JP2000138259A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of positioning by recognizing collectively the electrodes of a semiconductor chip and electrodes of a wiring board by an image recognizing means at the time of assembling a semiconductor device, wherein the semiconductor chip is mounted on the wiring board and the electrodes of them are connected with each other. SOLUTION: A wiring board 11, on which a semiconductor chip 10 is mounted, is composed of transparent or semitransparent mica. Electrodes 12 of the semiconductor chip 10 and electrodes 13 of the wiring board 11 are recognized collectively by an image recognizing camera 17 which is arranged on the side opposite with respect to the semiconductor chip 10, interposing the wiring board 11. Positions of the semiconductor chip 10 and the wiring board 11 are adjusted on the bais of the image recognization, and assembling is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method of manufacturing the same, and more particularly, to a semiconductor device having a semiconductor chip mounted on a wiring board made of an insulating material and a method of manufacturing the same.

[0002]

2. Description of the Related Art Semiconductor devices having a semiconductor package structure including a chip size package (CPS) and a ball grid array (BGA) have been widely used. In such a semiconductor device, when manufacturing a semiconductor package structure by a flip chip method in which a semiconductor chip is face down and mounted on a wiring board,
The alignment of the electrodes of the semiconductor chip and the electrodes of the wiring board is performed. That is, the position of each electrode is individually recognized by an image recognition camera or the like, and the position adjustment is performed by combining the two recognition data.

[0005] Referring to FIG. 5, a semiconductor device can be assembled with a semiconductor chip 1 and a wiring board 2. Here, the electrodes 5 are formed on the semiconductor chip 1 in advance. The wiring board 2 is a wiring board made of an insulating material such as a glass epoxy board and a ceramic board, on which wirings and electrodes 6 are respectively formed.

When the semiconductor chip 1 and the wiring board 2 are aligned with each other, the surface of the semiconductor chip 1 on which the electrodes 5 are formed and the electrodes 6 of the wiring board 2 are formed as shown in FIG. The image recognition camera 3 is inserted between them, and the image recognition camera 3 recognizes the image of the electrode 5 of the upper semiconductor chip 1 and the electrode 6 of the lower wiring board 2 respectively. Of the semiconductor chip 1 or the wiring board 2 if necessary.
Is moved to adjust the position.
In other methods, the electrodes 5 and 6 of the semiconductor chip 1 and the wiring board 2 are image-recognized, and the positions of the electrodes 5 and 6 are aligned by combining the two recognition data. I do it.

[0005]

As shown in FIG. 5, image recognition of the semiconductor chip 1 and the wiring board 2 is performed by an image recognition camera 3 inserted between the semiconductor chip 1 and the wiring board 2. According to the positioning, it is necessary to adjust the combination of the recognition data very accurately, and by performing individual recognition, a plurality of recognition camera units are required,
There is a problem that the structure becomes complicated.

Further, after the semiconductor chip 1 and the wiring board 2 are connected to each other, the electrode 5 of the semiconductor chip 1 and the wiring board 2
Confirmation of the connection state such as the displacement of the electrode 6 and the connection failure
Since the electrodes 5 and 6 are hidden inside, direct confirmation cannot be performed. For this reason, analysis by X-ray transmission,
There has been a problem that analysis by destruction has to be performed, and it is not possible to simply and accurately confirm a semiconductor device actually used as it is.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is possible to perform image recognition between a semiconductor chip and a wiring board without inserting an image recognition camera between the two. It is an object of the present invention to provide a semiconductor device and a method of manufacturing the same, which can easily confirm a defect of an electrode connection portion such as a mutual displacement between a semiconductor chip and a wiring board even after assembly.

[0008]

According to the present invention, there is provided a semiconductor device comprising a semiconductor chip mounted on a wiring board made of an insulating material, wherein the wiring board is transparent or translucent. It concerns the device. Here, the wiring board may be made of transparent or translucent mica. Further, the electrode of the semiconductor chip and the electrode of the wiring board may be connected to each other.

The present invention relates to a method of manufacturing a semiconductor device, wherein a semiconductor chip is mounted on a wiring board made of an insulating material and an electrode of the semiconductor chip is connected to an electrode on the wiring board. The wiring board is made of a transparent or translucent material, and the electrodes of the semiconductor chip and the electrodes of the wiring board are image-recognized using image recognition means from the side opposite to the semiconductor chip with respect to the wiring board. The present invention also relates to a method for manufacturing a semiconductor device, comprising correcting a mutual displacement between the semiconductor chip and the wiring board based on the image recognition.

A preferred embodiment of the present invention relates to a semiconductor device using a transparent or translucent substrate such as mica as a wiring board of a semiconductor device having a package structure such as a chip size package and a ball grid array. According to such a semiconductor device, when the semiconductor chip is mounted on the wiring board and the two electrodes are aligned, the electrode of the wiring board and the electrode of the semiconductor chip are connected to the semiconductor chip with respect to the wiring board. Can be simultaneously recognized by the image recognition camera located on the opposite side, and alignment can be facilitated. Also from this,
The recognition camera in the semiconductor mounting device can be simplified. Further, after mounting the semiconductor chip on the wiring board and assembling it, it is possible to easily check the connection failure of the electrode portion based on the shift of the mounting position of the semiconductor chip from the outside.

By utilizing such a semiconductor package structure, application to a bare chip mounting method in which a semiconductor chip is directly mounted on a circuit board without forming a package becomes possible. Further, a semiconductor device using a mica substrate in which one or two or more passive elements are incorporated in a wiring board can be provided.

According to this aspect of the invention, particularly when the semiconductor chip is mounted on the wiring board and manufactured, the electrodes of the wiring board and the electrodes of the semiconductor chip can be simultaneously image-recognized. Positioning can be easily performed. This simplifies the camera section for alignment in the semiconductor chip mounting device. Further, after the semiconductor chip is mounted on the wiring board, it is possible to easily confirm whether or not the electrode portion is connected properly, such as a mounting position shift.

Since the mica material used for a wiring board has a higher heat resistance temperature than an organic substrate such as glass epoxy which has been generally used in the past, it is easy to manufacture or use the material because of reduced manufacturing restrictions. Can be. In addition, since the mica material has excellent surface flatness, stable connection with a semiconductor chip can be achieved. Furthermore, the mica material has a very small thermal expansion coefficient, almost the same as a semiconductor chip,
The difference in expansion between the semiconductor chip and the semiconductor chip due to temperature change is small, and this has an advantageous effect on the life of the connection portion.

By using a lightweight mica as the wiring board, the weight of the semiconductor device and the entire electronic circuit can be reduced. Further, by using an inexpensive mica material for the wiring board, the cost of the semiconductor device can be reduced.

[0015]

FIG. 1 shows a semiconductor chip used for manufacturing a semiconductor device according to an embodiment of the present invention. Electrodes 5 constituting each terminal are formed on the surface of the semiconductor chip 10.

FIG. 2 shows a wiring board 11 combined with such a semiconductor chip 10. The wiring board 11 is a substrate made of mica (mica). The surface of the wiring board 11 is provided with wiring by a conductive material, and the electrodes 13 are formed so as to correspond to the electrodes 12 of the semiconductor chip 10. I have.

Here, the semiconductor chip 10 is turned upside down (face down), the electrodes 12 and the electrodes 13 of the wiring board 11 are aligned as shown in FIG. 4, and the semiconductor chip 10 is mounted on the wiring board 11. I do. The semiconductor device is a semiconductor package composed of a semiconductor chip 10 and a wiring board 11, and the electrodes 12 of the semiconductor chip 10 and the electrodes 13 of the wiring board 11 are connected with a conductive adhesive or the like as necessary, or Further, reinforcement is performed by a sealing resin or the like. The electrode 2 formed on the lower surface of the wiring board 11
0 is an electrode of the semiconductor package, and such an electrode is connected to the connection land of the circuit board.

A feature of the semiconductor device of the present embodiment is that it has a structure using a mica (mica) substrate for the wiring board 11. It is used as a circuit board by performing pattern wiring on a plate-like mica with a silver conductor or the like. It may be laminated as necessary to form a multilayer wiring board. The structure of the wiring board 11 as a circuit board is the same as a conventional circuit board. Making use of the fact that the appearance of mica is transparent or translucent,
Is composed of a mica substrate, whereby the alignment between the electrode 12 of the semiconductor chip 10 and the electrode 13 of the wiring board 11 is facilitated, and the quality of the connection portion after mounting is easily checked.

FIG. 3 shows an example of a configuration for positioning the semiconductor chip 10 and the wiring board 11. Here, a mica substrate is used as the wiring board 11.

When the mica substrate is used for the wiring board 11, the surface of the semiconductor chip 10 on which the electrodes 12 are formed and the surface of the wiring board 11 on which the electrodes 13 are formed, as shown in FIG. The image recognition camera 17 is installed at a position opposite to and below the semiconductor chip 10 with respect to the wiring board 11.

According to such an arrangement, the electrode 1 on the transparent wiring board 11 is interposed by the image recognition camera 17 via the transparent wiring board 11.
In addition to the image recognition of the electrode 3, the electrode 12 of the semiconductor chip 10 can be image-recognized via the transparent wiring board 11. That is, the electrode 1 of the wiring board 11 is passed through the transparent wiring board 11 by the image recognition camera 17.
3 and the electrodes 12 of the semiconductor chip 10 can be collectively recognized, whereby the alignment can be easily performed, and a combination of special recognition data requiring strict adjustment is not required. Bring benefits.

Further, according to the semiconductor device comprising such a combination of the semiconductor chip 10 and the wiring board 11, after the assembly, the position of the electrode portion 12 of the semiconductor chip 10 and the position of the electrode portion 13 of the wiring board 11 are shifted or connected. Conventionally, it is not possible to directly confirm the connection quality such as a defect by performing analysis or destructive inspection by X-ray transmission, but by adopting this structure, the transparent or translucent mica substrate 1
1, the connection portion can be directly observed, and the quality of the connection can be easily confirmed.

Further, the mica substrate constituting the wiring board 11
By incorporating one or more passive elements, it is possible to assemble a semiconductor device incorporating the passive elements, shorten the wiring between the semiconductor chip and the passive elements, improve the circuit electrical characteristics, and improve the electronic performance. This makes it possible to achieve a lighter and smaller circuit.

[0024]

According to one aspect of the present invention, there is provided a semiconductor device having a semiconductor chip mounted on a wiring board made of an insulating material, wherein the wiring board is transparent or translucent.

Therefore, through such a transparent or translucent wiring board, the connection between the semiconductor chip and the wiring board can be optically recognized from the side opposite to the semiconductor chip with respect to the wiring board. Therefore, image recognition at the time of assembly can be easily performed. Further, even after assembly, it is possible to easily confirm the quality of the connection portion through the transparent or translucent wiring board.

According to the structure in which the wiring board is made of transparent or translucent mica, the connection portion can be confirmed through the wiring board by the wiring board made of such mica.

According to the configuration in which the electrodes of the semiconductor chip and the electrodes of the wiring board are connected to each other, the electrodes of the semiconductor chip and the electrodes of the wiring board are aligned through a transparent or translucent wiring board. Alternatively, the quality of the connection after assembly can be determined.

The present invention relates to a method of manufacturing a semiconductor device, wherein a semiconductor chip is mounted on a wiring board made of an insulating material and electrodes of the semiconductor chip and electrodes on the wiring board are connected to each other. Is made of a transparent or translucent material, and the electrodes of the semiconductor chip and the electrodes of the wiring board are image-recognized using image recognition means from the side opposite to the semiconductor chip with respect to the wiring board. In addition, the mutual displacement between the semiconductor chip and the wiring board is corrected.

Therefore, according to such a manufacturing method, the electrodes of the semiconductor chip and the electrodes of the wiring board are integrated by the image recognition means arranged on the side opposite to the semiconductor chip with respect to the transparent or translucent wiring board. The semiconductor chip and the wiring board are corrected for mutual positional deviation based on the image recognition, and the electrodes of the semiconductor chip and the electrodes of the wiring board can be correctly connected.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a semiconductor chip.

FIG. 2 is a longitudinal sectional view of a wiring board.

FIG. 3 is a perspective view showing image recognition by an image recognition camera.

FIG. 4 is a longitudinal sectional view of the assembled semiconductor device.

FIG. 5 is a perspective view showing image recognition in manufacturing a conventional semiconductor device.

[Explanation of symbols]

1 ‥‥ semiconductor chip, 2 ‥‥ wiring board, 3 ‥‥ image recognition camera, 5 ‥‥ electrode, 6 ‥‥ electrode, 10 ‥‥ semiconductor chip, 11 ‥‥ wiring board, 12 ‥‥ electrode, 13 ‥‥ electrode , 1
7mm image recognition camera, 20mm electrode

Claims (4)

[Claims] 1. A semiconductor device comprising a semiconductor chip mounted on a wiring board made of an insulating material, wherein the wiring board is transparent or translucent. 2. The semiconductor device according to claim 1, wherein said wiring board is made of transparent or translucent mica. 3. An electrode of the semiconductor chip and an electrode of the wiring board are connected to each other.
3. The semiconductor device according to claim 1. 4. A method for manufacturing a semiconductor device, wherein a semiconductor chip is mounted on a wiring board made of an insulating material so that electrodes of the semiconductor chip and electrodes on the wiring board are connected to each other. It is made of a transparent or translucent material, and image-recognizing the electrodes of the semiconductor chip and the electrodes of the wiring board using image recognition means from the side opposite to the semiconductor chip with respect to the wiring board, A method of manufacturing a semiconductor device, comprising: correcting a mutual displacement between the semiconductor chip and the wiring board based on recognition.