JP3216727B2 - Surface mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to minute electronic components such as ICs, resistors, capacitors and the like (hereinafter referred to as chip components).
The present invention relates to a surface mounter that mounts a substrate on a substrate.

[0002]

2. Description of the Related Art In a surface mounter for mounting minute chip components on a substrate, the chip components are sucked by suction nozzles, and the suction nozzles are lowered by, for example, air pressure, whereby the chip suctioned by the suction nozzles is performed. The component is mounted at a predetermined position on the board.

[0003]

However, in the above-mentioned conventional surface mounter, the height position of the suction nozzle cannot be adjusted, and the suction nozzle is moved up and down by a predetermined stroke by air pressure. Since the stroke and speed are uncontrollable, depending on the thickness of the chip component (especially when the thickness is large), an impact force is applied to the chip component at the time of mounting, and various problems occur. However, there is a problem that it is not possible to flexibly respond to changes in the height position.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a purpose thereof is to efficiently and efficiently mount a chip component having an arbitrary thickness set at an arbitrary height position. It is an object of the present invention to provide a surface mounting machine capable of performing the above.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a suction nozzle for picking up chip components, a first lifting / lowering mechanism for raising / lowering the suction nozzle by air pressure, and A first supporting mechanism for supporting the first lifting mechanism and the suction nozzle, a head supporting member for supporting the head, and a servomotor for vertically moving the head relative to the head supporting member; It is configured to include a second lifting and lowering mechanism for weak chip components to an impact, increasing the head by the second lifting and lowering mechanism
Then, the second lifting mechanism moves the suction nozzle.
Lower the chisel, and in this state, use the second lifting mechanism.
To lower the head and suck the chip components with the suction nozzle
Then, the head is lowered by the second lifting mechanism.
The chip components adsorbed by the suction nozzle on the board
And, for the strong chip component to impact the first by a lifting and lowering mechanism lowers the suction nozzle adsorption with nozzle
After picking up the chip components with the
Then, the height of the head is increased by the second elevation mechanism.
The suction nozzle when the suction nozzle is lowered.
The chip components adsorbed by the landing nozzle are
Fix the head at the position where it touches
The suction nozzle is lowered by the lifting mechanism
The mounted chip component is mounted on a substrate .

[0006]

According to the present invention, a chip component and a strong chip
Adsorption and implementation have chip components is done by the suction nozzle by a second lifting and lowering mechanism using a servo motor is caused to move up and down, in this case, the second elevation motion positioning of the suction nozzle using a servo motor Since it is arbitrarily and accurately performed by the mechanism, a chip component having an arbitrary thickness set at an arbitrary height position can be mounted on a substrate with almost no impact.

[0007] Further, it is possible to arbitrarily adjust even acceleration and deceleration of the lifting and lowering of the suction nozzle by a second lifting and lowering mechanism using a servo motor, it is possible to soft-stop and speed of adsorption nozzles, in particular Chip components resistant to impact
The second lifting and lowering motive only for head height position correction
Since the structure is used, high efficiency is realized by shortening the mounting time in addition to reducing the impact on the chip component.

[0008]

An embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a side view of a head portion of a surface mounter according to the present invention, FIG. 2 is an enlarged fragmentary detailed view of the head portion of the surface mounter, and FIG. 3 is a flowchart showing a procedure for mounting chip components.

In FIG. 1, reference numeral 1 denotes a head support member, and the head support member 1 is movably supported along two upper and lower rails 2, which are long and horizontally installed in the direction perpendicular to the plane of FIG. A ball screw mechanism (not shown) driven by a servo motor (not shown) reciprocates in a direction perpendicular to the plane of FIG.

A servo motor 4 is attached to the head support member 1, and a ball screw 5 extends vertically downward from the servo motor 4. The lower end of the ball screw 5 is rotatable by a bearing member 6. It is supported by A slider 7 is screwed to the ball screw 5 so as to be vertically movable along the ball screw 5, and a head 8 is attached to the slider 7. The servo motor 4, the ball screw 5 and the slider 7 constitute a ball screw mechanism.

The head 8 is supported so as to be able to move up and down along a guide 9 mounted on the end surface (front surface) of the head support member 1 in a vertical direction. A hollow rod 10 is moved up and down by the head 8. It is movably supported. That is, FIG.
As shown in detail in FIG.
A piston member 13 is fitted on the outer periphery of the upper guide member 11 so as to be able to move up and down, and the lower end of the piston member 13 is fitted on the outer periphery of the rod 10. A spring receiving member 14 that fits up and down is attached. And the piston member 13 is the head 8
Is vertically movably fitted in a cylinder 15 formed at an upper portion of the cylinder 15, and a chamber 16 is formed above the piston member 13 in the cylinder 15. The chamber 16 is connected to a compressed air supply source (not shown) such as a compressor through an air hole 17 formed in the head 8.

A return spring 18 is contracted between the spring receiving member 14 and the lower guide member 12, and a small coil diameter is provided between the spring receiving member 14 and an intermediate portion of the rod 10. A spring 19 is interposed.
The rod 10 is slidable up and down with respect to the spring receiving member 14. The sliding is restricted by the stopper ring 20 fitted on the outer periphery of the rod being in contact with the upper surface of the spring receiving member 14. You.

FIG. 2 shows a state in which the rod 10 is located at the upper limit. That is, in this state, the supply of the compressed air to the chamber 16 in the cylinder 15 is not performed, and the piston member 13 and the spring receiving member 14 are at the upper limit by receiving the elastic force of the retarder spring 18. At this time, since the spring receiving member 14 comes into contact with the stopper ring 20 and pushes up the rod 10 integrally, the rod 10 is also positioned at the upper limit as shown in the figure.

A nozzle support member 21 is attached to the lower end of the rod 10, and the nozzle support member 21 is
Is provided with a suction nozzle 22. The suction nozzle 22 is connected to a vacuum source (not shown) via a vacuum hole 23 formed in the rod 10.

Next, a procedure for mounting a chip component using the surface mounter will be described with reference to the flowchart of FIG.

With the suction nozzle 22 at the upper limit position as shown in FIG. 2, the servo motor 4 is driven to raise the head 8 along the guide 9 (step 1 in FIG. 3).
That is, when the servo motor 4 is driven to rotate the ball screw 5, the slider 7 screwed to the servo motor 4 moves upward along the guide 9, so that the head 8 supported by the slider 7 rises.

When the head 8 moves up as described above, the suction nozzle 22 moves up integrally with the head at the upper limit.

Next, when compressed air is supplied to the chamber 16 of the head 8 from a compressed air supply source (not shown), the piston member 13 and the spring receiving member 14 are lowered by receiving air pressure, and the spring receiving member 14 is stopped by the stopper. It stops in a state of contact with 24. Then, since the spring 19 interposed between the spring receiving member 14 and the rod 10 is compressed by the spring receiving member 14, the rod 10 receives the compression reaction force of the spring 19 and descends, and the lower end of the rod 10 The suction nozzle 22 attached to the nozzle also descends as shown by the dashed line in FIG.
Step 2).

If the servo motor 4 is restarted in the above state to reverse the ball screw 5, the head 8 descends along the guide 9 (step 3 in FIG. 3).
2 also descends by a predetermined amount, and sucks the chip component W set immediately below it (step 4 in FIG. 3).

As described above, when the chip component W is
2, the servo motor 4 is driven to raise the head 8 by a predetermined amount (step 5 in FIG. 3), and the chip component W in this state is image-recognized (step in FIG. 3). 6).

Since the distance between the chip component W and the substrate (not shown) is accurately determined in advance from the component dimensions, the servo motor 4 is driven to lower the head 8 by a predetermined amount (see FIG. 3), the chip component W is also lowered by the same amount, and the chip component W is mounted at a predetermined position on the substrate set below the chip component W (FIG. 3).
Step 8). When the supply of the compressed air to the chamber 16 of the head 8 is cut off after the mounting, the piston member 13
The spring receiving member 14 is lifted by the return spring 18. At this time, the spring receiving member 14 comes into contact with the stopper ring 20 to push up the rod 10 integrally, so that the suction nozzle 22 is raised (step 9 in FIG. 3). ), One cycle of the mounting operation is completed.

As described above, according to the present embodiment, the suction and mounting of the chip component W are performed by moving the head 8 and the suction nozzle 22 up and down by the ball screw mechanism using the servomotor 4. In this case, Since the positioning of the suction nozzle 22 is arbitrarily and accurately performed by the ball screw mechanism, and the acceleration and deceleration of the vertical movement of the suction nozzle 22 are arbitrarily adjusted by the ball screw mechanism, and the suction nozzle 22 can be soft-stopped. A chip component W having an arbitrary thickness set at an arbitrary height can be mounted on a substrate without impact. Therefore, the mounting method according to the present embodiment is particularly effective for mounting chip components that are vulnerable to impact, and can mount chip components without impact. The adverse effect on other chip components already mounted on the chip can be eliminated.

Next, another embodiment of the mounting procedure by the surface mounting machine will be described with reference to the flowchart shown in FIG.

That is, in this embodiment, first, the suction nozzle 22 is lowered by air pressure (Step 1 in FIG. 4), and the chip component W is sucked at the tip thereof (Step 2). Is raised (Step 3), and the chip component W sucked by the suction nozzle 22 is image-recognized (Step 4).

Thereafter, the height position of the head 8 is corrected by a ball screw mechanism using the servomotor 4 (step 5 ), and when the suction nozzle 22 is lowered, the chip component W sucked by the suction nozzle 22 is removed from the substrate. The head 8 is fixed at a position where the head 8 just touches the top without impact. Then, the suction nozzle 22 is lowered by air pressure while the height position of the head 8 is fixed (Step 6), and the chip component W sucked by the suction nozzle 22 is mounted on the substrate (Step 7). At the time of mounting, almost no impact is applied to the chip component W. Thereafter, if the suction nozzle 22 is raised in the same manner as described above (step 8), the mounting operation is completed.
In this embodiment, the same effects as those obtained in the above-described embodiment can be obtained, and the mounting time can be shortened as compared with the above-described embodiment, so that the mounting efficiency can be increased.

Therefore, the user can select the mounting method shown in FIG. 3 for mounting a chip component that is vulnerable to impact, and FIG. 4 for mounting a chip component that can withstand some impact. The mounting time can be shortened by selecting the method shown in FIG.

[0028]

As is apparent from the above description, according to the present invention, a suction nozzle for picking up chip components, a first lifting / lowering mechanism for raising / lowering the suction nozzle by air pressure, and A head for supporting the first elevating mechanism and the suction nozzle, a head support member for supporting the head,
It is configured to include a second elevation motion mechanism using a servo motor for relatively lifting movement of the head relative to the head support member, relative to weak chip components to an impact, the second lift The head is raised by a moving mechanism.
After squeezing, the suction nozzle is moved by the second lifting mechanism.
And in this state the second lifting mechanism
Lower the head and suck the chip components with the suction nozzle
Then, the head is lowered by the second lifting mechanism.
The chip components adsorbed by the suction nozzle on the board
And, for the strong chip component to impact the first by a lifting and lowering mechanism lowers the suction nozzle adsorption with nozzle
After picking up the chip components with the
Then, the height of the head is increased by the second elevation mechanism.
The suction nozzle when the suction nozzle is lowered.
The chip components adsorbed by the landing nozzle are
Fix the head at the position where it touches
The suction nozzle is lowered by the lifting mechanism
Effect that wear chips components for you to implement on a substrate, any of which is set to an arbitrary height position location the thickness of the chip component with no impact, and can be efficiently mounted on a substrate Is obtained.

[Brief description of the drawings]

FIG. 1 is a side view of a head portion of a surface mounter according to the present invention.

FIG. 2 is an enlarged cutaway detailed view of a head portion of the surface mounter according to the present invention.

FIG. 3 is a flowchart showing a procedure for mounting a chip component.

FIG. 4 is a flowchart illustrating another embodiment of a mounting procedure of a chip component.

[Explanation of symbols]

 4 Servo motor 5 Ball screw 8 Head 22 Suction nozzle

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-2979898 (JP, A) JP-A-1-177931 (JP, A) JP-A-61-67986 (JP, A) 261899 (JP, A) Hikaru 1-110026 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (1)

(57) [Claims] A suction nozzle for sucking a chip component;
A first elevating mechanism for moving the suction nozzle up and down by air pressure, a head supporting the first elevating mechanism and the suction nozzle, a head supporting member supporting the head, and the head wherein it is configured to include a second elevation motion mechanism using a servo motor for relatively move up and down relative to the head support member, relative to weak chip components to an impact, by the second lifting and lowering mechanism After raising the head, the second raising
The suction nozzle is lowered by the lowering mechanism,
The head is lowered by the second lifting mechanism in
The chip component is sucked by the arrival nozzle, and then moved up and down for the second time
The head is lowered by the mechanism and sucked by the suction nozzle.
And the chip components mounted on a substrate, for strong chip component to impact the first is lowered the suction nozzle by lifting and lowering mechanism in the adsorption nozzle
After sucking the chip parts, raise the suction nozzle and
After that, the height position of the head is
When the suction nozzle is lowered, the suction nozzle
The chip components adsorbed on the board just touch the board without impact
The head is fixed in a position where
The suction nozzle is lowered by the moving mechanism
A surface mounter characterized by mounting chip components on a substrate .