JPH0453190A - Manufacture of rigid/flexible wiring board - Google Patents
Manufacture of rigid/flexible wiring boardInfo
- Publication number
- JPH0453190A JPH0453190A JP15933290A JP15933290A JPH0453190A JP H0453190 A JPH0453190 A JP H0453190A JP 15933290 A JP15933290 A JP 15933290A JP 15933290 A JP15933290 A JP 15933290A JP H0453190 A JPH0453190 A JP H0453190A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- board
- rigid
- clad laminate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000011229 interlayer Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フレキシブル回路が形成されたリジット／フ
レックス配線板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a rigid/flex wiring board on which a flexible circuit is formed.
（従来の技術）
従来、リジット／フレックス配線板の製造に際しては、
例えば第２図（ａ）〜（ｃ）に示す工程を経て行なわれ
ている。すなわち、まず、フレキシブル回路板１に回路
を形成しく第２図（ａ））、次に、このフレキシブル回
路板１に、接着剤２を介して銅張り積層板３を加圧・加
熱する（同図（ｂ））。この後、穴あけ、化学めっき、
外層回路加工等を行い、リジット／フレックス配線板を
製造している（同図（Ｃ））。(Conventional technology) Conventionally, when manufacturing rigid/flex wiring boards,
For example, this is carried out through the steps shown in FIGS. 2(a) to 2(c). That is, first, a circuit is formed on the flexible circuit board 1 (FIG. 2(a)), and then a copper-clad laminate 3 is pressed and heated on the flexible circuit board 1 via the adhesive 2 (see FIG. 2(a)). Figure (b)). After this, drilling, chemical plating,
Rigid/flex wiring boards are manufactured by processing outer layer circuits, etc. ((C) in the same figure).
しかし、この製造方法では、上記回路板１および積層板
３に厚み段差があるために、配線板間に多数のプレスセ
ット品を入れることが困難になっており、またフレキシ
ブル部が露出し、可撓性を有しているため取り扱い作業
性も悪かった。However, in this manufacturing method, since the circuit board 1 and the laminate board 3 have thickness differences, it is difficult to insert a large number of press set products between the wiring boards, and the flexible parts are exposed, making it difficult to Due to its flexibility, handling efficiency was also poor.
そこで、このような欠点を改善した製造方法として、第
３図（ａ）〜（Ｃ）に示す製造方法が知られている。す
なわち、まず回路形成したフレキシブル回路板１と、所
定の部分をくり抜いた層間接着プリプレグ４とを互いに
重ね合わせ、このプリプレグ４のくり抜き部分に、離型
性を有するシート５を嵌め合わせ、さらにこのシート５
の表面に、所定の部分をくり抜いた銅張り積層板３を重
ね合わせ、このくり抜き部分に別の銅張り積層板６を嵌
め合わせて、加熱・加圧する（同図（ａ））。この後、
穴あけ、化学めっき、外層回路加工等を行い（同図（ｂ
）） 、最後に銅張り積層板６の不要部、離型性シート
５を取り外して、リジット／フレックス配線板を製造し
ている（同図（Ｃ））（発明が解決しようとする課題）
しかし、上記した従来の技術では、表面の銅張り積層板
をくり抜き、このくり抜き部分に再度銅張り積層板を嵌
め合わせていたため、嵌め合わせ部分に隙間が生じ、め
っき液のしみ込み等に起因して、後加工にめっき液が持
ち込まれ、処理液の早期劣化、基材変色、絶縁特性の劣
化などの問題が生じていた。Therefore, the manufacturing method shown in FIGS. 3(a) to 3(C) is known as a manufacturing method that improves these drawbacks. That is, first, a flexible circuit board 1 on which a circuit has been formed and an interlayer adhesive prepreg 4 with a predetermined portion hollowed out are stacked on top of each other, a sheet 5 having mold releasability is fitted into the hollowed out portion of this prepreg 4, and then this sheet 5
A copper-clad laminate 3 with a predetermined portion hollowed out is placed on the surface of the copper-clad laminate 3, and another copper-clad laminate 6 is fitted into the hollowed out portion and heated and pressurized (FIG. 3(a)). After this,
Drilling, chemical plating, outer layer circuit processing, etc. (see figure (b)
)) Finally, unnecessary parts of the copper-clad laminate 6 and the release sheet 5 are removed to produce a rigid/flex wiring board ((C) in the same figure) (Problem to be solved by the invention) However, In the above-mentioned conventional technology, the surface copper-clad laminate was hollowed out and the copper-clad laminate was refitted into the hollowed out part, resulting in a gap in the fitted part, which caused the plating solution to seep in. , the plating solution was brought into post-processing, causing problems such as early deterioration of the processing solution, discoloration of the base material, and deterioration of insulation properties.
本発明は、このような点に鑑みてなされたもので、処理
液の早期劣化などの上記問題を解決して低コストで高性
能のリジット／フレックス配線板の製造方法を提供しよ
うとするものである。The present invention has been made in view of these points, and aims to provide a low-cost, high-performance method for manufacturing rigid/flex wiring boards by solving the above-mentioned problems such as early deterioration of the processing liquid. be.
（課題を解決するための手段）
本発明は、上記の目的を達成するため、回路形成したフ
レキシブル回路板に、所定の部分をくり抜いた層間接着
プリプレグを重ね合わせ、このくり抜き部分に離型性を
有するシートを嵌め合わせ、さらにこの表面に銅張り積
層板を重ね合わせて加圧・加熱した後、回路加工を施し
てなるリジット／フレックス配線板の製造方法において
、上記くり抜き部分の外周と整合する部分にレーザー光
を照射して上記積層板の樹脂のみを除去することによっ
て、凹部を形成した銅張り積層板を用いることを特徴と
する。(Means for Solving the Problems) In order to achieve the above object, the present invention overlaps a flexible circuit board on which a circuit is formed with an interlayer adhesive prepreg with a predetermined portion cut out, and imparts mold releasability to the hollowed out portion. In a method for manufacturing a rigid/flex wiring board, the part that aligns with the outer periphery of the hollowed out part in a method for manufacturing a rigid/flex wiring board in which a copper-clad laminate is placed on the surface of the board, and a copper-clad laminate is placed on top of the sheet and then subjected to circuit processing. The present invention is characterized in that a copper-clad laminate is used in which recesses are formed by irradiating the laminate with a laser beam to remove only the resin of the laminate.
以下に本発明のリジット／フレックス配線板の製造方法
を、実施例に対応する第１図を参照しながら、さらに詳
しく説明する。The method for manufacturing a rigid/flex wiring board of the present invention will be explained in more detail below with reference to FIG. 1, which corresponds to an embodiment.
まず、エツチドフォイル法により回路形成したフレキシ
ブル回路板１、所定の部分をくり抜いた層間接着プリプ
レグ４、このくり抜き部分に嵌め合わせる離型性を有す
るシート５、および上記くり抜き部分外周と整合する部
位に例えば幅１００〜３００μｍの凹部７を樹脂層にの
み形成してなる銅張り積層板８をプレス機などにより、
常圧あるいは真空の下で温度１±０〜２５０℃、２０〜
８０ｋｇ／ｃｍ２等の条件で接着する（第１図（ａ））
。First, a flexible circuit board 1 on which a circuit is formed using the etched foil method, an interlayer adhesive prepreg 4 with a predetermined portion cut out, a sheet 5 having mold releasability that fits into this hollowed out portion, and a portion aligned with the outer periphery of the hollowed out portion. For example, a copper-clad laminate 8 in which recesses 7 with a width of 100 to 300 μm are formed only in the resin layer is pressed using a press machine or the like.
Temperature 1±0~250℃, 20~ under normal pressure or vacuum
Glue under conditions such as 80 kg/cm2 (Figure 1 (a))
.
この場合、銅張り積層板８の凹部７は、積層前にＣＯ２
レーザーを出力４０〜６０Ｗ、パルス幅１〜４ｍ５ｅｃ
、照射エネルギーｌＸ１０２〜４ＸＩＯ２Ｊ／ｃｒｎ２
の条件で照射して形成されたものである。In this case, the recess 7 of the copper-clad laminate 8 is filled with CO2 before lamination.
Laser output 40~60W, pulse width 1~4m5ec
, irradiation energy lX102~4XIO2J/crn2
It was formed by irradiation under the following conditions.
なお、フレキシブル回路板１には、必要に応じてポリイ
ミドフィルムに接着剤を塗布したカバーレイ等をラミネ
ートしてもよい。また、フレキシブル回路板１および銅
張り積層板８は、必要に応じて多数枚使用することが可
能である。Note that the flexible circuit board 1 may be laminated with a coverlay or the like, which is a polyimide film coated with an adhesive, if necessary. Further, a large number of flexible circuit boards 1 and copper-clad laminates 8 can be used as needed.
その後、上記のようにして得られた積層体（同図（ｂ）
）の所要部分に穴あけを行い、公知の方法でその表面に
回路を形成する（同図（Ｃ））。Thereafter, the laminate obtained as described above (FIG. (b)
), and a circuit is formed on its surface by a known method (FIG. 3(C)).
最後に、銅張り積層板８の不要部、離型性シート５を取
り外し、リジット／フレックス配線板を得る（同図（ｄ
））。Finally, unnecessary parts of the copper-clad laminate 8 and the release sheet 5 are removed to obtain a rigid/flex wiring board (see Figure (d)
)).
次に、本発明に使用する材料について説明する。Next, materials used in the present invention will be explained.
フレキシブル回路板１には、ポリイミドフィルムあるい
はポリエステルフィルムをベースに銅やアルミニウム等
の金属箔を接着剤をはさんでラミネートした基板が用い
られる。もちろん、接着剤をはさまない基板も使用可能
である。また、層間接着プリプレグ４には、ガラス布や
ポリイミドフィルムにエポキシ、ポリイミド等の熱硬化
性樹脂を含浸または塗布させ、半硬化状態にしたものや
、ＮＢＲゴムまたはアクリルゴム等を主成分とする半硬
化状態にしたものなどが使用可能である。さらに、銅張
り積層板８には、片面あるいは両面に厚さ１８〜７０μ
ｍの銅箔を有する積層板が用いられる。The flexible circuit board 1 is made of a polyimide film or a polyester film, and a metal foil such as copper or aluminum is laminated with an adhesive sandwiched therebetween. Of course, substrates without adhesive can also be used. In addition, the interlayer adhesive prepreg 4 may be made by impregnating or coating a glass cloth or polyimide film with a thermosetting resin such as epoxy or polyimide to a semi-cured state, or a semi-cured material whose main component is NBR rubber or acrylic rubber. Those in a hardened state can be used. Furthermore, the copper-clad laminate 8 has a thickness of 18 to 70 μm on one or both sides.
A laminate with m copper foil is used.
（作用）
本発明によれば、銅張り積層板８には、樹脂層にのみ凹
部７を形成し、表面側の銅箔全部は一体化しているため
、隙間がなく平滑である。この結果、銅張り積層板８か
らはめっき液のしみ込みがないため、処理液の早期劣化
、基材の変色、絶縁特性の劣化を防止できる。また、銅
張り積層板の表面に凹部がなく、平滑な面となるので、
フォトレジスト形成等の回路加工が容易となるとともに
、銅張り積層板の取り扱い性も良くなる。(Function) According to the present invention, in the copper-clad laminate 8, the recess 7 is formed only in the resin layer, and the entire copper foil on the front side is integrated, so that it is smooth without any gaps. As a result, since the plating solution does not seep into the copper-clad laminate 8, early deterioration of the treatment solution, discoloration of the base material, and deterioration of the insulation properties can be prevented. In addition, the surface of the copper-clad laminate has no recesses and is smooth, so
Circuit processing such as photoresist formation becomes easier, and the copper-clad laminate becomes easier to handle.
（実施例） 以下に本発明の一実施例を図面に基づいて説明する。(Example) An embodiment of the present invention will be described below based on the drawings.
第１−図（ａ）〜（ｄ）はこの実施例を示す製造工程図
であって、図示工程の順序に従がって、本例のリジット
／フレックス配線板を製造した。1-(a) to (d) are manufacturing process diagrams showing this example, and the rigid/flex wiring board of this example was manufactured according to the illustrated process order.
（１） フレキシブル回路板１として、月面に厚さ３５
μｍの銅箔を有するポリイミドフィルムベースのＭＣＦ
−５０００Ｉ （日立化成工業■裂開品名）を回路加工
し、カバーレイＣＵＳＶ−２５３５にツカン工業畑製商
品名）をラミネートシたものを作成する。(1) As the flexible circuit board 1, a thickness of 35 mm is placed on the moon surface.
Polyimide film based MCF with μm copper foil
-5000I (Hitachi Chemical Co., Ltd. split product name) is processed into a circuit, and a coverlay CUSV-2535 is laminated with Tsukan Kogyo Hata Co., Ltd. product name).
（２） ガラスポリイミド製層間接着プリプレグ４とし
て、ＣＩＡ−６７Ｎ （Ｎ）（日立化成工業■裂開品名
）を用い、所定の部分に、ルータ−を用いてくり抜き加
工を行ったものを作成する。(2) As the glass polyimide interlayer adhesive prepreg 4, CIA-67N (N) (Hitachi Chemical Co., Ltd. split product name) is used, and predetermined portions are hollowed out using a router.
（３） くり抜いた部分に嵌め合わせる離型性シート５
として、テトラ−フィルム２００８Ｇ４０ＴＲ（デボコ
ン製商品名）を所定の寸法に裁断したものを作成する。(3) Release sheet 5 that fits into the hollowed out part
Tetra film 2008G40TR (trade name, manufactured by Devocon) was cut into predetermined dimensions.
（４） 銅張り積層板８として、両面に厚さ３５μｍの
銅箔をＭＣＬ−１６７（日立化成工業■裂開品名）を用
い、片面を回路加工し、前記（１）と同様にカバーレイ
をラミネートする。(4) As the copper-clad laminate 8, one side was processed with a circuit using MCL-167 (Hitachi Chemical Co., Ltd. split product name) copper foil with a thickness of 35 μm on both sides, and a coverlay was applied in the same manner as in (1) above. Laminate.
（５） 銅張り積層板８のカバーレイをラミネトシた側
から、上記くり抜き部分の外周と整合する部分に、Ｃ０
２レーザーを出力６０Ｗ１パルス幅１．５ｍ５ｅｃ、照
射エネルギー１．８Ｘ１０２Ｊ／ｃｍ２の照射条件で照
射し、幅２００μｍの凹部７を樹脂層にのみ形成する（
第１図（ａ））（６） 」二記フレキシブル回路板１と
銅張り積層板８を、くり抜き部分に離型性シート５を嵌
め合せた層間接着プリプレグ４を介して、温度１７０℃
、圧力２４．５Ｋｇ／ａｍ２で加圧・加熱することによ
り一体化する（同図（ｂ））。(5) From the side where the cover lay of the copper-clad laminate 8 is laminated, apply C0 to the part that matches the outer periphery of the hollowed out part.
2 laser is irradiated with an output of 60 W, a pulse width of 1.5 m5 ec, and an irradiation energy of 1.8 x 10 J/cm to form a recess 7 with a width of 200 μm only in the resin layer (
The flexible circuit board 1 and the copper-clad laminate 8 are bonded together at a temperature of 170°C via an interlayer adhesive prepreg 4 with a releasable sheet 5 fitted in the hollowed out part.
, and are integrated by applying pressure and heating at a pressure of 24.5 kg/am2 ((b) in the same figure).
（７） 上記一体化された積層体の所定位置に穴あけ加
工を施し、銅めっきおよびエツチングをして回路形成す
る（同図（Ｃ））。(7) Holes are drilled at predetermined positions in the integrated laminate, and a circuit is formed by copper plating and etching (FIG. 3(C)).
（８） 銅張り積層板８の不要部、離型性シート５を取
り外す（同図（ｄ））。(8) Remove unnecessary parts of the copper-clad laminate 8 and the release sheet 5 (FIG. 1(d)).
このようにして得られたリジット／フレックス配線板は
、銅張り積層板８の表面に隙間がないため、銅めっきを
行う際に、この積層板８からめっき液がしみ込むことが
なかった。その結果、リジット／フレックス接合部が変
色することもなく、絶縁特性も良好であった。また、銅
張り積層板８の表面に凹部がなく、平坦な滑かな面であ
るため、外層回路のパターンも精度よく形成することが
できた。In the thus obtained rigid/flex wiring board, since there was no gap on the surface of the copper-clad laminate 8, the plating solution did not seep through the laminate 8 during copper plating. As a result, there was no discoloration of the rigid/flex joint, and the insulation properties were good. Furthermore, since the surface of the copper-clad laminate 8 had no recesses and was a flat, smooth surface, the pattern of the outer layer circuit could be formed with high precision.
（発明の効果）
以上説明したように、本発明のリジット／フレックス配
線板の製造方法においては、銅張り積層板の樹脂層にの
み凹部を有し、その表側の銅箔には隙間がないので、次
の効果が得られる。(Effects of the Invention) As explained above, in the method for manufacturing a rigid/flex wiring board of the present invention, only the resin layer of the copper-clad laminate has a recess, and there is no gap in the copper foil on the front side. , the following effects can be obtained.
（１）めっき工程で銅張り積層板の表面からめっき液な
どがしみ込むことがないため、後工程における処理液の
早期劣化、基板の変色を防止するとともに、絶縁特性を
向上させることができる。(1) Since the plating solution does not seep through the surface of the copper-clad laminate during the plating process, early deterioration of the processing solution in the subsequent process and discoloration of the substrate can be prevented, and the insulation properties can be improved.
（２）銅張り積層板の表面に凹部がなく、平滑な面であ
るため、外層回路の形成が容易となり、断線、ショート
当の不良を減少させることができる。(2) Since the surface of the copper-clad laminate has no recesses and is a smooth surface, it is easy to form an outer layer circuit, and defects such as disconnections and short circuits can be reduced.
第１図（ａ）〜（ｄ）は本発明の一実施例を示す製造工
程図、第２図（ａ）〜（Ｃ）は従来例を示す製造工程図
、第３図（ａ）〜（ｃ）は他の従来例を示す製造工程図
である。
１・・・フレキシブル回路板
２・・・層間接着プリプレグ
３・・・離型性シート
４・・・凹部
５−・・銅張り積層板
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（ｂ）
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第
図
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図Figures 1(a) to (d) are manufacturing process diagrams showing one embodiment of the present invention, Figures 2(a) to (C) are manufacturing process diagrams showing a conventional example, and Figures 3(a) to ( c) is a manufacturing process diagram showing another conventional example. 1...Flexible circuit board 2...Interlayer adhesive prepreg 3...Mold release sheet 4...Concave portion 5-...Copper-clad laminate (al (b) fd+ Figure [b) (C) figure
Claims (1)
くり抜いた層間接着プリプレグを重ね合わせ、このくり
抜き部分に離型性を有するシートを嵌め合わせ、さらに
この表面に銅張り積層板を重ね合わせて加圧・加熱した
後、回路加工を施してなるリジット／フレックス配線板
の製造方法において、 上記くり抜き部分の外周と整合する部分にレーザー光を
照射して上記積層板の樹脂のみを除去することによって
、凹部を形成した銅張り積層板を用いることを特徴とす
るリジット／フレックス配線板の製造方法。1. A flexible circuit board with a circuit formed thereon is overlaid with an interlayer adhesive prepreg with a predetermined portion cut out, a sheet with mold releasability is fitted into this hollowed out portion, and a copper-clad laminate is overlaid on this surface and pressure is applied. In a method for manufacturing a rigid/flex wiring board that is heated and then subjected to circuit processing, the concave portion is removed by irradiating a laser beam onto a portion that aligns with the outer periphery of the hollowed out portion to remove only the resin of the laminated board. A method for manufacturing a rigid/flex wiring board, characterized by using a formed copper-clad laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15933290A JPH0453190A (en) | 1990-06-18 | 1990-06-18 | Manufacture of rigid/flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15933290A JPH0453190A (en) | 1990-06-18 | 1990-06-18 | Manufacture of rigid/flexible wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0453190A true JPH0453190A (en) | 1992-02-20 |
Family
ID=15691511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15933290A Pending JPH0453190A (en) | 1990-06-18 | 1990-06-18 | Manufacture of rigid/flexible wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453190A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7036214B2 (en) | 2002-03-07 | 2006-05-02 | Denso Corporation | Manufacturing method of rigid-flexible printed circuit board and structure thereof |
| JP2007059528A (en) * | 2005-08-23 | 2007-03-08 | Nippon Mektron Ltd | Hybrid multilayered circuit board and its manufacturing method |
| JP2007317864A (en) * | 2006-05-25 | 2007-12-06 | Sharp Corp | Build-up substrate, process for manufacturing build-up substrate, and electronic device using build-up substrate |
| KR101319808B1 (en) * | 2012-02-24 | 2013-10-17 | 삼성전기주식회사 | Method of manufacturing rigid-flexible printed circuit board |
| JP2014072521A (en) * | 2012-09-27 | 2014-04-21 | Samsung Electro-Mechanics Co Ltd | Manufacturing method of rigid flexible printed circuit board |
| TWI464356B (en) * | 2008-04-09 | 2014-12-11 | Panasonic Corp | Refrigerator and egg storage box |
| CN114786370A (en) * | 2022-04-25 | 2022-07-22 | 黄石西普电子科技有限公司 | Manufacturing method of six-layer rigid-flex board |
-
1990
- 1990-06-18 JP JP15933290A patent/JPH0453190A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7036214B2 (en) | 2002-03-07 | 2006-05-02 | Denso Corporation | Manufacturing method of rigid-flexible printed circuit board and structure thereof |
| JP2007059528A (en) * | 2005-08-23 | 2007-03-08 | Nippon Mektron Ltd | Hybrid multilayered circuit board and its manufacturing method |
| JP2007317864A (en) * | 2006-05-25 | 2007-12-06 | Sharp Corp | Build-up substrate, process for manufacturing build-up substrate, and electronic device using build-up substrate |
| TWI464356B (en) * | 2008-04-09 | 2014-12-11 | Panasonic Corp | Refrigerator and egg storage box |
| KR101319808B1 (en) * | 2012-02-24 | 2013-10-17 | 삼성전기주식회사 | Method of manufacturing rigid-flexible printed circuit board |
| JP2014072521A (en) * | 2012-09-27 | 2014-04-21 | Samsung Electro-Mechanics Co Ltd | Manufacturing method of rigid flexible printed circuit board |
| CN114786370A (en) * | 2022-04-25 | 2022-07-22 | 黄石西普电子科技有限公司 | Manufacturing method of six-layer rigid-flex board |
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