JP2000164448A - Chip type electronic parts and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the soldering strength of chip type electronic parts when the parts are soldered to a circuit board and, at the same time, to give versatility to the pattern design of the circuit board. SOLUTION: Chip type electronic parts are provided with a part body 12 to which lead terminals are attached in the same direction and an encapsulating case 13 in which the part body 12 is housed and held and which is made of a heat-resistant synthetic resin. The case 13 has a square cross section, and one side face of the case 13 faced oppositely to a circuit board is used as a mounting surface 16. Lead terminals 11 are led out from one end side of the case 13 and the front end sections 11A of the terminals 11 are bent in a prescribed direction so that the sections 11A may follow the surface of the case 13 including the mounting surface 16. A plurality of pairs of dummy terminals 20A and 20B which are faced oppositely to each other in the direction perpendicular to the axial line of the case 13 is provided on the mounting surface 16 at prescribed intervals in the axial direction of the case 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for changing the form of a lead terminal in the same direction to a chip-type electronic part which can be surface-mounted, and more specifically, to improve the soldering strength to a circuit board. In addition, the present invention relates to a chip-type electronic component capable of giving flexibility to a pattern design on a circuit board side.

[0002]

2. Description of the Related Art Lead terminals in the same direction (discrete type) such as an aluminum electrolytic capacitor are mounted on a circuit board such that each lead terminal is inserted into a through hole of the circuit board. ,
It has been considered difficult to mount the surface as it is.

[0003] In recent years, even in such electronic components, in order to enable surface mounting by handling of an automatic machine, a discrete type component main body is housed in a predetermined case to form a chip. The applicant also filed an application earlier, for example, in Japanese Patent Application No. 8-192929 (Japanese Unexamined Patent Application Publication No.
No. 22159) makes a similar proposal.

[0004] The outline of this is as follows. An outer case having a rectangular cross section made of a heat-resistant synthetic resin is prepared, and a discrete-type capacitor body is housed in the outer case. Then, each lead terminal pulled out from one end thereof is bent in a predetermined direction along a plane including one side surface (a mounting surface facing the circuit board) of the outer case.

According to this embodiment, the tip of each lead terminal is placed on a creamy solder applied to a predetermined position on a circuit board, and the whole is heated to melt the solder, thereby performing surface mounting. be able to.

[0006] Further, for example, in the case of a vehicle-mounted electronic device or the like having a lot of vibration, a stronger soldering strength is required for a circuit board. Only dummy terminals for soldering are provided.

[0007]

The dummy terminal is provided on the side of the outer case opposite to the side from which the lead terminals are drawn out, thereby preventing the so-called Manhattan phenomenon in which the side opposite to the lead terminals is lifted up when soldering the lead terminals. However, the following new issues have arisen.

That is, in recent years, it has been increasingly required to further increase the reliability of the mounting strength on a circuit board.
In addition, since there is only one mounting position of the dummy terminal on the side opposite to the lead terminal lead-out side of the exterior case, the pattern design of the circuit board is restricted thereby, and the degree of freedom in design is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and a first object of the present invention is to increase the soldering strength to a circuit board,
It is an object of the present invention to provide a chip-type electronic component capable of giving flexibility to a pattern design of a circuit board.

A second object of the present invention is to provide a method of manufacturing a chip-type electronic component capable of improving the accuracy of assembling a dummy terminal to an outer case.

[0011]

According to the present invention, a first object of the present invention is to provide a component body having a lead terminal in the same direction and an outer case made of a heat-resistant synthetic resin for accommodating the component body therein. The outer case has a rectangular cross section, one side surface of which is a mounting surface facing the circuit board, each of the lead terminals is pulled out from one end side of the outer case, and each of their tips In a chip-type electronic component in which a portion is bent in a predetermined direction so as to be along a plane including the mounting surface, a plurality of pairs of dummy terminals facing the mounting surface along a direction orthogonal to the axis of the outer case, This is achieved by providing the outer case at predetermined intervals in the axial direction.

In this case, each of the dummy terminals comprises an L-shaped body having a first substrate part provided on the mounting surface and a second substrate part provided on a side surface connected to the mounting surface. Preferably, anchor plates embedded in the outer case are continuously provided on both side edges of the first substrate portion.

It is preferable that first notch grooves are formed on both sides of a bending boundary between the first substrate portion and the second substrate portion, and similarly, the first substrate portion and the anchor plate are formed. It is preferable that the second notch grooves are formed on both sides of the folding boundary line. According to this, the bending can be performed more smoothly.

In order to achieve the second object, the manufacturing method of the present invention comprises a step of punching a lead frame having a plurality of pairs of dummy terminals each including an anchor plate from a single metal plate by pressing, A step of bending the anchor plates of the dummy terminals at substantially right angles in the same direction, and disposing the lead frame in a molding die, so that the anchor plate is buried in the resin, and has a component storage hole therein. Molding the outer case in the shape of a circle, separating each of the dummy terminals from the lead frame and bending the same along the side surface of the outer case, and placing the lead terminal in the same direction in the component storage hole of the outer case. Insert the main body, and bend each lead terminal pulled out from one end thereof in a predetermined direction along a plane including the mounting surface of the outer case. It is characterized by carrying out the extent.

According to this manufacturing method, when a plurality of pairs of dummy terminals are provided in the outer case, each dummy terminal is obtained from the lead frame, so that the dummy terminals can be accurately assembled to the outer case.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS The invention will now be described with reference to an embodiment shown in the drawings. In this embodiment, an aluminum electrolytic capacitor is formed as a chip. FIG. 1 is a perspective view, FIG. 2 is a right side view, FIG. 3 is a bottom view, and FIG. 4 is a sectional view taken along line BB of FIG. .

The chip-type electronic component 10 includes a substantially cylindrical capacitor body 12 having a pair of lead terminals 11 extending in the same direction, and an outer case 13 for housing and holding the capacitor body 12. A stopper wall 14 is formed on one end side of 13.

The outer case 13 is formed in a square cylindrical shape having a square cross section provided with a through hole 15 corresponding to the shape and size of the capacitor main body 12, and includes four side surfaces parallel to the axis of the through hole 15. In FIG. 1, a side surface corresponding to a bottom surface is a mounting surface 16 facing a circuit board (not shown). In addition,
The outer case 13 has one end 15A of the through hole 15 closed in a semicircular shape by a stopper wall 14, and is made of synthetic resin having high heat insulation.

The lead terminals 11, 11 drawn from one end 15 A of the through hole 15 are bent so as to sandwich the stopper wall 14 between the lead terminal 11 and the capacitor body 12. Specifically, after the capacitor main body 12 is housed in the outer case 13 so as to abut against the stopper wall 14, the lead terminals 11, 11 are bent in an L shape along the stopper wall 14, and then the lead terminals 11, 11, Are bent in an L shape so as to extend in a direction away from the capacitor body 12 and the outer case 13.

According to the chip-type electronic component 10, a plurality of pairs, 3 in this embodiment, are mounted on the mounting surface 16 of the outer case 13.
A pair of dummy terminals 20 are provided. That is, the pair of dummy terminals 20 includes the dummy terminals 20A and 20B which are arranged to face each other along a direction orthogonal to the axis of the outer case 13. In addition, each dummy terminal 20A,
20B has the same configuration except that it is bilaterally symmetric. Therefore, when the common components are described, they are collectively referred to as dummy terminals 20.

In this embodiment, each pair of the dummy terminals 20 is arranged on the lead terminal lead-out side of the mounting surface 16 of the outer case 13, at the opposite side of the lead terminal lead-out side, and at an intermediate position between them.

Each dummy terminal 20 is formed in an L-shape having a first substrate portion 21 attached to the mounting surface 16 and a second substrate portion 22 attached to a side surface connected to the mounting surface 16. In the present invention, it is attached to the outer case 13 as follows.

First, as shown in FIG. 5, each dummy terminal 20 is a lead frame (also referred to as a hoop material) 3.
Provided as 0. That is, each dummy terminal 20 is
The first substrate part 21 and the second substrate part 22 are integrated,
From one metal plate (for example, a stainless steel plate) to the frame 31
It is punched by a press in a state where it is attached to

At the time of pressing, anchor plates 211 and 211 are continuously provided on both sides of the first substrate portion 21. On both sides of the bending boundary C between the first substrate portion 21 and the second substrate portion 22, first notch grooves 23 are formed to make the bending smoother.
On both sides of the bending boundary line D between the first substrate portion 21 and the anchor plate 211, second notch grooves 24, 24 for making the bending smoother are formed.

After this pressing, the lead frame 3
Copper plating and solder plating are sequentially applied to 0, and then,
As shown in FIG. 6 and FIG. 7 which is an enlarged perspective view of the main part, the anchor plates 211 and 211 are bent at a substantially right angle toward the near side of FIG.

Thereafter, the lead frame 30 is set in a mold (not shown). Then, a heat-resistant synthetic resin is poured into a region surrounded by a two-dot chain line E in FIG. 6, and the outer case 13 is formed.

In this manner, the anchor plates 211 and 211 of each dummy terminal 20 are embedded in the outer case 13, and the first substrate 21 of each dummy terminal 20 is attached to the mounting surface 16 of the outer case 13. Is established.

After molding, the outer case 13 is taken out of the mold, and each dummy terminal 2 is cut along the cutting line F in FIG.
0 is separated from the lead frame 30 and the second substrate 2
2 is bent along the side surface of the outer case 13 from the portion of the bending boundary line C.

In this case, since the anchor plates 211 and 211 bit into the outer case 13 firmly, the second
Even if the substrate part 22 is bent as described above, the subsequent deformation of the dummy terminal 20 is effectively suppressed.

Thereafter, the capacitor body 12 is inserted into the outer case 13, the lead terminals 11, 11 thereof are bent along the stopper wall 14, and the tips 11 A, 11 A of the capacitor terminal 12 are placed on a flat surface including the mounting surface 16. Along this line, in this embodiment, it is bent at a substantially right angle in a direction away from the outer case 13.

According to this manufacturing method, the dummy terminals 20 forming a pair are provided as the lead frame 30, so that their positional relationship does not change. It will be attached to the case 13.

Further, since a plurality of pairs of dummy terminals 20 are provided on the mounting surface 16 of the outer case 13, the use of these dummy terminals 20 increases the soldering strength by a multiple.

On the other hand, even if all the dummy terminals 20 are not used, any one of the dummy terminals 20 can be selected in designing the pattern of the circuit board, so that the degree of freedom in the pattern design can be increased accordingly. become.

It should be noted that the present invention is not limited to the above-described embodiment, and improvements, modifications, and the like within a range in which the present invention can be achieved are included in the present invention. For example, the dummy terminal 20 is fixed at a position straddling the ridge line of the case in the above-described embodiment, but may be fixed at an arbitrary position on a flat surface. The effect that the quality of the soldering of the dummy terminal to the substrate can be easily visually recognized is obtained.

In addition, the main body shown in the above-described embodiment,
The material, shape, dimensions, form, number, location, and the like of the case, the flat surface, the lead terminals, the dummy terminals, and the like are arbitrary and are not limited as long as the present invention can be achieved.

[0036]

As described above, according to the present invention,
By providing a plurality of pairs of dummy terminals on the mounting surface of the outer case, it is possible to further increase the soldering strength with respect to the circuit board and to provide flexibility in the pattern design of the circuit board.

Further, according to the manufacturing method of the present invention, when a plurality of pairs of dummy terminals are provided in the outer case, each dummy terminal is obtained from the lead frame, so that the dummy terminal can be accurately assembled to the outer case. it can.

[Brief description of the drawings]

FIG. 1 is an overall perspective view showing an embodiment of the present invention.

FIG. 2 is a right side view of the embodiment.

FIG. 3 is a bottom view of the embodiment.

FIG. 4 is a sectional view taken along line BB of FIG. 2;

FIG. 5 is a plan view of a lead frame provided with dummy terminals according to the present invention.

FIG. 6 is a plan view showing a state where the anchor plate is bent in the lead frame.

FIG. 7 is an enlarged perspective view of a main part of FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Chip-type electronic component 11 Lead terminal 11A Lead terminal part 12 Capacitor main body 13 Outer case 14 Stopper wall 16 Mounting surface 20 Dummy terminal 21 First substrate part 211 Anchor plate 22 Second substrate part 23, 24 Cut of bending boundary Chip

Claims (5)

[Claims] 1. A component body having a lead terminal in the same direction, and an outer case made of a heat-resistant synthetic resin for housing and holding the component body therein, wherein the outer case has a rectangular cross section. The side surface is a mounting surface facing the circuit board, each of the lead terminals is pulled out from one end side of the outer case, and each of the tip portions is bent in a predetermined direction along a plane including the mounting surface. In the chip-type electronic component, a plurality of pairs of dummy terminals facing each other along a direction orthogonal to the axis of the outer case are provided on the mounting surface at predetermined intervals in the axial direction of the outer case. A chip-type electronic component, characterized in that: 2. Each of the dummy terminals comprises an L-shaped body having a first substrate portion attached to the mounting surface and a second substrate portion attached to a side surface connected to the mounting surface. 2. An anchor plate embedded in the outer case is continuously provided on both side edges of the first substrate portion.
2. The chip-type electronic component according to item 1. 3. The chip-type electronic component according to claim 2, wherein first notch grooves are formed on both sides of a bending boundary between the first substrate portion and the second substrate portion. 4. The chip-type electronic component according to claim 2, wherein a second notch groove is formed on both sides of a bending boundary between the first substrate portion and the anchor plate. 5. A step of punching a lead frame having a plurality of pairs of dummy terminals each including an anchor plate from a single metal plate by pressing, and a step of bending the anchor plates of each of the dummy terminals at substantially right angles in the same direction. And disposing the lead frame in a molding die, and molding a rectangular cylindrical outer case having a component storage hole inside so that the anchor plate is buried in the resin; and Separating each dummy terminal and bending the dummy terminal along the side surface of the outer case; inserting each lead terminal in the same direction as the component body into the component housing hole of the outer case; and each lead terminal pulled out from one end thereof Bending in a predetermined direction along a plane including the mounting surface of the outer case. Method.