JPH10189170A - Metal substrate terminal and its fixing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a metal substrate terminal capable of being formed with an existing molding die even when types are increased by separably connecting multiple blocks each pressed-in with one pin, providing pin guides molded with a resin, cutting and separating the block according to the number of required pins, and integrating the pin guides into a terminal section. SOLUTION: Multiple pins 3 having pin root sections 4 and pin guides 5, 6 each pressed-in with one pin 3 are separably connected to form a terminal section 2 which is the constituting element of a metal substrate terminal 1, and pin guides 7, 8 pressed-in with no pin 3 are connected to the right and left end sections of the pin guide 5. Positioning guide sections 11, 12 which are the other constituting elements of the metal substrate terminal 1 contain fitting section 13a, 14a, 13b, 14b with a terminal section 2, butt faces 15a, 15b for obtaining the combination sizes with the terminal section 2, and positioning lugs 16a, 16b for a metal substrate 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a metal substrate terminal and a method for fixing the same.

[0002]

2. Description of the Related Art Conventionally, this type of metal substrate terminal fixing method is different from a glass epoxy substrate and a ceramic substrate in that a clip terminal cannot be used because the substrate itself is a conductor.
A method of mounting on a surface of a metal substrate has been used, and a positioning protrusion of a terminal is inserted into a positioning hole of the metal substrate to be positioned, fixed and used.

FIG. 4 is a diagram showing an example of a conventional method for fixing a terminal for a metal substrate. The terminal 41 is formed by integrally molding a plurality of pins 43 with a resin 42 having positioning protrusions 45 and 46. The positioning protrusions 45 and 46 are inserted into the holes 22 and 23 of the metal substrate 21 to be positioned. Root 44
Is fixed on the terminal pads 24 of the metal substrate 21 on which the solder paste 25 is printed in advance. In this state, when passing through a reflow furnace, the pin root portion 44 and the terminal pad 24 are soldered with the solder paste 25 and connected.

[0004]

The first problem is that it is necessary to make a terminal mold for each product, and in recent years, since many kinds of small-quantity production are common, the cost of the terminal mold is large. The terminals become expensive.

The reason is that the pins of the terminals and the positioning protrusions are integrally formed by a resin mold.

[0006] The second problem is that if common use of terminals is considered during product development, the design can be restricted, which makes flexible product development difficult.

[0007] The reason is that if the number of terminals is designed differently for each product, it is necessary to make a terminal mold for each product. Because it comes out.

[0008] The object of the present invention is to increase the variety,
An object of the present invention is to provide a metal substrate terminal that can be obtained in an existing mold without causing a new terminal mold, and a method of fixing the terminal.

[0009]

The metal substrate terminal of the present invention has a pin guide formed by resin molding with a plurality of blocks into which pins are press-fitted one by one, which are releasably connected. The pin guide is formed as an integral terminal portion by cutting and separating the block according to the above.

Further, the method for fixing a terminal for a metal substrate according to the present invention comprises:
It has a pin guide formed by resin molding and a plurality of blocks into which pins are press-fitted one by one. The blocks are cut and separated according to the required number of pins, and the pin guide is integrated with a terminal part. No, a positioning guide portion having a positioning protrusion with respect to the metal substrate is provided as a separate body, and the positioning guide portion is fixed to the metal substrate in a state of being fitted into the terminal portion.

Furthermore, another method of fixing a terminal for a metal substrate according to the present invention has a pin guide formed by resin molding and a plurality of blocks into which pins are press-fitted one by one and are detachably connected. In accordance with the above, the block is cut and separated to form the pin guide as an integral terminal portion, and the terminal portion is attached to the metal substrate by using a positioning jig that defines a relative position to a pin existing elsewhere on the same metal substrate. It is fixed.

More specifically, a terminal part (2) including pin guides (5, 6) formed by molding a plurality of blocks into which pins (3 in FIG. 1) into which pins (3 in FIG. 1) are press-fitted are detachably connected. It does not have positioning protrusions with the metal substrate (21), has a shape that can be used by cutting the required number of pins with the pin guides (5, 6), and has positioning protrusions (16a, 16).
The positioning guides (11, 12) having b) are separate from the terminal portion (2), and are provided with the fitting portions (13, 14) for the terminal portion (2) and the abutment surface (1) for obtaining the combined dimensions.
5), is formed as an integral terminal in combination with the terminal portion (2), and can be fixed on the metal substrate (21).

Further, instead of using the positioning guide having the positioning protrusion as described above, a jig (31 in FIG. 3) for positioning the metal substrate (21) relative to other terminals is used. Alternatively, it can be fixed on a metal substrate (21).

According to the metal substrate terminal and the method of fixing the same according to the present invention, the terminal portion which can be formed freely according to the required number of pins and the positioning guide are provided with a projection for forming the fitting portion and the combined dimensions. The terminal pins can be soldered to the pads by assembling them at the contact portions to form an integrated terminal, inserting the positioning protrusions of the positioning guide into the positioning holes of the metal substrate and fixing them.

When the positioning guide is not used, a terminal pin may be fixed on a pad of the metal substrate and soldered by using a jig for positioning relative to another terminal on the metal substrate. it can.

Therefore, a metal substrate terminal can be obtained at low cost without making a mold for each product, and a flexible product can be developed without being limited by the number of terminal pins.

[0017]

Next, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view showing a metal substrate terminal and a method for fixing the same according to the first embodiment.
Is a cross-sectional view at the time of fixing.

Referring to FIG. 1, a terminal portion 2 which is a component of the metal substrate terminal 1 has a pin 3 having a pin base 4.
And a plurality of pin guides 5 and 6 into which each pin 3 is press-fitted, are connected to each other in a separable manner, and the pins 3 are press-fitted into left and right ends of the pin guide 5. Each of the pin guides 7 and 8 is connected one by one. The plurality of pin guides 5 and the pin guides 6 are molded with a resin that withstands solder reflow heat, including the connection portions.

Further, since the end of the connection between the pin guides 5 and 6 is cut, some cutting burrs 9a and 9b are provided. In addition, the pin guides 5 and 6 are arranged in parallel with each other with a predetermined interval therebetween via the pins 3.

On the other hand, the positioning guides 11 and 12, which are the other components of the metal substrate terminal 1, are fitted with the above-mentioned terminal 2 by fitting portions 13a, 14a and 13b, respectively.
14b, abutment surfaces 15a and 15b for determining a combination dimension with the terminal portion 2, positioning protrusions 16a and 16b for determining a relative position with respect to the substrate side, and a contact surface 1 with the metal substrate surface.
7a and 17b. The positioning guides 11 and 12 have the same shape, and the pin guides 5 and 6
Similarly to the above, it is molded with a resin that can withstand solder reflow heat. Further, the fitting portion 13a with the terminal portion 2,
13b, 14a, and 14b have a structure in which the cutting burrs 9a and 9b of the terminal portion 2 escape.

The metal substrate terminal 1 is constructed by combining the terminal portion 2 and the positioning guide portions 11 and 12 as described above, and cuts an arbitrary number of the pin guides 5 and 6 connected to each other. Separately, the terminal portions 2 can be provided according to the required number of pins.

The metal substrate 21 has, in its terminal mounting portion, terminal positioning holes 22 and 23 for inserting the positioning protrusions 16a and 16b of the metal substrate terminal 1, and terminal pads 24 having the same number of terminal pins. I have. A solder paste 25 is printed on the terminal pads 24 in advance.

Next, a method of combining the terminal portion 2 for forming the metal substrate terminal 1 with the positioning guide portions 11 and 12, and a method of mounting and fixing the terminal portion 2 to the metal substrate will be described with reference to FIGS. .

First, a method of assembling the terminal portion 2 for forming the metal substrate terminal 1 and the positioning guide portions 11 and 12 is as follows. The pin guide 7 at the end of the terminal portion 2 is inserted into the fitting portion of the positioning guide portion 11. 13a, and at the same time, the pin guide 6 adjacent to the pin guide 7 is inserted into the fitting portion 14a of the positioning guide portion 11, and the positioning guide portion 11 is inserted into the pin 3 press-fitted into the pin guide 6 adjacent to the pin guide 7. Is pressed to fix the terminal portion 2 to the positioning guide portion 11. Similarly, the opposite side of the terminal portion 2 is also fixed to the positioning guide portion 12, and the metal substrate terminals 1 are combined.

Terminal section 2 and positioning guide sections 11 and 12
Positioning protrusion 16 of metal substrate terminal 1 combined with
When the (16a, 16b) is inserted into the terminal positioning holes 22, 23 of the metal substrate 21, the pin base 4 is
It is fixed in contact with the terminal pad 24 on which the solder paste 25 is printed in advance. In this state, when passing through the reflow furnace, the pin base portion 4 and the terminal pad 24 are soldered with the solder paste 25 and connected. FIG. 2 is a sectional view showing this state.

Next, the effect of the first embodiment of the present invention will be described. In the first embodiment, since the terminals for the metal substrate are divided into the terminal portion and the positioning guide portion, the terminal portion and the positioning guide portion are manufactured by using a single mold to manufacture terminals having different numbers of pins. Can do things. Therefore, there is no need to make a terminal mold for each product,
Terminals can be manufactured and purchased at low cost, and flexible product development that is not restricted by the number of terminal pins becomes possible.

In particular, in recent years when multi-product small-quantity production is expanding, the above-described effects are great.

Further, since the configuration is made up of two pin guides which are arranged in parallel at a distance from each other, the length of the pins can be changed freely, and the height of the pins can be adjusted. You can also plan.

Next, an example corresponding to the first embodiment will be described with reference to the drawings.

Referring to FIG. 1, the terminal portion 2 of the metal substrate terminal 1 is processed so that the tip is easy to insert, and the tip is 2 m.
0.5 m with pin base 4 bent at right angles by m
m (square) x 13.8 mm (length) pins 3, and 21 pin guides 5 and 6 into which the pins 3 are press-fitted and each block is 2.5 mm (square) x 1.3 mm (thickness); The pin guides 5 and 8 are connected to each other so as to be separable from each other, and pin guides 7 and 8 to which the pins 3 are not press-fitted are connected to the right and left ends of the pin guide 5, respectively. The plurality of pin guides 5 and 6 are molded with a PPS resin that withstands solder reflow heat, including the connection portions. Further, the ends of the connection of the pin guides 5 and 6 are provided with some cutting burrs 9a and 9b by cutting. The pin guides 5 and 6 are arranged in parallel with each other with a predetermined distance therebetween via the pin 3.

Positioning guide 11 of metal substrate terminal 1
And 12 are fitting portions 13a, 14a and 13b, 14b with the terminal portion 2 and two positioning protrusions 16a, 16a.
b, butting surfaces 15a and 15b for obtaining a combined dimension of 55.88 mm with the terminal portion 2 between the centers of the positioning protrusions 16a and 16b, and contact surfaces 17a and 17b with the surface of the metal substrate 21. It is configured. The positioning guides 11 and 12 have the same shape and, like the pin guides 5 and 6, are molded from PPS resin that can withstand the heat of solder reflow. Further, the fitting portion 13 with the terminal portion 2
a, 13b, 14a, and 14b are cutting burrs 9 of the terminal portion 2;
a and 9b escape.

The metal substrate terminal 1 is constructed by combining the terminal portion 2 and the positioning guide portions 11 and 12 as described above, and cuts and separates an arbitrary number of the pin guides 5 and 6 to meet the required number of pins. Terminal portion 2.

The metal substrate 21 is made of aluminum and has, in its terminal mounting portion, terminal positioning holes 22 and 23 for inserting the positioning protrusions 16a and 16b, and terminal pads 24 having the same number as 21 terminal pins. I have. A solder paste 25 is printed on the terminal pads 24 in advance.

Next, the method of combination in this embodiment and the method of mounting and fixing to a metal substrate are the same as in the case of the first embodiment described above. Omitted.

Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 is an exploded perspective view showing the second embodiment.

Referring to FIG. 3, the metal substrate terminal 10 is formed.
Is composed of only the terminal portion 2 including the pin 3, the pin base portion 4, the pin guides 5 and 6, and does not have the positioning guide portion as in the first embodiment. Similarly, metal substrate 2
No. 1 has only the same number of terminal pads 24 as the number of terminal pins in the terminal mounting portion, but does not have the terminal positioning holes as in the first embodiment.

The positioning jig 31 has the same number of holes 32 as the number of terminal pins at the same pitch as the terminal pitch. On the opposite side (not shown), the number of other terminal pins on the metal substrate 21 is different. This is a jig having the same number of holes as that described above, and for defining the relative positional relationship between two pin groups on the metal substrate 21.

Next, the metal substrate 21 of the metal substrate terminal 10
A method of mounting the components on a computer will be described with reference to FIG.

Unlike the case of the first embodiment, the positioning jig 31 is inserted into and fixed to the tip of the pin 3 of the metal substrate terminal 10 without using the positioning guide. Similarly, a pin of another terminal is inserted into the opposite side of the positioning jig 31 and fixed. While satisfying the positional dimensional relationship between the two terminals, the metal substrate terminal 1 is placed on the terminal pad 24 on which the solder paste 25 is printed in advance on the metal substrate 21.
0 is mounted. In this state, when the reflow furnace is passed, the pin base 4 and the terminal pad 24 are soldered with the solder paste 25 and connected. Thereafter, the positioning jig 31 is removed. The positioning jig 31 can be reused any number of times.

According to the second embodiment of the present invention, in addition to the effects of the first embodiment, since the positioning guide portion is not required, the terminal can be manufactured and purchased at a lower cost. Have.

[0042]

The first effect is that it is not necessary to make a terminal mold for each product. This makes it possible to manufacture and purchase the terminals at low cost. In particular, the effect is large in high-mix low-volume production.

The reason is that the metal substrate terminal is divided into a terminal portion which can be cut and separated and a positioning guide portion.
This is because terminals having different numbers of pins can be manufactured using one mold for both the terminal portion and the positioning guide portion.

A second effect is that a design can be made which is not restricted by the number of terminal pins during product development. This enables flexible product development.

The reason is that the terminals for the metal substrate are divided into the terminal portion and the positioning guide portion, so that it is possible to manufacture terminals having different numbers of pins by using a single mold for both the terminal portion and the positioning guide portion. Because we can.

A third effect is that the height of the terminal pins can be adjusted, and the thickness of the entire metal substrate can be reduced.

The reason is that the terminal portion is composed of two pin guides which are arranged in parallel with a space therebetween, so that the length of the pins can be changed.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a metal substrate terminal and a method for fixing the same according to the present invention.

FIG. 2 is a cross-sectional view at the time of fixing a portion cut along the line AA in FIG. 1;

FIG. 3 is an exploded perspective view showing a second embodiment of the present invention.

FIG. 4 is a perspective view showing a conventional method of fixing a terminal for a metal substrate.

[Explanation of symbols]

 1,10 Terminal for metal substrate 2 Terminal part 3 Pin 4 Pin base part 5,6,7,8 Pin guide 9a, 9b Cutting burr 11,12 Positioning guide part 13,13a, 13b Fitting part 14,14a, 14b Fitting part 15, 15a, 15b Abutment surface 16, 16a, 16b Positioning protrusion 17, 17a, 17b Contact surface with metal substrate surface 21 Metal substrate 22, 23 Terminal positioning hole 24 Terminal pad 25 Solder paste 31 Positioning jig 32 hole

Claims (4)

[Claims] 1. A block having a plurality of blocks into which pins are press-fitted one by one is releasably connected and has a pin guide formed by resin molding. The block is cut and separated according to the required number of pins to form the pin guide. A terminal for a metal substrate, which is formed as an integral terminal portion. 2. A block having a plurality of blocks into which pins are press-fitted one by one is detachably connected and has a pin guide formed by resin molding, and the block is cut and separated according to the required number of pins to form the pin guide. A metal, wherein an integrated terminal portion is provided, and a positioning guide portion having a positioning protrusion with the metal substrate is provided as a separate body, and the positioning guide portion is fixed to the metal substrate in a state of being fitted into the terminal portion. How to fix the board terminals. 3. A pin guide formed by resin molding and a plurality of blocks into which pins are press-fitted one by one are detachably connected, and the blocks are cut and separated according to the required number of pins to form the pin guides. Fixing the terminal portion to the metal substrate using a positioning jig that defines an integral terminal portion and defines a relative position to a pin located elsewhere on the same metal substrate; Method. 4. The terminal for a metal substrate according to claim 1, wherein the length of the pin is variable.