JP2000127191A - Device and method for laminating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminating device and a laminating method for manufacturing a good printed circuit board of superior follow-up properties neither polluting a body to be molded nor generating micro-voids. SOLUTION: In a laminating device provided with an upper plate 1 and a lower plate 2, membranes 3 and 4 placed respectively on the faces of the upper plate 1 and the lower plate 2 facing each other, and a body 5 to be molded is so placed as to be clamped between the membrane 3 of the upper plate and the membrane 4 of the lower plate, and the lower plate 2 is lifted up to form the seal engaged state with the upper plate 1 and laminated together, and films 6 and 7 are provided respectively between the membrane 3 of the upper plate 1 and the body 5 to be molded and also between the membrane 4 of the lower plate 2 and the body 5 to be molded.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate used for laminating a film-like resin on a molded object, in particular, a surface of a printed circuit board or a raised surface, for example, the surface of another substrate having conductive traces. The present invention relates to an apparatus and a method of laminating the same, and more particularly, to a laminating apparatus and a method of laminating which can efficiently remove a resin component exuding from a film-like resin end.

[0002]

2. Description of the Related Art In recent years, with the miniaturization and high performance of electronic devices, printed circuit boards have been increased in density and multilayered. In such a multilayer printed circuit board, using a thermosetting resin or a photosensitive resin composition as an insulating layer,
The thermosetting resin or the photosensitive resin composition is applied on a pre-formed inner layer circuit, or a film-like resin made of the thermosetting resin or the photosensitive resin composition is laminated, and furthermore, a non-woven fabric is formed on the resin. After applying electrolytic copper plating, perform patterning by light using a photosensitive dry film resist,
A simple multi-layering method for forming a circuit and a build-up method are considered to be effective.

When laminating a thermosetting resin or a photosensitive resin composition layer used as an insulating layer and using a film-like resin, a vacuum laminating apparatus as described in JP-A-5-200880 is used.

[0004]

However, in the apparatus described in Japanese Patent Application Laid-Open No. 5-200880, the ability of the film-like resin to follow the unevenness of the substrate and the air bubbles generated between the film-like resin and the substrate (micro In order to improve the suppression of voids, it is necessary to increase the fluidity of the film-like resin, and such fluidity has been increased by increasing the temperature and pressure of the lamination conditions.

However, the temperature at the time of lamination depends on the resin composition. Generally, when the temperature at the time of lamination is increased, the fluidity of the resin increases, and the resin component oozes out from the end of the film-like resin, and the substrate and Problems such as contamination of the roll, the film body 3 of the upper plate 1 and the film body 4 of the lower plate 2 occur, and when the contamination occurs, the film adheres to the surface of the next substrate to be laminated, or the adherence becomes poor due to the adhesion. Lowering and generation of microvoids occur, making it impossible to obtain a good circuit board. Conversely, when the temperature at the time of lamination is lowered, the bleeding of the resin component of the film-like resin is eliminated, but there are problems such as insufficient followability and generation of microvoids.

Under such circumstances, the present invention efficiently removes contamination due to bleeding of the resin component of the film-like resin for the insulating layer with the increase in the density and the number of layers of the printed circuit board. It is an object of the present invention to provide a laminating apparatus and a laminating method for obtaining a good printed circuit board which is excellent in microvoids and which is free from microvoids.

[0007]

Means for Solving the Problems In view of such circumstances, the present inventors have made intensive studies and as a result, have an upper plate 1 and a lower plate 2, and have a film on the opposing surfaces of the upper plate 1 and the lower plate 2, respectively. The bodies 3 and 4 are placed, and the molded body 5 is placed so as to be held between the film body 3 of the upper plate and the film body 4 of the lower plate. In a laminating apparatus for laminating in a sealing engagement state, a laminating apparatus in which films 6, 7 are provided between the film body 3 of the upper plate 1 and the molded body 5 and between the film body 4 of the lower plate 2 and the molded body 5, respectively. Found that the above object was met, and completed the present invention.

In the present invention, in particular, the film body 3 of the upper plate 1
And the molded body 5 and the film body 4 of the lower plate 2 and the molded body 5
It is preferable that the films 6 and 7 provided between the films are films capable of running continuously, and a printed circuit board can be efficiently obtained.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to FIG. However, it is not limited to this.
The laminating apparatus of the present invention automatically applies a combination of heat, vacuum and mechanical pressure, completely removes all air between the film-like resin and the surface of the circuit board or other substrate,
This ensures that the film-like resin conforms around the etched circuit trace.

FIG. 1 is a structural view of a main part of a laminating apparatus according to the present invention, wherein 1 is an upper plate, 2 is a lower plate, 3 is a film of the upper plate 1, 4 is a film of the lower plate 2, and 5 is a film of the lower plate 2. The molded body, 6 is a film provided between the film body 3 of the upper plate 1 and the molded body 5, 7 is a film provided between the film body 4 of the lower plate 2 and the molded body 5, 8 and 9 are This is a seal for sealingly engaging the upper plate 1 and the lower plate 2. Reference numerals 10 and 11 denote a film unwinding roll and a winding roll for continuously running the films 6 and 7, respectively. Reference numeral 12 denotes a vacuum suction port for bringing the upper plate 1 and the lower plate 2 into a vacuum state after sealingly engaging the upper plate 1 and the lower plate 2.

The membranes 3 and 4 are not particularly limited as long as they are heat-resistant, and include, for example, silicone rubber and fluorine rubber. The molded object 5 is not particularly limited, but is particularly composed of a substrate 5a and a film-like resin 5b. The films 6 and 7 are not particularly limited, but are preferably any of a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a nylon film, a polyimide film, a polystyrene film, and a fluorinated olefin film. The film thickness is 10-1
00 μm, more preferably 20 to 50 μm
Is preferred.

In the laminating apparatus of the present invention, the molded object 5 is placed on the film 7 on the film body 4 of the lower plate 2, and the lower plate 2 is lifted up and sealingly engaged with the upper plate 1.
Suction from upper and lower vacuum suction ports 12, 2 hpa or less,
Preferably, the vacuum is released to a state of 1 hpa or less, then the atmosphere is introduced from above to release the vacuum, and the lower plate 2 is moved downward away from the upper plate 1 to complete the lamination of the molded object 5. It is.

Further, according to the present invention, when the substrate 5a and the film-like resin 5b are laminated by using the above-mentioned laminating apparatus, the temperature at the time of lamination is set in order to improve the followability to the circuit board and to suppress the generation of microvoids. 50-120 ° C, preferably 70
Although it is preferable to carry out at a temperature of about 100 ° C., if the lamination is carried out at such a temperature, the resin component oozes out from the end of the film-like resin. The exuded resin component is applied to films 6 and 7
, And removing the films 6 and 7, a good circuit board can be formed. After use, the films 6 and 7 can be used after removing the contaminated portion, or a process for removing the contaminated portion can be provided. it can.

The film-like resin 5b of the molded body 5 composed of the film-like resin 5b and the substrate 5a is formed of a thermosetting resin composition or a photosensitive resin composition. The thermosetting resin composition or the photosensitive resin composition is not particularly limited, but the thermosetting resin composition is mainly composed of an epoxy resin, and the photosensitive resin composition is a high-molecular organic polymer, an ethylenic resin. It comprises an unsaturated compound and a photopolymerization initiator.

[0015]

The present invention will be specifically described below with reference to examples. Example 1 A substrate 5a and a film-like resin 5b were laminated using a laminating apparatus as shown in FIG. Films 6 and 7 are polyethylene terephthalate films (thickness 20 μm),
It is a film that can run continuously. Film-like resin 5b
Is a laminate composed of a thermosetting resin composition composed of an epoxy resin and a polyethylene terephthalate film,
The surface of the thermosetting resin composition layer is in contact with the substrate surface.

The lower plate 2 is lifted up, and sealingly engaged with the upper plate 1 to make a vacuum state up to 2 hpa. After 50 seconds, the vacuum is released from the upper part by releasing the air thereinto, and the substrate 5a and the film-like resin 5b are laminated. (The temperature during lamination was 9
It was 0 ° C. ). The same operation was repeated 20 times. By the laminating apparatus and the laminating method, since the films 6 and 7 continuously remove the resin component exuding from the film-shaped resin end portion, even if the laminating operation is repeatedly performed, the substrate is not contaminated, the followability is excellent, and A circuit board free of voids was obtained.

Comparative Example 1 The procedure of Example 1 was repeated, except that the films 6 and 7 were not provided. The lamination of the substrate 5a and the film-like resin 5b was repeated 20 times. In the above-described laminating apparatus, the resin component oozing out from the film-shaped resin end portion remains attached to the film bodies 3 and 4, not only contaminating the substrate, but also lowering the followability each time the laminating operation is repeated. The occurrence of microvoids was observed, and a good circuit board could not be obtained.

[0018]

According to the laminating apparatus and the laminating method of the present invention, films 6 and 7 are provided between the film body 3 of the upper plate 1 and the molded body 5 and between the film body 4 of the lower plate 2 and the molded body 5, respectively. Therefore, even if the resin component oozes out of the molded object 5, it does not contaminate the substrate, and exhibits an excellent effect of followability and suppression of generation of microvoids. Useful.

[Brief description of the drawings]

FIG. 1 is a structural view of a main part of a laminating apparatus of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Upper plate 2 ... Lower plate 3 ... Film body of upper plate 4 ... Film body of lower plate 5 ... Molded object 5a ... Substrate 5b ... Film-shaped resin 6 ... Film provided between the film body of the upper plate and the molded object 7 ... Film provided between the film body of the lower plate and the molded object 8,9 ... Seal 10 ... Film winding Dashi roll 11: Film winding roll 12: Vacuum suction port

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[Procedure amendment]

[Submission date] February 2, 2000 (200.2.2)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

Claims (6)

[Claims] An upper plate (1) and a lower plate (2) are mounted on opposite surfaces of the upper plate (1) and a lower plate (2), respectively. In a laminating apparatus in which the molded body 5 is placed so as to be held between the upper and lower plates 4, and the lower plate 2 is lifted up so as to be in sealing engagement with the upper plate 1, the film body 3 of the upper plate 1 is A laminating apparatus characterized in that films (6, 7) are provided between the molded body (5) and the film body (4) of the lower plate (2) and the molded body (5), respectively. 2. It is assumed that the films 6, 7 provided between the film body 3 of the upper plate 1 and the formed body 5 and between the film body 4 of the lower plate 2 and the formed body 5 are films that can be continuously run. The laminating apparatus according to claim 1, wherein: 3. A film 6, 7 provided between the film body 3 of the upper plate 1 and the molded body 5 and between the film body 4 of the lower plate 2 and the molded body 5, respectively, is a polyethylene terephthalate film, a polyethylene film, a polypropylene film. 3. The film according to claim 1, wherein the film is any one of a nylon film, a polyimide film, a polystyrene film, and a fluorinated olefin film. 4. The laminating apparatus according to claim 1, wherein the lower plate 2 is lifted into a sealing engagement with the upper plate 1 and then brought into a vacuum state. 5. The laminating apparatus according to claim 1, wherein the molded object 5 comprises a substrate 5a and a film-like resin 5b. 6. A method for laminating a substrate 5a and a film-like resin 5b using the laminating apparatus according to any one of claims 1 to 5, wherein a resin component that exudes from an end of the film-like resin 5b is a film 6,7. And laminating the films 6 and 7.