JP2000151193A - Mounting method and suction method for chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounting method in which impact onto a chip is minimized while reducing the size, weight and cost of an apparatus and a plurality of nozzles can be arranged in a head. SOLUTION: A chip mounting method employs a surface mounter comprising a nozzle 22 for sucking a chip, a first mechanism for elevating/lowering the suction nozzle 22, a head 8 for supporting the first elevating/lowering mechanism and the suction nozzle 22, a member 1 for supporting the head 8, and a second mechanism for elevating/lowering the head 8 relative to the head supporting member 1 using a servo motor 4. The head 8 is arranged at a predetermined height by the second elevating/lowering mechanism and then the suction nozzle 22 is lowered by means of the first elevating/lowering mechanism thus mounting the chip part at a specified position on a board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting minute electronic components (hereinafter, referred to as chip components) such as ICs, resistors, and capacitors on a substrate and a method for sucking chip components with a suction nozzle.

[0002]

2. Description of the Related Art In a surface mounter for mounting minute chip components on a substrate, the chip components are sucked by suction nozzles, and the suction nozzles are lowered by, for example, air pressure, whereby the chip suctioned by the suction nozzles is performed. The component is mounted at a predetermined position on the board.

As an apparatus for mounting chip components, for example, an apparatus has been proposed in which a nozzle for sucking components is moved up and down using a drive mechanism using two cams (Japanese Patent Laid-Open No. 2-63199). reference).

[0004]

However, in the mounting device according to the above proposal, a plurality of links are required, and only the mount head moves along the guide portion, so that the mounting device can be attached to and detached from the lifting mechanism. It is necessary to provide a coupling mechanism (roller, drive member), and there is a problem that the structure is complicated.

In the method of mounting components, a method of changing the rotation angle of the cam in order to correspond to the thickness of the component and thereby adjusting the vertical stroke is adopted.

However, in the above method, when the cam is adjusted in advance to shorten the elevating stroke, the roller is engaged with the driving member in a protruding state, and an impact at the time of engagement is applied to the tip of the nozzle. This causes the sucked parts to fall off. A method of adjusting the cam after the roller is engaged with the driving member is also conceivable, but this method reduces the mounting speed.

Accordingly, an object of the present invention is to minimize the impact on chip components and to reduce the size and size of the device.
It is an object of the present invention to provide a method for mounting a chip component that enables weight reduction, cost reduction and arrangement of a plurality of nozzles on a head.

Further, the object of the present invention is to make it possible to finely adjust the descending height and descending speed, and to minimize the shock at the time of suction to chip parts weak to shock or chip parts having different thicknesses. It is an object of the present invention to provide a method for adsorbing a chip component that can be performed.

[0009]

In order to achieve the above object, the present invention is directed to a suction nozzle for picking up a chip component, and a first lifting / lowering mechanism for raising / lowering the suction nozzle. A head for supporting the first elevating mechanism and the suction nozzle, a head supporting member for supporting the head, and a servomotor for elevating the head relative to the head supporting member. As a method of mounting a chip component using a surface mounter having a second lifting mechanism, the head is arranged at a predetermined height by the second lifting mechanism, and then the suction nozzle is mounted. Is lowered by the first raising / lowering mechanism to mount the chip component at a predetermined position on the substrate.

According to a second aspect of the present invention, there is provided a method of sucking a chip component using the surface mounting machine, wherein a suction nozzle is lowered to a predetermined height by a first raising / lowering mechanism.
And moving the head down by a second elevating mechanism to lower the height of the suction nozzle from the predetermined height to the chip component suction height. It is characterized by adsorption.

Therefore, according to the first aspect of the invention, the height of the head is adjusted according to the thickness of the chip component, so that the suction nozzle can be moved up and down by a predetermined stroke (for example, air pressure operation). Air cylinder mechanism), the impact on chip components can be minimized, and the structure of the head is simplified to reduce the size and weight of the device, reduce costs, and arrange multiple nozzles on the head. Can be possible. In the case where chip components are mounted on a plurality of types of substrates having different thicknesses, the stroke of the suction nozzle is kept constant by changing the height of the head by the second lifting / lowering mechanism when the type of the substrate changes. It is possible to mount the chip component on the substrate while keeping the same.

According to the second aspect of the present invention, the head and the suction nozzle supported by the head by the servomotor of the second raising / lowering mechanism in the second lowering step as the final lowering step at the time of component suction. Since the descending height and the descending speed can be finely adjusted, it is possible to minimize the impact at the time of suction to chip components that are vulnerable to impact or chip components having different thicknesses.

[0013]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a side view of a head portion of a surface mounter used in the method of the present invention, FIG. 2 is an enlarged fragmentary detailed view of the head portion of the surface mounter, and FIG. 3 is a mounting of a chip component according to the present invention. It is a flowchart which shows a method.

In FIG. 1, reference numeral 1 denotes a head support member. The head support member 1 is movably supported along two upper and lower rails 2 which are vertically and horizontally installed in FIG. A ball screw mechanism (not shown) driven by a servo motor (not shown) reciprocates in a direction perpendicular to the plane of FIG.

A servo motor 4 is attached to the head support member 1, and a ball screw 5 extends vertically downward from the servo motor 4. The lower end of the ball screw 5 is rotatable by a bearing member 6. It is supported by A slider 7 is screwed to the ball screw 5 so as to be vertically movable along the ball screw 5, and a head 8 is attached to the slider 7. The servo motor 4, the ball screw 5 and the slider 7 constitute a second elevating mechanism.

The head 8 is supported so as to be able to move up and down along a guide 9 mounted on the end surface (front surface) of the head support member 1 in a vertical direction. A hollow rod 10 is moved up and down by the head 8. It is movably supported. That is, FIG.
As shown in detail in FIG.
The upper and lower guide members 11 are supported by a piston member 13 movably up and down. The lower end of the piston member 13 is fitted to the outer periphery of the rod 10. A spring receiving member 14 that fits up and down is attached. And the piston member 13 is the head 8
Is vertically movably fitted in a cylinder 15 formed at the upper part of the cylinder 15, and a chamber 16 is formed above the piston member 13 in the cylinder 15. The chamber 16 is connected to a compressed air supply source (not shown) such as a compressor through an air hole 17 formed in the head 8, and the compressed air supply source, the rod 10, the guide members 11, 12, the piston member 13, spring receiving member 14, cylinder 15, chamber 1
6. The springs 18, 19 and the like constitute a first elevating mechanism.

A return spring 18 is contracted between the spring receiving member 14 and the lower guide member 12, and a small coil diameter is provided between the spring receiving member 14 and an intermediate portion of the rod 10. A spring 19 is interposed.
The rod 10 is slidable up and down with respect to the spring receiving member 14. The sliding is restricted by the stopper ring 20 fitted on the outer periphery of the rod being in contact with the upper surface of the spring receiving member 14. You.

FIG. 2 shows a state where the rod 10 is located at the upper limit. That is, in this state, the supply of the compressed air to the chamber 16 in the cylinder 15 is not performed, and the piston member 13 and the spring receiving member 14 are at the upper limit by receiving the elastic force of the retarder spring 18. At this time, since the spring receiving member 14 comes into contact with the stopper ring 20 to push up the rod 10 integrally, the rod 10 is also positioned at the upper limit as illustrated.

A nozzle support member 21 is attached to the lower end of the rod 10, and is connected to the nozzle support member 21.
Is provided with a suction nozzle 22. The suction nozzle 22 is connected to a vacuum source (not shown) via a vacuum hole 23 formed in the rod 10.

Next, a method for mounting a chip component according to the present invention using the present surface mounter will be described with reference to the flowchart of FIG.

When the suction nozzle 22 is at the upper limit position as shown in FIG. 2, the servomotor 4 of the second lifting / lowering mechanism is driven to raise the entire head support member 1 along the guide 9 (FIG. 3). Step 1). That is, when the servo motor 4 is driven to rotate the ball screw 5, the slider 7 screwed with the servo motor 4 moves upward along the guide 9, so that the head supporting member 1 supported by the slider 7 is raised.

When the head supporting member 1 is raised as described above, the suction nozzle 22 is integrally raised with the suction nozzle 22 positioned at the upper limit.

Next, if compressed air is supplied to the chamber 16 of the head 8 from a compressed air supply source (not shown), the piston member 13 and the spring receiving member 14 of the first lifting / lowering mechanism receive air pressure and descend. , And stops in a state where the spring receiving member 14 contacts the stopper 24. Then, the spring 19 interposed between the spring receiving member 14 and the rod 10 is
The rod 10 is compressed by the spring 1
9, the suction nozzle 22 attached to the lower end of the rod 10 also descends as shown by a chain line in FIG. 2 (Step 2 in FIG. 3).

If the servo motor 4 is restarted in the above state and the ball screw 5 is reversed, the entire head supporting member 1 descends along the guide 9 (step 3 in FIG. 3).
The suction nozzle 22 is also integrally lowered by a predetermined amount, and suctions the chip component W set immediately below the suction nozzle 22 (Step 4 in FIG. 3).

As described above, when the chip component W is
2, the servo motor 4 is driven as described above to raise the entire head support member 1 by a predetermined amount (step 5 in FIG. 3), and the chip component W in that state is image-recognized (FIG. 3). Step 6 of 3).

Since the distance between the chip component W and the substrate (not shown) is accurately determined in advance from the component dimensions, the servo motor 4 is driven to lower the entire head support member 1 by a predetermined amount. (Step 7 in FIG. 3), the chip component W is also lowered by the same amount.
Is mounted at a predetermined position on the substrate set below the substrate (step 8 in FIG. 3). Then, when the supply of the compressed air to the chamber 16 of the head 8 is cut off after the mounting, the piston member 13 and the spring receiving member 14 are raised by the return slipper ring 18, and at this time, the spring receiving member 1
In step 4, the suction nozzle 22 is raised to contact the stopper ring 20 to push up the rod 10 integrally (step 9 in FIG. 3), and one cycle of the mounting operation is completed.

As described above, according to the mounting method of the present invention, the height of the head 8 is adjusted according to the thickness of the chip component W, so that the suction nozzle 22 can be moved up and down by a first stroke of a predetermined stroke. Of the chip component 22
The impact on the head can be minimized, and the configuration of the head 8 can be simplified to reduce the size and weight of the apparatus, reduce the cost, and arrange a plurality of nozzles on the head.

When the chip component W is mounted on a plurality of types of substrates having different thicknesses, the suction nozzle is changed by changing the height of the head 8 by the second raising / lowering mechanism when the type of the substrate changes. The chip component W can be mounted on the substrate while keeping the stroke of 22 constant.

Next, another embodiment of a mounting method using the surface mounting machine will be described with reference to a flowchart shown in FIG.

That is, in the present embodiment, first, the suction nozzle 22 is lowered by the first lifting / lowering mechanism using the air pressure (step 1 in FIG. 4), and the chip component W is suctioned to the tip thereof (step 1 in FIG. 4). After step 2), the suction nozzle 22 is raised (step 3), and the chip component W sucked by the suction nozzle 22 is image-recognized (step 4).

Thereafter, the height position of the head 8 is corrected by a second lifting / lowering mechanism using the servomotor 4 (step 5), and when the suction nozzle 22 is lowered, the chip sucked by the suction nozzle 22 is moved. The head 8 is fixed at a position where the component W just touches the substrate without impact. And
With the height position of the head 8 fixed, the suction nozzle 22 is lowered by air pressure by the first elevating mechanism (step 6), and the chip component W sucked by the suction nozzle 22 is mounted on the substrate. (Step 7) Almost no impact is applied to the chip component W during mounting. Thereafter, if the suction nozzle 22 is raised in the same manner as described above (step 8),
The mounting operation is completed, and in this embodiment, the same effects as those obtained in the above-described embodiment can be obtained, and the mounting time is shortened compared to the above-described embodiment. Can be realized.

Accordingly, the user can select the mounting method shown in FIG. 3 for mounting chip components that are vulnerable to impact.

As described above, in the present embodiment, the head 8 and the suction nozzle 22 supported by the head 8 are supported by the servomotor 4 of the second lifting / lowering mechanism in the final lowering step at the time of suction of the chip component W. And the descending speed can be finely adjusted, so that the impact at the time of suction to the chip component W or the chip component having a different thickness that is vulnerable to impact can be minimized.

[0035]

As is apparent from the above description, claim 1
According to the described invention, by adjusting the height of the head according to the thickness of the chip component, the suction nozzle is moved up and down by a predetermined stroke elevating mechanism (for example, an air cylinder mechanism operated by air pressure). In addition, the impact on the chip component can be minimized, and the configuration of the head can be simplified to reduce the size and weight of the device, reduce the cost, and arrange a plurality of nozzles on the head. or,
When mounting chip components on a plurality of types of substrates having different thicknesses, the stroke of the suction nozzle was kept constant by changing the height of the head by the second lifting / lowering mechanism when the type of substrate changed. As it is, mounting of the chip component on the substrate becomes possible.

According to the second aspect of the present invention, the head and the suction nozzle supported by the servomotor of the second lifting / lowering mechanism in the second lowering step as the final lowering step at the time of picking up parts. Since the descending height and the descending speed can be finely adjusted, it is possible to minimize the impact at the time of suction to chip components that are vulnerable to impact or chip components having different thicknesses.

[Brief description of the drawings]

FIG. 1 is a side view of a head portion of a surface mounter used in the method of the present invention.

FIG. 2 is an enlarged cutaway detailed view of a head portion of the surface mounter used in the method of the present invention.

FIG. 3 is a flowchart showing a mounting method of a chip component according to the present invention.

FIG. 4 is a flowchart showing a chip component mounting method and a suction method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head support member 4 Servo motor 5 Ball screw 7 Slider 8 Head 10 Rod 11, 12 Guide member 13 Piston member 14 Spring receiving member 15 Cylinder 16 Room 18 Return spring 19 Spring 22 Suction nozzle W Tip part

Claims (2)

[Claims] A suction nozzle for sucking a chip component;
A first elevating mechanism for moving the suction nozzle up and down, a head supporting the first elevating mechanism and the suction nozzle, a head supporting member supporting the head, and the head supporting the head A second elevating mechanism using a servomotor for elevating and lowering a member relative to a member. A method of mounting a chip component using a surface mounter, comprising: Mounting the chip component at a predetermined position on a substrate by lowering the suction nozzle by the first raising / lowering mechanism after disposing the chip component at a predetermined height by a lifting / lowering mechanism; Method. 2. A suction nozzle for picking up chip components,
A first elevating mechanism for moving the suction nozzle up and down, a head supporting the first elevating mechanism and the suction nozzle, a head supporting member supporting the head, and the head supporting the head A chip component suctioning method using a surface mounter including a second lifting / lowering mechanism using a servomotor for raising / lowering a member relatively to the member, wherein the suction nozzle is provided in the first position. A first lowering step of lowering the head to a predetermined height by an elevating mechanism, and lowering the head by the second elevating mechanism to lower the height of the suction nozzle from the predetermined height to a chip component suction height. A chip component suction method, wherein the chip component is suctioned by the suction nozzle through a second descending step.