JP2002184821A - Sheet-shaped connector, its manufacturing method and probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet-shaped connector wherein the diameter of a surface electrode is small, a superior electrically connecting state can be surely obtained to a circuit device in which pitches between electrodes are small, strength of the surface electrode is high and a superior electrically connecting state can be maintained in the case of repetition use, its manufacturing method and a probe device having the sheet-shaped connector. SOLUTION: This sheet-shaped connector is provided with an insulating sheet and a plurality of electrode structures which are arranged on the insulating sheet. The protruded surface electrodes exposed on a surface of the insulating sheet and the back electrodes exposed on a back of the insulating sheet are linked with each other, by using short-circuit parts which are stretched penetrating the insulating sheet in the thickness direction. The surface electrodes in the respective electrode structures are formed by plating, preferably, chemical plating. It is preferable that the back electrodes are formed by laminating metal layers which are formed by chemical plating on base layers which are formed by etching metal thin layers.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-like connector suitable as a probe device for making an electrical connection to a circuit device in, for example, an electrical inspection of the circuit device, a method of manufacturing the same, and the sheet-like connector. To a probe device.

[0002]

2. Description of the Related Art For example, in electrical inspection of a circuit device such as a wafer on which a large number of integrated circuits are formed or electronic components such as semiconductor elements, a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected is used. A probe device having an arranged inspection electrode is used. As such a probe device, a device in which inspection electrodes (inspection probes) each composed of a pin or a blade are arranged has been used. However, when the circuit device to be inspected is a wafer on which a large number of integrated circuits are formed, it is necessary to arrange a very large number of inspection probes in order to manufacture a probe device for the wafer inspection. However, the probe device becomes extremely expensive, and when the pitch of the electrodes to be inspected is small, it is difficult to fabricate the probe device itself. Further, the wafer is generally warped, and the state of the warp is different for each product (wafer).
It is practically difficult to bring each of the test probes of the probe device into stable and reliable contact.

[0003] For the above reasons, recently,
An inspection circuit board having a plurality of inspection electrodes formed on one surface according to a pattern corresponding to a pattern of an electrode to be inspected; an anisotropic conductive sheet disposed on one surface of the inspection circuit board; There has been proposed a probe device including a sheet-like connector in which a plurality of electrode structures that extend through the flexible insulating sheet in the thickness direction thereof are arranged on the sheet.

FIG. 12 is an explanatory sectional view showing the structure of an example of a conventional probe device. In this probe device, an inspection circuit board 85 having a large number of inspection electrodes 86 formed on one surface in accordance with a pattern of the electrode to be inspected of the circuit device to be inspected is provided. On top of the anisotropic conductive sheet 80
The sheet-like connector 90 is arranged via the.

The anisotropic conductive sheet 80 has conductivity only in the thickness direction, or has a pressurized conductive portion which has conductivity only in the thickness direction when pressed in the thickness direction. As the anisotropic conductive sheet, those having various structures are known, for example, Japanese Patent Application Laid-Open No. 51-933.
No. 93 discloses an anisotropic conductive sheet obtained by uniformly dispersing metal particles in an elastomer (hereinafter referred to as “dispersion type anisotropic conductive sheet”).
Japanese Patent Application Laid-Open No. 53-147772 discloses that a large number of conductive portions extending in the thickness direction and insulating portions that insulate them from each other are formed by distributing conductive magnetic particles unevenly in an elastomer. Anisotropically conductive sheet (hereinafter, referred to as “distributed anisotropically conductive sheet”)
Further, Japanese Unexamined Patent Application Publication No. 61-250906 discloses an unevenly distributed anisotropic conductive sheet in which a step is formed between the surface of a conductive part and an insulating part.

The sheet-like connector 90 has a flexible insulating sheet 91 made of, for example, resin, and a plurality of electrode structures 95 extending in the thickness direction of the insulating sheet 91.
Are arranged in accordance with a pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. Each of the electrode structures 95 includes a protruding front surface electrode portion 96 exposed on the surface of the insulating sheet 91 and a plate-shaped rear surface electrode portion 97 exposed on the back surface of the insulating sheet 91.
Are integrally connected via a short-circuit portion 98 extending through the thickness direction.

[0007] Such a sheet-like connector 90 is generally manufactured as follows. First, FIG.
As shown in (a), a laminated material 90A in which a metal layer 92 is formed on one surface of an insulating sheet 91 is prepared, and FIG.
As shown in (b), through holes 98H are formed in the insulating sheet 91 in the thickness direction thereof by laser processing, dry etching processing, or the like. Next, as shown in FIG. 13C, after a resist film 93 is formed on the metal layer 92 of the insulating sheet 91, the metal sheet 92 is subjected to, for example, an electrolytic plating process using the metal layer 92 as a common electrode. The metal deposit is filled in the through hole 98H of the through-hole 91 to form a short-circuit portion 98 integrally connected to the metal layer 92, and the short-circuit portion 98 is formed on the surface of the insulating sheet 91.
A protruding surface electrode portion 96 integrally connected to the substrate is formed. After that, the resist film 93 is removed from the metal layer 92,
Further, as shown in FIG. 13D, a resist film 94A is formed on the surface of the insulating sheet 91 including the front electrode portion 96, and a pattern corresponding to the back electrode portion to be formed on the metal layer 92. By forming a resist film 94B according to the pattern and performing an etching process on the metal layer 92, as shown in FIG.
Is removed to form the back electrode portion 97, thereby forming the electrode structure 95. Then, the sheet-like connector 90 is obtained by peeling the resist film 94A from the surface of the insulating sheet 91 and peeling the resist film 94B from the back electrode portion 92.

In the above-described probe device, a sheet-like connector 90 is provided on the surface of a circuit device to be inspected, for example, a wafer.
Are arranged so that the surface electrode portion 96 of the electrode structure 95 is located on the electrode to be inspected of the wafer, and in this state,
When the wafer is pressed by the probe device,
The anisotropic conductive sheet 80 is pressed by the back electrode portion 97 of the electrode structure 95 in the sheet connector 90, whereby the anisotropic conductive sheet 80 is attached to the back electrode portion 97 and the inspection circuit board 85. A conductive path is formed in the thickness direction between the test electrode 86 and the test electrode 86 of the test circuit board 85.
And an electrical connection is established. Then, in this state, a required electrical inspection is performed on the wafer. According to such a probe device, when the wafer is pressed by the probe device, the anisotropic conductive sheet is deformed according to the magnitude of the warpage of the wafer, so that a large number of electrodes to be inspected on the wafer are formed. Good electrical connections can be reliably achieved for each.

However, the above-described probe device has the following problems. (1) In the step of forming the short-circuit portion 98 and the surface electrode portion 96 in the above-described method for manufacturing a sheet-like connector, a plating layer formed by electrolytic plating grows isotropically. In the surface electrode portion 96, the distance L from the peripheral edge of the surface electrode portion 96 to the peripheral edge of the short-circuit portion 98 is equal to the protrusion height h of the surface electrode portion 96. Therefore, the obtained surface electrode portion 96
(If the plane shape is not circular, the shortest length is indicated.) R1 is considerably larger than twice the protruding height h. Therefore, when the electrodes to be inspected in the circuit to be inspected are arranged at a very small pitch and very small, it is difficult to configure a probe device corresponding to this. In the above, means for reducing the diameter of the obtained surface electrode portion 96 include means for reducing the protruding height h of the surface electrode portion 96 and the diameter of the short-circuit portion 98 (the shortest when the cross-sectional shape is not circular, Means for reducing R2, that is, reducing the diameter of the through-hole 98H of the insulating sheet 91 can be considered, but the sheet-like connector obtained by the former means is stable with respect to the electrode to be inspected. In this case, it is difficult to form the short-circuit portion 98 and the surface electrode portion 96 by electrolytic plating. In addition, it is practically difficult to supply a current having a uniform current density distribution to the entire surface of the metal layer 92 in the electrolytic plating process. 9
Since the growth rate of the plating layer is different every 8H, the protrusion height h of the surface electrode portion 96 to be formed greatly varies. As a result, in the obtained sheet connector, it is difficult to reliably achieve stable electrical connection to the electrode to be inspected.

(2) In the anisotropic conductive sheet 80,
As described above, the conductive path is formed in the thickness direction of the anisotropic conductive sheet 80 by being pressed by the back electrode portion 97 of the electrode structure 95 in the sheet-like connector 90. Since the contact area between the back electrode portion 97 and the anisotropic conductive sheet 80 depends on the back electrode portion 97, the back electrode portion 97 is sufficiently large to secure a sufficiently high conductivity to the anisotropic conductive sheet 80. It must have an area. However, the laminated material 90A used for manufacturing the sheet-like connector 90
Generally, a commercially available material is used, and the metal layer 92 in such a commercially available laminated material 90A has a considerably small thickness of, for example, 9 to 18 μm. The back electrode portion 97 obtained by etching the metal layer 92 has a considerably small ratio of the thickness to the area thereof and has low strength. Is used repeatedly, the pressing force for making an electrical connection between the circuit device under test and the circuit board for inspection,
Deformation or breakage occurs in the back electrode portion 97 at an early stage, and high connection reliability cannot be obtained. As a means for solving such a problem, a method of forming the back electrode portion using a laminated material having a thick metal layer can be considered. However, when etching a thick metal layer, a side etch is required. And the like are likely to occur, making it difficult to form a required back electrode portion.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide an electrode structure having a small surface electrode portion having a small diameter. An object of the present invention is to provide a sheet-like connector capable of reliably obtaining a stable electrical connection state even to a circuit device having electrodes formed at a pitch, and a method for manufacturing the same. Second embodiment of the present invention
The purpose of having an electrode structure with a small diameter of the surface electrode part,
A good electrical connection state is reliably obtained even for a circuit device in which electrodes are formed at a small pitch, and the strength of the back electrode portion in the electrode structure is high. An object of the present invention is to provide a sheet-like connector that maintains an electrical connection state and a method for manufacturing the same. A third object of the present invention is to provide a probe device capable of reliably obtaining a good electrical connection state with respect to an electrode to be inspected even when electrodes to be inspected of a circuit device to be inspected are arranged at a small pitch. Another object of the present invention is to provide a probe device that maintains a good electrical connection state for a long period of time even when used repeatedly.

[0012]

According to the present invention, there is provided a sheet-like connector comprising: an insulating sheet; and a projection formed on the insulating sheet and separated from each other in a surface direction thereof and exposed on the surface of the insulating sheet. A sheet electrode having a plurality of electrode structures formed by connecting the front surface electrode portion and the back surface electrode portion exposed on the back surface of the insulating sheet to each other by a short-circuit portion extending through the insulating sheet in the thickness direction. A connector, wherein a surface electrode portion in each of the electrode structures is formed by plating. In the sheet connector of the present invention, it is preferable that the surface electrode portion in each of the electrode structures is formed by chemical plating.

In the sheet-like connector of the present invention,
It is preferable that the diameter of the surface electrode portion in the electrode structure is 100 to 200% of the diameter of the short-circuit portion. In the present invention, the “diameter of the surface electrode portion” indicates the diameter when the planar shape of the surface electrode portion is circular, and indicates the shortest length when the planar shape is not circular. Also,
The “diameter of the short-circuit portion” indicates the diameter of the short-circuit portion when the cross-sectional shape in the surface direction is circular, and indicates the shortest length when the cross-sectional shape is not circular. In the sheet-like connector of the present invention, the back electrode portion in the electrode structure is formed by stacking a metal layer formed by chemical plating on a base layer formed by etching a thin metal layer. Is preferred. Further, the thickness of the back electrode portion in the electrode structure is 20 to 50 μm.
m is preferable.

The method of manufacturing a sheet-like connector according to the present invention is directed to a method of manufacturing a sheet-like connector, comprising: an insulating sheet; and a protruding surface electrode exposed on the surface of the insulating sheet and arranged on the insulating sheet so as to be separated from each other in the surface direction. Producing a sheet-like connector having a plurality of electrode structures each of which is connected to each other by a short-circuit portion that extends through the insulating sheet in a thickness direction thereof, and a back surface electrode portion exposed on a back surface of the insulating sheet. Preparing a laminated material in which a thin metal layer is formed on an insulating sheet, and forming a through hole in the insulating sheet of the laminated material according to a pattern corresponding to an electrode structure to be formed. A short-circuit portion filled in the through-hole of the insulating sheet by applying a chemical plating to the laminated material having the through-hole formed in the insulating sheet; It characterized by having a step of forming a connecting surface electrode part.

In the method of manufacturing a sheet-like connector according to the present invention, the short-circuit portion filled in the through-hole of the insulating sheet is formed by chemically plating the laminated material having the through-hole formed in the insulating sheet. And a protruding surface electrode portion connected to the short-circuit portion and exposed on the surface of the insulating sheet, and corresponding to the electrode structure to be formed on the surface of the thin metal layer in the laminated material. It is preferable that a metal layer is formed in accordance with the pattern, and then a portion of the thin metal layer other than the portion where the metal layer is formed is removed to form a back electrode portion connected to the short-circuit portion. Further, the thickness of the thin metal layer in the laminated material is preferably 5 to 10 μm.

The probe device of the present invention is a probe device interposed between a circuit device under test and a tester for making an electrical connection between the circuit device under test and the tester. It is characterized by comprising the above-mentioned sheet-like connector in which an electrode structure is arranged according to a pattern corresponding to an electrode to be inspected.

In the probe device of the present invention, the sheet is placed on one surface of a circuit board for inspection on which a plurality of inspection electrodes are formed corresponding to the electrodes to be inspected of the circuit device to be inspected via an anisotropic conductive sheet. It is preferred that a connector in the shape of a circle is arranged.

[0018]

(1) By forming the surface electrode portion in the electrode structure of the sheet-like connector by chemical plating,
In this chemical plating, the plating layer can be grown anisotropically, specifically, because it can be grown in the thickness direction, the surface electrode portion having a sufficient protrusion height and a small diameter is required. It is possible to obtain. Moreover, in the chemical plating, the growth rate of the plating layer is not affected by the difference in the current density distribution unlike the electrolytic plating, so that it is possible to obtain a surface electrode portion with less variation in the protrusion height. . (2) The back electrode portion in the electrode structure of the sheet-like connector is a laminate in which a metal layer formed by chemical plating is formed on a base layer formed by etching a thin metal layer. By adjusting the thickness of the metal layer by chemical plating, it is possible to obtain a back electrode part having a large thickness. Further, since the thin metal layer forming the base layer may be small, the side-etching is performed by etching. This does not cause a back electrode portion having a sufficiently large area.

[0019]

Embodiments of the present invention will be described below in detail. [Sheet Connector] FIG. 1 is a cross-sectional view illustrating an example of a sheet connector according to the present invention, and FIG. 2 is an enlarged view illustrating an electrode structure of the sheet connector shown in FIG. FIG. The sheet connector 10 has a flexible insulating sheet 11, and the insulating sheet 11 includes the insulating sheet 11.
Electrode structure 15 made of a plurality of metals extending in the thickness direction
Are arranged apart from each other in the surface direction of the insulating sheet 11 according to a pattern corresponding to an electrode to be connected, for example, a pattern of an electrode to be inspected of a circuit under inspection. Each of the electrode structures 15 includes a protruding surface electrode portion 16 exposed on the surface of the insulating sheet 11 and a plate-shaped back electrode portion 17 exposed on the back surface of the insulating sheet 11. They are integrally connected to each other by a short-circuit portion 18 extending through in the thickness direction.

The insulating sheet 11 is not particularly limited as long as it is flexible and has insulating properties. For example, a resin sheet made of a polyimide resin, a liquid crystal polymer, polyester, a fluorine-based resin, or the like, or a fiber woven is used. A sheet in which the cloth is impregnated with the above resin can be used. Further, the thickness d1 of the insulating sheet 11 is not particularly limited as long as the insulating sheet 11 is flexible, but is preferably 10 to 50 μm, and more preferably 10 to 25 μm.

In the electrode structure 15, at least the surface electrode portion 16 is formed by chemical plating. In the illustrated example, the front electrode portion 16 and the short-circuit portion 18 are formed by chemical plating, and the back electrode portion 17 is formed by a base layer 17A formed by etching a thin metal layer.
And a metal layer 17B integrally formed on the base layer 17A and formed by chemical plating.

The metal constituting the electrode structure 15 is as follows.
Nickel, copper, gold, silver, palladium, iron, or the like can be used. As the electrode structure 15, even if the whole is made of a single metal, it is made of an alloy of two or more metals or Two or more metals may be laminated. In addition, on the surfaces of the front electrode portion 16 and the back electrode portion 17 in the electrode structure 15, gold, silver, palladium, or the like is provided in that the electrode portion is prevented from being oxidized and an electrode portion having low contact resistance is obtained. It is preferable that a chemically stable metal film having high conductivity is formed.

The diameter R1 of the surface electrode portion 16 is preferably 100 to 200%, more preferably 100 to 120%, of the diameter R2 of the short-circuit portion 18. By satisfying such a condition, even if the arrangement pitch p of the electrode structures 15 is extremely small, a sufficient separation distance between the electrode structures 15 can be ensured. As a result, a stable electrical connection can be reliably achieved.

The outer diameter R3 of the back electrode portion 17 may be larger than the diameter R2 of the short-circuit portion 18 and smaller than the arrangement pitch p of the electrode structures 15, but is as large as possible. It is preferable that a stable electrical connection can be reliably achieved even with, for example, an anisotropic conductive sheet. Further, the diameter R2 of the short-circuit portion 18
It is preferably 10 to 75% of the arrangement pitch p of the electrode structure 15, more preferably 20 to 50%.

Explaining the specific dimensions of the electrode structure 15, the protruding height h of the surface electrode portion 16 is 15 to 15 in that a stable electrical connection to the electrode to be connected can be achieved. It is preferably 50 μm, more preferably 15 to 30 μm. Diameter R1 of surface electrode section 16
Is set according to the diameter and pitch of the electrodes to be connected, for example, 30 to 80 μm, preferably 30 to 80 μm.
５０50 μm. The diameter R2 of the short-circuit portion 18 is preferably 30 to 80 μm, more preferably 30 to 50 μm, from the viewpoint of obtaining sufficiently high strength. The thickness d2 of the back surface electrode portion 17 is preferably 20 to 50 μm, more preferably 35 to 50 μm, from the viewpoint that the strength is sufficiently high and excellent repetition durability is obtained.

According to such a sheet-like connector 10, the surface electrode portion 16 in the electrode structure 15 is formed by chemical plating.
By selecting appropriate plating conditions, the plated layer can be grown anisotropically, and more specifically, can be grown in the thickness direction, so that it has a sufficient protrusion height h and a small diameter. The surface electrode portion 16 having R1 is obtained. Moreover, in the chemical plating, the growth rate of the plating layer is not affected by the difference in the current density distribution unlike the electrolytic plating, so that the surface electrode portion 16 with a small variation in the protrusion height h can be obtained. Therefore, even if the circuit device to be connected has a small pitch and a fine electrode, the electrode structure 15 having a pattern corresponding to the pattern of the electrode can be formed, and the circuit device is stable with respect to the circuit device. A reliable electrical connection state can be reliably obtained.

The back electrode portion 17 in the electrode structure 15 is a laminate formed by forming a metal layer 17B formed by chemical plating on a base layer 17A formed by etching a thin metal layer. Has been
By adjusting the thickness of the metal layer 17B by chemical plating, the back electrode portion 17 having a large thickness can be obtained. In addition, since the thin metal layer forming the base layer 17A may have a small thickness, the back electrode portion 17 having a sufficiently large area is obtained without side etching or the like due to etching, reflecting the resist shape. Therefore, the ratio of the thickness to the area is large and the back electrode portion 1 having high strength is provided.
7, even if it is used repeatedly, there is no deformation or breakage of the back electrode portion 17, and as a result,
A good electrical connection state can be maintained for a long time.

The above-mentioned sheet connector 10 can be manufactured, for example, as follows. First, as shown in FIG. 3, a laminated material 10 in which a thin metal layer 17C is formed on one surface (a lower surface in the figure) of an insulating sheet 11 is shown.
Prepare A. Here, the thickness of the thin metal layer 17C in the laminated material 10A is preferably 5 to 10 μm. When the thickness is less than 5 μm, in a step of forming a through hole in the insulating sheet 11 described later, the strength required to withstand the hole processing is not obtained, and the electrode structure 15 is formed reliably. Can be difficult. On the other hand, if the thickness exceeds 10 μm, side etching or the like is likely to occur in the etching process of the thin metal layer 17C described later, and it may be difficult to reliably form the desired back surface conductive portion 17. . Examples of a method for forming the thin metal layer 17A on the insulating sheet 11 include a sputtering method and an adhesion method.

As shown in FIG. 4, the insulating sheet 11 of the laminated material 10A has the through holes 1 according to the pattern corresponding to the pattern of the electrode structure 15 to be formed.
8H is formed. Here, the through-hole 1 is formed in the insulating sheet 11.
Means for forming 8H include dry etching,
Laser processing or the like can be used. Next, as shown in FIG. 5, the back electrode portion 17 to be formed is formed on the back surface of the laminated material 10A, that is, the surface on which the thin metal layer 17C is formed.
The resist film 14 in which the opening 14K is formed is formed according to the pattern corresponding to the above pattern.

Then, with respect to the thin metal layer 17C of the laminated material 10A, the through holes 18H of the insulating sheet 11 are provided.
By performing a chemical plating process on the portion exposed by the opening 14K of the resist film 14, a thin metal layer 17C is formed in the through hole 18H of the insulating sheet 11 as shown in FIG.
A short-circuit portion 18 connected to the short-circuit portion 18 and a protruding surface electrode portion 16 exposed on the surface of the insulating sheet 11 connected to the short-circuit portion 18 and a thin metal layer in the opening 14K of the resist film 14. A metal layer 17B integrally laminated on 17C is formed. The above chemical plating process is substantially
The plating is performed under appropriate conditions that allow the plating layer to grow anisotropically, specifically, in a direction perpendicular to the surface to be plated.

Next, after a resist film was formed on the surface of the insulating sheet 11, gold plating was performed on the surface of the surface electrode portion 16 and the surface of the metal layer 17 B, and thereafter, the resist film was formed on the surface of the insulating sheet 11. By removing the resist film and the resist film 14 formed on the surface of the thin metal layer 17C, the thin metal layer 17C is exposed as shown in FIG. Then, the metal layer 17 in the thin metal layer 17C is formed.
By etching the portion where B is not formed and removing the portion, a back electrode portion 17 having a required thickness formed by laminating the metal layer 17B on the base layer is formed. Sheet-shaped connector 10 having the configuration shown
Is obtained.

According to the above-described method, the surface electrode portion 16 in the electrode structure 15 is formed by chemical plating that allows the plating layer to grow anisotropically, specifically, to grow in the thickness direction. Thus, the surface electrode portion 16 having a sufficient protrusion height and a small diameter can be obtained. Moreover,
In the chemical plating process, the growth rate of the plating layer is not affected by the difference in the current density distribution unlike the electrolytic plating, so that the surface electrode portion 16 with less variation in the protruding height can be obtained. Therefore, even if the circuit device to be connected has a small pitch and a fine electrode, the electrode structure 15 having a pattern corresponding to the pattern of the electrode is used.
Can be formed, and the sheet-like connector 10 can reliably obtain a stable electrical connection state to the circuit device.
Can be manufactured.

Further, a metal layer 17B having a required pattern is formed on the metal thin layer 17C by chemical plating, and then the metal thin layer 17C is etched to form the back electrode portion 17. Metal layer 17B
By adjusting the thickness of the back surface electrode part 17 having a large thickness can be obtained. In addition, since the thin metal layer 17C may have a thickness small enough to withstand drilling in the step of forming the through holes 18H in the insulating sheet 11, side etching or the like does not occur by a subsequent etching process. The back surface electrode portion 17 having a sufficiently large area is obtained. Therefore, since the back electrode portion 17 having a high strength with a large ratio of the thickness to the area can be formed,
Even in the case of repeated use, the sheet-like connector 1 can maintain a good electrical connection state for a long time without causing deformation or breakage of the back electrode portion 17.
0 can be produced.

In the above-described manufacturing method, after the through holes 18H are formed in the insulating sheet 11 of the laminated material 10A, before the chemical plating treatment is performed, the surface (the upper surface in FIG. 5) of the insulating sheet 11 is formed. By forming a resist film having an opening equal to or slightly larger than the diameter of the through-hole 18H, the desired shape of the surface electrode portion 16 having a higher projection height and a smaller diameter can be ensured. Can be formed.

[Probe Apparatus] FIG. 8 is an explanatory sectional view showing the structure of an example of the probe apparatus according to the present invention. The probe device has an inspection circuit board 25 on one surface on which a plurality of inspection electrodes 26 are arranged in accordance with a pattern corresponding to a pattern of an electrode to be inspected of the circuit device to be inspected. Is a sheet-like connector 10 having the configuration shown in FIG.
Is arranged. In the sheet-like connector 10 of this example, the electrode structure 15 is arranged according to the pattern corresponding to the pattern of the electrode under test of the circuit device under test, while the anisotropic conductive sheet 20 is made of an insulating elastic polymer material. A plurality of conductive path forming portions 21 which are densely filled with conductive particles P exhibiting magnetism and extend in the thickness direction are arranged according to a pattern corresponding to a pattern of an electrode to be inspected of a circuit device to be inspected. The conductive path forming portions 21 are mutually insulated by an insulating portion 22 made of an insulating elastic polymer material. And the anisotropic conductive sheet 20 is
Each of the conductive path forming portions 21 is arranged so as to be positioned on the test electrode 26 of the test circuit board 25, and the sheet-like connector 10 is configured such that each of the electrode structures 15 is a conductive path in the anisotropic conductive sheet 20. It is arranged so as to be located on the forming part 21.

The elastic polymer material forming the conductive path forming portion 21 and the insulating portion 22 in the anisotropic conductive sheet 20 is as follows:
A polymer substance having a crosslinked structure is preferred. Various materials can be used as the curable polymer substance forming material that can be used to obtain such a crosslinked polymer substance, and specific examples thereof include silicone rubber, polybutadiene rubber, natural rubber, and polyisoprene. Rubber, styrene
Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, and block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Rubber and their hydrogenated products,
Examples include chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and soft liquid epoxy rubber. Among them, silicone rubber is preferred in terms of moldability and electrical properties.

As the silicone rubber, those obtained by crosslinking or condensing a liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group-containing one. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, and methylphenyl vinyl silicone raw rubber.

Among them, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
The liquid silicone rubber containing a vinyl group at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst. , The amount of cyclic siloxane and the amount of polymerization terminator). Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such a vinyl group-containing polydimethylsiloxane preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of the heat resistance of the obtained conductive path forming portion 21 and insulating portion 22, the molecular weight distribution index (the ratio Mw / Mn of the weight average molecular weight Mw in terms of standard polystyrene and the number average molecular weight Mn in terms of standard polystyrene).
The value of same as below. ) Is preferably 2 or less.

On the other hand, the liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
The cyclic siloxane is anionically polymerized in the presence of a catalyst, and a polymerization terminator such as dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used, and other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) are used. Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for the anionic polymerization, an alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C.

Such a hydroxyl group-containing polydimethylsiloxane has a molecular weight Mw of 10,000 to 400.
00 is preferred. Further, from the viewpoint of the heat resistance of the obtained conductive path forming portion 21 and insulating portion 22, those having a molecular weight distribution index of 2 or less are preferable. In the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

The polymer substance-forming material may contain a curing catalyst for curing the polymer substance-forming material. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as the curing catalyst include azobisisobutyronitrile and the like. Specific examples of those which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a siloxane complex containing a platinum-unsaturated group, a complex of vinylsiloxane and platinum, and platinum and 1,3-divinyltetramethyldisiloxane. And a complex of triorganophosphine or phosphite with platinum, acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of the curing catalyst used is appropriately selected in consideration of the type of the polymer substance-forming material, the type of the curing catalyst, and other curing treatment conditions.
It is 3 to 15 parts by weight based on 100 parts by weight of the polymer substance forming material.

The conductive particles P forming the conductive path forming portion 21
From the viewpoint that the particles can be easily oriented by a method described later, those exhibiting magnetism are used. Specific examples of the conductive particles exhibiting this magnetism include iron,
Nickel, particles of a metal exhibiting magnetism such as cobalt or particles of these alloys or particles containing these metals, or these particles as core particles, the surface of the core particles gold, silver, palladium, rhodium and the like Conductive metal plating or inorganic particles or polymer particles such as non-magnetic metal particles or glass beads as core particles, the surface of the core particles, nickel,
Examples thereof include those obtained by plating a conductive magnetic material such as cobalt, and those obtained by coating core particles with both a conductive magnetic material and a metal having good conductivity. Among them, it is preferable to use nickel particles as core particles, the surfaces of which are plated with a metal having good conductivity such as gold or silver. Means for coating the surface of the core particles with the conductive metal is not particularly limited, but may be, for example, electroless plating.

When the conductive particles P are formed by coating the surface of a core particle with a conductive metal, from the viewpoint of obtaining good conductivity, the coverage of the conductive metal on the particle surface (core (The ratio of the conductive metal coating area to the particle surface area) is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
It is. The amount of the conductive metal coating is 2.5% of the core particles.
To 50% by weight, more preferably 3% by weight.
To 30% by weight, more preferably 3.5 to 25% by weight,
Particularly preferably, it is 4 to 20% by weight. When the conductive metal to be coated is gold, the coating amount is 3% of the core particle.
It is preferably from 30 to 30% by weight, more preferably from 3.5 to 25% by weight, further preferably from 4 to 20% by weight, particularly preferably from 4.5 to 10% by weight. Also,
When the conductive metal to be coated is silver, the coating amount is preferably 3 to 30% by weight of the core particles, more preferably 4 to 25% by weight, and still more preferably 5 to 2% by weight.
It is 3% by weight, particularly preferably 6 to 20% by weight.

The particle diameter of the conductive particles P is 1 to 50.
0 μm, more preferably 2 to 40 μm.
0 μm, more preferably 5 to 300 μm, particularly preferably 10 to 150 μm. The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1 to 7, and still more preferably 1 to 7.
5, particularly preferably 1 to 4. By using the conductive particles P satisfying such conditions, the obtained conductive path forming portion 21 can be easily deformed under pressure, and
In the conductive path forming portion 21, sufficient electrical contact between the conductive particles P is obtained. The shape of the conductive particles P is
Although it is not particularly limited, it may be spherical, star-shaped, or agglomerated by secondary particles in which these are aggregated because they can be easily dispersed in the polymer material-forming material. preferable.

The water content of the conductive particles P is preferably at most 5%, more preferably at most 3%, further preferably at most 2%, particularly preferably at most 1%. By using the conductive particles P satisfying such conditions, it is possible to prevent or suppress the occurrence of air bubbles in the molding material layer when the molding material layer is cured in the manufacturing method described below.

The conductive particles P whose surfaces have been treated with a coupling agent such as a silane coupling agent can be used as appropriate. By treating the surface of the conductive particles with the coupling agent, the adhesiveness between the conductive particles P and the elastic polymer material is increased, and as a result, the obtained conductive path forming portion 21 is used in repeated use. The durability is high. The amount of the coupling agent used is appropriately selected within a range that does not affect the conductivity of the conductive particles P,
It is preferable that the coating rate of the coupling agent on the surface of the conductive particles P (the ratio of the area of the coupling agent to the surface area of the conductive core particles) is 5% or more, and more preferably, the coating rate is 5% or more. 7 to 100%, more preferably 10 to 100%, particularly preferably 20 to 10
The amount is 0%.

The conductive particles P are 10 to 60% by volume, preferably 1 to 10% by volume, based on the polymer material forming material.
It is preferably used in a ratio of 5 to 50%. If the ratio is less than 10%, the conductive path forming portion 21 having a sufficiently small electric resistance value may not be obtained. on the other hand,
If this ratio exceeds 60%, the obtained conductive path forming part 21 tends to be fragile, and the conductive path forming part 21
Required elasticity may not be obtained.

The polymer material forming material may contain an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, alumina or the like, if necessary. By including such an inorganic filler,
The thixotropic property of the obtained molding material is ensured, the viscosity is increased, and the dispersion stability of the conductive particles is improved, and the conductive path forming portion 2 obtained by curing treatment is obtained.
1 increases. The use amount of such an inorganic filler is not particularly limited, but when used in an excessively large amount, in the production method described later, it becomes impossible to sufficiently achieve the orientation of the conductive particles by a magnetic field,
Not preferred.

The anisotropic conductive sheet 20 as described above can be manufactured, for example, as follows. First, a molding material is prepared by dispersing conductive particles exhibiting magnetism in an elastic body forming material which becomes an elastic polymer substance by curing treatment. As shown in FIG. 9, this molding material is converted into an anisotropic conductive sheet. The cavity of the molding die 30 is filled to form a molding material layer 20A. In the molding material layer 20A, the conductive particles P are in a state of being dispersed in the molding material layer 20A. Here, the mold 30 will be specifically described. The mold 30 is configured such that the upper mold 31 and the lower mold 36 that is paired with the upper mold 31 are arranged to face each other with the frame-shaped spacer 35 interposed therebetween. A cavity is formed between the lower surface of the upper die 31 and the upper surface of the lower die 36. In the upper die 31, a ferromagnetic layer 33 is formed on the lower surface of the ferromagnetic substrate 32 according to a pattern opposite to the arrangement pattern of the conductive path forming portions 21 of the anisotropic conductive sheet 20 to be manufactured. Other than the magnetic layer 33, the non-magnetic layer 3
4 are formed. On the other hand, in the lower mold 36, the anisotropic conductive sheet 2 to be manufactured is provided on the upper surface of the ferromagnetic substrate 37.
The ferromagnetic layer 38 is formed according to the same pattern as the arrangement pattern of the conductive path forming portions 21 of the ferromagnetic layer 3.
A non-magnetic layer 39 is formed in a portion other than 8.

As a material for forming the ferromagnetic substrates 32 and 37 in each of the upper mold 31 and the lower mold 36, a ferromagnetic metal such as iron, iron-nickel alloy, iron-cobalt alloy, nickel, and cobalt is used. Can be. The ferromagnetic substrates 32 and 37 preferably have a thickness of 0.1 to 50 mm, and have a smooth surface, are chemically degreased, and are mechanically polished. preferable. Further, as a material forming the ferromagnetic layers 33 and 38 in each of the upper mold 31 and the lower mold 36, a ferromagnetic metal such as iron, an iron-nickel alloy, an iron-cobalt alloy, nickel, and cobalt may be used. it can. The ferromagnetic layers 33 and 38 preferably have a thickness of 10 μm or more. When the thickness is 10 μm or more, a magnetic field having a sufficient intensity distribution can be applied to the molding material layer 20A, and as a result, the molding material layer 20A
The conductive particles P can be gathered at a high density in a portion to be the conductive path forming part 21 in the above, and the conductive path forming part 21 having good conductivity can be obtained.

As a material for forming the nonmagnetic layers 34 and 39 in each of the upper mold 31 and the lower mold 36, a nonmagnetic metal such as copper, a heat-resistant polymer material, or the like can be used. Since the nonmagnetic layers 34 and 39 can be easily formed by a photolithography technique, a polymer material cured by radiation can be preferably used, and the material is, for example, an acrylic dry film. A photoresist such as a resist, an epoxy-based liquid resist, or a polyimide-based liquid resist can be used.

Thereafter, the ferromagnetic substrate 3 in the upper die 31
For example, a pair of electromagnets (not shown) is arranged on the upper surface of the lower mold 36 and the lower surface of the ferromagnetic substrate 37 in the lower mold 36, and by operating the electromagnets, a parallel magnetic field having an intensity distribution, that is, the strength of the upper mold 31 is increased. A parallel magnetic field having a large intensity acts between the magnetic layer 33 and the corresponding ferromagnetic layer 38 of the lower mold 36 in the thickness direction of the molding material layer 20A. As a result, in the molding material layer 20A, the conductive particles P dispersed in the molding material layer 20A are obtained.
Gather as shown in FIG. 10 in a portion to be the conductive path forming portion 21 located between the ferromagnetic layer 33 of the upper die 31 and the corresponding ferromagnetic layer 38 of the lower die 36. At the same time, they are oriented so as to be arranged in the thickness direction of the molding material layer 20A. Then, in this state, the molding material layer 20A is subjected to a hardening treatment, so that the elasticity height between the ferromagnetic layer 33 of the upper die 31 and the corresponding ferromagnetic layer 38 of the lower die 36 is reduced. Conductive path forming portion 21 in which conductive particles P are contained in a molecular substance in a state of being aligned in the thickness direction.
Then, an insulating portion 22 made of a polymer elastic material interposed between the conductive path forming portions 21 is formed, whereby the anisotropic conductive sheet 20 is manufactured.

In the above, the intensity of the parallel magnetic field applied to the molding material layer 20A is, on average, between the ferromagnetic layer 33 of the upper die 31 and the corresponding ferromagnetic layer 38 of the lower die 36. A size of 0.02 to 2 Gauss is preferred. The curing treatment of the molding material layer 20A is appropriately selected depending on the material used, but is usually performed by a heat treatment. When the molding material layer 20A is cured by heating, a heater may be provided on the electromagnet. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material forming material constituting the molding material layer 20A, the time required for the movement of the conductive particles P, and the like. In addition, the curing treatment of the molding material layer 20A can be performed after stopping the action of the parallel magnetic field, but is preferably performed while the parallel magnetic field is still applied.

In such a probe device, FIG.
As shown in FIG. 1, on the surface of the circuit device 50 to be inspected, the surface electrode portion 16 of the electrode structure 15 in the sheet-like connector 10 is arranged directly above the electrode 51 to be inspected of the circuit device 50 to be inspected. . Here, the circuit device 5 to be inspected
Examples of 0 include a wafer on which a large number of integrated circuits are formed, a semiconductor chip, a package IC, a liquid crystal display element, and the like. Next, when the circuit device 50 to be inspected is pressed by the probe device, the anisotropic conductive sheet 20 in the probe device is pressed by the back surface electrode portion 17 of the electrode structure 15 in the sheet-like connector 10, whereby In the anisotropic conductive sheet 20, a conductive path is formed in the thickness direction between the back electrode portion 17 of the electrode structure 15 of the sheet-like connector 10 and the test electrode 51 of the test circuit board 50. Thus, electrical connection between the electrode 51 to be inspected of the circuit device 50 to be inspected and the inspection electrode 26 of the circuit board 25 for inspection is achieved. Then, in this state, a required electrical test is performed on the circuit device under test.

According to the above-described probe device, the surface electrode portion 16 in the electrode structure 15 of the sheet connector 10 is provided.
However, since the circuit device 50 to be inspected has a small pitch and a small electrode 5 to be inspected because it has a sufficient projection height, a small diameter, and a small variation in the projection height.
1 can surely achieve a stable electrical connection state to the circuit device under test 50. The electrode structure 15 of the sheet-like connector 10
Since the back electrode portion 17 has a high thickness to area ratio and a high strength, the back electrode portion 17 is not deformed or damaged even when it is used repeatedly, and as a result, good for a long period of time. A proper electrical connection state can be maintained.

[0056]

EXAMPLES Hereinafter, specific examples of the present invention will be described, but the present invention is not limited to the following examples.

[Sheet-shaped connector] The thickness is 12.5 μm.
A thin metal layer made of copper having a thickness of 9 μm was formed on one surface of an insulating sheet made of polyimide having a thickness of m by a bonding method to produce a laminated material. The pitch of the insulating sheet in this laminated material is 100 μm by laser processing,
A plurality of through-holes having a diameter of 40 μm are formed, and then 60 μm corresponding to the through-holes of the insulating sheet are formed on the surface of the thin metal layer.
20 μm thick resist film 1 with m-square openings formed
4 was formed.

Then, by performing the chemical plating treatment, as shown in FIG. 6, a short-circuit portion is formed in the through hole of the insulating sheet, and the surface of the insulating sheet has a diameter of 50 μm.
m, a protruding surface electrode portion having a protrusion height of 20 μm was formed, and a metal layer having a thickness of 20 μm was formed in the opening of the resist film.

Next, gold plating is applied to the surface of the surface electrode portion and the surface of the metal layer, and thereafter, the resist film formed on the surface of the thin metal layer is removed, and the metal layer in the thin metal layer is formed. By etching the non-existing portion and removing the portion, a back electrode portion was formed to form an electrode structure, and a sheet-like connector was manufactured.

[Anisotropic Conductive Sheet] A molding material was prepared by adding 100 parts by weight of conductive particles having an average particle diameter of 15 μm to 100 parts by weight of the addition type liquid silicone rubber and mixing them. In the above, as the conductive particles, nickel particles are used as core particles, and the core particles are plated with gold (average coating amount: 15% by weight of the core particles).
%).

According to the structure shown in FIG. 9, a mold for forming an anisotropic conductive sheet was produced under the following conditions. [Ferromagnetic substrate] Material: iron, thickness: 10 mm [Ferromagnetic layer] Material: nickel, thickness: 0.1 mm, diameter: 0.05 m
m, pitch: 0.1 mm [non-magnetic layer] Material: copper, thickness: 0.13 mm [spacer] thickness: 0.15 mm

The prepared molding material was injected into the cavity of the mold to form a molding material layer. Next, an electromagnet is arranged on the upper surface of the upper die and the lower surface of the lower die, and the molding material layer is placed between the upper ferromagnetic layer and the lower ferromagnetic layer in a thickness direction of 1.5 T in the thickness direction. The molding material layer was cured at 100 ° C. for one hour while a parallel magnetic field was applied to produce an anisotropic conductive sheet having a thickness of 0.21 mm. The conductive path forming portion of the anisotropic conductive sheet has a diameter of 50 μm and an arrangement pitch of 100 μm.
m, the ratio of the conductive particles in the conductive path forming portion was 35% by volume.

[Probe Apparatus] A test circuit board having a plurality of test electrodes having a diameter of 40 μm and an arrangement pitch of 100 μm formed on one surface is prepared, and the above-described anisotropic conductive film is formed on one surface of the test circuit board. The sheet is fixedly arranged so that the conductive path forming portion is located on the inspection electrode of the inspection circuit board. On the anisotropic conductive sheet, the above-mentioned sheet-like connector is placed on the back electrode portion of the electrode structure. Was fixedly arranged so as to be located on the conductive path forming portion of the anisotropic conductive sheet, thereby producing a probe device.

The surface has a diameter of 60 μm and an arrangement pitch of 10
A circuit device to be inspected having a 0 μm electrode to be inspected is formed on the surface of the circuit device to be inspected. Arranged such that the surface electrode portion of the structure is located on the electrode under test of the circuit device under test,
The force applied to each of the electrodes to be inspected by the probe device is 0.98 N (0.01 kg).
w) is pressed under the conditions described below, and in this state, the electrical connection state of the test electrode of the test circuit device with respect to the test electrode of the test circuit device is checked. It was confirmed that the condition was achieved. When the above test was repeated 10,000 times, no deformation or breakage was observed in the back electrode portion of the electrode structure of the sheet-like connector, and a good electrical connection state was maintained for a long period of time. Was confirmed.

[0065]

According to the first to third aspects of the present invention, a surface electrode portion has an electrode structure with a small diameter, and is stable to a circuit device having electrodes formed at a small pitch. It is possible to provide a sheet-like connector capable of reliably obtaining an electrical connection state. According to the invention set forth in claims 4 and 5, a favorable electrical connection state can be obtained even with a circuit device having an electrode structure having a small diameter of the surface electrode portion and having electrodes formed at a small pitch. It is possible to provide a sheet-like connector that can be obtained reliably, has a high strength of the back electrode portion of the electrode structure, and maintains a good electrical connection state for a long period of time even when used repeatedly. According to the sixth aspect of the present invention, a stable electrical connection state can be reliably obtained even with a circuit device having an electrode structure having a small diameter of the surface electrode portion and having electrodes formed at a small pitch. Sheet connectors can be manufactured.
According to the invention described in claims 7 and 8, a favorable electrical connection state is provided even for a circuit device having an electrode structure having a small diameter of the surface electrode portion and having electrodes formed at a small pitch. It is possible to manufacture a sheet-like connector that can be obtained reliably, has a high strength of the back electrode portion in the electrode structure, and maintains a good electrical connection state for a long period of time even when used repeatedly. Claims 9 to 1
According to the invention described in Item No. 0, even when the electrodes to be inspected of the circuit to be inspected are arranged at a minute and small pitch, a probe device which can reliably obtain a good electrical connection state to the electrodes to be inspected, Further, it is possible to provide a probe device that maintains a good electrical connection state for a long period of time even when used repeatedly.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view illustrating a configuration of an example of a sheet-like connector according to the present invention.

FIG. 2 is an explanatory cross-sectional view showing an enlarged electrode structure of the sheet-like connector shown in FIG.

FIG. 3 is an explanatory cross-sectional view showing a configuration of a laminated material used for manufacturing a sheet-like connector.

FIG. 4 is an explanatory sectional view showing a state in which a through hole is formed in an insulating sheet of a laminated material.

FIG. 5 is an explanatory cross-sectional view showing a state in which a resist film is formed on the surface of a thin metal layer in a laminated material.

FIG. 6 is an explanatory cross-sectional view showing a state where a surface electrode portion, a short-circuit portion, and a metal layer are formed on a laminated material by a chemical plating process.

FIG. 7 is an explanatory cross-sectional view showing a state in which a resist film has been removed from a laminated material.

FIG. 8 is an explanatory sectional view showing a configuration of an example of a probe device according to the present invention.

FIG. 9 is an explanatory cross-sectional view showing a state in which a molding material layer is formed in a mold for producing an anisotropic conductive sheet.

FIG. 10 is an explanatory cross-sectional view showing a state in which a magnetic field having an intensity distribution in the thickness direction is applied to a molding material layer.

11 is an explanatory cross-sectional view showing a state where an electrical inspection of a circuit device under test is performed by the probe device shown in FIG. 8;

FIG. 12 is an explanatory cross-sectional view showing a configuration of an example of a conventional sheet-like connector.

FIG. 13 is an explanatory cross-sectional view showing a process for manufacturing a conventional sheet-like connector.

FIG. 14 is an explanatory cross-sectional view showing an enlarged electrode structure in a conventional sheet-like connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Sheet-shaped connector 10A Laminated material 11 Insulating sheet 14 Resist film 14K opening 15 Electrode structure 16 Surface electrode part 17 Back electrode part 17A Base layer 17B Metal layer 17C Thin metal layer 18 Short circuit part 18H Through hole 20 Anisotropic conductive sheet 21 Conductive path forming part 22 Insulating part 25 Inspection circuit board 26 Inspection electrode 30 Mold 31 Upper die 32 Ferromagnetic substrate 33 Ferromagnetic layer 34 Non-magnetic layer 35 Spacer 36 Lower die 37 Ferromagnetic substrate 38 Ferromagnetic Layer 39 Non-magnetic layer 50 Inspection circuit device 51 Inspection electrode 80 Anisotropic conductive sheet 85 Inspection circuit board 86 Inspection electrode 90 Sheet connector 90A Laminated material 91 Insulating sheet 92 Metal layer 93 Resist film 94A, 94B Resist Film 95 Electrode structure 96 Front electrode part 97 Back electrode part 98 Short circuit Part P conductive particles

Claims (10)

[Claims] 1. An insulating sheet, a protruding surface electrode portion exposed on the surface of the insulating sheet and disposed on the insulating sheet so as to be spaced apart from each other in the surface direction, and a back surface of the insulating sheet. A sheet-like connector having an exposed back electrode portion and a plurality of electrode structures connected to each other by a short-circuit portion extending through the insulating sheet in the thickness direction thereof, wherein each of the electrode structures A sheet-like connector, wherein the surface electrode portion is formed by plating. 2. The sheet-like connector according to claim 1, wherein the surface electrode portion in each of the electrode structures is formed by chemical plating. 3. The diameter of the surface electrode portion in the electrode structure is
The sheet-like connector according to claim 1 or 2, wherein the diameter of the short-circuit portion is 100 to 200%. 4. The back electrode portion of the electrode structure is formed by laminating a metal layer formed by chemical plating on a base layer formed by etching a thin metal layer. The sheet connector according to any one of claims 1 to 3. 5. The sheet-like connector according to claim 1, wherein the thickness of the back electrode portion in the electrode structure is 20 to 50 μm. 6. An insulating sheet, a protruding surface electrode portion exposed on the surface of the insulating sheet and disposed on the insulating sheet so as to be spaced apart from each other in a surface direction thereof, and a back surface of the insulating sheet. A method of manufacturing a sheet-like connector having a plurality of electrode structures in which an exposed back electrode portion is connected to each other by a short-circuit portion extending through the insulating sheet in a thickness direction thereof, comprising: A laminated material having a thin metal layer formed thereon is prepared, and a through hole is formed in an insulating sheet of the laminated material according to a pattern corresponding to an electrode structure to be formed. A step of forming a short-circuit portion filled in the through-hole of the insulating sheet and a surface electrode portion connected to the short-circuit portion by subjecting the formed laminated material to chemical plating. A method for manufacturing a sheet-shaped connector, comprising: 7. A short circuit portion filled in the through hole of the insulating sheet by chemical plating the laminated material having the through hole formed in the insulating sheet, and the short circuit portion connected to the short circuit portion. Forming a protruding surface electrode portion exposed on the surface of the insulating sheet, and forming a metal layer according to a pattern corresponding to an electrode structure to be formed on the surface of the thin metal layer in the laminated material, 7. The method according to claim 6, wherein a portion of the thin metal layer other than the portion where the metal layer is formed is removed to form a back electrode portion connected to the short-circuit portion. . 8. The thickness of the thin metal layer in the laminated material is 5 to 8.
The method for manufacturing a sheet-like connector according to claim 7, wherein the thickness is 10 µm. 9. A probe device interposed between a circuit device under test and a tester for making an electrical connection between the circuit device under test and the tester, the probe device corresponding to an electrode under test of the circuit device under test. A probe device comprising the sheet-like connector according to any one of claims 1 to 5, wherein the electrode structure is arranged according to a pattern to be formed. 10. A sheet-like connector via an anisotropic conductive sheet is arranged on one surface of an inspection circuit board on which a plurality of inspection electrodes are formed corresponding to electrodes to be inspected of a circuit device to be inspected. The probe device according to claim 9, wherein: