JP2000156597A - Electronic component arranging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component arranging apparatus by which a component arranging operation to a circuit board, a component tape or the like can be executed in a high-speed cycle. SOLUTION: In a state that a chip component EC which is fetched into a fetch part 2b in a component separator 2 from a discharge port 1b in a component holder 1 is sucked and held, the component separator 2 is turned by a prescribed angle. After it is turned, the sucking and holding operation of the chip component is released. As a result, the chip component EC is dropped by its own weight so as to be arranged in a prescribed position on a circuit board CS.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component placement apparatus for placing electronic components such as chip components on an object such as a circuit board or component tape.

[0002]

2. Description of the Related Art Conventionally, components are arranged on a circuit board by a component feeder for supplying electronic components to a predetermined take-out position, and electronic components are taken out from the component feeder and placed on the component mounting surface of the circuit board. In general, an apparatus in which a component placement device is combined is used.

[0003] A part feeder is used as a part feeder, and electronic parts stored in a bulk, for example, chip parts such as a chip capacitor and a chip resistor are subjected to vibration and aligned, and a predetermined state is maintained in the aligned state. It is sent to the removal position. Further, a suction nozzle and a manipulator for moving the suction nozzle two-dimensionally are used as the component placement device.

[0004]

In the above-mentioned conventional apparatus,
In order to arrange one electronic component on the component mounting surface of the circuit board, the suction nozzle is reciprocated once between the component extraction position and the component placement position, and the suction nozzle is moved in each of the component extraction position and the component placement position. Need to move up and down. That is, every time one electronic component is arranged on the circuit board, a time corresponding to the nozzle operation is required.

Although the component placement time can be reduced by increasing the moving speed of the suction nozzle, the nozzle operation related to the component placement is complicated. There is a limit to reducing time.

[0006] This problem can also occur when the electronic component is placed on an object other than the circuit board, for example, when the electronic component is placed in the component receiving recess of the component tape.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component arranging apparatus capable of arranging components on a circuit board, component tape, or the like in a high-speed cycle. .

[0008]

To achieve the above object, a first apparatus according to the present invention comprises a passage for accommodating a plurality of electronic components in an aligned manner and movably under its own weight, and an electronic component from an end of the passage. A component holder having a discharge port for discharging its own weight, at least one intake unit for receiving the electronic component discharged by its own weight from the discharge opening of the component holder, and holding and release of the electronic component captured by the intake unit A rotatable component separator provided with a suction unit that enables the component separator, and an actuator for rotationally driving the component separator.

According to this first device, the electronic component taken into the intake of the component separator from the discharge port at the end of the passage of the component holder is held by the suction portion, and the component separator is moved to a predetermined angle by the actuator. By rotating and releasing the component holding by the suction unit after the rotation, the electronic component can be dropped on its own weight and placed on the object.

According to a second aspect of the present invention, there is provided a component holder having a passage for accommodating a plurality of electronic components in an aligned manner and movable by its own weight, and a discharge port for discharging the electronic components from the end of the passage by its own weight. A vertically movable component separator having a take-in portion for receiving electronic components discharged by its own weight from a discharge port of the component holder, and a suction portion capable of holding and releasing the holding of the electronic component taken into the take-in portion And an actuator for reciprocatingly driving the component separator.

[0011] According to the second device, while the electronic component taken into the take-in portion of the component separator from the discharge port at the end of the passage of the component holder is held by the suction portion, the component separator is moved by a predetermined stroke by the actuator. By lowering and releasing the component holding by the suction unit after the lowering, the electronic component in the capturing unit can be arranged on the target.

A third device according to the present invention is provided adjacent to a passage for accommodating a plurality of electronic components in an aligned manner and movably under its own weight, and for admitting a leading electronic component in the passage. And a suction unit capable of releasing the first electronic component in the passage by pulling it into the intake unit and holding the component.

According to the third device, the electronic component in the take-in section is released by releasing the component held by the suction section in a state where the leading electronic component in the passage is drawn into and held by the take-up section by the suction section. It can be dropped on its own weight and placed on the object.

According to a fourth aspect of the present invention, there is provided a passage having a plurality of electronic components housed in an aligned state and movably under its own weight, having a discharge port corresponding to one component at the end of the passage, and a leading electronic device in the passage. A suction unit is provided for holding the component at the position of the outlet, and a gas outlet for applying gas pressure to the first electronic component in the passage and discharging the electronic component from the outlet.

According to the fourth device, while the leading electronic component in the passage is held by the suction portion, the gas pressure is applied to the electronic component from the gas outlet, thereby making
This electronic component can be forcibly discharged from the discharge port and placed on the object.

According to a fifth aspect of the present invention, there is provided a component holder for accommodating a plurality of electronic components in an aligned state and movably under its own weight, and having a passage having a discharge port corresponding to one component at the end of the passage, and a component holder. A first extrusion jig for extruding the first electronic component in the passage of the holder to the outside from the outlet, a transport belt having an elastic hole for receiving and holding the electronic component extruded from the outlet of the component holder, and an elasticity of the transport belt. A second extrusion jig for extruding the electronic component held in the hole to the outside and arranging it on the object, and an actuator for reciprocatingly driving each of the first and second extrusion jigs are provided.

According to the fifth device, the first electronic component in the passage of the component holder is forcibly discharged to the outside from the discharge port using the first extrusion jig, and the electronic component is inserted into the elastic hole of the transport belt. After being pushed in and elastically held, the electronic components held in the elastic holes of the transport belt can be forcibly ejected to the outside using the second extrusion jig and placed on the target object.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIG. 1A shows a first embodiment of the present invention. In the drawing, reference numeral 1 denotes a component holder, 2 denotes a component separator, and 3 denotes a guide fin.

The component holder 1 has a vertical passage 1a inside, and the lower end of the passage 1a is opened as a discharge port 1b. In the passage 1a, a quadrangular prismatic chip component EC as shown in FIG. 1B and a cylindrical chip component EC as shown in FIG. 1C can be moved under their own weight while being aligned in the longitudinal direction. Is stored in. Incidentally, the chip component EC is a known chip component such as a chip capacitor, a chip resistor, and a chip inductor. The cross-sectional shape of the passage 1a for accommodating the cylindrical chip component EC may be either rectangular or circular. However, the cross-sectional shape of the passage 1a for accommodating the quadrangular chip component EC is the same as that of the chip component EC. A rectangle is preferably employed to prevent the posture from being disturbed.

The component separator 2 is made of a disc-shaped member.
An actuator (not shown) for rotationally driving the component separator 2, for example, an electric motor, an air motor, or the like is connected to the center shaft 2a. In the component separator 2, an intake portion 2 b for receiving one chip component EC discharged by its own weight from the discharge port 1 b of the component holder 1 in a vertically oriented state is formed by cutting out a part of the outer peripheral portion. Is formed. Incidentally, the capturing unit 2b shown in FIG. 1 is configured by two planes orthogonal to each other. further,
The component separator 2 has an air passage 2 provided on the center shaft 2a.
The suction holes 2d and 2e extending from c to two planes of the intake portion 2b are formed. Air passage 2 of central shaft 2a
A suction source (not shown) such as an air circuit including a vacuum pump and a valve is connected to c through a rotary joint or the like.

The guide fins 3 are made of a flexible material such as resin or rubber, and are provided so as to hang from one lower end of the component holder 1. The guide fins 3 are used to transfer the chip components EC discharged from the discharge port 1b of the component holder 1 by its own weight.
It serves to guide the component separator 2 toward the intake portion 2b.

Hereinafter, a method of arranging the chip component EC on the component mounting surface of the circuit board CS using the device of the first embodiment will be described with reference to FIGS. 2A to 2C.

As shown in FIG. 2A, the chip components EC stored in the passage 1a of the component holder 1 move downward by their own weight while being aligned in the longitudinal direction. The lowermost chip component EC is discharged by its own weight from the outlet 1b, and is received by the intake portion 2b of the component separator 2 while being guided by the guide fins 3. At this time, a negative pressure is applied to the suction holes 2d and 2e of the intake unit 2b, and the chip component EC taken into the intake unit 2b is suction-held by the negative pressure.

At the same time, by moving the circuit board CS using an XY table or the like, the position of the substrate electrode SE of the circuit board CS on which the chip component EC is to be arranged is adjusted to coincide with the component arrangement position.

After the alignment, as shown in FIG. 2B, the component separator 2 is rotated 90 degrees clockwise in the figure by the actuator. By this rotation, the attitude of the chip component EC held by the capturing unit 2b is changed from vertical to horizontal. During this rotation, the intake unit 2b
The chip fin EC held by the guide fin touches the guide fin 3, but the guide fin 3 is bent as shown by a broken line in the drawing, so that there is no problem in rotation. At the time of this rotation, the passage 1
a, the lowermost chip component EC a contacts the outer peripheral surface of the component separator 2, so that the subsequent chip component EC
It does not jump out of b.

After the parts separator 2 is rotated, FIG.
As shown in (C), the negative pressure acting on the suction holes 2d and 2e of the intake section 2b is released. Thereby, the capture unit 2
The chip component EC held by b falls by its own weight and is arranged on the substrate electrode SE of the circuit board CS. Substrate electrode S
If a paste-like bonding agent such as cream solder is applied on E in advance, the chip components EC are temporarily fixed by using the viscosity of the bonding agent, and the dislocation of the chip components EC after placement may occur. Can be prevented. If the chip component EC does not fall under its own weight simply by releasing the negative pressure applied to the suction holes 2d and 2e, it is preferable to apply a positive pressure to the suction holes 2d and 2e after releasing the negative pressure.

Thereafter, the component separator 2 is rotated 90 degrees counterclockwise in FIG. 2C (see the broken arrow). When the intake section 2b returns to the original position by this rotation, the lowest-order chip component EC in the passage 1a is again discharged by its own weight from the discharge port 1b and is taken into the intake section 2b.
If the position of the circuit board CS is changed using the time when the component separator 2 returns to rotation, the same component arrangement as described above can be continuously performed without causing a time loss.

As described above, according to the apparatus of the first embodiment, while the chip component EC taken in from the outlet 1b of the component holder 1 into the intake portion 2b of the component separator 2 is sucked and held, this component separator is held. 2 is rotated a predetermined angle,
By releasing the suction holding after the rotation, the chip component EC can be dropped by its own weight and placed at a predetermined position on the circuit board CS.

That is, the chip components EC can be sequentially arranged on the circuit board CS only by controlling the rotation operation of the component separator 2 and the suction holding of the chip components EC.
As a result, the component placement time per component is greatly reduced, and the component placement can be speeded up, for example, the component placement cycle of 0.1 sec or less can be sufficiently followed. Further, if components are replenished into the passage 1a from a bulk storage such as a hopper along with the component arrangement, the component arrangement can be continuously performed for a long time.

In the first embodiment, the chip component EC having the shape shown in FIGS. 1B and 1C is stored in the passage 1a of the component holder 1. Passage 1a passes chip components having shapes other than these, electronic components other than chip components, for example, composite components such as LC filters and networks, and integrated circuit components such as semiconductor elements.
And can be placed on the object.

Further, the circuit board C
Although S is shown, the device of the first embodiment can also be used as a device for sequentially inserting electronic components into the component storage recesses of the component tape. Of course, the same device can be used and the same operation and effect can be obtained even when components are arranged on an object other than the circuit board and the component tape.

Further, in the above-described first embodiment, the component separator 2 is provided with one intake portion 2b. However, as shown in FIG. The two intake portions 4b may be formed at intervals of 90 degrees, and the suction holes 4d may extend from the air passage 4c provided in the central shaft 4a to one plane of each intake portion 4b. In this case, the component separator 4 is moved 90 degrees counterclockwise in the drawing.
Rotate intermittently at intervals of four degrees, and
Since one of the positions b is located at a position facing the object, the negative pressure applied to the suction hole 4d of the intake portion 4b is released, so that the same component arrangement as described above can be performed. Since four chip components EC can be held simultaneously by one component separator 4, the component arrangement cycle can be further accelerated as compared with the case where one chip component EC is held.

Further, in the apparatus of the first embodiment and the apparatus of the modified embodiment shown in FIG. 3, the suction hole is used for holding the parts in the intake section. 4A, an electromagnet 5c is provided on at least one plane of the take-in portion 5b, as shown in FIG.
Four take-in portions 6 like the component separator 6 shown in FIG.
If the electromagnets 6c are provided on at least one plane of b, by controlling the energization of the electromagnets 5c, 6c, the holding and release of the chip component EC can be performed in the same manner as described above. Incidentally, since the chip component EC has a metal portion such as an external electrode or an internal conductor, it can be attracted by the magnetic force of the electromagnet 6c in the energized state.

Further, in the device of the first embodiment, the device of the modified embodiment shown in FIG. 3, and the device of the modified embodiment shown in FIGS. 4 (A) and 4 (B), two planes orthogonal to each other are used. Although the configuration of the intake unit is shown, as shown in FIG. 5, if the wall surface 2b1 is provided on both sides of the intake unit 2b,
Oscillation of the chip component EC held by the intake section 2b can be suppressed by the wall surface 2b1.

Further, in the device of the first embodiment, the device of the modified embodiment shown in FIG. 3, and the device of the modified embodiment shown in FIGS. 4 (A) and 4 (B), a vertically long passage is used as a component holder. Although a component holder 7 is shown, it is also possible to use a component holder 7 having a passage 7a shaped such that a vertical portion, a curved portion, and a horizontal portion are continuous as shown in FIG. In this case, since the chip component EC is discharged in a horizontal state from the discharge port 7b of the component holder 7, a take-in portion 8b suitable for this component discharge direction is formed in the component separator 8. Center shaft 8a
A suction hole 8d extends from the air passage 8c provided on one side of the intake portion 8b. As shown in FIG. 6, the leading chip component EC in the passage 7a of the component holder 7 is
The weight of the component separator 8 is discharged in the horizontal direction from the position a. When the component separator is rotated 180 degrees counterclockwise from the state of FIG. 6 and then the negative pressure applied by the suction hole 2d is released, as shown in FIG. The chip component EC, which has been dropped by its own weight, is placed on the substrate electrode SE of the circuit board CS. Thereafter, when the component separator 8 is rotated 180 degrees counterclockwise in the figure, the passage 7a
Of the chip component EC is again discharged by its own weight from the discharge port 7b and is taken into the take-in section 8b. [Second Embodiment] FIG. 8 shows a second embodiment of the present invention. In the figure, reference numeral 11 denotes a component holder, and 12 denotes a component separator.

The component holder 11 has a passage 11a inside, and the tip of the passage 11a is opened as a discharge port 11b. The passage 11a is composed of a vertical portion, a curved portion continuous with the vertical portion, and a horizontal portion continuous with the curved portion. In the passage 11, square chip components EC as shown in FIG. 1 (B) and cylindrical chip components EC as shown in FIG. 1 (C) are aligned in the longitudinal direction and It is stored movably under its own weight. Incidentally, the chip component EC is a known chip component such as a chip capacitor, a chip resistor, and a chip inductor. In both cases where the quadrangular columnar chip components EC are stored and the columnar chip components EC are stored, a rectangular cross section is adopted for the passage 11a.

The component separator 12 is made of a vertically long rectangular parallelepiped member, and is arranged so as to be able to move up and down along the left side of the component holder 11 in the drawing. This part separator 1
2, a take-in portion 12a for receiving one chip component EC in a horizontal state is formed so as to cut out a part of a lower end portion. Incidentally, the take-in portion 12a shown in FIG. 6 is composed of two planes orthogonal to each other, and the lateral dimension Lr matches the length dimension of the chip component EC. Further, on the longitudinal side of the component separator 12, an electromagnet 1 capable of drawing in and sucking and holding the chip component EC is provided.
2b is buried or arranged with a part thereof exposed on the vertical surface. A power supply (not shown) is connected to the electromagnet 12b via a lead wire. Incidentally, since the above-mentioned chip component EC has a metal part such as an external electrode or an internal conductor, it can be attracted by the magnetic force of the electromagnet 12b in an energized state.

Hereinafter, a method for arranging the chip component EC on the component mounting surface of the circuit board CS using the apparatus according to the second embodiment will be described with reference to FIGS.

As shown in FIG. 9, the chip component EC housed in the passage 11a of the component holder 11 moves downward by its own weight while being aligned in the longitudinal direction, and from the vertical direction in the process of passing through the curved portion. The posture is changed sideways. The leading chip component EC is discharged by its own weight from the discharge port 11b in a horizontal position, and is received by the intake portion 12a of the component separator 12. At this time, a current is applied to the electromagnet 12b to apply a magnetic attraction, and the attraction force causes the chip component EC to be drawn into the intake unit 2b and the chip component EC taken into the intake unit 2b to be attracted and held. .

At the same time, by moving the circuit board CS using an XY table or the like, the position of the substrate electrode SE of the circuit board CS on which the chip component EC is to be placed is adjusted to match the component placement position.

After the alignment, as shown in FIG. 10, the component separator 12 is lowered by a predetermined stroke by the actuator. Due to this lowering, the chip component EC held by the intake section 12a comes into contact with the board electrode SE of the circuit board CS. During this downward movement, the leading chip component EC in the passage 11a comes into contact with the holder-side surface of the component separator 12, so that the following chip component EC is discharged from the outlet 1
No jump out of 1b.

After the chip component EC contacts the substrate electrode SE of the circuit board CS, as shown in FIG.
After stopping the power supply to b, the component separator 12 is raised and returned. As a result, the holding of the chip component EC in the capturing unit 12a is released, and the chip component EC is
It is arranged on the S substrate electrode SE. If a paste-like bonding agent such as cream solder is applied on the substrate electrode SE in advance, the chip component EC can be well separated from the component separator 12 by utilizing the viscosity of the bonding agent. By temporarily fixing the chip component EC using the viscosity of the agent, it is possible to prevent the displacement of the chip component EC after the placement.

When the component separator 12 returns to the original position,
The leading chip component EC in the passage 11a is discharged again to the outlet 11
b, and is taken into the intake section 12a by the attraction force of the electromagnet 12b. Therefore, if the position of the circuit board CS is changed using the time for the component separator 12 to rise and return, the same component arrangement as described above can be performed with time loss. It can be done continuously without occurring.

As described above, according to the apparatus of the second embodiment, the component separator EC is sucked and held in the take-in portion 12a of the component separator 12 from the outlet 11b of the component holder 11, and the component separator is held. The chip component EC can be arranged at a predetermined position of the circuit board CS by lowering the suction stroke 12 after lowering the predetermined stroke of the circuit board 12.

That is, it is possible to sequentially arrange the chip components EC on the circuit board CS only by controlling the raising / lowering operation of the component separator 12 and the suction holding of the chip components EC. The time can be greatly reduced, and the speed of component placement can be increased, for example, a component placement cycle of 0.1 sec or less can be sufficiently followed. In addition, if components are replenished into the passage 11a from a bulk storage such as a hopper along with the component arrangement, the component arrangement can be performed continuously for a long time.

The take-in portion 12a of the component separator 12
Until the chip component EC held by the device contacts the substrate electrode SE of the circuit board CS, the chip component EC is
Since the device and the circuit board can be held by suction at a sharp angle, the same component arrangement as described above can be performed without hindrance.

In the second embodiment, the chip component EC having the shape shown in FIGS. 1B and 1C is accommodated in the passage 11a of the component holder 11. A chip component having a shape other than these, an electronic component other than the chip component, for example, a composite component such as an LC filter or a network, an integrated circuit component such as a semiconductor element, or the like is housed in the passage 11a and placed on the target object. Is also possible.

Also, the circuit board C
Although S is shown, the device of the second embodiment can also be used as a device for sequentially inserting electronic components into the component storage recesses of the component tape. Of course, the same device can be used and the same operation and effect can be obtained even when components are arranged on an object other than the circuit board and the component tape.

Further, the apparatus according to the second embodiment described above uses an electromagnet for holding parts in the take-in section. However, instead of this electromagnet, a take-in apparatus such as a parts separator 13 shown in FIG. 12 is used. If a suction hole 13b is provided at least on the longitudinal side of the portion 13a and a tube connector 13c is provided at the end thereof and connected to a suction source via a tube, the suction hole 1b
By controlling the negative pressure acting on 3b, it is possible to draw, hold and release the chip component EC in the same manner as described above.

Further, the apparatus of the second embodiment and FIG.
In the device of the modified embodiment shown in FIG. 1, the capturing portion is configured by two planes orthogonal to each other, but as shown in FIG. 13, if the wall surface 12a1 is provided on both sides of the capturing portion 12a, The chip component E held by the intake unit 12a
The swing of C can be suppressed by the wall surface 12a1. [Third Embodiment] FIG. 14 shows a third embodiment of the present invention. Reference numeral 21 in the drawing is a component holder.

The component holder 21 has a vertical passage 21 therein.
a one chip component E adjacent to the lower end of the passage.
It has an intake 21b for receiving C, and the lower surface of the intake 21b is opened as a discharge port 21c. In the passage 21a, the square chip component EC shown in FIG. 1B and the cylindrical chip component EC shown in FIG.
It is housed in a state of being aligned in the height direction or the radial direction and movably under its own weight. Incidentally, the chip component EC is a known chip component such as a chip capacitor, a chip resistor, and a chip inductor. In both cases where the quadrangular columnar chip component EC is stored and the columnar chip component EC is stored, a rectangular cross section is adopted for the passage 21a. By the way,
The capturing unit 21b shown in FIG. 14 is configured by four planes orthogonal to each other.

The suction hole 2 is provided on the vertical side of the intake portion 21b.
1d is formed, and a tube connector 21e is provided at an end thereof. A suction source, for example, an air circuit including a vacuum pump and a valve is connected to the tube connector 21e via a tube.

Hereinafter, referring to FIG. 15 and FIG.
A method of arranging the chip component EC on the component mounting surface of the circuit board CS using the device of the embodiment will be described.

As shown in FIG. 15, the chip components EC accommodated in the passage 21a move downward by their own weight while being aligned in the height direction or the radial direction. In this state, a negative pressure is applied to the suction hole 21d of the intake section 21b, and the lowermost chip component EC in the passage 21a is drawn into the intake section 21b by the negative pressure, and the chip component EC is collected by the negative pressure. It is sucked and held by the insertion portion 21b. When the lowermost chip component EC in the passage 21a is drawn into the take-in portion 21b, the entire chip component EC in the passage 21a is lowered by one component.

At the same time, by moving the circuit board CS using an XY table or the like, the position of the substrate electrode SE of the circuit board CS on which the chip component EC is to be placed is adjusted to match the component placement position.

After the positioning, as shown in FIG. 16, the negative pressure acting on the suction hole 21d of the intake section 21b is released. As a result, the chip component EC held by the capturing unit 21b falls by its own weight, and the substrate electrode S of the circuit board CS is dropped.
E. If a paste-like bonding agent such as cream solder is applied on the substrate electrode SE in advance, the chip components EC are temporarily fixed by using the viscosity of the bonding agent, and the displaced chip components EC are displaced. Can be prevented.
If the chip component EC does not fall under its own weight simply by releasing the negative pressure acting on the suction hole 21d, it is preferable to apply a positive pressure to the suction hole 21d after the negative pressure is released.

Thereafter, when a negative pressure is applied to the suction hole 21d of the intake section 21b, the lowest-order chip component EC in the passage 21a is drawn into the intake section 21b again and held therein. If the position of the circuit board CS is changed using the above, the same component arrangement as described above can be continuously performed without causing a time loss.

As described above, according to the device of the third embodiment, the lowermost chip component EC in the passage 21a is taken into the loading unit 2
After being pulled into and held in the board 1b, the chip component EC in the take-in portion 21b can be dropped by its own weight by disengaging the component holding, and can be arranged at a predetermined position on the circuit board CS.

That is, it is possible to sequentially arrange the chip components EC on the circuit board CS only by controlling the suction holding of the chip components EC, thereby greatly shortening the component arrangement time per component. It is possible to speed up component placement, for example, sufficiently follow a component placement cycle of 0.1 sec or less. Further, if components are replenished into the passage 21a from a bulk storage such as a hopper along with the component placement, the component placement can be continuously performed for a long time.

In the third embodiment, the passage 21a
1B and FIG. 1C, a chip component EC having a shape as shown in FIGS. 1B and 1C is shown. However, a chip component having a shape other than these, an electronic component other than the chip component,
For example, composite parts such as LC filters and networks,
It is also possible to house an integrated circuit component such as a semiconductor element in the passage 21a and arrange it on the object.

Further, the circuit board C
Although S is shown, the device of the third embodiment can also be used as a device for sequentially inserting electronic components into the component storage recesses of the component tape. Of course, the same device can be used and the same operation and effect can be obtained even when components are arranged on an object other than the circuit board and the component tape.

Further, in the apparatus according to the third embodiment, the suction hole is used for holding the component in the intake section.
If an electromagnet 22d is provided on the vertical wall side of the intake portion 22b as in the component holder 22 shown in FIG.
By controlling the energization of the electromagnet 22d, the chip component EC can be pulled in, held, and released in the same manner as described above. Incidentally, since the chip component EC has a metal portion such as an external electrode or an internal conductor, it can be attracted by the magnetic force of the electromagnet 22d in an energized state.

Further, the apparatus of the third embodiment and FIG.
In the modification shown in FIG. 18A, the lowermost chip component EC in the passages 21a, 22a is drawn into the intake portions 21b, 22b by the suction force of the suction hole 21d or the electromagnet 22d. ) And the outlet holes 21f and 22e as shown in FIG. 18 (B) are provided at positions opposed to the intake portions of the passages 21a and 22a, and tube fittings 21g and 22f are provided at the respective ends, and via the tubes. Blowing source,
For example, if it is connected to an air circuit or the like provided with an air compressor and a valve, the gas exhaust pressure from the blowout holes 21f and 22e is used to assist in drawing the chip component EC into the intake portions 21b and 22b. be able to. [Fourth Embodiment] FIG. 19 shows a fourth embodiment of the present invention. Reference numeral 31 in the drawing denotes a component holder.

The component holder 31 has a passage 31a inside, and the lower surface of the leading end of the passage 31a is opened as a discharge port 31b. The passage 31a includes a vertical portion, a curved portion continuous with the vertical portion, and a horizontal portion continuous with the curved portion.
In the passage 31, square chip components EC as shown in FIG. 1 (B) and cylindrical chip components EC as shown in FIG. 1 (C) are aligned in the longitudinal direction and It is stored movably under its own weight. Incidentally, the chip component EC is a known chip component such as a chip capacitor, a chip resistor, and a chip inductor. In both cases where the quadrangular columnar chip components EC are stored and the columnar chip components EC are stored, a rectangular cross section is adopted for the passage 31a.

The outlet 31b at the tip of the passage 31a
An outlet 31c is formed on the upper wall opposite to the above, and a tube connector 31d is provided at an end thereof. A blow source, for example, an air circuit including an air compressor and a valve is connected to the tube connector 31d via a tube. Further, a permanent magnet 31e is buried in the front wall at the tip of the passage 31a such that one of the N pole and the S pole faces the end surface of the leading chip component EC.

Hereinafter, referring to FIGS. 20 and 21, the fourth
A method of arranging the chip component EC on the component mounting surface of the circuit board CS using the device of the embodiment will be described.

As shown in FIG. 20, the chip component EC housed in the passage 31a moves downward by its own weight while being aligned in the longitudinal direction, and changes its posture from vertical to horizontal in the process of passing through the curved portion. Be changed. Leading chip component E
C is attracted to and held by the permanent magnet 31e by the attractive force of the magnetic force of the permanent magnet 31e, and the subsequent chip component EC is connected to the rear. Since the leading chip component EC is attracted and held by the permanent magnet 31e, it does not fall from the outlet 31b by its own weight.

At the same time, by moving the circuit board CS using an XY table or the like, the position of the board electrode SE of the circuit board CS on which the chip component EC is to be placed is adjusted to match the component placement position.

After the alignment, as shown in FIG. 21, gas such as air is instantaneously blown from the outlet 31c toward the leading chip component EC. As a result, the leading chip component EC held at the end of the passage 31a is discharged downward by gas pressure against the holding force of the permanent magnet 31e, and is disposed on the board electrode SE of the circuit board CS. If a paste-like bonding agent such as cream solder is applied on the substrate electrode SE in advance, the chip component E is used by utilizing the viscosity of the bonding agent.
By temporarily fixing C, it is possible to prevent the chip components EC after the placement from being displaced.

When the gas blowing is stopped, the leading chip component EC in the passage 31a is attracted to the permanent magnet 31e again by the attractive force of the magnetic force of the permanent magnet 31e and is attracted and held. If the position of CS is changed, the same component arrangement as described above can be continuously performed without causing time loss.

As described above, according to the device of the fourth embodiment, the leading chip component EC in the passage 31a is
By applying gas pressure to the chip component EC from the outlet 31c while holding the chip component EC, the chip component EC is discharged from the discharge port 31b and the circuit board C
S can be arranged at a predetermined position.

That is, it is possible to sequentially arrange the chip components EC on the circuit board CS only by controlling the gas blowing from the air outlet 31c, thereby greatly shortening the component arranging time per component. It is possible to speed up component placement, for example, sufficiently follow a component placement cycle of 0.1 sec or less. Further, if components are replenished into the passage 31a from a bulk storage such as a hopper along with the component placement, the component placement can be continuously performed for a long time.

In the fourth embodiment, the passage 31a
1B and FIG. 1C, a chip component EC having a shape as shown in FIGS. 1B and 1C is shown. However, a chip component having a shape other than these, an electronic component other than the chip component,
For example, composite parts such as LC filters and networks,
It is also possible to house an integrated circuit component such as a semiconductor element in the passage 31a and arrange it on the object.

Further, the circuit board C
Although S is shown, the device of the fourth embodiment can also be used as a device for sequentially inserting electronic components into the component storage recesses of the component tape. Of course, the same device can be used and the same operation and effect can be obtained even when components are arranged on an object other than the circuit board and the component tape.

Further, in the apparatus of the fourth embodiment, the permanent magnet is used for holding the component at the end of the passage. However, instead of the permanent magnet, a component holder 32 shown in FIG. Electromagnet 2 is provided on the front wall at the tip of passage 32a.
If 2d is provided, the leading chip component EC can be pulled in and sucked and held by the magnetic force of the electromagnet 32d in the same manner as described above. Further, as in a component holder 33 shown in FIG. 22 (B), a suction hole 33e is formed in the front wall at the front end of the passage 33a.
If a tube connector 33f is provided at the end of the tube and connected to a suction source, for example, an air circuit equipped with a vacuum pump and a valve via a tube, the head is actuated by the negative pressure acting on the suction hole 33e. The pull-in and holding release of the chip component EC can be performed in the same manner as described above. Fifth Embodiment FIGS. 23A to 23D show a fifth embodiment of the present invention. In the figure, reference numeral 41 denotes a component holder, 42 denotes a first pressing rod, 43 denotes a first solenoid for driving the first pressing rod, 44 denotes a transport belt, 45 denotes a support table, and 46 denotes a second driving rod for driving the second pressing rod. The solenoid 47 is a second pressing rod.

The component holder 41 has a vertically oriented passage 41 therein.
a, and one side of the lower end of the passage is opened as a discharge port 41b. Also, a discharge port 41b at the lower end of the passage 41a.
An insertion port 41c for the first pressing rod is formed in a wall opposed to. In the passage 41a, the quadrangular columnar chip component EC shown in FIG. 1B and the columnar chip component EC shown in FIG. 1C are arranged in the length direction and can move under their own weight. Is stored. Incidentally, the chip component EC is a known chip component such as a chip capacitor, a chip resistor, and a chip inductor. The cross-sectional shape of the passage 41a for accommodating the cylindrical chip component EC may be either rectangular or circular, but the cross-sectional shape of the passage 41a for accommodating the quadrangular chip component EC is the same as that of the chip component EC. A rectangle is preferably employed to prevent the posture from being disturbed. The component holder 41 is disposed on one surface side of an area where the transport belt 44 passes vertically.

The tip of the first pressing rod 42 is inserted into the insertion port 4
The first solenoid 43 is disposed in a state inserted into the first solenoid 43, and the base thereof is connected to the movable portion of the first solenoid 43. The first solenoid 43 is attached to the component holder 41.

The transport belt 44 comprises an endless belt.
It is wound around a pulley or a sprocket (not shown), and intermittently moves counterclockwise in the figure by an actuator (not shown) in accordance with the movement of the first pressing rod 42. The transport belt 44 is formed of an elastic material such as a soft resin or a synthetic rubber, and has elastic holes 44a for holding chip components at equal intervals in the length direction.

The support 45 supports the second solenoid 46, and the movable part of the second solenoid 46 is connected to the base of the second pressing rod 47. The support table 45 is disposed on one surface side of an area where the transport belt 44 passes in the vertical direction.

Hereinafter, a method of arranging the chip component EC on the component mounting surface of the circuit board CS using the device of the fifth embodiment will be described with reference to FIGS. 23A to 23D.

As shown in FIG. 23A, the component holder 4
The chip components EC accommodated in one passage 41a move downward by their own weight while being aligned in the longitudinal direction, and stop when the lowest chip component EC comes into contact with the bottom surface of the passage 41a.

When one of the elastic holes 44a of the transport belt 44 which moves intermittently in the counterclockwise direction in the figure stops at a position aligned with the discharge port 41b of the component holder 41, the operation shown in FIG.
As shown in (B), the first solenoid 43 causes the first
The pressing rod 42 is moved, and the passage 41 of the component holder 41 is moved.
a is pushed out from the outlet 41b, and the chip component EC is pushed out of the elastic hole 44 of the belt 44.
a. This part pushing operation
The conveyor belt 44 moves by a predetermined distance, and the empty elastic holes 44
This is carried out every time a stops at the part pushing position.

In the process of moving the conveyor belt 44 by a predetermined distance, as shown in FIG. 23C, the circuit board CS is moved using an XY table or the like, and the substrate of the circuit board CS on which the chip components EC are to be arranged. The position of the electrode SE is adjusted so as to coincide with the component arrangement position.

After the positioning, as shown in FIG. 23D, the second pressing rod 47 is moved by the second solenoid 46, and the chip component EC held in the elastic hole 44a of the conveyor belt 44 is moved to the second position. It is pushed out by the two pressing rods 47 and is arranged on the substrate electrode SE of the circuit board CS. If a paste-like bonding agent such as cream solder is applied on the substrate electrode SE in advance, the chip component EC is temporarily fixed by utilizing the viscosity of the bonding agent, and the chip component EC after the placement is arranged.
Can be prevented from being displaced. This component placement operation is performed every time the chip component EC held in the elastic hole 44a of the transport belt 44 stops at the component placement location.

As described above, according to the apparatus of the fifth embodiment, the lowermost chip component EC in the passage 41a of the component holder 41 is pushed out from the discharge port 41b to the outside by using the first push rod 42. Conveyor belt 4 for chip components EC
After being pushed into the elastic hole 44a of No. 4 and held elastically,
The chip components EC held in the elastic holes 44a of the conveyor belt 44 can be pushed out to the outside using the second push rods 47, and the chip components EC can be arranged at predetermined positions on the circuit board CS.

That is, the chip components EC can be sequentially arranged on the circuit board CS only by controlling the intermittent movement of the transport belt 44 and the reciprocating operation of the second push rod 47 for discharging components. Significantly shortened component placement time per component to speed up component placement, for example, 0.1 s
ec or less can be sufficiently followed. In addition, if components are replenished into the passage 41a from a bulk storage such as a hopper along with the component placement, the component placement can be continuously performed for a long time.

In the fifth embodiment, the chip component EC having the shape shown in FIGS. 1B and 1C is stored in the passage 41a of the component holder 41. A chip component having a shape other than these, an electronic component other than the chip component, for example, a composite component such as an LC filter or a network, or an integrated circuit component such as a semiconductor element is housed in the passage 41a and arranged on the target object. Is also possible.

Further, the circuit board C
Although S is shown, the device of the fifth embodiment can also be used as a device for sequentially inserting electronic components into the component storage recesses of the component tape. Of course, the same device can be used and the same operation and effect can be obtained even when components are arranged on an object other than the circuit board and the component tape.

[0089]

As described in detail above, according to the present invention,
With a simple configuration and operation, components can be arranged on an object such as a circuit board or component tape at a high speed cycle.

[Brief description of the drawings]

FIG. 1 is a side view of an apparatus showing a first embodiment of the present invention, and a perspective view of a chip component housed in a passage of a component holder.

FIG. 2 is an explanatory diagram of the operation of the device of the first embodiment.

FIG. 3 is a diagram showing a modified aspect of the component separator in the apparatus of the first embodiment.

FIG. 4 is a diagram showing a modified aspect of the component separator in the apparatus of the first embodiment.

FIG. 5 is a diagram showing a modified aspect of the component separator in the apparatus of the first embodiment.

FIG. 6 is a diagram showing a modification of the apparatus according to the first embodiment;

FIG. 7 is an explanatory diagram of the operation of the apparatus shown in FIG. 6;

FIG. 8 is a side view of an apparatus showing a second embodiment of the present invention.

FIG. 9 is a diagram illustrating the operation of the device according to the second embodiment.

FIG. 10 is an explanatory diagram of the operation of the device according to the second embodiment.

FIG. 11 is a diagram illustrating the operation of the apparatus according to the second embodiment.

FIG. 12 is a diagram showing a modified aspect of the component separator in the apparatus of the second embodiment.

FIG. 13 is a view showing a modified aspect of the component separator in the apparatus of the second embodiment.

FIG. 14 is a side view of an apparatus showing a third embodiment of the present invention.

FIG. 15 is a diagram illustrating the operation of the device according to the third embodiment.

FIG. 16 is a diagram illustrating the operation of the device according to the third embodiment.

FIG. 17 is a diagram showing a change mode of the component magazine in the apparatus according to the third embodiment.

FIG. 18 is a diagram showing a change mode of the component magazine in the apparatus according to the third embodiment.

FIG. 19 is a side view of an apparatus showing a fourth embodiment of the present invention.

FIG. 20 is an explanatory diagram of the operation of the device according to the fourth embodiment.

FIG. 21 is an explanatory diagram of the operation of the device according to the fourth embodiment.

FIG. 22 is a diagram showing a change mode of the component magazine in the apparatus according to the fourth embodiment.

FIG. 23 is a diagram showing the configuration and operation of an apparatus according to a fifth embodiment of the present invention.

[Explanation of symbols]

EC: chip component, CS: circuit board, 1: component holder,
1a ... passage, 1b ... outlet, 2 ... parts separator, 2b
... intake part, 2d, 2e ... suction holes, 4 ... parts separator,
4b: intake section, 4d: suction hole, 5: component separator, 5
b: intake part, 5c: electromagnet, 6: parts separator, 6b
... intake part, 6c ... electromagnet, 7 ... parts holder, 7a ... passage, 7b ... outlet, 8 ... parts separator, 8b ... intake part, 8d ... suction hole, 11 ... parts holder, 11a ... passage,
11b: outlet, 12: component separator, 12a: intake unit, 12b: electromagnet, 13: component separator, 13a ...
Intake part, 13b suction hole, 21 parts holder, 21a
Passageway, 21b ... intake part, 21c ... outlet, 21d ... suction hole, 22 ... part holder, 22a ... passage, 22b ... intake part, 22c ... outlet, 22d ... electromagnet, 31 ... part holder, 31a ... passage , 31b ... outlet, 31c ... outlet
31e: permanent magnet, 32: component holder, 32a: passage,
32b: outlet, 32c: outlet, 32e: electromagnet, 3
3 ... part holder, 33a ... passage, 33b ... discharge port, 33
c: outlet, 33e: suction hole, 41: component holder, 41
a: passage, 41b: discharge port, 42: first push rod, 4
3 ... first solenoid, 44 ... conveying belt, 44a ... elastic hole, 46 ... second solenoid, 47 ... second push rod.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Hajime Koyama 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Toshiyuki Kato 6-16-20 Ueno, Taito-ku, Tokyo Taiyo (72) Inventor Atsushi Kamimura 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Co., Ltd. (72) Inventor Kazunari Koyama 6-16-20, Ueno, Taito-ku, Tokyo Taiyo Induction F-term in Denki Co., Ltd. (reference) 3F070 AA14 CA09 EC01 5E313 AA03 AA22 CC08 CD05 DD41 EE24 EE37

Claims (5)

[Claims] 1. A component holder having a passage for accommodating a plurality of electronic components in an aligned state and movably under its own weight, and a discharge port for discharging the electronic component from its end by its own weight. A rotatable component separator including at least one intake unit for receiving the electronic component discharged by its own weight, and a suction unit capable of holding and releasing the electronic component captured by the intake unit, and rotating the component separator. An electronic component placement device, comprising: an actuator for driving. 2. A component holder having a passage for accommodating a plurality of electronic components in an aligned state and movably under its own weight, and a discharge port for discharging electronic components from the end of the passage under its own weight. A vertically movable component separator having a take-in portion for receiving electronic components discharged by its own weight and a suction portion capable of holding and releasing the electronic component taken in by the take-in portion, and reciprocatingly driving the component separator An electronic component placement apparatus, comprising: 3. A passage for accommodating a plurality of electronic components in an aligned state and movably under its own weight, and a take-in portion with an outlet provided adjacent to a front end of the passage for receiving a leading electronic component in the passage. An electronic component placement device, comprising: a suction portion that draws and holds a leading electronic component in a passage into a take-in portion and that can release the component holding. 4. A passage that houses a plurality of electronic components in an aligned state and movably under its own weight and has a discharge port corresponding to one component at the end of the path, and holds the first electronic component in the path at the discharge port position. An electronic component placement device, comprising: a suction part; and a gas outlet for applying gas pressure to a leading electronic component in a passage and discharging the gas from an outlet. 5. A component holder having a passage for accommodating a plurality of electronic components in an aligned state and movably under its own weight and having a passage having a discharge port corresponding to one component at a front end of the passage, and a leading electron in the passage of the component holder. A first extruding jig for extruding components from an outlet, a transport belt having an elastic hole for receiving and holding the electronic components extruded from the outlet of the component holder, and an electronic component held in the elastic holes of the transport belt An electronic component placement device, comprising: a second extruding jig for extruding the object to the outside and arranging the object on an object; and an actuator for reciprocatingly driving each of the first and second extruding jigs.