JP2000114608A - Method for mounting circuit board and mounting structure for circuit board - Google Patents
Method for mounting circuit board and mounting structure for circuit boardInfo
- Publication number
- JP2000114608A JP2000114608A JP10284229A JP28422998A JP2000114608A JP 2000114608 A JP2000114608 A JP 2000114608A JP 10284229 A JP10284229 A JP 10284229A JP 28422998 A JP28422998 A JP 28422998A JP 2000114608 A JP2000114608 A JP 2000114608A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder material
- case
- metal member
- superconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29109—Indium [In] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29111—Tin [Sn] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、超伝導平面回路基
板等の回路基板をケース等の金属部材に実装する回路基
板の実装方法および回路基板の実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a circuit board such as a superconducting flat circuit board or the like on a metal member such as a case and a mounting structure of the circuit board.
【０００２】[0002]
【従来の技術】超伝導平面回路基板は、図６に示すよう
に、誘電体基板１ａの表面に超伝導材を用いた回路パタ
ーン１ｂが形成され、裏面にグランドプレーンを構成す
る超伝導材１ｃが形成された構造になっている。また、
裏面に形成された超伝導材１ｃの表面にはＡｕ（金）膜
１ｄが形成されている。この超伝導平面回路基板１は、
ケースに実装され、ケースを介して接地される。2. Description of the Related Art As shown in FIG. 6, a superconducting planar circuit board has a circuit pattern 1b using a superconducting material formed on the surface of a dielectric substrate 1a and a superconducting material 1c forming a ground plane on the back surface. Is formed. Also,
An Au (gold) film 1d is formed on the surface of the superconducting material 1c formed on the back surface. This superconducting planar circuit board 1
Mounted on the case and grounded through the case.
【０００３】超伝導平面回路基板１をケースに実装する
場合、ケースとしては、Ａｕメッキされた金属（例え
ば、Ｃｕ、Ａｌなど）のケースを用い、図７に示すよう
に、超伝導平面回路基板１とケース２との間にシート状
のハンダ材３を挿入し、ハンダ材３を溶融させて超伝導
平面回路基板１をケース２に固着する。しかしながら、
この実装方法のものでは、超伝導平面回路基板１、ケー
ス２およびハンダ材３のぞれぞれの表面が凹凸状になっ
ているため、超伝導平面回路基板１とケース２との間に
ハンダ材３を一様に介在させるのが難しいという問題が
ある。具体的には、ハンダ材３中に気泡が発生し、例え
ば、図８に示すように、Ａｕ膜１ｄおよびＡｕメッキ層
２ａとハンダ材３とのそれぞれの間に、気泡４が存在す
る部分と、ハンダ材３と溶融固着した部分（すなわち合
金化した部分で、図中の斜線で示す部分）が存在する。
このため、ケース２の裏側にコールドヘッドを固定して
超伝導平面回路基板１を冷却する場合には、気泡４の存
在によって超伝導平面回路基板１に温度ムラが生じると
いう問題がある。When the superconducting planar circuit board 1 is mounted on a case, a case made of Au-plated metal (eg, Cu, Al, etc.) is used as the case, and as shown in FIG. A sheet-like solder material 3 is inserted between the case 1 and the case 2, and the solder material 3 is melted to fix the superconducting flat circuit board 1 to the case 2. However,
In this mounting method, since the surfaces of the superconducting planar circuit board 1, the case 2, and the solder material 3 are uneven, the solder between the superconducting planar circuit board 1 and the case 2 is formed. There is a problem that it is difficult to intervene the material 3 uniformly. Specifically, bubbles are generated in the solder material 3. For example, as shown in FIG. 8, a portion where the bubbles 4 exist between the Au film 1 d and the Au plating layer 2 a and the solder material 3, respectively. There is a portion that is melted and fixed to the solder material 3 (that is, a portion that is alloyed and indicated by oblique lines in the drawing).
For this reason, when cooling the superconducting planar circuit board 1 by fixing the cold head to the back side of the case 2, there is a problem that the temperature of the superconducting planar circuit board 1 is uneven due to the presence of the bubbles 4.
【０００４】また、溶融固着した部分においては、超伝
導平面回路基板１とケース２の熱膨張率の差により冷熱
ストレスが発生し、剥離や基板割れを引き起こすという
問題がある。このような問題を解決する方法として、図
９に示すように、超伝導平面回路基板１とケース２の間
にシート状のハンダ材３を挿入した状態で、押さえ部材
５により超伝導平面回路基板１をケース２に圧接する方
法があるが、この実装方法では、図中の拡大図に示すよ
うに、超伝導平面回路基板１とハンダ材３の間およびケ
ース２とハンダ材３の間に隙間が存在しており、ハンダ
材３を溶融固着する方法に比べて、超伝導平面回路基板
１とケース２の間の電気的、熱的な接触が十分得られな
いという問題がある。[0004] In addition, in the portion where the melted and fixed portions are formed, there is a problem that a thermal stress is generated due to a difference in thermal expansion coefficient between the superconducting planar circuit board 1 and the case 2, thereby causing peeling and substrate cracking. As a method for solving such a problem, as shown in FIG. 9, with a sheet-like solder material 3 inserted between the superconducting flat circuit board 1 and the case 2, In this mounting method, as shown in an enlarged view in the figure, a gap is provided between the superconducting planar circuit board 1 and the solder material 3 and between the case 2 and the solder material 3. And there is a problem that sufficient electrical and thermal contact between the superconducting flat circuit board 1 and the case 2 cannot be obtained as compared with the method of melting and fixing the solder material 3.
【０００５】なお、超伝導平面回路基板以外の回路基板
をケース等の金属部材に実装する場合においても、上記
したハンダ材の一様な形成および回路基板と金属部材の
熱膨張率の差による回路基板の剥離等といった問題が生
じ得る。When a circuit board other than the superconducting flat circuit board is mounted on a metal member such as a case, the circuit is formed by the uniform formation of the above-mentioned solder material and the difference in the coefficient of thermal expansion between the circuit board and the metal member. Problems such as peeling of the substrate may occur.
【０００６】[0006]
【発明が解決しようとする課題】本発明は上記問題に鑑
みたもので、回路基板とケース等の金属部材の間にハン
ダ材を一様に介在させることを目的とする。また、回路
基板と金属部材の熱膨張率の差による回路基板の剥離等
の問題を解決することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to uniformly dispose a solder material between a circuit board and a metal member such as a case. It is another object of the present invention to solve a problem such as peeling of a circuit board due to a difference in coefficient of thermal expansion between a circuit board and a metal member.
【０００７】さらに、回路基板を超伝導平面回路基板と
した場合に、超伝導平面回路基板とケースの間の電気
的、熱的な接触を良好にすることを目的とする。Another object of the present invention is to improve the electrical and thermal contact between the superconducting flat circuit board and the case when the circuit board is a superconducting flat circuit board.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明においては、以下に示す技術的手段を採用す
る。請求項１に記載の発明においては、回路基板（１）
の裏面に形成された金属膜（１ｄ）と金属部材（２）と
の間にハンダ材（３）を挿入し、ハンダ材を加熱して溶
融させるとともに、金属部材に設けられた貫通穴から余
分なハンダ材を吸引して、回路基板を金属部材に固定す
ることを特徴としている。Means for Solving the Problems In order to achieve the above object, the present invention employs the following technical means. According to the first aspect of the present invention, the circuit board (1)
A solder material (3) is inserted between the metal film (1d) formed on the back surface of the metal member and the metal member (2), and the solder material is heated and melted. It is characterized in that the circuit board is fixed to a metal member by sucking a suitable solder material.
【０００９】この発明によれば、貫通穴を介してハンダ
材の吸引を行うことにより、ハンダ材中に存在する気泡
を少なくして、回路基板と金属部材の間にハンダ材を一
様に介在させることができる。請求項２に記載の発明に
おいては、回路基板（１）の裏面に形成された金属膜
（１ｄ）と金属部材（２）との間にハンダ材（３）を挿
入し、ハンダ材を金属膜および金属部材との間で固溶体
を形成しない温度で加熱して溶融させることを特徴とし
ている。According to the present invention, by sucking the solder material through the through hole, bubbles existing in the solder material are reduced, and the solder material is uniformly interposed between the circuit board and the metal member. Can be done. According to the second aspect of the present invention, the solder material (3) is inserted between the metal film (1d) and the metal member (2) formed on the back surface of the circuit board (1), and the solder material is changed to the metal film. And heating at a temperature that does not form a solid solution with the metal member to cause melting.
【００１０】この発明によれば、ハンダ材を金属膜およ
び金属部材との間で固溶体を形成しない温度で加熱して
溶融させているから、回路基板と金属部材の熱膨張率の
差によるストレスに対しハンダ材の表面ですべりを発生
させて、回路基板にかかるストレスを緩和し、回路基板
の剥離等の問題を解決することができる。請求項３に記
載の発明においては、回路基板（１）の裏面に形成され
た金属膜（１ｄ）と金属部材（２）との間にハンダ材
（３）を挿入し、ハンダ材を金属膜および金属部材との
間で固溶体を形成しない温度で加熱して溶融させるとと
もに、金属部材に設けられた貫通穴から余分なハンダ材
を吸引して、回路基板を金属部材に固定することを特徴
としている。According to the present invention, since the solder material is heated and melted at a temperature at which a solid solution is not formed between the metal film and the metal member, stress due to the difference in thermal expansion coefficient between the circuit board and the metal member is reduced. On the other hand, a slip is generated on the surface of the solder material, so that stress applied to the circuit board can be reduced, and problems such as peeling of the circuit board can be solved. According to the third aspect of the present invention, the solder material (3) is inserted between the metal film (1d) and the metal member (2) formed on the back surface of the circuit board (1), and the solder material is changed to the metal film. And melting at a temperature that does not form a solid solution with the metal member, and sucking excess solder material from through holes provided in the metal member to fix the circuit board to the metal member. I have.
【００１１】この発明によれば、貫通穴を介してハンダ
材の吸引を行うことにより、ハンダ材中に存在する気泡
を少なくして、回路基板と金属部材の間にハンダ材を一
様に介在させることができ、また、ハンダ材を金属膜お
よび金属部材との間で固溶体を形成しない温度で加熱し
て溶融させているから、回路基板と金属部材の熱膨張率
の差によるストレスに対しハンダ材の表面ですべりを発
生させて、回路基板にかかるストレスを緩和し、回路基
板の剥離等の問題を解決することができる。According to the present invention, by sucking the solder material through the through hole, the bubbles existing in the solder material are reduced, and the solder material is uniformly interposed between the circuit board and the metal member. Further, since the solder material is heated and melted at a temperature at which a solid solution is not formed between the metal film and the metal member, the solder material is not subjected to stress due to a difference in coefficient of thermal expansion between the circuit board and the metal member. By causing slip on the surface of the material, stress applied to the circuit board can be reduced, and problems such as peeling of the circuit board can be solved.
【００１２】ここで、請求項４に記載の発明のように、
回路基板として超伝導平面回路基板（１）を用い、この
超伝導平面回路基板を金属部材としてのケース（２）に
固定するようにすれば、超伝導平面回路基板とケースの
間の電気的、熱的な接触を良好にすることができる。ま
た、請求項５に記載の発明によれば、回路基板と金属部
材の間にハンダ材を一様に介在させた回路基板の実装構
造を提供することができる。Here, as in the invention according to claim 4,
If a superconducting flat circuit board (1) is used as a circuit board and this superconducting flat circuit board is fixed to a case (2) as a metal member, the electrical connection between the superconducting flat circuit board and the case can be improved. Good thermal contact can be achieved. Further, according to the invention described in claim 5, it is possible to provide a circuit board mounting structure in which a solder material is uniformly interposed between the circuit board and the metal member.
【００１３】また、請求項６に記載の発明によれば、回
路基板と金属部材の熱膨張率の差による回路基板の剥離
等の問題を解決した回路基板の実装構造を提供すること
ができる。また、請求項７に記載の発明によれば、回路
基板と金属部材の間にハンダ材を一様に介在させ、回路
基板と金属部材の熱膨張率の差による回路基板の剥離等
の問題を解決した回路基板の実装構造を提供することが
できる。Further, according to the invention described in claim 6, it is possible to provide a circuit board mounting structure which solves a problem such as peeling of the circuit board due to a difference in thermal expansion coefficient between the circuit board and the metal member. Further, according to the invention as set forth in claim 7, a solder material is uniformly interposed between the circuit board and the metal member, and problems such as peeling of the circuit board due to a difference in coefficient of thermal expansion between the circuit board and the metal member are solved. It is possible to provide a solved mounting structure of a circuit board.
【００１４】なお、上記した請求項６、７に記載の発明
に対し、請求項８に記載の発明のように、押さえ部材
（５）によって回路基板を金属部材に押さえるようにす
れば、ハンダ材の表面でのすべりに対し回路基板の位置
ずれを防止することができる。また、請求項８に記載の
発明によれば、超伝導平面回路基板とケースの間の電気
的、熱的な接触を良好にした超伝導平面回路基板の実装
構造を提供することができる。In addition, when the circuit board is pressed against the metal member by the pressing member (5) as in the invention described in claim 8, the solder material can be improved. In this way, it is possible to prevent the circuit board from being displaced by slipping on the surface of the circuit board. Further, according to the invention described in claim 8, it is possible to provide a mounting structure of the superconducting flat circuit board in which the electrical and thermal contact between the superconducting flat circuit board and the case is improved.
【００１５】なお、上記した括弧内の符号は、後述する
実施形態記載の具体的手段との対応関係を示すものであ
る。[0015] The reference numerals in the parentheses indicate the correspondence with the specific means described in the embodiment described later.
【００１６】[0016]
【発明の実施の形態】以下、本発明を図に示す実施形態
について説明する。なお、この実施形態において、図６
乃至図９に示すものと同一符号を付したものは、同一も
しくは均等物であることを示している。この実施形態に
おいては、ケース２として、図２（ケース２を上から見
た図）に示すように、ケース２の底に複数の貫通穴２ｂ
が設けられたものを用いる。この貫通穴２ｂは、直径が
２ｍｍ程度のものである。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention. In this embodiment, FIG.
Those denoted by the same reference numerals as those shown in FIG. 9 to FIG. 9 indicate the same or equivalent. In this embodiment, as shown in FIG. 2 (a view of the case 2 from above), the case 2 has a plurality of through holes 2b at the bottom of the case 2.
Is used. The through hole 2b has a diameter of about 2 mm.
【００１７】超伝導平面回路基板１をケース２に実装す
る場合、図１に示すように、超伝導平面回路基板１とケ
ース２との間にシート状のハンダ材３を挿入し、押さえ
部材５により超伝導平面回路基板１をケース２に押さえ
る。また、ケース２の裏面側にハンダ吸引ジグ（吸引装
置）６を取り付ける。そして、加熱を行ってハンダ材３
を溶融させる。このとき、ハンダ材３をＡｕ膜１ｄおよ
びＡｕメッキ層２ａとの間で固溶体を形成しない温度で
加熱して溶融させる。具体的には、ハンダ材３の融点よ
りも若干高い温度で加熱を行い、ハンダ材３を溶融させ
る。例えば、ハンダ材３として、Ｉｎ（インジュウム）
を用いた場合には融点が約１５７℃であるので、それよ
りも若干高い約１６０℃で加熱を行う。When the superconducting flat circuit board 1 is mounted on the case 2, as shown in FIG. 1, a sheet-like solder material 3 is inserted between the superconducting flat circuit board 1 and the case 2, and The superconducting flat circuit board 1 is pressed against the case 2 by the above. Further, a solder suction jig (suction device) 6 is attached to the back side of the case 2. Then, heat is applied to the solder material 3
Is melted. At this time, the solder material 3 is heated and melted at a temperature at which a solid solution is not formed between the Au film 1d and the Au plating layer 2a. Specifically, heating is performed at a temperature slightly higher than the melting point of the solder material 3 to melt the solder material 3. For example, as the solder material 3, In (indium)
In the case where is used, the melting point is about 157 ° C., so that heating is performed at about 160 ° C., which is slightly higher.
【００１８】また、この加熱と同時にハンダ吸引ジグ６
により真空引きを行い、ケース２に設けられた複数の貫
通穴２ｂから余分なハンダ材３を吸引する。このとき、
ハンダ材３とともにハンダ材３中の気泡も吸引される。
このような実装方法を用いることにより、ハンダ材３中
に存在する気泡を少なくして、超伝導平面回路基板１と
ケース２の間にハンダ材３を一様に介在させることがで
きる。なお、貫通穴２ｂ中のハンダ材は、図３に示すよ
うに吸引によって除去される。At the same time as the heating, the solder suction jig 6
Then, the excess solder material 3 is sucked from the plurality of through holes 2 b provided in the case 2. At this time,
Air bubbles in the solder material 3 are sucked together with the solder material 3.
By using such a mounting method, bubbles existing in the solder material 3 can be reduced, and the solder material 3 can be uniformly interposed between the superconducting planar circuit board 1 and the case 2. The solder material in the through hole 2b is removed by suction as shown in FIG.
【００１９】また、ハンダ材３をＡｕ膜１ｄおよびＡｕ
メッキ層２ａとの間で固溶体を形成しない温度で加熱し
て溶融させているから、超伝導平面回路基板１とケース
２の熱膨張率の差によるストレスに対しハンダ材３の表
面ですべりを発生させて、超伝導平面回路基板１にかか
るストレスを緩和することができる。すなわち、ハンダ
材３は、従来のもののような溶融固着でなく、変形する
が固着していない状態となっているため、上記したスト
レスを緩和することができる。従って、超伝導平面回路
基板１の剥離や基板割れといった問題を解決することが
できる。The solder material 3 is made of Au film 1d and Au film.
Heating and melting at a temperature that does not form a solid solution with the plating layer 2a causes slipping on the surface of the solder material 3 due to stress caused by the difference in the coefficient of thermal expansion between the superconducting planar circuit board 1 and the case 2. Thus, stress applied to the superconducting planar circuit board 1 can be reduced. That is, since the solder material 3 is not melted and fixed as in the conventional solder material but is deformed but not fixed, the above-mentioned stress can be reduced. Therefore, problems such as peeling of the superconducting planar circuit board 1 and cracking of the board can be solved.
【００２０】なお、上記したハンダ材３の表面でのすべ
りによって超伝導平面回路基板１に位置ずれが生じる可
能性があるが、この実施形態においては、押さえ部材５
により超伝導平面回路基板１をケース２に固定している
ので、そのような位置ずれを防止することができる。上
記した実装構造のものと図９に示す従来の実装構造のも
のについて、ケース２の裏側にコールドヘッドを固定し
超伝導平面回路基板１を冷却した場合の基板表面温度に
ついて検討を行った。従来の実装構造のものでは、図４
中のＢのグラフで示すようにコールドヘッドの温度と基
板表面温度に差が生じたが、この実施形態の実装構造の
ものでは、図４中のＡのグラフで示すようにコールドヘ
ッドの温度と基板表面温度にほとんど差が生じなかっ
た。このことから、この実施形態の実装構造のものによ
れば、ハンダ材３が均一に薄膜化して形成されハンダ材
３の中に気泡がほとんど存在していないため、超伝導平
面回路基板１とケース２との間の熱的な接触が良好なも
のになっていることがわかる。The slip on the surface of the solder material 3 may cause displacement of the superconducting flat circuit board 1, but in this embodiment, the pressing member 5
Thus, since the superconducting flat circuit board 1 is fixed to the case 2, such a displacement can be prevented. With respect to the above-described mounting structure and the conventional mounting structure shown in FIG. 9, the board surface temperature when the cold head was fixed to the back side of the case 2 and the superconducting flat circuit board 1 was cooled was examined. In the case of the conventional mounting structure, FIG.
The difference between the cold head temperature and the substrate surface temperature occurred as shown by the graph B in FIG. 4, but in the case of the mounting structure of this embodiment, as shown by the graph A in FIG. There was almost no difference in the substrate surface temperature. From this, according to the mounting structure of this embodiment, the solder material 3 is formed in a uniform thin film, and almost no air bubbles exist in the solder material 3. It can be seen that the thermal contact between the two was good.
【００２１】また、超伝導平面回路としてフィルタ回路
を形成し、その周波数特性について検討を行った。図９
に示す従来の実装構造のものでは、図５中のＢのグラフ
で示すように所望の周波数以外の周波数のところで不要
な信号を通過させてしまうのに対し、この実施形態の実
装構造のものでは、図５中のＡのグラフで示すようにそ
のような不要な信号の通過がなく、所望の周波数特性を
得ることができた。このことから、この実施形態の実装
構造のものによれば、超伝導平面回路基板１とケース２
との間の電気的な接触が良好なものになっていることが
わかる。Further, a filter circuit was formed as a superconducting planar circuit, and its frequency characteristics were examined. FIG.
The conventional mounting structure shown in FIG. 5 passes an unnecessary signal at a frequency other than the desired frequency as shown by the graph B in FIG. 5, whereas the mounting structure of this embodiment As shown by the graph A in FIG. 5, such unnecessary signals did not pass, and a desired frequency characteristic could be obtained. From this, according to the mounting structure of this embodiment, the superconducting planar circuit board 1 and the case 2
It can be seen that the electrical contact between the two is good.
【００２２】なお、上記した実施形態においては、ケー
ス２の表面にＡｕメッキ層２ａを形成するものを示した
が、これは表面の酸化を防止するためのものであり、そ
の酸化が問題にならないのであれば、Ａｕメッキ層２ａ
はなくてもよい。また、超伝導回路基板１の裏面に形成
する金属膜としては、Ａｕ膜１ｄ以外にＡｇ等の他の金
属膜であってもよい。In the above-described embodiment, the case where the Au plating layer 2a is formed on the surface of the case 2 has been described, but this is for preventing the surface from being oxidized, and the oxidization is not a problem. If so, the Au plating layer 2a
May not be required. Further, the metal film formed on the back surface of the superconducting circuit board 1 may be another metal film such as Ag other than the Au film 1d.
【００２３】また、ハンダ材３を吸引する場合に真空引
きを行うものを示したが、超伝導回路基板１の表面側と
ケース２の裏面側に吸引に必要な圧力差を設けて吸引を
行うようにしてもよい。また、ハンダ材３としては、Ｉ
ｎ以外に、Ｓｎ−Ｓｂ、Ｐｂ−Ａｇ、Ｐｂ−Ｓｂ、Ｐｂ
−（Ｓｎ）−Ｉｎ、Ｐｂ−（Ａｇ）−Ｉｎなどのハンダ
材を用いることができ、その場合もそれぞれの融点より
若干高い温度（例えば融点より１０℃程度高い温度）で
ハンダ材を加熱溶融させればよい。In addition, while the vacuum is evacuated when sucking the solder material 3, the pressure difference required for suction is provided between the front side of the superconducting circuit board 1 and the back side of the case 2 to perform suction. You may do so. Also, as the solder material 3, I
n, Sn-Sb, Pb-Ag, Pb-Sb, Pb
A solder material such as-(Sn) -In or Pb- (Ag) -In can be used, and also in this case, the solder material is heated and melted at a temperature slightly higher than the melting point thereof (for example, about 10 ° C. higher than the melting point). It should be done.
【００２４】さらに、ケース２に設ける貫通穴２ｂは、
ケース２の裏面側に貫通するものに限らず、ケース２の
側面側に貫通するものであってもよい。なお、本発明
は、超伝導平面回路基板以外の回路基板をケース等の金
属部材に実装するものについても、同様に適用すること
ができる。Further, the through hole 2b provided in the case 2
It is not limited to the one penetrating to the back side of the case 2, but may be the one penetrating to the side surface of the case 2. The present invention can be similarly applied to a case where a circuit board other than the superconducting flat circuit board is mounted on a metal member such as a case.
【図１】本発明の一実施形態に係る超伝導平面回路基板
の実装方法を示す図である。FIG. 1 is a diagram illustrating a method for mounting a superconducting planar circuit board according to an embodiment of the present invention.
【図２】図１中のケース２の平面図である。FIG. 2 is a plan view of a case 2 in FIG.
【図３】図１に示す実装方法によって得られた超伝導平
面回路基板の実装構造を示す図である。FIG. 3 is a diagram showing a mounting structure of a superconducting flat circuit board obtained by the mounting method shown in FIG. 1;
【図４】本発明の一実施形態に係る実装構造のものと従
来の実装構造のものにおける、コールドヘッド温度と基
板表面温度の関係を示す図である。FIG. 4 is a diagram showing a relationship between a cold head temperature and a substrate surface temperature in a mounting structure according to an embodiment of the present invention and a conventional mounting structure.
【図５】本発明の一実施形態に係る実装構造のものと従
来の実装構造のものの周波数特性を示す図である。FIG. 5 is a diagram showing frequency characteristics of a mounting structure according to an embodiment of the present invention and a conventional mounting structure.
【図６】超伝導平面回路基板の構造を示す図である。FIG. 6 is a diagram showing a structure of a superconducting planar circuit board.
【図７】従来の超伝導平面回路基板の実装方法を示す図
である。FIG. 7 is a diagram illustrating a conventional method for mounting a superconducting planar circuit board.
【図８】図７に示す実装方法の問題点を説明するための
図である。FIG. 8 is a diagram for explaining a problem of the mounting method shown in FIG. 7;
【図９】従来の超伝導平面回路基板の他の実装方法を示
す図である。FIG. 9 is a view showing another mounting method of a conventional superconducting flat circuit board.
１…超伝導平面回路基板、１ａ…誘電体基板、１ｂ…回
路パターンを構成する超伝導材、１ｃ…グランドプレー
ンを構成する超伝導材、１ｄ…Ａｕ膜、２…ケース、２
ａ…Ａｕメッキ層、２ｂ…貫通穴、３…ハンダ材、４…
気泡、５…押え部材、６…ハンダ吸引ジグ。DESCRIPTION OF SYMBOLS 1 ... Superconducting plane circuit board, 1a ... Dielectric board, 1b ... Superconducting material which comprises a circuit pattern, 1c ... Superconducting material which comprises a ground plane, 1d ... Au film, 2 ... Case, 2
a: Au plating layer, 2b: through hole, 3: solder material, 4 ...
Bubble, 5 ... holding member, 6: solder suction jig.
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成１１年１１月１５日（１９９９．１１．
１５）[Submission date] November 15, 1999 (1999.11.
15)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００８[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するた
め、本発明においては、以下に示す技術的手段を採用す
る。 Means for Solving the Problems In order to achieve the above object, the present invention employs the following technical means .
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００９】請求項１に記載の発明においては、回路基
板（１）の裏面に形成された金属膜（１ｄ）と金属部材
（２）との間にハンダ材（３）を挿入し、ハンダ材を金
属膜および金属部材との間で固溶体を形成しない温度で
加熱して溶融させることを特徴としている。According to the first aspect of the present invention, the solder material (3) is inserted between the metal film (1d) formed on the back surface of the circuit board (1) and the metal member (2). Is heated and melted at a temperature at which a solid solution is not formed between the metal film and the metal member.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１０】この発明によれば、ハンダ材を金属膜およ
び金属部材との間で固溶体を形成しない温度で加熱して
溶融させているから、回路基板と金属部材の熱膨張率の
差によるストレスに対しハンダ材の表面ですべりを発生
させて、回路基板にかかるストレスを緩和し、回路基板
の剥離等の問題を解決することができる。請求項２に記
載の発明においては、回路基板（１）の裏面に形成され
た金属膜（１ｄ）と金属部材（２）との間にハンダ材
（３）を挿入し、ハンダ材を金属膜および金属部材との
間で固溶体を形成しない温度で加熱して溶融させるとと
もに、金属部材に設けられた貫通穴から余分なハンダ材
を吸引して、回路基板を金属部材に固定することを特徴
としている。According to the present invention, since the solder material is heated and melted at a temperature at which a solid solution is not formed between the metal film and the metal member, stress due to the difference in thermal expansion coefficient between the circuit board and the metal member is reduced. On the other hand, a slip is generated on the surface of the solder material, so that stress applied to the circuit board can be reduced, and problems such as peeling of the circuit board can be solved. According to the second aspect of the present invention, the solder material (3) is inserted between the metal film (1d) and the metal member (2) formed on the back surface of the circuit board (1), and the solder material is changed to the metal film. And melting at a temperature that does not form a solid solution with the metal member, and sucking excess solder material from through holes provided in the metal member to fix the circuit board to the metal member. I have.
【手続補正５】[Procedure amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１２】ここで、請求項３に記載の発明のように、
回路基板として超伝導平面回路基板（１）を用い、この
超伝導平面回路基板を金属部材としてのケース（２）に
固定するようにすれば、超伝導平面回路基板とケースの
間の電気的、熱的な接触を良好にすることができる。 Here, as in the invention according to claim 3 ,
If a superconducting flat circuit board (1) is used as a circuit board and this superconducting flat circuit board is fixed to a case (2) as a metal member, the electrical connection between the superconducting flat circuit board and the case can be improved. Good thermal contact can be achieved .
【手続補正６】[Procedure amendment 6]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１３[Correction target item name] 0013
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１３】また、請求項４に記載の発明によれば、回
路基板と金属部材の熱膨張率の差による回路基板の剥離
等の問題を解決した回路基板の実装構造を提供すること
ができる。また、請求項５に記載の発明によれば、回路
基板と金属部材の間にハンダ材を一様に介在させ、回路
基板と金属部材の熱膨張率の差による回路基板の剥離等
の問題を解決した回路基板の実装構造を提供することが
できる。According to the fourth aspect of the present invention, it is possible to provide a circuit board mounting structure in which a problem such as peeling of the circuit board due to a difference in thermal expansion coefficient between the circuit board and the metal member is solved. According to the fifth aspect of the present invention, a solder material is uniformly interposed between the circuit board and the metal member, and a problem such as separation of the circuit board due to a difference in coefficient of thermal expansion between the circuit board and the metal member is solved. It is possible to provide a solved mounting structure of a circuit board.
【手続補正７】[Procedure amendment 7]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１４[Correction target item name] 0014
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００１４】なお、上記した請求項４、５に記載の発明
に対し、請求項６に記載の発明のように、押さえ部材
（５）によって回路基板を金属部材に押さえるようにす
れば、ハンダ材の表面でのすべりに対し回路基板の位置
ずれを防止することができる。また、請求項７に記載の
発明によれば、超伝導平面回路基板とケースの間の電気
的、熱的な接触を良好にした超伝導平面回路基板の実装
構造を提供することができる。[0014] In contrast to the inventions described in claims 4 and 5 above, if the circuit board is pressed against the metal member by the pressing member (5) as in the invention described in claim 6 , the solder material can be obtained. In this way, it is possible to prevent the circuit board from being displaced by slipping on the surface of the circuit board. Further, according to the invention described in claim 7 , it is possible to provide a mounting structure of a superconducting flat circuit board in which electrical and thermal contact between the superconducting flat circuit board and the case is improved.
Claims (9)
膜（１ｄ）と少なくとも１つの貫通穴（２ｂ）が設けら
れた金属部材（２）との間にハンダ材（３）を挿入し、
前記ハンダ材を加熱して溶融させるとともに前記貫通穴
から余分なハンダ材を吸引して前記回路基板を前記金属
部材に固定することを特徴とする回路基板の実装方法。1. A solder material (3) is inserted between a metal film (1d) formed on a back surface of a circuit board (1) and a metal member (2) provided with at least one through hole (2b). And
A method of mounting a circuit board, comprising: heating and melting the solder material, and sucking excess solder material from the through hole to fix the circuit board to the metal member.
膜（１ｄ）と金属部材（２）との間にハンダ材（３）を
挿入し、前記ハンダ材を前記金属膜および前記金属部材
との間で固溶体を形成しない温度で加熱して溶融させる
ことを特徴とする回路基板の実装方法。2. A solder material (3) is inserted between a metal film (1d) formed on the back surface of a circuit board (1) and a metal member (2), and the solder material is inserted into the metal film and the metal. A method for mounting a circuit board, comprising heating and melting at a temperature that does not form a solid solution with a member.
膜（１ｄ）と少なくとも１つの貫通穴（２ｂ）が設けら
れた金属部材（２）との間にハンダ材（３）を挿入し、
前記ハンダ材を前記金属膜および前記金属部材との間で
固溶体を形成しない温度で加熱して溶融させるととも
に、前記貫通穴から余分なハンダ材を吸引して、前記回
路基板を前記金属部材に固定することを特徴とする回路
基板の実装方法。3. A solder material (3) is inserted between a metal film (1d) formed on the back surface of the circuit board (1) and a metal member (2) provided with at least one through hole (2b). And
The solder material is heated and melted at a temperature that does not form a solid solution between the metal film and the metal member, and the excess solder material is sucked from the through-hole to fix the circuit board to the metal member. A method of mounting a circuit board.
（１）を用い、この超伝導平面回路基板を前記金属部材
としてのケース（２）に固定することを特徴とする請求
項１乃至３のいずれか１つに記載の回路基板の実装方
法。4. A superconducting planar circuit board (1) is used as said circuit board, and said superconducting planar circuit board is fixed to a case (2) as said metal member. A method for mounting the circuit board according to any one of the above.
（１）の裏面側をハンダ材（３）により金属部材（２）
に固定してなる回路基板の実装構造であって、 前記金属部材には少なくとも１つの貫通穴（２ｂ）が設
けられており、 前記ハンダ材は、加熱溶融され、かつ余分なハンダ材が
前記貫通穴から吸引されたものとなっていることを特徴
とする回路基板の実装構造。5. A metal member (2) on the back side of a circuit board (1) on which a metal film (1d) is formed by a solder material (3).
Wherein the metal member is provided with at least one through hole (2b), the solder material is heated and melted, and an extra solder material is inserted through the through hole. A mounting structure of a circuit board, wherein the circuit board is sucked from a hole.
（１）の裏面側をハンダ材（３）により金属部材（２）
に固定してなる回路基板の実装構造であって、 前記ハンダ材は、前記金属膜および前記金属部材との間
で固溶体を形成しない温度で加熱溶融されたものとなっ
ていることを特徴とする回路基板の実装構造。6. A metal member (2) made of a solder material (3) on the back side of the circuit board (1) on which the metal film (1d) is formed.
Wherein the solder material is heated and melted at a temperature at which a solid solution is not formed between the metal film and the metal member. Circuit board mounting structure.
（１）の裏面側をハンダ材（３）により金属部材（２）
に固定してなる回路基板の実装構造であって、 前記金属部材には少なくとも１つの貫通穴（２ｂ）が設
けられており、 前記ハンダ材は、前記金属膜および前記金属部材との間
で固溶体を形成しない温度で加熱溶融され、かつ余分な
ハンダ材が前記貫通穴から吸引されたものとなっている
ことを特徴とする回路基板の実装構造。7. A metal member (2) made of a solder material (3) on the back side of the circuit board (1) on which the metal film (1d) is formed.
Wherein the metal member is provided with at least one through hole (2b), and the solder material is a solid solution between the metal film and the metal member. Wherein the soldering material is heated and melted at a temperature that does not result in the formation of the circuit board, and the excess solder material is sucked from the through hole.
って前記金属部材に押さえられていることを特徴とする
請求項６又は７に記載の回路基板の実装構造。8. The circuit board mounting structure according to claim 6, wherein the circuit board is pressed by the metal member by a pressing member.
（１）であり、前記金属部材は、前記超伝導平面回路基
板を実装するケース（２）であることを特徴とする請求
項５乃至８のいずれか１つに記載の回路基板の実装構
造。9. The circuit board according to claim 5, wherein the circuit board is a superconducting planar circuit board, and the metal member is a case for mounting the superconducting planar circuit board. 9. The mounting structure of the circuit board according to any one of 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28422998A JP3233111B2 (en) | 1998-10-06 | 1998-10-06 | Circuit board mounting method and circuit board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28422998A JP3233111B2 (en) | 1998-10-06 | 1998-10-06 | Circuit board mounting method and circuit board mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000114608A true JP2000114608A (en) | 2000-04-21 |
| JP3233111B2 JP3233111B2 (en) | 2001-11-26 |
Family
ID=17675853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28422998A Expired - Fee Related JP3233111B2 (en) | 1998-10-06 | 1998-10-06 | Circuit board mounting method and circuit board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3233111B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881905B2 (en) | 2002-01-10 | 2005-04-19 | Hitachi Kokusai Electric, Inc. | Mounting structure of a superconductor circuit |
| JP2007027227A (en) * | 2005-07-13 | 2007-02-01 | Mitsubishi Electric Corp | Semiconductor device and its manufacturing method |
| JP2008041816A (en) * | 2006-08-03 | 2008-02-21 | Yokogawa Electric Corp | Superconducting circuit device |
| US10656686B2 (en) | 2002-06-27 | 2020-05-19 | Intel Corporation | Multiple mode display apparatus |
| CN113133329A (en) * | 2018-10-09 | 2021-07-16 | 国立研究开发法人科学技术振兴机构 | Superconducting composite quantum computing circuit |
| WO2021245948A1 (en) * | 2020-06-05 | 2021-12-09 | 日本電気株式会社 | Quantum device |
| US11639623B2 (en) | 2014-03-29 | 2023-05-02 | Intel Corporation | Micro-hinge for an electronic device |
-
1998
- 1998-10-06 JP JP28422998A patent/JP3233111B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881905B2 (en) | 2002-01-10 | 2005-04-19 | Hitachi Kokusai Electric, Inc. | Mounting structure of a superconductor circuit |
| US10656686B2 (en) | 2002-06-27 | 2020-05-19 | Intel Corporation | Multiple mode display apparatus |
| US10817031B2 (en) | 2002-06-27 | 2020-10-27 | Intel Corporation | Multiple mode display apparatus |
| US11226660B2 (en) | 2002-06-27 | 2022-01-18 | Intel Corporation | Multiple mode display apparatus |
| JP2007027227A (en) * | 2005-07-13 | 2007-02-01 | Mitsubishi Electric Corp | Semiconductor device and its manufacturing method |
| JP2008041816A (en) * | 2006-08-03 | 2008-02-21 | Yokogawa Electric Corp | Superconducting circuit device |
| US11639623B2 (en) | 2014-03-29 | 2023-05-02 | Intel Corporation | Micro-hinge for an electronic device |
| CN113133329A (en) * | 2018-10-09 | 2021-07-16 | 国立研究开发法人科学技术振兴机构 | Superconducting composite quantum computing circuit |
| WO2021245948A1 (en) * | 2020-06-05 | 2021-12-09 | 日本電気株式会社 | Quantum device |
| JPWO2021245948A1 (en) * | 2020-06-05 | 2021-12-09 | ||
| JP7290201B2 (en) | 2020-06-05 | 2023-06-13 | 日本電気株式会社 | quantum device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3233111B2 (en) | 2001-11-26 |
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