JP2000150465A - Dry etching method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide good high-speed characteristics, good selectivity against base material, and low damage characteristics, by etching a silicon compound layer on a substrate with an etching gas comprising a saturated fluoro carbon compound comprising an annular part at least at a part of molecular structure while the substrate to be etched is controlled for cooling. SOLUTION: Related to a saturated fluoro carbon compound c-CnF2n comprising an annular part at a part of molecular structure, the number of fluorine atoms is less by two for a single molecule compared to a straight chain saturated fluoro carbon compound CnF2n+2 if the number of carbons is equal. So, C/F ratio of etching reaction system is lowered with no extra additive gas. A cooling piping of a reactive ion etching device is set on an incorporated wafer placement electrode, a coolant is supplied to the cooling piping from a cooling device for circulation, so that the temperature of wafer during etching is controlled to 50 deg.C or below. Thus, fast etching is possible with high selectivity, high anisotropism, and low damage characteristics.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dry etching method applied to the manufacture of semiconductor devices, and more particularly to a dry etching method for a silicon compound layer which is excellent in selectivity with respect to a resist and selectivity with respect to a silicon underlayer, and has high speed and low particle contamination. It relates to an etching method.

[0002]

2. Description of the Related Art Conventionally, as the integration and performance of semiconductor devices such as VLSI and ULSI have been improved, the fineness and high precision of the dry etching method of a silicon compound layer such as silicon oxide have been increased. Has been requested.

First, since the area of device chips has been increased due to high integration, and the wafer to be formed has a large diameter, the pattern to be formed has been miniaturized. Dry etching apparatuses range from batch type to single wafer type. In order to maintain productivity while adopting such a single wafer type,
A drastic improvement in the etching rate is required.

In addition, if the junction depth of the impurity diffusion region becomes shallower and the thickness of various deposited films becomes thinner in order to increase the speed and miniaturization of the device, an etching technique which is excellent in selectivity to a base and causes less damage is required. . For example, when a contact is to be formed in an impurity diffusion region formed in a semiconductor substrate or a source / drain region of a PMOS transistor used as a resistance load element of an SRAM,
An example thereof is etching of a silicon oxide interlayer insulating film which is performed using a silicon substrate or a polycrystalline silicon layer as a base.

[0005] Further, improvement of the selectivity to resist is also an important issue. In submicron devices, the occurrence of slight dimensional change due to resist receding is becoming unacceptable.

Conventionally, in order to dry-etch a silicon compound layer such as silicon oxide while maintaining a high selectivity with respect to a silicon-based material layer, a CHF ₃ , CF ₄ / H ₂ mixed system, CF ₄ / O ₂ mixed system has been used. , C ₂ F ₆ / CHF ₄ mixed system or the like uses an etching gas. Each of these is mainly composed of a fluorocarbon gas having a C / F ratio (ratio of the number of carbon atoms to the number of fluorine atoms in a molecule) of 0.25 or more. These gas systems are used because (a) C contained in the fluorocarbon-based gas forms a bond of C—O on the surface of the silicon oxide layer and cuts or weakens the Si—O bond. (B) it can generate CF _x ⁺ (particularly CF ₃ ⁺ ), which is the main etching species of the silicon oxide layer;
(C) Since a relatively carbon-rich state is created in the plasma, the oxygen in the silicon oxide is reduced to CO or CO
C, H, F contained in the gas system while being removed in the form of _2.
This is based on the reason that the carbon-based polymer is deposited on the surface of the silicon-based material layer and the etching rate is reduced due to the contribution of the silicon-based material layer, and a high selectivity to the silicon-based material layer is obtained.

The above-mentioned added gases such as H ₂ and O ₂ are used for the purpose of controlling the selectivity, and can reduce or increase the amount of F ^* generated. That is, it has the effect of controlling the apparent C / F ratio of the etching reaction system.

On the other hand, the applicant of the present application has previously filed Japanese Patent Application No. Hei.
No. 75828 proposes a dry etching method for a silicon compound layer using a saturated or unsaturated chain-like higher-order fluorocarbon-based gas having 2 or more carbon atoms. This is because CF _x ^{* is} obtained by using a higher-order fluorocarbon-based gas such as C ₂ F ₆ , C ₃ F ₈ , C ₄ F ₁₀ and C ₄ F ₆ ^.
Is efficiently generated, and the etching speed is increased. However, if the higher-order fluorocarbon-based gas is used alone, the selectivity to resist and the selectivity to silicon underlayer cannot be made sufficiently large. For example, C ₃
When the silicon oxide layer on the silicon substrate is etched using F ₈ as an etching gas, high speed is achieved, but the selectivity to resist is as low as about 1.3, the etching resistance is insufficient, and the edge of the pattern edge is insufficient. A dimensional conversion difference occurs due to the retreat. Further, since the selectivity with respect to silicon is about 4.1, there remains a problem in over-etching resistance. Therefore, in order to solve these problems, in the above prior art, the etching using the chain-like higher fluorocarbon gas alone is stopped immediately before the base is exposed, and the carbon-based polymer is etched when the remaining portion of the silicon compound layer is etched. Two-stage etching is performed in which a hydrocarbon-based gas is further added to this gas in order to promote the deposition of the gas.

If the design rule of the semiconductor device is further miniaturized, the dimensional conversion difference from the etching mask becomes almost unacceptable. It is necessary to further improve the selectivity. As further miniaturization proceeds, it is conceivable that the influence of particle contamination by the carbon-based polymer may occur. Therefore, the amount of deposition gas such as hydrocarbon-based gas used in the second-stage etching is also reduced as much as possible. There is a need.

Accordingly, the applicant of the present application has previously filed Japanese Patent Application No. Hei.
In the specification of Japanese Patent No. 95225, the temperature of the substrate
A technique is disclosed in which a silicon compound layer is etched using a chain unsaturated fluorocarbon-based gas having at least one unsaturated bond in a molecule while controlling the temperature at a temperature of not more than ° C. Since the chain unsaturated fluorocarbon-based gas theoretically generates two or more CF _x ^* from one molecule by discharge dissociation, silicon oxide can be etched at high speed. In addition, since it has an unsaturated bond in the molecule, it is easy to generate a highly active radical by dissociation, and promotes the polymerization of the carbon-based polymer. Moreover, since the temperature of the substrate to be processed is controlled to 50 ° C. or less, the deposition of the carbon-based polymer is promoted. Therefore, selectivity to resist and selectivity to silicon underlayer can be improved.

[0011] Further, in the same specification, the etching with the chain unsaturated fluorocarbon-based gas alone is stopped halfway in the silicon compound layer, and the remaining etching is carried out with the hydrocarbon-based gas in the chain unsaturated fluorocarbon-based gas. A technique performed using a gas to which is added is also disclosed. In this method, a deposition gas is used in the middle of the etching in order to further improve the selectivity to the underlying silicon.

Further, hexafluorobenzene (C ₆ F ₆ )
Japanese Patent Publication No. 1-6093 discloses a technique for etching silicon oxide with a mixed gas of methane and tetrafluoromethane (CF ₄ ).
No. 8 discloses this. This is to use a cyclic unsaturated higher-order fluorocarbon-based gas to efficiently generate CF _x ^* in the plasma and promote the polymerization of the carbon-based polymer.

[0013]

The technique of using a chain unsaturated fluorocarbon-based gas or a cyclic unsaturated fluorocarbon-based gas, which has been conventionally proposed, has a sufficient selectivity as apparent from the above description. In order to obtain the above, it is practically necessary to use it in combination with another additive gas.

Further, according to the technique using C ₆ F ₆ , as described in the gazette which discloses the technique, it is impossible to form an etching gas by C ₆ F ₆ alone. This is because C ₆ F ₆ alone generates a remarkably large amount of CF _x ^{* in the} plasma, and excessively promotes the polymerization of the carbon-based polymer so that the etching reaction does not proceed. Therefore, this CF
_In order to suppress the generation of _x ^* , CF ₄ having the lowest C / F ratio among the fluorocarbon gases is mixed.

Therefore, even if a cyclic higher-order fluorocarbon-based gas is used, it is advantageous to select a compound which can be used alone in order to improve controllability and stability of etching.

Therefore, the present invention examines a cyclic high order fluorocarbon-based gas as a dry etching gas for a silicon compound layer, and examines high speed, selectivity to base, selectivity to resist, low contamination, and low damage. It is an object of the present invention to provide a novel dry etching method which is excellent in quality.

[0017]

The dry etching method according to the present invention is proposed to achieve the above-mentioned object, and includes a saturated fluorocarbon compound having a cyclic portion in at least a part of the molecular structure. Using the etching gas, the silicon compound layer formed on the substrate is etched while controlling the cooling of the substrate to be etched by the cooling medium supplied from the cooling means.

Further, according to the present invention, an etching gas containing an unsaturated fluorocarbon-based compound having a cyclic portion in at least a part of its molecular structure is used, and the substrate to be etched is controlled by a cooling medium supplied from a cooling means to control the substrate. The silicon compound layer formed above is etched.

In the following description, when the above-mentioned saturated or unsaturated fluorocarbon compound is represented by a general formula, it is cyclic in order to avoid confusion with a chain unsaturated fluorocarbon compound. C
-Is attached to the head.

First, the saturated fluorocarbon compound used in the present invention is represented by the general formula c-C _n F _2n (where n is 3)
Represents the above integer. And a typical example thereof is a monocyclic compound represented by the following chemical formula 1.

[0021]

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Here, F in the center of the carbocycle in each structural formula indicates that all hydrogen atoms of hydrocarbons having the same carbon skeleton are substituted with fluorine atoms. Hereinafter, this description method is adopted in the description.

In Chemical formula 1, each compound having a 3- to 7-membered ring is exemplified, but any compound having a larger carbon ring may be used as long as it is technically feasible and can be stably present.

Further, as a structural isomer of the monocyclic compound, a compound having a perfluoroalkyl group in the side chain as shown in the following chemical formula 2 is also exemplified.

[0025]

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In chemical formula 2, the case where the side chain is a trifluoromethyl group is exemplified. Since these are all liquids at normal temperature and normal pressure, it is necessary to perform heating or bubbling using an inert gas or the like in order to introduce them into the etching reaction system.

The unsaturated fluorocarbon used in the present invention is
The carbon-based compound has the general formula c-C _nF_y(However, n is 3
It represents the above integer and satisfies the condition of y ≦ 2n−2. )so
Represented by a monocyclic ring represented by the following chemical formula 3.
Examples are based compounds.

[0028]

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[0029] Formula 3 In has been illustrated each compound _{c-C n} F _2n-2 3-6 membered ring one have a double bond in the carbocyclic ring, manufacture technically possible and stably exist As long as the compound is obtained, it may have a larger carbon ring.
Also, the number of unsaturated bonds in the carbocycle is not particularly limited to one, but as described above, C ₆ F ₆ (C / F ratio =
Considering that 1) alone cannot constitute an etching gas, it is not desirable that the C / F ratio is extremely increased due to the presence of too many unsaturated bonds in the molecule. Therefore, it is desirable that the C / F ratio is less than 1 in practical use.

Further, as the structural isomers of the above-mentioned unsaturated fluorocarbon compounds, those having a perfluoroalkyl group bonded to the above-mentioned unsaturated ring and those having an unsaturated ring such as a perfluorovinyl group on the unsaturated ring are mentioned. One having a chain bonded thereto, one having an unsaturated chain such as a perfluorovinyl group bonded to a saturated ring, and the like are conceivable.

By the way, it may be mixed as appropriate with mixing either, or other gases from each other depending on c-C _n F _2n or object c-C _n F _y in the present invention. Further, the etching process may be divided into multiple stages, and different gas systems may be used in each stage.

For example, in terms of the C / F ratio, c-C _n F _2n
Is advantageous in achieving high speed in comparison with c-C _n F _y, the c-C _n F _y Conversely advantageous in achieving high selectivity in comparison with c-C _n F _2n . Therefore, (i) c-C _n F _2n
Performed at high speed at a low temperature etching, or (b) alone gas system of c-C _n F _2nn the etching of the silicon compound layer until just before the base is exposed with a mixed gas system was added a small amount of c-C _n F _y in, the remainder of the etching and over-etching and a two-step etching process performed with a high selectivity in a mixed gas system of c-C _n F _2n and c-C _n F _y silicon-based compounds are employed.

[0033] Alternatively, it is possible to employ also a process for performing the two-step etching, the second half of the etching by a mixed gas system of the deposition gas and c-C _n F _2n (iii) above (b).

Further, c-C _n F _2n and c-C _n F _y, since both compared with linear saturated fluorocarbon compounds C _n F _{2n + 2} is intended to reduce the etch rate, C the _n F _{2n + 2} mainly of etching gas, it is possible to use c-C _n F _2n or c-C _n F _y as an additive gas thereto. Examples of this are (d) C _n F _{2n + 2}
C _n F _2n or c-C _n F _y cold etching using a mixed gas, at high speed (e) until just before the base is exposed silicon compound layer etching alone gas system of c-C _n F _{2n + 2} with 2 step is performed, performing with a high selectivity by a mixed gas system of the etching and overetching of the remaining portion c-C _n F _{2n + 2} and c-C _n F _2n or c-C _n F _y silicon compound There are processes such as etching.

[0035]

The etching gas used in the present invention contains a saturated or unsaturated fluorocarbon-based gas having a cyclic portion in at least a part of its molecular structure. Since these gases have three or more carbon atoms in one molecule, the amount of CF _x ⁺ generated from one molecule is greater than or equal to that of the higher order fluorocarbon gas proposed by the present applicant. . Therefore, the speed of the etching can be increased. Further, when such a gas is dissociated by plasma discharge, monoradicals or, in some cases, highly active biradicals (binary free radicals) such as carbene are also generated, and these attack the π-electron system in the unsaturated bond. This promotes the polymerization of the carbon-based polymer. This carbon-based polymer
When deposited on the surface of a silicon-based material layer such as single-crystal silicon or polycrystalline silicon or on the surface of a resist pattern, it is not easily removed by ion bombardment or the like. Oxygen contained therein is easily removed because it is sputtered out and contributes to decomposition of the carbon-based polymer. Therefore, as the deposition of the carbon-based polymer increases, the selectivity to resist and the selectivity to silicon underlayer improve.

Here, if the C / F ratio is too small, excess F
^* Lowers the selectivity to base or resist.
Conventionally, H ₂ or a deposition gas has been added to increase the C / F ratio of the etching reaction system. However, the present invention does not require the additional gas to be used in combination as the etching gas for the fluorocarbon gas. An attempt is made to increase the C / F ratio by using a carbon skeleton different from the conventional one.

That is, the saturated fluorocarbon compound c having a cyclic portion in a part of the molecular structure used in the present invention.
-C _n F _2n is, two small number of fluorine atoms per molecule than the linear saturated fluorocarbon compounds C _n F _{2n + 2} If the same number of carbon atoms. Further, the present invention unsaturated fluorocarbon compound as a part of the molecular structure that is used has an annular portion with _{c-C n F y (y} ≦ 2n-2) is a linear saturated fluorocarbon if the same number of carbon atoms The number of fluorine atoms in one molecule is smaller by 4 or more than the compound C _n F2 _{n + 2} .

Accordingly, the C / F ratio of the etching reaction system can be reduced as compared with the conventional one without using any additional gas.

It should be noted, saturated fluorocarbon compounds c-C _n F2 _n used in the present invention, among the chain fluorocarbon compound present inventors have proposed in Japanese Patent Application No. Hei 2-295225 specification above Are represented by the same general formula as a compound having one double bond in the molecule. Therefore, it is not always clear whether a significant difference is observed in the effect of increasing the C / F ratio between the two, but the dissociation state in plasma, the molecular structure of the polymer deposited on the surface of the substrate to be etched, and the selectivity There is a significant difference in the temperature dependency of the substrate and the state of occurrence of substrate damage.

Further, in the present invention, the temperature of the substrate to be etched during the etching is controlled to be cooled to 50 ° C. or less by using a cooling means. This temperature control may be performed in a room temperature range or in a temperature range of 0 ° C. or lower as in low-temperature etching which has recently attracted attention in the field of dry etching. Usually, the temperature of the substrate to be etched rises to about 200 ° C. unless cooling is particularly performed in the process of dry etching. If the temperature is controlled to be 50 ° C. or less, even if a deposition gas such as a hydrocarbon gas is not used or the amount of the deposition gas is extremely small, the carbon polymer can be efficiently deposited by lowering the vapor pressure. As a result, selectivity can be improved as described above. As a result, the amount of deposition gas added can be reduced, so that the risk of particle contamination is also reduced.

In particular, if the etching is performed at a low temperature of 0 ° C. or less, the selectivity is more remarkably improved. Since the etching of the resist material or the silicon-based material layer proceeds mainly by a chemical reaction due to F ^* (fluorine radical), when the temperature of the reaction system is reduced and the movement of the radical is suppressed, the etching rate is also reduced. On the other hand, since etching of a silicon compound layer such as silicon oxide physically proceeds mainly by sputtering with ions, the decrease in etching rate due to cooling is not as remarkable as that of a resist material or a silicon-based material. Therefore, further improvement of the selectivity can be expected in the low temperature range.

[0042]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described. Here, a combination of Examples 1 to 3 in a process using a c-C _n F _2n or c-C _n F _y alone, C _c-n in Example 4 F _2n and c-C _n F _y using a process, a process using a combination of deposition gas as in example 5, c-C _n F _2n, a examples 6 8 in chain saturated fluorocarbon C _n F _{2n + 2} in c-C _n F2 _n or respectively illustrating a process using a combination of c-C _n F _y.

Embodiment 1 In this embodiment, the first invention of the present application is applied to contact hole processing, and C ₄ F ₈ (octafluorocyclobutane, also known as Freon C318, C / F ratio) =
0.5) is an example in which an interlayer insulating film made of silicon oxide is etched by using (0.5). This process is illustrated in FIG.
This will be described with reference to (a) and (b).

First, as shown in FIG. 1A, an interlayer insulating film 3 is formed on a single-crystal silicon substrate 1 on which an impurity diffusion layer 2 has been formed, and further as an etching mask for the interlayer insulating film 3. A substrate to be etched (wafer) on which the resist pattern 4 was formed was prepared. The resist pattern is provided with openings 4 by predetermined patterning.
a is provided.

Next, the above-mentioned wafer was set on a wafer mounting electrode of a magnetron RIE (reactive ion etching) apparatus as an example. Here, the wafer mounting electrode has a built-in cooling pipe, and by supplying a coolant to the cooling pipe from a cooling device such as a chiller connected to the outside of the apparatus and circulating the same, the wafer temperature during etching can be reduced by 50%. It is possible to control the temperature to below ° C. Here, ethanol was used as the refrigerant. C ₄ F ₈ Flow rate 4
6SCCM, gas pressure 2Pa, RF power density 2.2W /
The etching was performed under the conditions of cm ² , a magnetic field strength of 150 Gauss, and a wafer temperature of 0 ° C. Here, there are some differences in the physical properties of C ₄ F ₈ depending on the literature, but the melting point is about −40.
The compound has a boiling point of about −6 ° C. and is a gaseous compound at room temperature.

In the above-described etching process, the etching of the interlayer insulating film 3 proceeds by a mechanism mainly using an ion assist reaction due to CF _x ^* generated in the plasma by discharge dissociation of C ₄ F ₈ . At this time, the resist pattern 4
Although the carbon-based polymer (not shown) was efficiently deposited on the surface of the interlayer insulating film 3 exposed in the opening 4a, the carbon-based polymer was also removed along with the etching itself. As a result, despite the fact that no deposition gas such as a hydrocarbon gas is added to the gas system,
As shown in FIG. 1B, a contact hole 5 having a favorable anisotropic shape was formed at a high speed. The etching rate of the interlayer insulating film in this process is 701 nm /
As a result, the selectivity to resist was 3.5 and the selectivity to silicon was 7.2.

For comparison, a chain saturated fluorocarbon compound having the same number of fluorine atoms as the above C ₄ F ₈ is C ₃ F ₈ (octafluoropropane, C / F ratio = 0.3
75), and using this to etch the interlayer insulating film under the same conditions as above, the etching rate was 7
The selectivity to resist was 1.5 and the selectivity to silicon was 3.9 at 34 nm / min.

Comparing the results of etching with C ₄ F ₈ and C ₃ F _8, C ₄ F ₈ is remarkably superior in selectivity to resist and selectivity to silicon. This is C
_{This is because} 4F ₈ has a larger C / F ratio than C ₃ F ₈ , and the generation of excessive F * which causes a decrease in the selectivity is suppressed. On the other hand, as for the etching rate, C ₄ F ₈ is changed to C ₃ F ₈
Slightly inferior. This is because the deposition amount of the carbon-based polymer is larger when C ₄ F ₈ is used, and there is competition between sputter removal and etching of the carbon-based polymer. However, there is a practical advantage to using a cyclic saturated fluorocarbon compound because the selectivity is significantly improved while the etching rate is slightly reduced.

Embodiment 2 In this embodiment, the second invention of the present application is applied to contact hole processing, and C ₄ F ₆ (hexafluorocyclobutene, also known as Freon C1316, C / F This is an example in which an interlayer insulating film made of silicon oxide is etched using a ratio of 0.67).

The same wafer as in the first embodiment was set in a magnetron RIE apparatus, and a C ₄ F ₆ flow rate of 50 SCCM was set.
Etching was performed under the conditions of a gas pressure of 2 Pa, an RF power density of 1.5 W / cm ² , a magnetic field strength of 150 Gauss, and a wafer temperature of 0 ° C. Here, the physical properties of C ₄ F ₆ are slightly different depending on the literature, but the melting point is about −60 ° C. and the boiling point is 5
６6 ° C. and is a gaseous compound at normal temperature.

By this etching, a contact hole having a favorable anisotropic shape was formed. At this time, the selectivity to resist is about 4, and the selectivity to silicon is about 12
In each case, the results were further improved as compared with the case where C ₄ F ₈ was used (see Example 1). This is because C ₄ F ₈ has one double bond in the molecule, thereby further increasing the C / F ratio and promoting the deposition of the carbon-based polymer.

Embodiment 3 In this embodiment, the second invention of the present application is applied to contact hole processing, and C ₅ F ₈ (octafluorocyclopentene, also known as Freon 1418, C / F ratio = 0.625) is used to etch an interlayer insulating film made of silicon oxide.

The same wafer as in the first embodiment was set in a magnetron RIE apparatus, and a C ₅ F ₈ flow rate of 50 SCC, a gas pressure of 2 P, an RF power density of 1.5 W / cm ² , a magnetic field strength of 150 Gauss, and a wafer temperature of 0 ° C. Etching was performed under the conditions. Here, the physical properties of C ₅ F ₈ vary considerably depending on the literature, but the melting point is about −40 ° C. and the boiling point is about 6 ° C.
° C and is a gaseous compound at normal temperature.

By this etching, a contact hole having a favorable anisotropic shape was formed. The etching rate at this time is the case where C ₄ F ₆ is used (Example 2).
reference. ). This corresponds to the fact that C ₅ F ₈ has a lower C / F ratio than C ₄ F ₆ .

In the first to third embodiments described above, the etching examples using a single gas system have been described. No deposition gas is added to these gas systems, and the particle level does not deteriorate even after the number of processes performed on multiple wafers in a single-wafer etching apparatus, thereby improving the device yield. In addition, the time required for maintenance of the apparatus can be greatly reduced.

[0056] Example 4 This example after the application of the first invention and second invention of the present application, were carried out immediately before the base is exposed interlayer insulating film by using a C ₄ F _8, C ₄ This is an example in which the remaining portion of the interlayer insulating film is etched and over-etched by using a mixed gas of F ₈ and C ₄ F ₆ . This process will be described with reference to FIG. 2 in addition to FIGS. 1A and 1B described above.

First, the wafer shown in FIG. 1A was set in a magnetron RIE apparatus, and a C ₄ F ₈ flow rate of 50 SCC was set.
M, gas pressure 2 Pa, RF power density 2.0 W / cm ² ,
At a wafer temperature of 20 ° C., the etching of the interlayer insulating film 3 was performed until just before the single crystal silicon substrate 1, more precisely, the impurity diffusion layer 2 was exposed. The etching end point at this time is
Judgment was made at the point where the emission spectrum intensity of CO ^* at 483.5 nm began to decrease. As a result of this first stage etching, the state of the wafer is as shown in FIG.
The contact hole 5 was formed halfway, and the remaining portion 3a of the interlayer insulating film 3 was left at the bottom.

Next, under the conditions of a C ₄ F ₈ flow rate of 40 SCCM, a C ₄ F ₆ flow rate of 10 SCCM, an RF power density of 1.0 W / cm ² , and a wafer temperature of 20 ° C., the remaining portion 3a was etched and over-etched. . As a result of this second-stage etching, as shown in FIG. 1B, a contact hole 5 having a favorable anisotropic shape is formed without damaging the underlying impurity diffusion layer 2. Was.

In the above-described process, the first stage etching is performed at a relatively high speed, and in the second stage etching, a gas having a high C / F ratio is added to lower the RF power density to reduce the incident ion energy. To increase the selectivity ratio to the background. Therefore, although wafer cooling down to 0 ° C. or less is not performed,
High anisotropy and high selectivity were achieved.

Embodiment 5 This embodiment is directed to Embodiment 4 as an application of the first invention of the present application.
Example in which a contact hole processing using the same for 2-step etching, a mixed gas of C ₄ F ₈ and C ₂ H ₄ in C ₄ F _8, 2-stage etching in the first stage etching and It is.

The first stage etching conditions were as follows: C ₄ F ₈ flow rate 50 SCCM, gas pressure 2 Pa, RF power density 2.0 W
/ Cm ^{2 The} wafer temperature was 20 ° C. The second stage etching conditions were as follows: C ₄ F ₈ flow rate 46 SCCM, C ₂ H ₄ flow rate ₄ SC
CM, RF power density 1.0 W / cm ² , wafer temperature 2
0 ° C.

Here, C ₂ H ₄ added in the second-stage etching generates H ^* by discharge decomposition in addition to the deposition gas itself, and captures excess F ^*. This has the effect of increasing the C / F ratio of the etching reaction system. According to this example, high anisotropy, high selectivity, and low damage were achieved.

Embodiment 6 This embodiment is an application of the first invention of the present application. The main component of the etching gas is C ₃ F ₈ which is a chain saturated fluorocarbon, to which C ₄ F ₈ is added. This is an example in which a contact hole is formed by performing low-temperature etching using a mixed gas.

The etching conditions are as follows: C ₃ F ₈ flow rate 30 SCC
M, C ₄ F _{8 The} flow rate was 20 SCCM, the gas pressure was 2 Pa, the RF power density was 1.5 W / cm ^{2 and the} wafer temperature was −30 ° C.

In this process, the C / F
While C ₃ F ₈ having a relatively low ratio is mainly used for the gas composition, C / F is used to achieve high selectivity and low damage.
C ₄ F ₈ having a relatively high ratio was added, and the wafer was cooled at a low temperature. According to this example, high speed, high anisotropy, high selectivity, and low damage were achieved.

Embodiment 7 This embodiment is an application of the first invention of the present application. As in Embodiment 6, the main component of the etching gas is C ₃ F ₈ , which is replaced with C ₇ F ₁₄ (Chemical Formula 1). This is an example in which a contact hole is formed by performing low-temperature etching using a mixed gas to which a contact hole is added.

The etching conditions were as follows: C ₃ F ₈ flow rate 45 SCC
M, C ₇ F _{14 The} flow rate was 5 SCCM, the gas pressure was 2 Pa, the RF power density was 1.5 W / cm ^{2 and the} wafer temperature was −30 ° C. According to this example, high speed, high anisotropy, high selectivity, and low damage were achieved.

Embodiment 8 This embodiment is an application of the second invention of the present application. As in Embodiment 6, the etching gas is mainly composed of C ₃ F _8, and C ₄ F ₆ is added thereto. This is an example in which low-temperature etching is performed with a mixed gas to form a contact hole.

The etching conditions are as follows: C ₃ F ₈ flow rate 25 SCC
M, C ₄ F ₆ flow rate was 25 SCCM, gas pressure was 2 Pa, RF power density was 1.5 W / cm ^{2 and} wafer temperature was −30 ° C. According to this example, high speed, high anisotropy, high selectivity, and low damage were achieved.

Although the present invention has been described with reference to the eight embodiments, the present invention is not limited to these embodiments. In the above-described gas system, H ₂ is further added to control the etching rate. Or an O ₂ gas or the like, or a rare gas such as He or Ar may be added as appropriate in order to achieve a sputtering effect, a dilution effect, a cooling effect, or the like.

Further, the material layer to be etched is not limited to the above silicon oxide, but may be PSG, BSG, B
It may be PSG, AsSG, AsPSG, AsBSG, SiN, or the like.

[0072]

As is apparent from the above description, the present invention uses a saturated or unsaturated fluorocarbon compound having a cyclic portion in a part of the molecular structure,
High-speed etching becomes possible. Moreover, the compound has a somewhat high C / F ratio due to the carbon skeleton of the compound itself, and can basically achieve a high selectivity without using an additive gas for increasing the C / F ratio. Therefore, control of the etching reaction, maintenance of the etching apparatus, and the like become extremely easy. Moreover, in the present invention, etching is performed while cooling the substrate to be etched by the cooling means, so that high anisotropy and low damageability are also achieved.

Therefore, the present invention is extremely effective for manufacturing a semiconductor device having high performance and high integration.

[Brief description of the drawings]

FIGS. 1A and 1B are schematic cross-sectional views illustrating an example in which the present invention is applied to contact hole processing in the order of steps, in which FIG. 1A is a state in which a resist pattern is formed on an interlayer insulating film, and FIG. The state in which a contact hole is formed is shown.

FIG. 2 illustrates a method of forming a contact according to the present invention using two-step etching.
FIG. 11 is a schematic cross-sectional view showing a state where a contact hole is formed halfway when applied to hole processing.

[Explanation of symbols]

1 single crystal silicon substrate, 2 impurity diffusion layer, 3
Interlayer insulating film, 3a (interlayer insulating film) residue, 4 resist pattern, 4a opening, 5 contact
hole

Claims (4)

[Claims] An etching method comprising a saturated fluorocarbon-based compound having a cyclic portion in at least a part of its molecular structure.
A dry etching method, wherein a silicon compound layer formed on a substrate is etched using a gas while controlling the substrate to be etched with a cooling medium supplied from a cooling unit. 2. The dry etching method according to claim 1, wherein the silicon compound layer is etched while cooling the substrate to be etched to 50 ° C. or less. 3. An etching gas containing an unsaturated fluorocarbon-based compound having a cyclic portion in at least a part of its molecular structure is formed on a substrate while controlling the cooling of a substrate to be etched by a cooling medium supplied from a cooling means. Dry etching method characterized by etching a silicon compound layer which has been etched. 4. The dry etching method according to claim 3, wherein the silicon compound layer is etched while cooling the substrate to be etched to 50 ° C. or lower.