JP2000159289A - Storing container for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a storing container suitable for storing a semiconductor device which is small in size and compact in high-density state so as to perform a positive protection against the semiconductor device by a simple configuration. SOLUTION: There is provided a storing container for use in storing a semiconductor device 5 having a bump 4 at a storing part 24 formed in each of the container half bodies 22, 23 when a lower container half body 22 and an upper container half body 23 are overlapped from each other. Each of the container half bodies 22, 23 is made of more soft material than that of the bump 4 and then the bump 4 is abutted against the soft material under a state in which the semiconductor device 5 is stored in the storing part 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device storage container, and more particularly to a semiconductor device storage container suitable for storing a miniaturized and high-density semiconductor device. 2. Description of the Related Art In recent years, the density and miniaturization of semiconductor devices have been rapidly progressing, and miniaturized and miniaturized semiconductor devices such as CSP and BGA (Ball Grid Array) have been provided. In addition, high reliability is required for semiconductor devices, and various steps are taken in the semiconductor device manufacturing process in order to achieve high reliability.

On the other hand, manufactured semiconductor devices are transported and shipped in a state of being stored in a storage container. During this transfer, an external force is easily applied to the storage container, and therefore, if the semiconductor device is damaged by the external force applied at the time of transfer, even if high reliability is realized at the manufacturing stage, the semiconductor device will eventually be damaged. Reliability decreases. Therefore, in order to enhance the reliability of the semiconductor device, a semiconductor device storage container that can reliably prevent damage to the semiconductor device during transportation is desired.

[0003]

2. Description of the Related Art FIGS. 1 to 3 show a CSP (Chip Size Pac).
kage), BGA (Ball Grid Array), LGA (Lead Grid Arr
ay) shows a storage container 1 for storing a miniaturized semiconductor device 5. The storage container 1 is a hard case made of a hard resin, and includes a lower container half 2 and an upper container half 3.

The lower container half 2 is provided with a cavity 9 for accommodating the semiconductor device 5, a lower positioning fence 6 for positioning the semiconductor device 5, and the like. The upper container half 3 is provided with a pressing surface 8 for preventing the semiconductor device 5 from floating in the housed state, an upper positioning fence 7 for positioning the semiconductor device 5 together with the lower positioning fence 6, and the like.

Incidentally, the semiconductor device 5 of each package structure described above has external connection terminals on the mounting surface side. FIG. 3 shows a semiconductor device 5 having solder bumps 4 (hereinafter simply referred to as bumps) as external connection terminals. Since the bumps 4 are formed of a soft material such as solder, the bumps 4 are easily deformed by application of external force or impact.

For this reason, conventionally, in order to store and hold the semiconductor device 5 in the storage container 1, the outer peripheral region (the region indicated by the arrow W in FIG. 3) of the region where the bumps 4 are formed on the mounting surface of the semiconductor device 5 is used. Utilizing such a structure, the outer peripheral area is mounted on a mounting portion 10 formed on the lower container body 2.
With this configuration, the bumps 4 can be lifted from the bottom surface of the cavity 9, so that even if an external force or impact is applied to the storage container 1, it can be prevented from being applied directly to the bumps 4. With this configuration, the deformation of the bump 4 is prevented.

On the other hand, FIGS. 4 and 5 show a state in which an appearance inspection is performed on the bumps 4 of the semiconductor device 5. As shown in the figure, in order to inspect the appearance of the bumps 4, the storage container 1 is turned over so that the lower container half 2 and the upper container half 3 are turned upside down from the state shown in FIG. The lower container half 2 is removed from the upper container half 3 with. As a result, the bumps 4 of the semiconductor device 5 can be exposed as shown in FIGS.

[0008]

With the recent demand for miniaturization and high density of semiconductor devices, the packages of the semiconductor devices tend to be miniaturized and the number of external connection terminals provided tends to increase. . For this reason, the area occupied by the bump formation area on the mounting surface of the semiconductor device 5 increases, and the outer peripheral area of the bump formation area (arrow W in FIG. 3) relatively increases.
The area of the portion indicated by) tends to be smaller.

For this reason, in the conventional case, the outer peripheral area (W) sufficient to hold the semiconductor device 5 in the storage container 1 is sufficient.
However, in recent years, with the miniaturization and high density of the semiconductor device 5, it has become impossible to secure a sufficient outer peripheral area (W) for holding the semiconductor device 5 in the storage container 1 in recent years. For this reason, when the miniaturized and high-density semiconductor device 5 is housed in the conventional container 1 and transported, the outer peripheral region (W) of the semiconductor device 5 is applied by applying a small external force.
Is detached from the mounting portion 10 of the storage container 1.

When the outer peripheral region (W) separates from the mounting portion 10 as described above, the bumps 4 collide with the lower container half 2 made of a hard resin, and the soft bumps 4 are deformed or damaged. Would. For this reason, conventionally, a packing process as shown in FIG. 7 has been performed so that the bumps 4 are not deformed or damaged by an impact applied during transportation or the like. Specifically, first, the storage container 1 in which the semiconductor device 5 is stored is mounted in the inner bag 12 in which the cushioning material 1 is provided, and then the inner bag 12 is stored in the inner foil body 14. Then, after attaching the lid 13 for the interior box to the interior foil body 14, it is packed in the outer layer box 16. The outer layer box 16 is also provided with a cushioning material 15 for preventing impact application.

As described above, conventionally, a large number of packing members 11 are used to protect the bumps 4 from impacts applied during transportation or the like.
In addition, there is a problem in that the packaging process becomes complicated, and the product cost increases due to this. Furthermore, in the test described with reference to FIGS. 4 and 5, the upper container half 3 holding the semiconductor device 5 at the time of the test has a so-called hard case structure. For example, when an external vibration is applied to the upper container half 3, the vibration is directly applied to the semiconductor device 5, and the semiconductor device 5 is easily removed from the upper container half 3 as shown in FIG. Therefore, there is a problem that an appropriate inspection cannot be performed due to, for example, riding on the upper positioning fence 7.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a semiconductor device storage container that can reliably protect a semiconductor device with a simple configuration.

[0013]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means. According to the first aspect of the present invention, when the lower container half and the upper container half are stacked, a semiconductor device having an external connection terminal in a storage portion formed in each of the container halves is stored. In a container, when the semiconductor device is stored in the storage portion, at least a region of the storage portion that contacts the external connection terminal is formed of a soft material.

According to a second aspect of the present invention, in the storage container of the semiconductor device according to the first aspect, the entire lower container half and the upper container half are softer than the external connection terminals. Characterized by being formed of a soft material. According to a third aspect of the present invention, in the container for a semiconductor device according to the second aspect, the soft material is urethane.

According to a fourth aspect of the present invention, in the storage container for a semiconductor device according to the first aspect, the lower container half is formed of a first outer hard portion having an outer portion formed of a hard material; A first inner soft portion formed of a soft material on an inner portion where the storage portion is formed;
Further, the upper container half is formed by a second outer hard portion formed of a hard material on an outer portion, and a second inner soft portion formed of a soft material on an inner portion where the storage portion is formed. It is characterized by having comprised.

According to a fifth aspect of the present invention, in the semiconductor device container of the fourth aspect, the first outer hard portion and the first inner soft portion are integrally formed and the second outer hard portion is formed integrally with the second inner hard portion. Wherein the outer hard portion and the second inner soft portion are integrally formed.

According to a sixth aspect of the present invention, in the storage container of the semiconductor device according to any one of the first to fifth aspects, separation of the upper container half and the lower container half in the storage portion. The position is set between the heights of the semiconductor device in the housed state.

Further, according to a seventh aspect of the present invention, in the storage container for a semiconductor device according to any one of the first to sixth aspects, both the upper container half and the lower container half are provided on the lower surface of the storage portion. And a lower container half of the storage unit formed on the upper surface, and a plurality of the container halves can be stacked. Of a semiconductor device.

Each of the above means operates as follows.
According to the first aspect of the invention, when the semiconductor device is housed in the housing, the external connection electrode of the semiconductor device comes into contact with the region formed of the soft material in the housing. Because this soft material is softer than the external connection terminal,
Even if the external connection terminal directly contacts the soft part, no crushing, scratching or breakage occurs. Therefore, even if the semiconductor device is miniaturized and the external connection terminals have a narrow pitch, the semiconductor device can be reliably held (stored) in the storage container.

Further, since the external connection terminal can be held in a state of being in contact with the housing, the area where the housing and the semiconductor device come into contact, that is, the area for holding can be expanded.
Thus, even when external force is applied to the storage container, the semiconductor device can be reliably held.
Further, since the storage container itself can have a buffering effect, the packaging for packing the storage container can be simplified and downsized.

According to the second and third aspects of the present invention, the entire lower container half and the upper container half are formed of a soft material (eg, urethane) which is softer than the external connection terminals. By doing so, the lower container half and the upper container half can be easily manufactured as compared with the configuration in which the soft material is locally provided. Further, since the entire storage portion is formed of a soft material, it is possible to reliably prevent the semiconductor device from being damaged by the storage container. Further, since the soft material has elasticity, the inner wall of the storage section is elastically pressed against the semiconductor device, thereby preventing the semiconductor device from being detached from the storage section.

According to the fourth aspect of the present invention, the lower and upper container halves are provided with a first and a second outer hard portion formed of a hard material and a soft inner portion formed with a storage portion. Since the first and second inner soft portions formed of the material include the first and second inner soft portions, the first and second inner soft portions that are in contact with the semiconductor device are formed of the soft material even if the first and second inner soft portions are formed of the soft material. Since the second outer hard portion is made of a hard material, the rigidity of the storage container as a whole can be maintained. Therefore, even if the storage container is gripped or moved for stacking, the storage container does not bend or deform, and the handleability can be improved.

According to the fifth aspect of the present invention, the first
The outer hard portion and the first inner soft portion are integrally formed, and the second outer hard portion and the second inner soft portion are integrally formed, so that each outer hard portion and each inner soft portion are separate members. As compared with the configuration described above, the number of parts can be reduced and the number of steps for manufacturing the storage container can be reduced, and the cost of the storage container can be reduced.

According to the sixth aspect of the present invention, the separation position of the upper container half and the lower container half in the storage section is set between the heights of the semiconductor device in the storage state. Assuming that the device is housed in a storage container such that the external connection terminal is located on the lower container half side, the upper container half is removed from the lower container half, so that the upper surface of the semiconductor device (the surface on which the external connection terminal is formed) is removed. The opposing half-side surface) is exposed, so that a visual inspection such as a label inspection can be performed.

On the other hand, when the upper container half and the lower container half are inverted and the lower container half is removed from the upper container half in the storage state, the formation surface of the external connection terminals of the semiconductor device is changed. Thus, the external connection terminals can be inspected. At this time, since the semiconductor device is held in the storage portion formed in the upper container half or the lower container half, the semiconductor device is not separated from each container half.

According to the seventh aspect of the present invention, the upper container half and the lower container half are constituted by identically shaped container halves. The body is configured such that the lower housing half of the housing is formed on the upper surface. By stacking the container halves, a housing for housing the semiconductor device is provided between the pair of upper and lower container halves. It is formed. Therefore, the semiconductor device can be stored three-dimensionally, and the storage efficiency can be improved.

[0027]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 8 is a sectional view showing the storage container 20 according to the first embodiment of the present invention. The storage container 20 stores the semiconductor device 5 inside, and is generally constituted by a pair of container halves 21.

In the following description, when it is necessary to separately describe the container halves 21 located above and below the semiconductor device 5, the container halves 21 located at the lower part of the semiconductor device 5 will be described below. The container half 21 located at the top of the semiconductor device 5 is called an upper container half 22.
It is assumed that. As shown in FIG. 9, the container half 21 is a plate-like member. On the upper surface thereof, a plurality of upper storage unit halves 26 are formed by being defined by an upper fence 27, and on the lower surface, Are formed in the lower fence 28 to form a plurality of lower storage unit halves 25. The lower fence 28 and the lower storage unit half 25
Does not appear in

The present embodiment is characterized in that the entire container half 21 is formed of a soft material. Specifically, the container half 21 is formed by integrally molding urethane. Further, the hardness of the urethane is selected to be softer than the hardness of the bumps 4 formed on the semiconductor device 5 stored in the storage container 20. That is, the container half 21 is formed of a soft material softer than the bumps 4.

As described above, the storage container 20 has a basic configuration in which a pair of container halves 21 (a lower container half 22 and an upper container half 23) are stacked. This lower container half 22
The upper fence 27 of the lower container half 22 and the lower fence 28 of the upper container half 23 are in contact with each other in a state in which the lower container 22 and the upper container half 23 are stacked, and the lower storage half 25 and the upper storage half 26 are in contact with each other. Cooperate to form a storage section 24.

In the following description, the upper fence 2
The position at which the lower fence 28 and the lower fence 28 abut, and the position at which the lower storage half 25 and the upper storage half 26 abut are referred to as separation positions (indicated by an arrow A in FIG. 8). Here, paying attention to the storage state of the semiconductor device 5 in the storage container 20, in this embodiment, the bumps 4 of the semiconductor device 5 are connected to the lower container half 22.
Is formed so as to directly contact the bottom surface of the upper storage section half 26 formed at the bottom. This is because the conventional storage structure shown in FIG. 3 cannot be used due to the miniaturization and high density of the semiconductor device 5.

As described above, the bump 4 is connected to the upper housing half 2
In the case where the bump 4 is brought into direct contact with the bottom surface, the bump 4 may be crushed. However, as described above, the lower and upper container halves 22, 23 are integrally formed of urethane that is softer than the bump 4, and therefore, the bottom surface of the upper storage unit half 26 is also formed of urethane. Therefore, in the configuration of the present embodiment, the bumps 4 are in direct contact with the soft urethane. Therefore, even if the bumps 4 directly contact the bottom surface of the upper housing half 26, the bumps 4 are crushed and damaged. And no damage occurs. Therefore, even the miniaturized and high-density semiconductor device 5 can be reliably held (stored) in the storage container 20.

Further, since the bumps 4 can be held in a state in which the bumps 4 are in contact with the storage section 24, the area where the storage section 24 and the semiconductor device 5 are in contact, that is, the area for holding can be expanded. Accordingly, even when external force is applied to the storage container 20, the semiconductor device 5 can be reliably held. Further, since the storage container 20 itself can have a buffering effect, the packing of the storage container 20 can be simplified and downsized as compared with the conventional case (see FIG. 7). As a result, it is possible to reduce man-hours and cost required for packing.

In this embodiment, the entire lower container half 22 and upper container half 23 are made of urethane (soft material) as described above. Therefore, compared to a configuration in which the soft material is locally provided in the storage container, each of the container halves 22 and 23
Can be easily manufactured. Further, since the entire storage portion 24 is formed of a soft material, even if the storage portion 24 is in contact with the storage container 20, the semiconductor device 5 is not damaged.

Further, in this embodiment, a pair of container halves 21 (the lower container halves 22, the upper container
The storage container 20 is constituted by stacking 3).
Therefore, as compared with the case where each of the container halves has a different configuration in the upper part and the lower part, the manufacturing cost can be reduced, and the container halves 2
1 can be easily managed (that is, there is no need to store the upper and lower parts separately).

In this embodiment, the lower container half 22 and the upper container half 23 have the same structure, and the lower housing half 25 is provided on the lower surface of each of the container bodies 22 and 23, and the lower housing half 25 is provided on the upper surface. The upper housing half 26 is formed. Thus, by stacking the container halves 21, as shown in FIG. 12, the semiconductor device 5 can be stored three-dimensionally, and thus the storage efficiency of the semiconductor device 5 can be improved.

On the other hand, FIG. 10 and FIG.
3 shows a state when an appearance inspection is performed on the bump 4. Examples of the appearance inspection of the semiconductor device include a label inspection formed on the upper surface 5A of the semiconductor device 5 and a visual inspection (or an image processing inspection) of the bump 4 formed on the mounting surface. In the storage state shown in FIG. 8, to perform the label inspection of the semiconductor device 5, the upper container half 23 is removed from the lower container half 22.

As a result, the upper container half 23 is separated from the lower container half 22, and this separation position A is located between the heights of the semiconductor device 5 in the housed state (between indicated by arrows H in FIG. 8). It is set. With this configuration, by removing the upper container half 23 from the lower container half 22, the upper surface 5A of the semiconductor device 5 is exposed, so that a visual inspection such as a label inspection can be performed.

In order to inspect the appearance of the bump 4,
From the state shown in FIG. 8, the lower container half 22 and the upper container half 2
3 is turned upside down, the lower container half 22 and the upper container half 23 are removed therefrom.
As a result, the bumps 4 of the semiconductor device 5 can be exposed as shown in FIG. 11, and the appearance of the bumps 4 can be inspected.

In the storage container 1 having the conventional configuration, the semiconductor device 5 is detached from the container halves 2 and 3 due to vibration generated when the tester touches the container halves 2 and 3 during the appearance inspection. As described above, there is a possibility that the data may be lost. However, the storage container 20 according to the present embodiment
Since the container halves 22 and 23 are made of a soft material (urethane), even if the above-described vibration occurs, the vibration is absorbed by the container halves 22 and 23. Therefore,
Even if the above-described vibration occurs, the semiconductor device 5 does not separate from each of the container halves 22, 23, and the reliability of the inspection can be improved.

FIG. 13 shows a storage container 30 according to a second embodiment of the present invention. Storage container 30 according to the present embodiment
Also, it is roughly composed of a lower container half 32 and an upper container half 33. The lower container half 32 has a first portion formed of a hard material (for example, hard resin) on an outer portion.
And a first inner soft portion 32B formed of a soft material (for example, urethane) in an inner portion where the storage portion 34 is formed.

The upper container half 33 has a second outer hard portion 33A formed of a hard material (for example, hard resin) on the outer portion, and a soft material ( For example, urethane).
And the inner soft portion 33B. Further, a space formed between each of the inner soft portions 32B and 33B is defined between the first inner soft portion 32B and the second inner soft portion 33B so as to correspond to the shape of the semiconductor device 5. A fence 35 is provided. The material of the fence portion 35 is formed of the same soft material as the inner soft portions 32B and 33B.

In this embodiment, the first outer rigid portion 32A constituting the lower container half 32 and the second outer rigid portion 33A constituting the upper container half 33 are configured to be shared. I have. In addition, a second outer hard portion 33A is provided at the top.
A lid 31 functioning as a cover is provided. As in the present embodiment, the lower and upper container halves 32, 33 are made of first and second outer hard portions 32A, 33A formed of a hard material located on the outer portion, and soft materials located on the inner portion. First and second inner soft portions 32B, 33B formed
With this configuration, the rigidity of the storage container 30 as a whole can be maintained.

Therefore, even if the storage container 30 is gripped or stacked for moving, the storage container 30 is not bent or deformed, and the handling property can be improved. In this embodiment, the first and second
Although the outer hard portions 32A, 33A and the first and second inner soft portions 32B, 33B are shown as separate members, the first outer hard portion 32A and the first inner soft portion 33A are integrally formed. At the same time, the second outer hard part 32B and the second inner soft part 33B can be integrally formed.

As a specific method for realizing this configuration, for example, when the lower container main body 32 and the upper container main body 33 are molded with resin, the portions that become the first inner soft portion 33A and the second inner soft portion 33B are formed. Foaming is conceivable. With the above configuration, each outer hard portion 32A,
Compared with a configuration in which 33A and each of the inner soft portions 32B and 33B are separate members, the number of parts and the number of steps for manufacturing the storage container 30 can be reduced, and the cost of the storage container 30 can be reduced. be able to.

FIG. 14 shows a storage container 40 according to a third embodiment of the present invention. Storage container 40 according to the present embodiment
The lower container half 42 is made of a hard material (eg,
First outer hard portion 42A formed of hard resin)
And a first inner soft portion 42 formed of a soft material (for example, urethane) in an inner portion where the storage portion 44 is formed.
B, and the upper container half 43 is formed of the same hard resin as in the prior art.

The structure of the lower container half 42 is the same as that of the second container half described above.
It has the same configuration as that of the embodiment, and the upper container half 43
Fence part 45 for holding the fence member 35
Are formed. As in this embodiment, the lower container half 4
2 and the upper container half 43 may be made of a different material and a different structure, and the same effect as described above can be realized if the portion in contact with the bump 4 of the semiconductor device 5 in the housed state is formed of a soft material. it can.

In each of the above embodiments, the semiconductor device 5
Although a device having a BGA structure having bumps 4 as external connection terminals has been described as an example, the present invention can also be applied to a case where a semiconductor device having another package structure is housed. Further, in each of the above-described embodiments, the example in which urethane is used as the soft material is described. However, the soft material is not limited to urethane, and is softer (softer) than the external connection terminals provided in the semiconductor device. If so, other materials can be used.

[0049]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, since the region of the semiconductor device that contacts the external connection electrode is softer than the external connection terminal, even if the external connection terminal directly contacts the soft region, the semiconductor device is crushed, scratched, and damaged. Even if the semiconductor device is not damaged and is thus miniaturized and the external connection terminals have a narrow pitch, the semiconductor device can be reliably held (stored) in the storage container.

Further, since the external connection terminal can be held in contact with the storage portion, the area where the storage portion contacts the semiconductor device, that is, the holding region can be expanded, and external force can be applied to the storage container. Even in such a case, the semiconductor device can be reliably held. Further, since the storage container itself can have a buffering effect, the packaging for packing the storage container can be simplified and downsized.

According to the second and third aspects of the present invention, the lower container half and the upper container half can be easily manufactured, as compared with a configuration in which the soft material is locally provided. Further, since the entire storage portion is formed of a soft material, it is possible to reliably prevent the semiconductor device from being damaged by the storage container. Further, since the soft material has elasticity, the inner wall of the storage section is elastically pressed against the semiconductor device, thereby preventing the semiconductor device from being detached from the storage section.

According to the fourth aspect of the present invention, the rigidity of the storage container as a whole can be maintained, so that even if the storage container is gripped or stacked for moving, the storage container is not bent or deformed. It does not occur, and the handleability can be improved. Claim 5
According to the described invention, compared to a configuration in which each outer hard portion and each inner soft portion are formed as separate members, it is possible to reduce the number of parts and the number of steps when manufacturing the storage container, and to reduce the number of storage containers. Cost reduction can be achieved.

According to the invention, various tests can be performed on the semiconductor device while maintaining the state where the semiconductor device is stored in the storage container (the upper container half and the lower container half). This makes it possible to improve test efficiency. Further, during the test, the semiconductor device is held in the storage portion formed in the upper container half or the lower container half, so that it is possible to prevent the semiconductor device from being detached from each container half.

According to the seventh aspect of the present invention, a housing portion for housing a semiconductor device is formed between a pair of upper and lower container halves by stacking the container halves. The storage can be performed, and the storage efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a conventional storage container.

FIG. 2 is an enlarged perspective view showing the vicinity of a storage section of a conventional storage container.

FIG. 3 is an enlarged sectional view showing the vicinity of a storage section of a conventional storage container.

FIG. 4 is a view for explaining a problem of a conventional storage container (part 1).

FIG. 5 is a view for explaining a problem of a conventional storage container (part 2).

FIG. 6 is a view for explaining a problem of a conventional storage container (part 3).

FIG. 7 is a view for explaining a problem of a conventional storage container (part 4).

FIG. 8 is a sectional view of the storage container according to the first embodiment of the present invention.

FIG. 9 is a perspective view showing a container half.

FIG. 10 is a view for explaining a test method of the semiconductor device stored in the storage container (part 1).

FIG. 11 is a view for explaining a test method of the semiconductor device stored in the storage container (part 2).

FIG. 12 is a diagram illustrating an embodiment of a storage container when a plurality of semiconductor devices are stored in a stacked state.

FIG. 13 is a sectional view illustrating a storage container according to a second embodiment of the present invention.

FIG. 14 is a sectional view illustrating a storage container according to a third embodiment of the present invention.

[Explanation of symbols]

 20, 30, 40 Storage container 21 Container half 22, 32, 42 Lower container half 23, 33, 43 Upper container half 24, 34, 44 Storage part 25 Lower storage part half 26 Upper storage part half 27 Upper part Fence 28 lower fence 32A first outer hard part 32B first inner soft part 33A second outer hard part 33B second inner soft part 42A outer hard part 42B inner soft part

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Shigeo Suzuki 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture F-term in Fujitsu Limited (reference) 3E096 AA09 BA08 BB05 CA14 CB02 DA04 DA17 DB07 DC01 EA02X FA10 FA20 FA23 GA01 5F031 CA13 DA05

Claims (7)

[Claims] 1. A storage container for a semiconductor device which stores a semiconductor device having an external connection terminal in a storage portion formed in each of the container halves when the lower container halves and the upper container halves are stacked. In a state where the semiconductor device is housed in the housing, at least a region of the housing that contacts the external connection terminal is formed of a soft material. 2. The storage container for a semiconductor device according to claim 1, wherein the entire lower container half and the upper container half are formed of a soft material softer than the external connection terminals. Of a semiconductor device. 3. The container for a semiconductor device according to claim 2, wherein said soft material is urethane. 4. The storage container for a semiconductor device according to claim 1, wherein the lower container half is formed of a first outer hard portion formed of a hard material on an outer portion, and an inner portion formed with the storage portion. A first inner soft portion formed of a soft material, and the upper container half is formed with a second outer hard portion formed of a hard material on an outer portion, and the storage portion is formed. And a second inner soft portion formed of a soft material on an inner portion of the semiconductor device. 5. The storage container for a semiconductor device according to claim 4, wherein the first outer hard portion and the first inner soft portion are integrally formed, and the second outer hard portion and the second outer hard portion are formed integrally. A storage container for a semiconductor device, wherein an inner soft part is integrally formed. 6. The semiconductor device storage container according to claim 1, wherein a separation position of said upper container half and said lower container half in said storage portion is in a storage state. A storage container for a semiconductor device, wherein the storage container is set between the heights of the semiconductor device. 7. The storage container for a semiconductor device according to claim 1, wherein said upper container half and said lower container half have the same shape on a lower surface thereof, and an upper storage portion of said storage portion. A semiconductor comprising: a half container; a lower container half of the storage unit formed on the upper surface of the container half; and a plurality of the container halves can be stacked. Storage container for the device.