JP2001171782A - Semiconductor device-housing container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate shortcomings of a conventional semiconductor device- housing container, wherein a semiconductor device is placed on a sponge laid on the bottom of a plastic case, and a lid is disposed on the top, such that the protection for an impact from the outside or static electricity is insufficient, and in addition, the container is inconvenient for transport because the case and the lid have to be tied with a rubber band or the like at the time of transport. SOLUTION: For this container, an openable cover 9 is attached to a main body 10 wherein a plurality of recess-form housing sections 11 to house a semiconductor device are partitioned into a grid-shape. In such a container, by closing the cover 9 at the times of storage and transport of the semiconductor device, the semiconductor device is individually arranged in a sealed space, and the semiconductor devices are protected from a damage by a contact or collision of the semiconductor devices with each other due to an impact from the outside, or dust and dirt. In addition, by forming the main body 10 of a conductive plastic, the semiconductor device can be protected from static electricity as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device storage container used for transporting and storing semiconductor devices.

[0002]

2. Description of the Related Art Conventionally, integrated circuit components including semiconductors (ICs)
2. Description of the Related Art Semiconductor devices such as chips) are used in various electronic devices, and containers for storing and transporting such devices in small quantities as samples or small articles are known. FIG. 1 is a perspective view of a semiconductor device. In FIG. 1, 1
Denotes a sealing resin portion, and metal leads 2 protrude from these four sides. This type of semiconductor device is a surface mount type
It is called P and has the advantage that the number of leads is structurally larger than the size of the semiconductor device, and has recently become the mainstream of the surface mount type.

FIGS. 2 and 3 show a conventional storage container for such a semiconductor device, and FIG. 2 is a perspective view of a business card holder-sized storage container used in a trial production stage and for transporting and storing sample samples. is there. FIG. 3 is a perspective view of a tray used in a semiconductor device manufacturing process and mass shipment.

In FIG. 2, a semiconductor device 5 is mounted on a sponge 4 laid on a transparent plastic case body 6, and is made of the same material as the case body 6 during transportation and storage. The lid 3 is used with the lid closed.

In FIG. 3, reference numeral 7 denotes the entire tray. The semiconductor device is mounted on the storage unit 8 and the storage unit 8 is closed by stacking the trays 7 vertically so that the semiconductor can be safely transported without jumping out of the storage unit. Usually, the tray is made of a conductive plastic material, and the semiconductor devices contained therein are protected from static electricity. In addition, the tray 7 is about the size of A4 paper, and the number of storages in one tray is several hundred in recent miniaturized semiconductor devices, which is suitable for mass shipment.

[0006]

2. Description of the Related Art Normally, semiconductor device prototypes, sample samples, and small-sized products are handled in units of several to several tens of units. Conventionally, simple packaging containers as shown in FIG. However, in such a conventional container, when the semiconductor devices collide with each other during transportation, the metal lead 2 is bent, the sealing resin portion 1 is damaged, and the static electricity is not sufficiently treated. There is a problem that the circuit is damaged due to this. Further, while the tray of FIG. 3 is suitable for mass shipments, it is economically unsuitable for the operation of small samples or small items. Furthermore, the storage container shown in FIGS. 2 and 3 has a problem that it is difficult to operate it flexibly because the lid or the tray serving as the lid must be bound together with a rubber band or the like during transportation.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and comprises a plurality of recessed storage portions 11 suitable for the size and shape of a semiconductor device, which are preferably made of conductive plastic. And an openable / closable plastic cover 9 is attached to the main body 10. That is, the present invention is set forth in the claims as claims, and is as described below.

According to a first aspect of the present invention, there is provided a main body having a plurality of recessed storage portions for storing semiconductor devices.
Reference numeral 0 denotes a plastic semiconductor device storage container having an openable / closable cover 9 attached thereto. The invention of claim 2 is
The container according to claim 1, wherein the main body (10) is assembled from the storage portion forming member (15) and a frame member (16) holding the storage portion forming member (15). According to the third aspect of the present invention, the outer peripheral portion of the storage portion forming member 15 is composed of the front surface edge portion 19 and the rear surface edge portion 20, and the storage portion forming member 15 alone has an appropriate fitting clearance and can be stacked. 3. The container according to claim 1, which can be used as a container. The invention according to claim 4 is the container according to claims 1, 2 or 3, wherein the frame member 16 is a dish-shaped container having a peripheral wall 17 and a bottom wall 18. The invention according to claim 5 is characterized in that the main body 10 and the cover
9. A rectangular shape when viewed in a plan view, wherein the two pivot relative to each other with a pivot member formed parallel to one side of the rectangular shape.
5. The container according to any one of items 4 to 4. The invention according to claim 6 is the container according to any one of claims 1 to 5, wherein the entire container is made of a conductive plastic. According to the invention of claim 7, the main body 10 or the storage section forming member 1 is provided.
5. The method as claimed in claim 1, wherein said conductive material is made of conductive plastic.
It is a container described in any one of Claims. Claim 8
The container according to any one of claims 1 to 5, wherein the pivot member is the opening / closing support portion 14 including a projection and a pivot.

Such a container comprises a cover 9 and a main body 1.
0 or a frame member 16 has an opening / closing support portion 14 that cannot be easily separated and detachable connection points 12 and 13. When the cover 9 is closed during transportation or storage, the semiconductor devices are individually located in a sealed space, and are protected from damage due to contact or collision between semiconductor devices due to external impact, dust, dust, and even static electricity. Protected. further,
Since one end of the cover can be opened and closed, it has excellent operability for carrying and carrying.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device storage container according to a first embodiment of the present invention will be described. FIG. 4 is a perspective view of the semiconductor device storage container according to the first embodiment of the present invention, and FIG. 5 is a perspective view of the semiconductor device storage container according to the second embodiment of the present invention.

In FIG. 4, reference numeral 10 denotes a main body in which a plurality of storage sections 11 for semiconductor devices are formed in a lattice pattern, and 9 denotes a cover which is connected to the main body 10 by an opening / closing support section 14.
Structures 12 and 13 are provided which define a fit when the 9 is completely closed to the body 10.

In FIG. 5, the main body 10 is formed separately from a housing part forming member 15 for a semiconductor device and a frame member 16 for supporting the housing part forming member in consideration of the operation. Although the fitting method of the housing portion forming member 15 and the frame member 16 is not shown,
Any suitable mating scheme can be employed, thereby enabling coupling and separation. By adopting such a separating member system, molding of the main body 10 is facilitated.

Furthermore, there is an advantage that only one member, that is, the storage portion forming member 15 can be used as a single storage container. In this case, it is preferable that the storage portion forming member 15 has a structure in which a plurality of storage part forming members 15 regulate any left and right displacement in the vertical direction of the stack. FIG. 6 is an example of a cross section having a front edge 19 and a rear edge 20 that regulate the displacement when the storage section forming member 15 shown in FIG. 5 is overlapped. FIG. 7 shows such a storage section forming member. Reference numeral 15 denotes a superposed cross section.

The opening and closing support portion 14 shown in FIGS. 4 and 5 has a cover.
Although it is a pivot point for opening and closing, and not shown in the figure, it is a pivot mechanism composed of a projection and a pivot, and has a similar supporting portion on the opposite side so as to form an axis parallel to one side of the rectangular main body 10. As long as the cover 9 is opened and closed smoothly and the cover 9 and the main body 10 or the frame member 16 are not easily detached, the structure of the open / close support 14 may be any.
The above structure is preferred because it is simple and effective.

In FIGS. 4 and 5, when the cover 9 is completely closed, the cover 9 is not easily opened by an external impact, but is easily opened by a manual operation. The provided joint point 12 and the joint point 13 provided on the main body 10 or the frame 16 have a male-female structure and are fitted.

The cover 9 is preferably made of a transparent plastic resin, such as an acrylic resin or a polystyrene resin, because the semiconductor device contained therein can be seen through. Further, it is preferable to use a conductive plastic as a material from the viewpoint of measures against static electricity.

Since the main body 10 shown in FIG. 4 or the accommodating portion forming member 15 shown in FIG. 5 is in constant contact with a part of the semiconductor device when the semiconductor device is accommodated, it is made of conductive plastic from the viewpoint of measures against static electricity. It is preferable to use a material.

The frame member 16 shown in FIG.
Although it is a structure that can be attached to and detached from 5, it must not come off easily. Further, even when the storage portion forming member 15 uses a material that takes measures against static electricity, the frame member 16 is preferably a material that takes measures against static electricity.

In the present embodiment, the semiconductor device type has been described as a surface mount type QFP. However, the purpose is to show a storage container excellent in operation.
The present invention is not limited to the QFP, and can be applied to various semiconductor devices with appropriate modifications as needed or in a similar manner.

[0020]

As described above, according to the semiconductor device storage container of the present invention, semiconductor devices are individually stored in sealed spaces, protected from external impact, dust, and dust, and can be safely transported and stored. it can. In addition, by using a conductive plastic as a material for all or a part of the components of the semiconductor device storage container of the present invention, the stored semiconductor device can be protected from static electricity. In the transportation and storage of small samples or small items with smaller semiconductor devices,
The storage space can be saved compared to the conventional large tray, and safer operation is possible because the storage container itself has a cover that can be opened and closed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor device.

FIG. 2 is a perspective view of a conventional storage container.

FIG. 3 is a perspective view of a conventional tray.

FIG. 4 is a perspective view of a semiconductor device storage container according to the first embodiment.

FIG. 5 is a perspective view of a semiconductor device storage container according to a second embodiment.

FIG. 6 is a vertical cross-sectional view of the storage section forming member 15.

FIG. 7 is a longitudinal sectional view of the storage portion forming member 15 which is superimposed.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 semiconductor device sealing resin portion 2 metal lead 3 conventional storage container lid 4 sponge 5 semiconductor device 6 case body 7 tray 8 semiconductor device storage portion 9 cover 10 storage container body 11 semiconductor device storage portion 12 Junction point provided on cover 13 Junction point provided on main body or frame member 14 Opening / closing support portion 15 Storage portion forming member 16 Frame member 17 Peripheral wall 18 Bottom wall 19 Surface edge 20 Back edge

Claims (8)

[Claims] 1. A container for accommodating a semiconductor device, comprising: a main body having a plurality of recessed accommodating portions for accommodating the semiconductor device divided into a lattice; and an openable / closable cover attached to the main body. 9. A storage container for a plastic semiconductor device, comprising: 2. The container according to claim 1, wherein the main body is assembled from a storage portion forming member and a frame member holding the storage portion forming member. 3. The storage container according to claim 1, wherein the outer peripheral portion of the storage portion forming member 15 includes a front surface edge portion 19 and a rear surface edge portion 20, and the storage portion forming member 15 alone can be used as a storage container that can be overlapped. container. 4. The container according to claim 1, wherein the frame member is a dish-shaped container having a peripheral wall and a bottom wall. 5. The body according to claim 1, wherein the main body and the cover have a rectangular shape in plan view, and the two pivot relative to each other with a pivot member formed in parallel with one side of the rectangular shape. The container according to claim 1. 6. The container according to claim 1, wherein the entire container is made of a conductive plastic. 7. The container according to claim 1, wherein the main body 10 or the storage section forming member 15 is made of a conductive plastic. 8. The container according to claim 1, wherein the pivot member is an opening / closing support portion comprising a projection and a pivot.