layer was formed and patterned to form a black matrix. The contact angle of the substrate to water was 80 ° on the black matrix and 38 ° on the glass substrate exposed in the opening of the black matrix.

The same R, G, and B inks as in Example 1 were applied to the openings of the black matrix of the substrate using an ink jet recording apparatus. As a result, the ink that has landed over the black matrix and across the opening is drawn into the opening, but its speed is slow, so that the ink is applied to the adjacent opening before the ink dries, Color mixing of ink occurred between adjacent openings. In addition, ink was repelled in the other openings, resulting in white spots.

[0054]

According to the present invention, in the production of a color filter in which ink is applied to the openings of the black matrix and cured, ink in the openings is not repelled, and the ink that has landed on the black matrix is removed from the openings. , It is possible to form a uniform colored portion in each opening, it is possible to produce a high-contrast color filter without defects such as color mixing, white spots, and color unevenness with good yield, Using the color filter, a liquid crystal element having excellent color display characteristics can be provided at low cost.

[Brief description of the drawings]

FIG. 1 is a process chart of a preferred embodiment of a method for manufacturing a color filter of the present invention.

FIG. 2 is a schematic sectional view showing another embodiment of the method for manufacturing a color filter of the present invention.

FIG. 3 is a schematic sectional view showing another embodiment of the method for manufacturing a color filter of the present invention.

FIG. 4 is a schematic cross-sectional view of one embodiment of the liquid crystal element of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transparent substrate 2 Photocatalytic semiconductor material layer 3 Light shielding layer 4 Ink 5 Colored part 6 Protective layer 12 Common electrode 13 Alignment film 15 Substrate 17 Pixel electrode 18 Alignment film 19 Incident light 20 Outgoing light

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H048 BA00 BA64 BB02 BB14 BB23 BB44 2H091 FA02Y FA34Y FB02 FB06 FB12 FB13 FC12 FC22 FC23 FC25 GA13 LA12

Claims (7)

[Claims] 1. A light-shielding layer having an opening on a transparent substrate and made of a black resin composition; a step of providing a photocatalytic semiconductor material layer on at least the transparent substrate exposed at the opening of the light-shielding layer; Photo-exciting the photocatalytic semiconductor material layer in the opening to raise the surface energy of the photocatalytic semiconductor material layer higher than the surface energy of the light-shielding layer; and applying ink to the opening of the light-shielding layer and curing the ink. Forming a colored portion by forming the colored portion. 2. After forming a light-shielding layer having an opening on a transparent substrate, a photocatalytic semiconductor material layer is provided only on the opening of the light-shielding layer, and at least one of the front side and the back side of the photocatalytic semiconductor material layer is provided. The method for producing a color filter according to claim 1, wherein the surface energy of the photocatalytic semiconductor material layer is made higher than the surface energy of the light-shielding layer by exposing and photoexciting. 3. After forming a light-shielding layer having an opening on a transparent substrate, a photocatalytic semiconductor material layer is provided on the entire surface of the substrate, and exposure is performed from the back side of the photocatalytic semiconductor material layer.
The method for manufacturing a color filter according to claim 1, wherein only the photocatalytic semiconductor material layer at the opening of the light-shielding layer is photoexcited to make the surface energy of the photocatalytic semiconductor material layer higher than the surface energy of the light-shielding layer. 4. A photocatalyst semiconductor material layer is formed on a transparent substrate, a light-shielding layer having an opening is formed thereon, and then the photocatalyst semiconductor material layer is exposed from the front side and the back side to form the photocatalyst semiconductor material layer. 2. The method for producing a color filter according to claim 1, wherein the semiconductor material layer is photoexcited to make the surface energy of the photocatalytic semiconductor material layer higher than the surface energy of the light-shielding layer. 5. The method for producing a color filter according to claim 1, wherein the means for applying ink to the opening of the light-shielding layer is an ink-jet method. 6. A color filter comprising: a transparent substrate; a light-shielding layer having an opening on the transparent substrate; and a colored portion formed in the opening of the light-shielding layer. A color filter manufactured by any one of the color filter manufacturing methods described above. 7. A liquid crystal element comprising a pair of substrates sandwiching liquid crystal, and one of the substrates is formed using the color filter according to claim 6. Description: