JP2000113923A - Adapter device and circuit board inspecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adapter device produced at a low cost for facilitating electrical connection between a locally high density connecting electrode and a terminal electrode dispersed over a wide range. SOLUTION: An adapter device having an insulative layer layered on the upper face of a connector plate 11 is provided with an anisotropic conductive elastomer layer 30 and an adapter main body 10 having a connecting electrode 26 on the upper face and a terminal electrode 12 on the lower face. On the upper face of the connector plate 11, the area of the connector plate 11 is divided so as to be formed into a plurality of functional areas, and the respective functional areas are provided with mutually corresponding relay electrodes 15 arranged in lattice point positions. At least one of the functional areas is provided with an auxiliary relay electrode 16 corresponding to the relay electrode 15 in another adjacent functional area, and the auxiliary relay electrode 16 is electrically connected to the corresponding relay electrode 15 in another functional area, while the relay electrode 15 is electrically connected to the terminal electrode 12. The connecting electrode 26 is electrically connected to the relay electrode 15 or the auxiliary relay electrode 16, while the anisotropic conductive elastomer layer 30 is provided with a conductive part arranged on the connecting electrode and an insulating part insulating the connecting electrode and the conductive part from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adapter device and a circuit board inspection apparatus which can be suitably used for electrical inspection of a circuit board such as a printed circuit board.

[0002]

2. Description of the Related Art Generally, for a circuit board on which an integrated circuit or other electronic components are mounted, it is necessary to confirm that a wiring pattern of the circuit board has an expected performance before mounting the electronic components. It is necessary to inspect its electrical characteristics. Conventionally, as a method for executing the inspection of the circuit board, (a) an inspection electrode arranged according to the arrangement pattern of the electrodes to be inspected on the circuit board to be inspected is used, and the inspection electrode is inspected by a wire wiring using a tester. A method using an individually corresponding inspection electrode device electrically connected to a circuit; and (b) an inspection electrode device in which inspection electrodes are formed at standard lattice points arranged in rows and columns called a universal type. There is known a method in which an electrode to be inspected on a circuit board to be inspected and an inspection electrode of the inspection electrode device are used in combination with an adapter for electrically connecting the electrode and the inspection electrode. The adapter used in the method (b) has a plurality of connection electrodes arranged on one surface in accordance with a pattern corresponding to the electrodes to be inspected on the circuit substrate to be inspected, and is arranged at a standard lattice point position on the other surface. It consists of a multilayer wiring board having a plurality of terminal electrodes.

At present, in an integrated circuit, the number of electrodes increases as the function and capacity of the integrated circuit increase, and the pitch at which the electrodes are arranged, that is, the center-to-center distance between adjacent electrodes, is reduced, and the density is further promoted. Tend to be. For example, CSP
In a (Chip Scale Package) type semiconductor integrated circuit, surface electrodes are formed at an arrangement pitch of 0.5 mm, and in a FC (Flip Chip) type semiconductor integrated circuit, surface electrodes are formed at an arrangement pitch of 0.25 mm. Is formed. Since these semiconductor integrated circuits are mounted on a circuit board by face-down bonding, electrodes are formed at a small arrangement pitch even on a circuit board on which the semiconductor integrated circuit is mounted. Therefore, even in such an inspection apparatus for inspecting a circuit board, it is necessary to increase the density of the inspection electrodes.

However, in the individually-adapted inspection electrode device, an inspection electrode having a pattern corresponding to the electrode to be inspected on the circuit substrate to be inspected is required, so that the inspection circuit is used more efficiently than the universal type. On the other hand, although it has the advantage that it can be performed, after all, it is necessary to form a high-density test electrode in the same manner as the test target electrode by using a spring probe or the like. Is very high.

In a universal type test electrode device, the distance between adjacent test electrodes paired with a test circuit of a tester is constant, and the test electrode having a high-density test electrode. In order to inspect the inspection circuit board, an electrical connection may be made to the inspection electrode at the closest position in the inspection electrode device for some of the electrodes to be inspected by the adapter. However, it is often necessary to electrically connect some of the other electrodes to be inspected to the inspection electrodes at a considerably separated position in the inspection electrode device. This is because the density of the electrodes to be inspected at a part of the electrode area to be inspected on the circuit board to be inspected, specifically, at the point where the CPS type or FC type semiconductor integrated circuit is mounted, is lower than the inspection electrode Because it is considerably higher than the density of

Therefore, in the adapter to be used, a pattern corresponding to the electrode to be inspected on the circuit board to be inspected, that is, a connection electrode having a small pitch and arranged at a high density is replaced with a pattern corresponding to the inspection electrode of the inspection electrode device, That is, since it is necessary to electrically connect to the terminal electrodes arranged in a state of being dispersed over a wide area, the time required for wiring design of the adapter becomes large, and the number of layers of the adapter is reduced. It has to be constituted by a considerably large number of multilayer wiring boards, and therefore, the time required for manufacturing the adapter is enormous. In addition, since such an adapter is individually manufactured according to a circuit board to be inspected, it is not mass-produced. Therefore, there is a problem in that the manufacturing cost of the adapter becomes extremely high, which leads to an increase in the inspection cost of the circuit board to be inspected.

In order to solve such a problem, it is conceivable to increase the density of the inspection electrodes by reducing the arrangement pitch of the inspection electrodes in the inspection electrode device. There is a limit. A grid for electrically connecting the terminal electrodes of the adapter and the test electrodes of the test electrode device between the adapter and the test electrode device to secure a space for accommodating the transport mechanism of the circuit board to be tested. An intermediate pin device having a large number of conductive pins arranged at point positions is arranged. Then, when the arrangement pitch of the inspection electrodes in the inspection electrode device becomes small, it is necessary to arrange the conductive pins of the mediating pin device at a small pitch accordingly, but for that purpose, a conductive pin having a small diameter must be used. As a result, the required strength of the conductive pin cannot be obtained, and a required inspection cannot be performed.

On the other hand, when electrically connecting the connection electrodes of the adapter to the electrodes to be inspected on the circuit board to be inspected,
In order to reliably achieve a stable electrical connection state between the connection electrode and the electrode to be inspected, or to prevent the electrode to be inspected from being damaged by the contact of the connection electrode, an adapter is generally used. An anisotropic conductive elastomer sheet is interposed between a circuit board to be inspected and a circuit board to be inspected. This anisotropic conductive elastomer sheet has conductivity only in the thickness direction, or has a large number of pressurized conductive conductive portions that show conductivity only in the thickness direction when pressed, Various structures are known, for example,
-48951, JP-A-51-93393,
JP-A-53-147772, JP-A-54-146
This is known from, for example, Japanese Patent Publication No. 873. For an inspection target circuit board having an inspection target electrode with a small arrangement pitch, an anisotropic conductive elastomer sheet having a conductive portion having a pattern corresponding to the inspection target electrode of the inspection target circuit board has high connection reliability. Is preferred in that the following is obtained.

However, the above-mentioned anisotropic conductive elastomer sheet is manufactured as a single product itself and is handled independently, and has a specific positional relationship with respect to a circuit board in an electrical connection operation. It is necessary to hold and fix with. However, in the means for achieving the electrical connection of the circuit board to be inspected using the independent anisotropic conductive elastomer sheet, the anisotropic conductive elastomer sheet becomes smaller as the arrangement pitch of the electrodes to be inspected on the circuit board to be inspected becomes smaller. There is a problem that it is difficult to align and hold and fix the position.

[0010] Even if the desired alignment and holding and fixing have been achieved, the degree of stress due to thermal expansion and thermal contraction may be reduced when thermal history due to temperature change is received. Is different from the material forming the anisotropic conductive elastomer sheet, and therefore, there is a problem that the electrical connection state changes and a stable connection state is not maintained.

Conventionally, in order to solve the above problems, connection electrodes arranged on the upper surface in accordance with a pattern corresponding to the electrode to be inspected of the circuit device to be inspected are provided, and the lower surface is provided on the standard grid point. There has been proposed an adapter device including an adapter main body having terminal electrodes arranged thereon and an anisotropic conductive elastomer layer integrally provided on an upper surface of the adapter main body.

According to such an adapter device, even when the electrodes to be inspected on the inspection and inspection circuit board have a minute arrangement pitch and a fine and high-density complex pattern, the electrodes to be inspected can be used. The required electrical connection of the circuit board can be reliably achieved, and a good electrical connection state is stably maintained against environmental changes such as heat history due to temperature changes, and thus high connection reliability is achieved. can get.

However, when an electrical inspection of a circuit board to be inspected having electrodes to be inspected having extremely small arrangement pitches is performed by using the above-mentioned adapter device, there are the following problems. Conventionally, in the manufacture of adapter devices,
The formation of the anisotropic conductive elastomer layer is performed, for example, as follows. First, as shown in FIG. 15, on the upper surface of the adapter main body 90, an elastomer material layer 95A in which conductive magnetic particles are dispersed in a polymer material forming material that is cured to become an elastic polymer material is formed. .

Next, as shown in FIG. 16, for example, the ferromagnetic portion 81 is arranged in accordance with the same pattern as the electrode to be inspected on the circuit to be inspected, and the ferromagnetic portion 8
One of the molds 80 (hereinafter, referred to as an “upper mold”) in which a nonmagnetic material portion 82 is disposed in a portion other than the first portion 1 and a ferromagnetic material portion 86 according to a pattern opposite to an electrode to be inspected of a circuit substrate to be inspected. And the other die (hereinafter, referred to as a “lower die”) 85 in which a non-magnetic portion 87 is disposed in a portion other than the ferromagnetic portion 86, using an upper die 80 and a lower die 80. The adapter body 90 having the elastomer material layer 95A formed between the ferromagnetic part 81 of the upper die 80 and the ferromagnetic part 8 of the lower die 85
6, and a pair of electromagnets 83 and 88 are disposed on the upper surface of the upper die 80 and the lower surface of the lower die 85.

By operating the electromagnets 83 and 88, a parallel magnetic field is applied in a direction from the ferromagnetic portion 81 of the upper die 80 to the corresponding ferromagnetic portion 86 of the lower die 85. As a result, the material layer 95 for the elastomer
In A, the conductive magnetic particles dispersed in the elastomer material layer 95A are located between the ferromagnetic portion 81 of the upper die 80 and the ferromagnetic portion 86 of the lower die 85, ie, It gathers at the portion of the adapter body 90 located on the connection electrode 91, and is further oriented in the thickness direction. In this state, the material layer 95A for elastomer is subjected to, for example, a hardening treatment by heating, whereby the material layer 95A shown in FIG.
As shown in FIG. 7, an anisotropic conductive elastomer layer 95 composed of a number of conductive portions 96 extending in the thickness direction and insulating portions 97 for mutually insulating the conductive portions 96 is formed by connecting the conductive portions 96 to the connection electrodes 9.
1 and is integrally formed on the upper surface of the adapter main body 90 in a state where the adapter body 90 is disposed on the upper surface.

When forming the anisotropic conductive elastomer layer 95 corresponding to the circuit board to be inspected on which the electrodes to be inspected are arranged at an extremely small arrangement pitch, the ferromagnetic portions 81 and It is necessary to use the upper die 80 and the lower die 85 in which the 86s are arranged at an extremely small pitch. However, when forming the anisotropic conductive elastomer layer 95 as described above using the upper mold 80 and the lower mold 85, as shown in FIG. In one of the ferromagnetic portions 81a,
86a and the ferromagnetic portions 81b and 86b adjacent thereto have a small separation distance, and the presence of the adapter body 90 makes the distance between the upper die 80 and the lower die 85 considerably large depending on the thickness thereof. Therefore, the upper die 80
Not only from the ferromagnetic portion 81a of the upper die 80 to the corresponding ferromagnetic portion 86a of the lower die 85 (indicated by the arrow X), but also from the ferromagnetic portion 81a of the upper die 80 to the corresponding lower die. The magnetic field also acts in a direction (indicated by an arrow Y) toward the ferromagnetic portion 86b adjacent to the ferromagnetic portion 86a of FIG. Therefore, in the material layer 95A for the elastomer, the conductive magnetic particles are aggregated in a portion located between the ferromagnetic portion 81a of the upper die 80 and the corresponding ferromagnetic portion 86a of the lower die 85. And the conductive magnetic particles also aggregate in a portion located between the ferromagnetic portion 81a of the upper die 80 and the ferromagnetic portion 86b of the lower die 85. It is difficult to orient the layer sufficiently in the thickness direction of the elastomer material layer 95A, and as a result, an anisotropic conductive elastomer layer having a desired conductive portion and insulating portion cannot be obtained.

[0017]

SUMMARY OF THE INVENTION The present invention has been made based on the above circumstances. A first object of the present invention is to disperse connection electrodes of a pattern corresponding to the electrodes in a wide area even if the electrodes of a circuit board to be connected are locally arranged at a high density. It is an object of the present invention to provide an adapter device which can be easily electrically connected to terminal electrodes arranged in a state where the adapter is placed, and which can be manufactured at low cost. A second object of the present invention is to provide an adapter device in which a good electrical connection state is stably maintained even in a change in environment such as a heat history due to a temperature change, and therefore, the connection reliability is high. A third object of the present invention is to provide a circuit board to be connected to even if the arrangement pitch of the electrodes is minute, and the electrodes are of a fine and high-density complicated pattern, the required electric power for the circuit board is required. An object of the present invention is to provide an adapter device that can reliably achieve a dynamic connection. A fourth object of the present invention is to
Provided is a circuit board inspection apparatus capable of performing an electrical inspection of a circuit board at a low cost even if electrodes to be inspected of the circuit board to be inspected are locally arranged at high density. It is in. A fifth object of the present invention is to
For a circuit board having electrodes to be inspected arranged at high density, electrical connection to the test circuit of the tester can be easily achieved with high efficiency, and the required electrical inspection is performed with sufficiently high reliability. It is an object of the present invention to provide a circuit board inspection apparatus which can be used.

[0018]

The adapter device of the present invention has a connector plate and at least one insulating layer integrally laminated on the upper surface thereof, and a circuit board to be connected to the upper surface of the uppermost insulating layer. An adapter body having a plurality of connection electrodes arranged in accordance with a pattern corresponding to the electrode, and having a plurality of terminal electrodes arranged at lattice points on the lower surface of the connector plate; and A plurality of functional regions formed on the upper surface of the connector plate of the adapter body by dividing the region of the upper surface, and each of the functional regions includes a grid. It has a plurality of relay electrodes corresponding to each other and arranged at point positions, and at least one of these functional regions is located in another functional region adjacent thereto. It has a plurality of sub-relay electrodes arranged corresponding to the relay electrodes, each of the sub-relay electrodes is electrically connected to a relay electrode in another corresponding functional area, and the Each of the relay electrodes is electrically connected to the terminal electrode, and each of the connection electrodes is electrically connected to a relay electrode or a sub-relay electrode of the connector plate, and the anisotropic conductive elastomer layer Has a plurality of conductive portions arranged on the connection electrodes of the adapter body, conductive particles filled in an elastic polymer material, and an insulating portion for insulating these conductive portions from each other. It is characterized by becoming.

In the adapter device of the present invention, it is preferable that two or more functional regions each having a sub-relay electrode are continuously formed on the connector plate of the adapter body. Further, it is preferable that the total density of the relay electrode and the sub-relay electrode in the functional region having the sub-relay electrode is 2 to 64 times the density of the terminal electrode. Further, it is preferable that at least a part of the connection electrode of the adapter body is made of a magnetic material.

According to a second aspect of the present invention, there is provided an inspection apparatus for a circuit board, comprising: the above-mentioned adapter device; And a test electrode plate device having a plurality of test electrodes arranged in the same manner. Further, in the circuit board inspection device of the present invention, the inspection electrode plate device has a plurality of functional regions having the same inspection electrode arrangement formed by dividing an upper surface region thereof. Is electrically connected to test electrodes in other functional regions arranged at positions corresponding to each other.

[0021]

(1) In the adapter body, when a certain connection electrode is electrically connected to the sub-relay electrode in the function area close to the connection electrode, the connection electrode is connected to another function area adjacent to the function area. Is also electrically connected to the relay electrode in the above. In this manner, the connection electrode is electrically connected to the sub-relay electrode in the functional region at a position close to the connection electrode, and at the same time, the relay electrode in the functional region at a position separated from the connection electrode. Also, an electrically connected state is achieved. Therefore, even if the substrate to be inspected has electrodes to be inspected which are locally arranged at high density, the connection electrodes of the pattern corresponding to the electrodes to be inspected are arranged in a state of being dispersed in a wide area. Can easily be electrically connected to the terminal electrode. Further, since the connection electrode may be electrically connected to the relay electrode or the sub-relay electrode at a position close to the connection electrode, the number of insulating layers formed on the connector plate can be reduced, and the connector The plate can be mass-produced because the same configuration can be used for an adapter body having connection electrodes of different patterns.
As a result, the adapter device can be manufactured at low cost.

(2) By forming at least a part of the connection electrode in the adapter body from a magnetic material, a parallel magnetic field acts in the thickness direction when forming the anisotropic conductive elastomer layer on the upper surface of the adapter body. When this is done, the magnetic material constituting the connection electrode acts as a magnet, so that lines of magnetic force considerably larger than other positions are concentrated on the position above the connection electrode. Thereby, even if the arrangement pitch of the connection electrodes is extremely small, the conductive particles gather at positions above the connection electrodes and are further oriented in the thickness direction, so that they are arranged on the connection electrodes, and An intended anisotropic conductive elastomer layer having a plurality of conductive portions insulated from each other by an insulating portion can be formed. Therefore, the electrodes of the circuit board to be connected are
Even in the case where the arrangement pitch is minute and the pattern has a fine and high-density complex pattern, required electric connection can be reliably achieved for the circuit board.

[0023]

Embodiments of the present invention will be described below. <Adapter Device> FIG. 1 is an explanatory view showing a configuration of an example of the adapter device according to the present invention, with a part thereof cut away. FIG. FIG. The adapter device is used, for example, for electrical inspection of a circuit board, and includes a connector plate 11 made of a multilayer wiring board, a first insulating layer 20 integrally laminated on an upper surface of the connector plate 11, and The adapter body 10 includes the second insulating layer 25, and an anisotropic conductive elastomer layer 30 is integrally provided on the upper surface of the adapter body 10. A plurality of terminal electrodes 12 are arranged on the lower surface of the adapter body 10, that is, on the lower surface of the connector plate 11 in accordance with the lattice point positions, and the upper surface of the adapter body, that is, the upper surface of the uppermost second insulating layer 25, A plurality of connection electrodes 26 are arranged according to a pattern corresponding to an electrode to be inspected on a circuit board to be inspected.

As shown in FIG. 3, on the upper surface of the connector plate 11, the area of the upper surface is divided into four in the vertical direction (vertical direction in FIG. The functional areas A, B, C, and D are on one side (FIG. 1).
3 to the left side in FIG. 3). In each of the functional areas A, B, C, and D, a plurality of relay electrodes (indicated by “○” in FIG. 3) 15
Are arranged in accordance with grid point positions arranged in vertical j rows and horizontal k columns. In FIG. 3, in order to identify each of the relay electrodes 15 in each functional area, the functional areas A, B, C, D
Relay electrode 15 at the position of the j-th row and the k-th column in each of
Are indicated by the symbol “(j, k)”, and symbols “A” to “D” indicating the functional area are added to the head of the symbol “(j, k)” to further specify the functional area. The arrangement pitch of the relay electrodes 15 in this example is the same as the arrangement pitch of the terminal electrodes 12, but may be different from the arrangement pitch of the terminal electrodes 12.

Of the four functional areas, one counted from one side
The second and third functional areas A, B, C
A plurality of sub-relay electrodes (indicated by “●” in FIG. 3) 16 corresponding to the relay electrodes 15 in the functional areas B, C, and D adjacent to the other side are arranged in accordance with the lattice point positions and mutually equal to each of the relay electrodes 15. They are arranged at intervals. The sub relay electrode 16 in each of the functional areas A, B, and C is electrically connected to the corresponding relay electrode 15 in each of the functional areas B, C, and D adjacent to the other side of the functional area by the wiring path 13. It is connected. Such a set of electrodes electrically connected to each other is referred to as a “common electrode” in this specification. That is, in this example,
A sub-relay electrode 16 in each of the functional areas A, B, and C;
A common electrode composed of a set with the relay electrode 15 in each of the other functional regions B, C, and D adjacent thereto is formed.

In the above, the total density of the relay electrode 15 and the sub-relay electrode 16 in the functional areas A, B, and C having the sub-relay electrode 16 is 2 to 64 times the density of the terminal electrode 12.
That is, the arrangement pitch L1 between the relay electrode 15 and the sub-relay electrode 16 is two times the arrangement pitch L2 of the terminal electrode 12.
It is preferably from ^-1/2 (0.71) to 64 ^-1/2 (0.125) times. When the total density of the relay electrode 15 and the sub-relay electrode 16 is too small, a considerable number of the connection electrodes 26 are electrically connected to the relay electrode 15 or the sub-relay electrode 16 on the connector plate 11. As a result, it may be difficult to obtain a laminated connector device with low manufacturing cost. On the other hand, if the total density of the relay electrode 15 and the sub-relay electrode 16 is excessively large, the connector plate 11 must be formed of a multilayer wiring board having a considerably large number of layers. Costs are high,
It may be difficult to manufacture the connector plate 11 itself.

The arrangement pitch of the terminal electrodes 12 and the relay electrode 1
A preferred combination of the terminal electrode 12 and the wiring pitch of the sub relay electrode 16 is, for example, 2.54.
mm, the arrangement pitch between the relay electrode 15 and the sub-relay electrode 16 is 1.27 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is four times the density of the terminal electrode 12). 12 is 1.80 mm, the arrangement pitch between the relay electrode 15 and the sub-relay electrode 16 is 1.27 mm (the relay electrode 15 and the sub-relay electrode 16).
Is twice the density of the terminal electrode 12) or 0.9.
0 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is four times the density of the terminal electrode 12), and when the arrangement pitch of the terminal electrodes 12 is 1.5 mm, the relay electrode 15
The arrangement pitch between the sub-relay electrode 16 and the sub-relay electrode 16 is 1.06 mm (the total density of the
2) or 0.75 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is four times the density of the terminal electrode 12), and the arrangement pitch of the terminal electrodes 12 is 1.27 m.
m, the arrangement pitch between the relay electrode 15 and the sub-relay electrode 16 is 0.90 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is twice the density of the terminal electrode 12) or 0.635 mm ( Relay electrode 15 and sub-relay electrode 16
Is four times the density of the terminal electrodes 12) and the arrangement pitch of the terminal electrodes 12 is 1.06 mm,
The arrangement pitch between the relay electrode 15 and the sub-relay electrode 16 is 0.7
5 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is twice the density of the terminal electrode 12) or 0.53 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is four times the density of the terminal electrode 12) When the arrangement pitch of the terminal electrodes 12 is 0.90 mm, the arrangement pitch of the relay electrode 15 and the sub-relay electrode 16 is 0.635 mm (relay electrode 1).
5 and the sub relay electrode 16 have a total density of twice the density of the terminal electrode 12) or 0.45 mm (the total density of the relay electrode 15 and the sub relay electrode 16 is four times the density of the terminal electrode 12).
When the arrangement pitch of the terminal electrodes 12 is 0.75 mm, the arrangement pitch of the relay electrode 15 and the sub-relay electrode 16 is 0.53 mm (the relay electrode 15 and the sub-relay electrode 1).
6 is twice the density of the terminal electrode 12) or 0.
375 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is four times the density of the terminal electrode 12).
2 is 0.53 mm, the arrangement pitch between the relay electrode 15 and the sub-relay electrode 16 is 0.375 m.
m (the total density of the relay electrode 15 and the sub-relay electrode 16 is twice the density of the terminal electrode 12) or 0.265 mm (the total density of the relay electrode 15 and the sub-relay electrode 16 is the terminal electrode 1)
4 times the density of 2).

Further, in an inspection apparatus described later, the arrangement pitch of the terminal electrodes 12 of the connector plate 11 is preferably 0.53 mm or more, since conductive pins having a required strength and a large outer diameter can be used. Preferably, for example, 2.54 mm, 1.80 mm, 1.50 mm, 1.27
mm.

A wiring section 21 is formed on the upper surface of the first insulating layer 20 according to an appropriate pattern, and the wiring section 21 is formed by a short-circuit extending through the first insulating layer 20 in its thickness direction. The portion 22 is electrically connected to the relay electrode 15 or the sub-relay electrode 16 of the connector plate 11. Further, on the upper surface of the second insulating layer 25, a plurality of connection electrodes 26 are formed in accordance with a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected, and each of the connection electrodes 26 is The first insulating layer 2 is formed by the short-circuit portion 27 extending through the second insulating layer 25 in the thickness direction.
0 is electrically connected to the wiring portion 21 formed on the upper surface of the first wiring. Note that the wiring portion 21 can be formed to extend in a direction intersecting with the paper surface in FIG. 1, and all the connection electrodes 26 can be formed through such a wiring portion.
Is the relay electrode 15 or the auxiliary relay electrode 1 of the connector plate 11
6 are electrically connected.

As described above, the connection electrode 26 is formed by the short-circuit portion 27 of the second insulating layer 25, the wiring portion 21, and the first insulating layer 2.
0 short-circuit portion 22, relay electrode 15 or sub-relay electrode 16
In addition, it is electrically connected to the terminal electrode 12 via the wiring path 13.

At least a part of the connection electrode 26 in this example is made of a magnetic material. Specifically, as shown in FIG. 4, the connection electrode 26 is made of, for example, copper,
It has a multilayer structure of a base layer portion 26A made of gold, silver or the like and a surface layer portion 26B made of a magnetic material. However, it is not essential for the present invention that the connection electrode 26 has a multilayer structure. For example, the entire connection electrode 26 may be made of a magnetic material. Surface part 26B
As the magnetic material constituting, nickel, iron, cobalt and alloys containing these elements can be used. The thickness of the surface portion 26B made of a magnetic material is, for example, 10 to 500 μm.

The method of forming the connection electrode 26 is not particularly limited, but the base layer 2 may be formed.
When 6A is made of copper and the surface portion 26B is made of nickel, iron, or the like, a thin copper layer is formed on the upper surface of the second insulating layer 25, and then photolithography and etching are performed. A base layer portion 26A is formed, and then photolithography, nickel, or the like is formed on the upper surface of the second insulating layer 25 on which the base layer portion 26A is formed.
By applying a plating treatment of iron or the like, the surface layer 2
The method of forming 6B can be used.

An anisotropic conductive elastomer layer 30 is formed on the upper surface of the adapter body 10 in a state of being integrally adhered or adhered thereto. As shown in FIG. 5, the anisotropic conductive elastomer layer 30 has a large number of conductive portions 31 in which conductive particles P are densely filled in an insulating elastic polymer substance E for connecting the adapter body 10. The conductive portions 31 are positioned on the electrodes 26 and are insulated from each other by the insulating portions 32. In each conductive portion 31, the conductive particles P are oriented so as to be arranged in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive portion 31 may be a pressurized conductive portion in which a conductive path is formed by reducing a resistance value when compressed in a thickness direction and compressed. On the other hand, the insulating part 32
No conductive path is formed in the thickness direction even when pressed.

In the illustrated example, on the outer surface of the anisotropic conductive elastomer layer 30, the conductive portion 31 forms a protruding portion protruding from the surface of the insulating portion 32. According to such an example, since the degree of compression by pressurization is larger in the conductive portion 31 than in the insulating portion 32, a conductive path having a sufficiently low resistance value is reliably formed in the conductive portion 31, and thereby, the pressing force It is possible to reduce the change in the resistance value with respect to the change or fluctuation, and as a result, even if the pressing force applied to the anisotropic conductive elastomer layer 30 is not uniform, the conductivity between the conductive portions 31 is not changed. Variation can be prevented.

When the conductive portion 31 forms a protrusion as described above, the protrusion height h of the protrusion is determined by the total thickness t of the anisotropic conductive elastomer layer 40 (t = h + d, and d is the insulating portion 32).
Is the thickness. ) Is preferably 8% or more. Further, the total thickness t of the anisotropic conductive elastomer layer 30 is 300% or less of the arrangement pitch p of the connection electrodes 26, that is, t ≦
It is preferably 3p. By satisfying such conditions, even if the pressure applied to the anisotropic conductive elastomer layer 30 changes, the conductive portion 31
This is because the change in conductivity of the substrate is suppressed to a sufficiently small value.

In the case where the conductive portion 31 forms a protrusion, it is not always necessary that the entire surface of the protrusion has conductivity. Road non-forming portions may be present. Further, it is preferable that the minimum value of the separation distance r between the adjacent conductive portions 31 is 10% or more of the width R of the conductive portion 31. By satisfying such conditions, it is possible to sufficiently avoid the possibility that the adjacent conductive portions 31 electrically contact each other due to lateral displacement when the protrusion is deformed by being pressed. Can be. In the above, the planar shape of the conductive portion 31 can be a rectangular shape having the same width as the connection electrode 26, but can be a circular shape having a necessary area, or any other appropriate shape. Further, on the outer surface of the anisotropic conductive elastomer layer 30, the conductive portion 3
The configuration in which 1 protrudes from the surface of the insulating section 32 is not essential in the present invention.
1 (a configuration in which a recess is formed at the position of the conductive portion 31), or a configuration in which the outer surface of the anisotropic conductive elastomer layer 30 is flat.

As the insulating elastic high molecular substance constituting the conductive portion 31, a high molecular substance having a crosslinked structure is preferable. Various materials can be used as the curable polymer material that can be used to obtain the crosslinked polymer material, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene- Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, and block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like can be given. In the above, when the obtained anisotropic conductive elastomer layer 30 is required to have weather resistance, it is preferable to use a material other than the conjugated diene-based rubber. It is preferable to use

As the silicone rubber, those obtained by crosslinking or condensing a liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group. Good. Specifically, dimethylsilicone raw rubber, methylvinylsilicone raw rubber, methylphenylvinylsilicone raw rubber and the like can be mentioned.

Among these, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation reaction in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
A liquid silicone rubber containing vinyl groups at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, and uses, for example, dimethyldivinylsiloxane as a polymerization terminator and other reaction conditions (for example, , The amount of cyclic siloxane and the amount of polymerization terminator). Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such a vinyl group-containing polydimethylsiloxane preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of heat resistance of the obtained conductive path element, the molecular weight distribution index (the value of the ratio Mw / Mn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn; the same applies hereinafter) is 2. 0.0 or less is preferable.

On the other hand, a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
The cyclic siloxane is anionically polymerized in the presence of a catalyst, and a polymerization terminator such as dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used. Other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such hydroxyl group-containing polydimethylsiloxane is,
It is preferable that the molecular weight Mw is 10,000 to 40,000. Further, from the viewpoint of heat resistance of the obtained conductive path element, those having a molecular weight distribution index of 2.0 or less are preferable. In the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

In order to cure the above-mentioned polymer material, a curing catalyst can be used. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as the curing catalyst include azobisisobutyronitrile and the like. Specific examples of those which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a platinum-unsaturated group-containing siloxane complex, a complex of vinylsiloxane and platinum, and platinum and 1,1.
Known examples include a complex with 3-divinyltetramethyldisiloxane, a complex of triorganophosphine or phosphite and platinum, an acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer substance-forming material, the type of the curing catalyst, and other curing treatment conditions. 15 parts by weight.

As the conductive particles constituting the conductive portion 31, from the viewpoint that the particles can be easily oriented by a method for forming an anisotropic conductive elastomer layer described later.
It is preferable to use conductive magnetic particles. Specific examples of the conductive magnetic particles include particles of a metal exhibiting magnetism such as iron and cobalt, or particles of an alloy thereof, or particles containing these metals, or these particles as core particles. The surface of which is plated with a metal with good conductivity such as gold, silver, palladium, rhodium,
Alternatively, inorganic particles or polymer particles such as non-magnetic metal particles or glass beads are used as core particles, and the surface of the core particles is plated with a conductive magnetic material such as nickel or cobalt. One coated with both a conductive magnetic material and a metal having good conductivity. Among them, it is preferable to use nickel particles as core particles, and to use those obtained by plating the surface with a metal having good conductivity such as gold or silver, and in particular, both gold and silver are coated. Are preferred. Means for coating the surface of the core particles with the conductive metal is not particularly limited, but may be, for example, chemical plating or electroless plating.

When the conductive particles are formed by coating the surface of a core particle with a conductive metal, the coverage of the conductive metal on the particle surface (from the viewpoint of obtaining good conductivity) Is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%. Moreover, the coating amount of the conductive metal is 2.5 to
It is preferably 50% by weight, more preferably 3 to
It is 30% by weight, more preferably 3.5 to 25% by weight, particularly preferably 4 to 20% by weight. When the conductive metal to be coated is gold, the coating amount is 3 to
It is preferably 30% by weight, more preferably 3 to
It is 20% by weight, more preferably 3.5 to 15% by weight, particularly preferably 4.5 to 10% by weight. When the conductive metal to be coated is silver, the coating amount is preferably 3 to 30% by weight of the core particles, more preferably 4 to 25% by weight, and further preferably 5 to 23% by weight. %, Particularly preferably from 6 to 20% by weight. Further, when both gold and silver are used as the conductive metal to be coated, the coating amount of gold is preferably 0.1 to 5% by weight of the core particles, more preferably 0.2 to 4% by weight. % By weight, more preferably 0.5 to 3% by weight.
It is preferably 3 to 30% by weight of the core particles, more preferably 4 to 25% by weight, and still more preferably 5 to 20% by weight.

The conductive particles have a particle size of 1 to 100.
0 μm, more preferably 2 to 50 μm.
0 μm, more preferably 5 to 300 μm, particularly preferably 10 to 200 μm. The particle size distribution (Dw / Dn) of the conductive particles is preferably 1 to 10, more preferably 1.01 to 7, further preferably 1.05 to 5, and particularly preferably 1.1 to 1. 4. By using conductive particles that satisfy such conditions,
The obtained conductive portion 31 is easily deformed under pressure,
Further, sufficient electrical contact between the conductive particles in the conductive portion 31 is obtained. Further, the shape of the conductive particles is not particularly limited, but is spherical, star-shaped, or a secondary particle in which these are aggregated because they can be easily dispersed in the polymer material. It is preferably in the form of a lump of particles.

The water content of the conductive particles is preferably at most 5%, more preferably at most 3%, further preferably at most 2%, particularly preferably at most 1%. By using the conductive particles satisfying such conditions, in the formation of an anisotropic conductive elastomer layer to be described later, when the conductive portion forming material layer is cured, bubbles are generated in the conductive portion forming material layer. Is prevented or suppressed.

Further, a conductive particle whose surface has been treated with a coupling agent such as a silane coupling agent can be used as appropriate. By treating the surface of the conductive particles with the coupling agent, the adhesion between the conductive particles and the elastic polymer material is increased, and as a result, the obtained conductive portion 31 has durability in repeated use. It will be expensive. The amount of the coupling agent used is appropriately selected within a range that does not affect the conductivity of the conductive particles. However, the coverage of the coupling agent on the surface of the conductive particles (the amount of the coupling agent with respect to the surface area of the conductive core particles). 5%
It is preferable that the amount is not less than the above, more preferably the above-mentioned coverage is 7 to 100%, and still more preferably 10 to 10%.
The amount is 0%, particularly preferably 20 to 100%.

The conductive particles have a volume fraction of 30 to 60%, preferably 35 to 60% with respect to the polymer material.
It is preferable to use it at a ratio of 50%. If this ratio is less than 30%, a conductive portion having a sufficiently low electric resistance may not be obtained. On the other hand, this ratio is 60
%, The obtained conductive part tends to be fragile, and the elasticity required for the conductive part may not be obtained.

The material for forming the conductive portion for forming the conductive portion may contain, if necessary, an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, and alumina. By including such an inorganic filler, the thixotropic property of the material for forming the conductive portion is ensured, the viscosity thereof is increased, and the dispersion stability of the conductive particles is improved, and the obtained material is cured. The strength of the conductive portion to be formed is increased. The use amount of such an inorganic filler is not particularly limited, but when used in an excessively large amount, in the method of forming an anisotropic conductive elastomer layer described later, the orientation of the conductive particles by the magnetic field is sufficiently achieved. It is not preferable because it becomes impossible to perform the operation.

As the material for forming the insulating portion 32, the same or different material as the polymer material for forming the conductive portion 31 can be used. It is preferable to use one that holds the adapter and is integrated with the adapter body 10.

Such an anisotropic conductive elastomer layer 30
The method for forming is not particularly limited, but for example, the following first method and second method can be mentioned as preferable methods.

[First Method] In the first method, a fluid mixture in which conductive magnetic particles are dispersed in a polymer material which becomes an insulating elastic polymer by curing treatment is used. A material for an elastomer is prepared. The viscosity of this elastomer material is preferably in the range of 100,000 to 1,000,000 cp at a temperature of 25 ° C. Then, the elastomer material is applied to the upper surface of the adapter body 10 as shown in FIG. 6 to form the elastomer material layer 30A on the upper surface of the adapter body 10.

Next, as shown in FIG. 7, a ferromagnetic material portion M is arranged according to the same pattern as the electrode to be inspected of the circuit substrate to be inspected, and a non-magnetic material portion is provided in a portion other than the ferromagnetic material portion M. N type (hereinafter, referred to as N type)
"Upper type". And 36) a ferromagnetic portion M is arranged according to a pattern opposite to the electrode to be inspected on the circuit substrate to be inspected, and a non-magnetic portion N is arranged in a portion other than the ferromagnetic portion M. (Hereinafter, referred to as “lower mold”) 37, the adapter body 10 having the elastomer material layer 30A formed between the upper mold 36 and the lower mold 37, and the connection electrode 26 thereof It is arranged so as to be located between the ferromagnetic portion M of the upper die 36 and the ferromagnetic portion M of the lower die 37, and a pair of electromagnets 38 and 39 are provided on the upper surface of the upper die 36 and the lower surface of the lower die 37. Deploy. At this time, the lower surface of the upper mold 36 is separated from the elastomer material layer 30A to form a gap.

By operating the electromagnets 38 and 39, a parallel magnetic field is applied in a direction from the ferromagnetic portion M of the upper die 36 to the corresponding ferromagnetic portion M of the lower die 37. At this time, when at least a part of the connection electrode 26 is made of a magnetic material, in this example, when the connection electrode 26 has a surface portion 26B made of a magnetic material, the surface portion 26B is used as a magnet As a result, considerably larger lines of magnetic force are generated at positions above the connection electrodes 26 than at other positions. As a result, as shown in FIG. The conductive magnetic particles dispersed in the material layer 30A gather at a portion located between the ferromagnetic portion M of the upper die 36 and the connection electrode 26 of the adapter main body 10, and are further arranged in the thickness direction. Orientation.

However, at this time, since there is a gap on the surface side of the elastomer material layer 30A, the polymer material is similarly moved by the moving and gathering of the conductive magnetic particles. The surface of the material for a polymer substance in the portion located at the position is raised and protruded. And
After the parallel magnetic field is applied or after the parallel magnetic field is removed, a curing process is performed on the elastomer material layer 30A to form a plurality of conductive portions 31 extending in the thickness direction as shown in FIG. An anisotropic conductive elastomer layer 30 composed of insulating portions 32 mutually insulated is integrally formed on the upper surface of the adapter main body 10 in a state where the conductive portions 31 are arranged on the connection electrodes 26.

In the above, the material layer for elastomer 30
The intensity of the parallel magnetic field applied to A is 200 to 10 on average.
A size of 000 gauss is preferred. The curing treatment of the elastomer material layer 30A is appropriately selected depending on the material to be used, but is usually performed by heat treatment. When the elastomer material layer 30A is cured by heating, the electromagnets 38 and 39 may be provided with heaters. The specific heating temperature and heating time are appropriately selected in consideration of the type of the material for the polymer substance constituting the elastomer material layer 30A, the time required for the movement of the conductive magnetic particles, and the like.

[Second Method] In the second method, a fluid mixture in which conductive magnetic particles are dispersed in a polymer material which becomes an insulating elastic polymer by curing treatment is used. A conductive part forming material is prepared. The viscosity of the conductive part forming material is 100 at 25 ° C.
It is preferably in the range of 000 to 1,000,000 cp. On the other hand, a polymer material which becomes an insulating elastic polymer material by a curing process is applied to the upper surface of the adapter body, and the material is cured, as shown in FIG. Is integrally formed on the upper surface of the sheet. Next, a portion of the insulating portion sheet body 32A located on the connection electrode 26 is subjected to, for example, laser drilling, so that the insulating portion sheet body 32A has a thickness as shown in FIG. A conductive portion hole 31H penetrating in the direction is formed.
Then, by applying the conductive part forming material to the insulating part sheet 32A, as shown in FIG. 9C, the conductive part forming material 31A is formed in the conductive part hole 31H of the insulating part sheet 32A. To form

In the above, as a means for applying the material for forming the conductive portion, means by printing such as roll coating, blade coating, screen printing and the like can be used. In the formation of the conductive layer forming material layer 31A, for example, 1 × 10 ⁻³ atm or less, preferably 1 × 10 ⁻³ atm or less.
Under an atmosphere reduced to ^-4 to 1 × 10 ^-5 atm,
After applying the conductive part forming material to the insulating part sheet 32A, it is preferable to form the conductive part forming material layer 31A by increasing the atmospheric pressure to, for example, normal pressure. According to such a method, by increasing the atmospheric pressure, it is possible to prevent bubbles from being generated in the conductive portion forming material layer 31A due to a difference from the pressure in the conductive portion hole 31H.

Next, as shown in FIG. 10, the upper mold 36 and the lower mold 37 are used, and between the upper mold 36 and the lower mold 37, the insulating body sheet 32A and the material for forming the conductive part are formed. The adapter main body 10 on which the layer 31A is formed is arranged such that the connection electrode 26 is located between the ferromagnetic portion M of the upper die 36 and the ferromagnetic portion M of the lower die 37. A pair of electromagnets 3 are provided on the upper surface of the mold 36 and the lower surface of the lower mold 37.
8, 39 are arranged.

By operating the electromagnets 38 and 39, a parallel magnetic field is applied in a direction from the ferromagnetic portion M of the upper die 36 to the corresponding ferromagnetic portion M of the lower die 37. At this time, since the surface portion 26B of the connection electrode 26 made of a magnetic material acts as a magnet,
As a result, magnetic field lines considerably larger than the other positions are concentrated at the position above the connection electrode 26, and as a result, FIG.
As shown in the figure, in the conductive part forming material layer 31A,
The conductive magnetic particles dispersed in the conductive portion forming material layer 31A are oriented so as to be arranged in the thickness direction. In this state, the conductive portion is formed by, for example, performing a curing process by heating the conductive portion forming material layer 31A.
Many conductive parts 31 extending in the thickness direction as shown in FIG.
And an insulating portion 32 that insulates them from each other, an anisotropic conductive elastomer layer 30 is integrally formed on the upper surface of the adapter body 10 with the conductive portion 31 disposed on the connection electrode 26. .

In the above, the conductive portion forming material layer 31A
Of the parallel magnetic field applied to the conductive layer, the conductive layer forming material layer 31
The curing treatment conditions for A are the same as those for the elastomer material layer in the first method.

In the above-described adapter device, as will be described below, in the adapter main body 10, the connection electrodes 26 arranged locally at high density are easily electrically connected to the terminal electrodes 12 dispersed over a wide area. Can be connected. For example, a certain connection electrode 26 arranged above the first functional area A counted from one side of the connector plate 11
Is electrically connected to the sub-relay electrode 16 at an appropriate position in the functional area A by the short-circuit portion 27 of the second insulating layer 30 and the wiring portion 21 and the short-circuit portion 22 of the first insulating layer 20. Since the sub-relay electrode 16 in the functional area A forms a common electrode with the relay electrode 15 in the functional area B adjacent to the other side, the sub-relay electrode 16 in the functional area B is provided above the functional area A. The placed connection electrodes 26 are electrically connected.

Further, a certain connection electrode 26 disposed above the second functional area B counted from one side of the connector plate 11 is connected to the short-circuit portion 27 of the second insulating layer 30 and the first insulating layer 20.
It is assumed that the wiring section 21 and the short-circuit section 22 electrically connect to the sub-relay electrode 16 at an appropriate position in the functional area B. The sub relay electrode 16 in this functional area B
Is the relay electrode 1 in the functional area C adjacent to the other side.
5, the connection electrode 26 disposed above the functional area B is electrically connected to the relay electrode 15 in the functional area C.

As described above, a certain connection electrode 26 is electrically connected to the sub-relay electrode 16 in the functional area at a position close to the connection electrode 26, and at the same time, the connection electrode 26 A state where the relay electrode 15 is electrically connected to the functional region at the separated position is achieved.

According to such an adapter device, in the manufacture of the adapter body 10, the connection electrode 26
Is electrically connected to the sub-relay electrode 16 in the functional area at a position close to this, so that the connection electrode 2
6 is electrically connected to the relay electrode 15 in the functional region at a position separated therefrom, so that even if the substrate to be inspected has electrodes to be inspected locally densely arranged. A pattern corresponding to the electrode to be inspected, that is, the connection electrodes 26 locally densely arranged.
, Terminal electrodes 1 arranged in a state of being dispersed in a wide area
2 can be easily electrically connected.

Further, since the connection electrode 26 may be electrically connected to the relay electrode 15 or the sub-relay electrode 16 at a position close to the connection electrode 26, the number of insulating layers formed on the connector plate 11 is reduced. In addition, the connector plate 11 can be mass-produced because the same configuration can be used for an adapter body having connection electrodes of different patterns. Therefore, the adapter device can be manufactured at low cost.

Further, as shown in the illustrated example, the auxiliary relay electrode 16
Are formed continuously, the connection electrode 26 has a high density at a plurality of locations separated from each other, for example, a location immediately above the functional area A and a location immediately above the functional area B. In this case, the connection electrodes 26 at each of the plurality of locations can be easily electrically connected to the terminal electrodes 12 arranged in a state of being distributed over a wide area.

Further, an anisotropic conductive elastomer layer 30 is integrally formed on the upper surface of the adapter body 10, and the conductive portion 31 of the anisotropic conductive elastomer layer 30 is formed on the connection electrode 26 of the adapter body 10. Because of this arrangement, the anisotropic conductive elastomer layer 30
It is completely unnecessary to perform the alignment and the holding and fixing of the electrodes, so that even when the arrangement pitch of the electrodes to be inspected in the inspection and inspection circuit device is minute, the required electrical connection can be reliably achieved.

Furthermore, since the anisotropic conductive elastomer layer 40 is integral with the adapter body 10, a good electrical connection state can be stably maintained even with environmental changes such as heat history due to temperature changes. High connection reliability can always be obtained.

Further, since the surface portion 26B of the connection electrode 26 in the adapter body 10 is made of a magnetic material, the thickness direction in forming the anisotropic conductive elastomer layer 30 on the upper surface of the adapter body 10 is reduced. When a parallel magnetic field acts on the surface of the connection electrode 26 made of a magnetic material, the surface layer portion 26B acts as a magnet. Occurs in a concentrated manner. Accordingly, even if the arrangement pitch of the connection electrodes 26 is extremely small, the conductive particles gather at positions above the connection electrodes 26 and are further oriented in the thickness direction. Thus, the desired anisotropic conductive elastomer layer 30 having the plurality of conductive portions 31 insulated from each other by the insulating portions 32 can be formed. Therefore, even when the electrodes to be inspected of the circuit board to be inspected have a minute arrangement pitch and a fine and high-density complicated pattern, the required electrical connection for the circuit board is reliably achieved. can do.

The above-described adapter device is an example in which the region on the upper surface of the connector plate 11 in the adapter body 10 is divided into four to form four functional regions. In the present invention, the functional device is formed on the upper surface of the connector plate. The number of functional regions is not limited to four, but may be two, three, or five or more. The direction in which the upper surface of the connector plate is divided is not limited to the same direction. For example, the upper surface of the connector plate is divided in the vertical direction and the horizontal direction perpendicular thereto, so that a plurality of functional regions are formed. You may.

FIG. 12 is an explanatory view showing the arrangement of the relay electrodes and the sub-relay electrodes and the functional areas in another example of the connector plate. On the upper surface of this connector plate 11,
The area on the upper surface is in the vertical direction as shown by a dashed line (FIG. 12).
1 in the up-down direction and the horizontal direction (FIG. 1).
2 in the left-right direction) and a total of eight functional areas A1, B1, C1, D1, A2,
B2, C2, and D2 are formed in two rows from one side (the left side in FIG. 12) to the other side.

In each of the functional areas A1 to D1 and A2 to D2, a plurality of relay electrodes (indicated by “○” in FIG. 12) 15 corresponding to each other are arranged in accordance with grid point positions arranged in vertical j rows and horizontal k columns. Are located. In FIG. 12, in order to specify each of the relay electrodes 15 in each functional area, the relay electrode 15 at the position of the j-th row and the k-th column in each of the functional areas A1 to D1 and A2 to D2 is set to “(j, k)), and in order to further specify the functional area, symbols A1 to D indicating the functional area at the beginning of the symbol “(j, k)”
1, A2 to D2 are attached. In the connector plate 11 of this example, for example, the total number of the relay electrodes 15 is twice the total number of the terminal electrodes (not shown) formed on the lower surface, and the density of the relay electrodes 15 is smaller than the density of the terminal electrodes. It is doubled. Then, between the functional areas adjacent to each other in the vertical direction, that is, between the functional areas A1 and A2, between the functional areas B1 and B2, between the functional areas C1 and C2, and between the functional areas D1 and D2.
In each of the spaces, the corresponding relay electrodes 15 are electrically connected to each other to form a common electrode. Specifically, for example, the relay electrode A1 (i, j) and the relay electrode A
2 (i, j) are electrically connected to form a common electrode composed of a set of these relay electrodes. The common electrode composed of the pair of two relay electrodes 15 is electrically connected to one terminal electrode.

Of the eight functional areas, the first, second and third functional areas A1, B1, and B1, counting from one side (the left side in FIG. 12) of the first row (the upper row in FIG. 12).
C1, and the first, second, and third functional areas A2, B counted from one side (the left side in FIG. 12) of the second column
2 and C2, the same number of sub-relay electrodes as the relay electrode 15 (FIG. 1)
2 (indicated by “●”) are arranged in accordance with the lattice point positions and at equal intervals from each of the relay electrodes 15. Then, the functional areas A1, B1, C1, A
2, B2, and C2 are connected to the other functional regions B1, C1, and D adjacent to the other side of the functional region.
1, B2, C2, and D2, which are electrically connected to the corresponding relay electrodes 15 so that a common set of a sub-relay electrode 16 in one functional area and a relay electrode 15 in another adjacent functional area is formed. Electrode is formed.

In the adapter body having the connector plate 11 described above, for example, a certain connection electrode arranged above the first functional area A1 counted from one side of the first row of the connector plate 11 is connected to the corresponding function. By electrically connecting to the sub relay electrode 16 at an appropriate position in the region A1,
Since the sub-relay electrode 16 in the functional area A1 forms a common electrode with the relay electrode 15 in the functional area B1 adjacent to the other side, the sub-relay electrode 16 is provided on the relay electrode 15 in the functional area B1 above the functional area A1. The placed connection electrodes are electrically connected.

Further, a certain connection electrode arranged above the first functional area A2 counted from one side of the second row of the connector plate 11 is connected to the sub relay electrode 16 at an appropriate position in the functional area A2. The sub-relay electrode 16 in the functional area A2 forms a common electrode with the relay electrode 15 in the functional area B2 adjacent to the other side by electrically connecting to the relay electrode in the functional area B2. In FIG. 15, the connection electrode disposed above the functional area A1 is in a state of being electrically connected.

According to the adapter device having such an adapter main body, similarly to the adapter device shown in FIG. 1, the electrodes to be inspected have the substrates to be inspected arranged at a plurality of locations locally at high density. Even so, it is possible to easily electrically connect the pattern corresponding to the electrode to be inspected, that is, the connection electrodes locally arranged at high density to the terminal electrodes arranged in a state of being dispersed in a wide area. In addition, the adapter device can be manufactured at low cost.

<Circuit Board Inspection Apparatus> FIG. 13 is an explanatory view showing the structure of an example of the circuit board inspection apparatus according to the present invention. In FIG. 13, reference numeral 1 denotes a circuit board to be inspected, and electrodes 2 and 3 to be inspected are formed on both surfaces thereof. Then, below the circuit board 1 to be inspected,
A lower-side adapter device 40a having a configuration as shown in FIG.
First anisotropic conductive sheet 41a, lower intermediate pin device 4
5a and a lower inspection head 50a are arranged in this order from the top, and an upper adapter device 40b, a first anisotropic conductive sheet 41b having a configuration as shown in FIG. The upper mediating pin device 45b and the upper inspection head 50b are arranged in this order from below.
Here, each of the first anisotropic conductive sheets 41a and 41b has a conductive path forming portion that forms a conductive path only in the thickness direction thereof. As such first anisotropic conductive sheets 41a and 41b, those in which each conductive path forming portion is formed so as to protrude in at least one surface in the thickness direction exhibit high electrical contact stability. Is preferred.

The lower intermediate pin device 45a is configured to connect a number of conductive pins 46a and each of the plurality of conductive pins 46a to each other.
A conductive pin support mechanism 47a for supporting the adapter device 40a so as to extend in the up-down direction while being arranged at lattice points corresponding to the terminal electrodes 12 of the adapter device 40a. In the conductive pin support mechanism 47a, each conductive pin 4
A horizontal base-side support plate 48a for inserting and supporting the base 6a at a lower base portion thereof is provided.
Above a, a horizontal center support plate 49a that inserts and supports each conductive pin 46a at the center thereof is provided.

The lower inspection head 50a includes an inspection electrode plate device 51a composed of a multilayer wiring board and the inspection electrode plate device 5a.
And a second anisotropic conductive sheet 55a having elasticity disposed on the upper surface of the test electrode plate device 51a.
2 and a plurality of test electrodes 5 at grid point positions having the same arrangement pitch
2a is formed. Second anisotropic conductive sheet 55a
Is formed with a conductive path forming portion that forms a conductive path only in the thickness direction thereof. Like the first anisotropic conductive sheet 41a, the conductive path forming portion is formed in at least one surface thereof in the thickness direction. Preferably, it is formed so as to protrude.

In the inspection electrode plate device 51a, FIG.
As shown in FIG. 5, the region on the upper surface where the test electrode 52a is formed is divided into, for example, two in the vertical direction and the horizontal direction to form four functional regions F, G, H, and I having the same test electrode arrangement. And the functional areas F, G,
In each of H and I, a plurality of inspection electrodes 52a corresponding to each other are arranged according to lattice point positions arranged in m rows and n columns. Here, in each of the functional regions F, G, H, and I, in order to specify a specific position of the inspection electrode 52a arranged in m rows and n columns, the position of the mth row and nth column is determined. When the address display of a certain inspection electrode 52a is (m, n), and when the function area is further specified, the address display is indicated with symbols F, G, H, and I indicating the functional area. And For example, the first in the functional area F
The inspection electrode 52a in the first row is represented by F (1,1).

The inspection electrodes 52a corresponding to each other in the functional regions F, G, H, and I are electrically connected to each other to form a common electrode. That is, there are a total of four test electrodes 52a having the same address indication (m, n) in each of the functional areas F, G, H, and I. However, four test electrodes 52 having the same address indication are provided.
a are electrically connected to each other. Therefore, in the illustrated example, one common electrode is a test electrode F (m, n) as four branched terminals that are electrically connected,
G (m, n), H (m, n) and G (m, n).

The inspection electrodes 52a having the same address indication (m, n) are connected to the wiring paths 53 of an appropriate pattern formed on the multilayer wiring board constituting the inspection electrode plate device 50a.
a (shown by broken lines). Further, an external lead terminal 54a is formed on one side (left side in FIG. 13) of the lower surface of the inspection electrode plate device 50a by an end of the wiring path 53a, and the external lead terminal 54a is detachably attached. Connected connector 56
By a, it is electrically connected to the test circuit 60 of the tester.

The upper mediating pin device 45b includes a plurality of conductive pins 46b and each of the plurality of conductive pins 46b.
A conductive pin support mechanism 47b for supporting the adapter device 40b so as to extend vertically in a state where the conductive pins are arranged at grid points corresponding to the terminal electrodes 12 of the adapter device 40b. A horizontal proximal support plate 48 that is inserted and supported at the upper proximal portion thereof.
b and a horizontal center support plate 49b for inserting and supporting each conductive pin 46b at the center thereof. These correspond to the conductive pin 46a and the conductive pin support mechanism 47a in the lower intermediate pin device 45a.

The upper inspection head 50b has a plurality of inspection electrodes 52a formed on the lower surface at lattice points having the same arrangement pitch as the terminal electrodes 12 of the adapter device 41b.
An inspection electrode plate device 51b made of a multilayer wiring board, and a second elastic electrode disposed on the lower surface of the inspection electrode plate device 51b.
And an anisotropic conductive sheet 55b. These correspond to the inspection electrode plate device 51a and the second anisotropic conductive sheet 55a in the lower inspection head 50a. That is, in the test electrode plate device 51b, a plurality of functional regions having the same test electrode arrangement are formed by dividing the lower surface region where the test electrodes 52b are formed. The inspection electrodes 52b at the positions are electrically connected to each other by wiring paths 53b (shown by broken lines) of an appropriate pattern to form a common electrode. Also, the wiring path 53b
An external lead-out terminal 54b is formed on one side of the upper surface of the test electrode plate device 50b by the end of the test electrode plate device 50b. 60 is electrically connected.

In such a circuit board inspection apparatus, the circuit board 1 to be inspected is disposed between the lower adapter device 40a and the upper adapter device 40b by appropriate means. When the test electrode plate device 51a of the lower test head 50a is pressed upward by the pressing plate 65, the lower adapter device 4 is pressed.
0a, the first anisotropic conductive sheet 41a, the lower intermediary pin device 45a, and the lower inspection head 50a as a whole rise, whereby the circuit board 1 to be inspected is moved to the lower adapter device 40a and the upper adapter device 40b. And it is pinched.

In this state, the electrode 2 to be inspected on the lower surface of the circuit board 1 to be inspected is
0a is electrically connected to the connection electrode 26a via the conductive portion 31 of the anisotropic conductive elastomer layer. The terminal electrode 12 of the lower adapter device 40a is connected to the first anisotropic conductive sheet 41a. Via the lower intermediate pin device 45a
Is electrically connected to the distal end of the conductive pin 46a, and the proximal end of the conductive pin 46a is connected to the second anisotropic conductive sheet 5
5a, the inspection electrode 52a of the inspection electrode plate device 51a
Is electrically connected to On the other hand, the electrode 3 to be inspected on the upper surface of the circuit board 1 to be inspected is
0b is electrically connected to the connection electrode 26 via the conductive portion 31 of the anisotropic conductive elastomer layer. The terminal electrode 12 of the lower adapter device 40b is connected to the first anisotropic conductive sheet 41b. Through the upper intermediate pin device 45b
Is electrically connected to the distal end of the conductive pin 46b, and the proximal end of the conductive pin 46b is connected to the second anisotropic conductive sheet 5.
5b, the test electrode 52b of the test electrode plate device 51b
Is electrically connected to

In this manner, each of the electrodes 2 and 3 on the lower and upper surfaces of the circuit board 1 to be inspected is connected to the inspection electrode 52a and the upper inspection head of the inspection electrode plate device 51a in the lower inspection head 50a. By being electrically connected to the test electrode 52b of the test electrode plate device 51b at 50b, a state of being electrically connected to the test circuit 60 of the tester is achieved, and a required electrical test is performed in this state.

According to the circuit board inspection device described above, since the lower adapter device 40a and the upper adapter device 40b according to the present invention are provided, the electrodes 2 and 3 of the circuit board 1 to be inspected are arranged at a high density. However, the electrical inspection of the circuit board under test 1 can be performed at low cost. Further, it is not necessary to perform positioning and holding and fixing of the anisotropic conductive elastomer layer 30 at the time of the electrical connection operation. Can be reliably achieved. Further, even in a change in environment such as a heat history due to a temperature change, a good electrical connection state is stably maintained, and therefore, high connection reliability can always be obtained.

In the inspection electrode plate devices 51a and 51b of the lower inspection head 50a and the upper inspection head 50b, the inspection electrodes 52a and 52b are formed in the same arrangement state in a plurality of functional areas. Inspection electrodes 52a, 5 at corresponding positions in the functional area
2b is electrically connected to each other by the wiring paths 53a and 53b to form a common electrode, so that the test electrode 5 electrically connected to certain test electrodes 2 and 3 on the circuit board 1 to be tested.
2a and 52b are present in each of the functional areas. Therefore, the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected can be electrically connected to the test circuit 60 of the tester with a large degree of freedom, and the number of terminals to be connected to the test circuit 60 of the tester is common. Since the number of test electrodes 52 may be sufficient, the number of test electrodes 52a and 52b is greatly reduced. As a result, even if the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected are formed in a highly densified state at a specific location, a common functional region separated from the location is shared. By using the electrodes, that is, by using the inspection electrodes 52a and 52b at positions dispersed by the common electrode, necessary electrical connection can be easily achieved, and high reliability can be achieved. An inspection can be performed.

In the inspection electrode plate devices 51a and 51b, the inspection electrodes 52a and 52b in each functional area are used as common electrodes, so that the inspection electrode plate devices 51a and 51b are used.
Since the utilization efficiency of the inspection electrodes 52a and 52b of the entire 1b is increased, unnecessary inspection electrodes are significantly reduced, and the inspection can be performed with extremely high efficiency.

The adapter device of the present invention and the inspection device for a circuit board provided with the adapter device have been described above. However, the adapter device of the present invention is not limited to an inspection device for a circuit board, but may be used for various purposes. be able to.

[0092]

According to the adapter device of the present invention, even if the electrodes of the circuit board to be connected are locally arranged at a high density, the connection electrodes having a pattern corresponding to the electrodes are used. The adapter device can be easily and electrically connected to the terminal electrodes arranged in a state of being dispersed in a wide area, and the adapter device can be manufactured at low cost. In addition, a good electrical connection state is stably maintained even with a change in the environment such as a heat history due to a temperature change, and thus a high connection reliability is obtained. Furthermore, by forming a part of the connection electrode from a magnetic material, the electrode of the circuit board to be connected may have a minute arrangement pitch, and may have a fine and high-density complicated pattern. As a result, the required electrical connection can be reliably achieved for the circuit board.

According to the circuit board inspection apparatus of the present invention, even if the electrodes to be inspected of the circuit board to be inspected are arranged at a high density, the electrical inspection of the circuit board can be performed at low cost. can do. Further, according to the circuit board inspection apparatus of the present invention, for a circuit board having electrodes to be inspected arranged at high density, electrical connection of the tester to the inspection circuit can be easily achieved with high efficiency, The required electrical inspection can be performed with sufficiently high reliability.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a configuration of an example of an adapter device according to the present invention with a part thereof cut away.

FIG. 2 is an explanatory diagram showing a configuration of a connector plate in an adapter body.

FIG. 3 is an explanatory diagram showing an arrangement state and functional areas of a relay electrode and a sub-relay electrode of a connector plate in an adapter body.

FIG. 4 is an explanatory sectional view showing a connection electrode in an enlarged manner.

FIG. 5 is an explanatory cross-sectional view showing an enlarged part of an anisotropic conductive elastomer layer.

FIG. 6 is an explanatory sectional view showing a state in which a material layer for elastomer is formed on an upper surface of an adapter body.

FIG. 7 is an explanatory cross-sectional view showing a state in which an adapter main body on which an elastomer material layer is formed is arranged between one mold and the other mold.

FIG. 8 is an explanatory cross-sectional view showing a state where a parallel magnetic field is applied to the elastomer material layer.

FIG. 9 is an explanatory diagram showing a step of forming an insulating portion sheet and a conductive portion forming material layer on the upper surface of the adapter body.

FIG. 10 is an explanatory cross-sectional view showing a state in which the adapter body on which the insulating body sheet and the conductive part forming material layer are formed is disposed between one mold and the other mold.

FIG. 11 is an explanatory cross-sectional view showing a state where a parallel magnetic field is applied to a conductive part forming material layer.

FIG. 12 is an explanatory view showing an arrangement state and functional regions of a relay electrode and a sub-relay electrode in another example of the connector plate.

FIG. 13 is an explanatory diagram showing a configuration of an example of a circuit board inspection apparatus according to the present invention.

FIG. 14 is an explanatory diagram showing an arrangement state and a functional region of an inspection electrode in the inspection electrode plate device.

FIG. 15 is an explanatory cross-sectional view showing a state in which a material layer for elastomer is formed on an upper surface of an adapter body in manufacturing a conventional adapter device.

FIG. 16 is an explanatory cross-sectional view showing a state in which an adapter body on which an elastomer material layer is formed is disposed between one mold and the other mold.

FIG. 17 is an explanatory sectional view showing a state in which an adapter device is manufactured by forming an anisotropic conductive elastomer layer on the upper surface of an adapter body.

FIG. 18 is an explanatory cross-sectional view showing a direction of a magnetic field applied to a material layer for elastomer in manufacturing a conventional adapter device.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 circuit board to be inspected 2, 3 electrode to be inspected 10 adapter body 11 connector plate 12 terminal electrode 13 wiring path 15 relay electrode 16 sub-relay electrode 20 first insulating layer 21 wiring section 22 short-circuit section 25 second insulating layer 26 connection Electrode 26A Base layer part 26B Surface part 27 Short circuit part 30 Anisotropic conductive elastomer layer 30A Elastomer material layer 31 Conductive part A, B, C, D Functional area A1, B1, C1, D1, A2, B2, C2, D2 Functional area L1 Arrangement pitch of relay electrode and sub-relay electrode L2 Arrangement pitch of terminal electrode 31A Conductive part forming material layer E Elastic polymer substance P Conductive particle 31H Conductive part hole 32 Insulating part 32A Insulating part sheet 36 One mold (upper mold) 37 The other mold (lower mold) 38, 39 Electromagnet 40a Lower adapter unit 40b Upper adapter Device 41a, 41b First anisotropic conductive sheet 45a Lower intermediate pin device 45b Upper intermediate pin device 46a, 46b Conductive pin 47a, 47b Conductive pin support mechanism 48a, 48b Base end support plate 49a, 49b Central support Plate 50a Lower inspection head 50b Lower inspection head 51a, 51b Inspection electrode plate device 52a, 52b Inspection electrode 53a, 53b Wiring path 54a, 54b External lead-out terminal portion 55a, 55b Second anisotropic conductive sheet 56a, 56b Connector 60 pressure plate 65 receiving plate F, G, H, I functional area

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G011 AA16 AA21 AB06 AB08 AC14 AE01 AE03 AF04 2G014 AA01 AB51 AB59 AC09 AC10 5E023 AA04 AA05 AA16 AA26 BB22 BB28 CC22 EE18 FF07 HH05 HH06 HH08 HH16 HH25H

Claims (6)

[Claims] 1. A connector board comprising: a connector plate and at least one insulating layer integrally laminated on an upper surface thereof, and a plurality of insulating layers arranged in accordance with a pattern corresponding to an electrode of a circuit board to be connected to the upper surface of the uppermost insulating layer An adapter body having a plurality of terminal electrodes arranged at lattice points on the lower surface of the connector plate, and an anisotropic conductive elastomer layer integrally provided on the upper surface of the adapter body. On the upper surface of the connector plate in the adapter body,
A plurality of functional regions are formed by dividing the region on the upper surface, and each of the functional regions is arranged at a lattice point position.
It has a plurality of relay electrodes corresponding to each other, at least one of these functional areas has a plurality of sub-relay electrodes arranged corresponding to the relay electrodes in another functional area adjacent thereto, Each of the sub relay electrodes is
Each of the relay electrodes on the connector plate is electrically connected to the terminal electrode, and each of the connection electrodes is connected to the connector. The anisotropic conductive elastomer layer is electrically connected to a relay electrode or a sub-relay electrode on the plate, and the anisotropic conductive elastomer layer is disposed on the connection electrode of the adapter body and is filled with conductive particles in an elastic polymer material. An adapter device, comprising: a plurality of conductive portions formed as described above; and an insulating portion that insulates the conductive portions from each other. 2. The adapter device according to claim 1, wherein two or more functional areas each having a sub-relay electrode are continuously formed on a connector plate of the adapter body. 3. The adapter according to claim 1, wherein the total density of the relay electrode and the sub-relay electrode in the functional region having the sub-relay electrode is 2 to 64 times the density of the terminal electrode. apparatus. 4. The adapter device according to claim 1, wherein at least a part of the connection electrode of the adapter body is made of a magnetic material. 5. The adapter device according to claim 1, further comprising: a same pitch as the terminal electrode, the upper surface being electrically connected to a terminal electrode of the adapter main body in the adapter device. And a test electrode plate device having a plurality of test electrodes arranged at the grid point positions. 6. The test electrode plate device has a plurality of functional regions having the same test electrode arrangement formed by dividing an upper surface region thereof, and the test electrodes in each of the functional regions correspond to each other. The inspection apparatus for a circuit board according to claim 5, wherein the inspection apparatus is electrically connected to inspection electrodes in other functional regions arranged at positions where the inspection is performed.