JP2000109994A - 基板メッキ装置 - Google Patents
基板メッキ装置Info
- Publication number
- JP2000109994A JP2000109994A JP10282844A JP28284498A JP2000109994A JP 2000109994 A JP2000109994 A JP 2000109994A JP 10282844 A JP10282844 A JP 10282844A JP 28284498 A JP28284498 A JP 28284498A JP 2000109994 A JP2000109994 A JP 2000109994A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- substrate
- cleaning
- semiconductor wafer
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 149
- 239000000758 substrate Substances 0.000 title claims abstract description 81
- 238000004140 cleaning Methods 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 59
- 235000012431 wafers Nutrition 0.000 description 59
- 239000010949 copper Substances 0.000 description 45
- 238000000034 method Methods 0.000 description 29
- 238000005406 washing Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 102100024522 Bladder cancer-associated protein Human genes 0.000 description 1
- 101150110835 Blcap gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101100493740 Oryza sativa subsp. japonica BC10 gene Proteins 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10282844A JP2000109994A (ja) | 1998-10-05 | 1998-10-05 | 基板メッキ装置 |
| US09/555,650 US6495004B1 (en) | 1998-10-05 | 1999-10-04 | Substrate plating apparatus |
| KR1020007005920A KR100694563B1 (ko) | 1998-10-05 | 1999-10-04 | 기판도금장치 |
| PCT/JP1999/005439 WO2000020663A1 (fr) | 1998-10-05 | 1999-10-04 | Dispositif de placage de substrat |
| TW088117038A TW428223B (en) | 1998-10-05 | 1999-10-04 | Apparatus for plating a substrate |
| EP99970132A EP1048756A4 (en) | 1998-10-05 | 1999-10-04 | DEVICE FOR PLATING SUBSTRATES |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10282844A JP2000109994A (ja) | 1998-10-05 | 1998-10-05 | 基板メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000109994A true JP2000109994A (ja) | 2000-04-18 |
| JP2000109994A5 JP2000109994A5 (enExample) | 2005-06-30 |
Family
ID=17657814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10282844A Pending JP2000109994A (ja) | 1998-10-05 | 1998-10-05 | 基板メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000109994A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3367655B2 (ja) | 1999-12-24 | 2003-01-14 | 島田理化工業株式会社 | めっき処理装置及びめっき処理方法 |
| WO2023127554A1 (ja) * | 2021-12-28 | 2023-07-06 | 芝浦メカトロニクス株式会社 | 基板搬送用台車 |
-
1998
- 1998-10-05 JP JP10282844A patent/JP2000109994A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3367655B2 (ja) | 1999-12-24 | 2003-01-14 | 島田理化工業株式会社 | めっき処理装置及びめっき処理方法 |
| WO2023127554A1 (ja) * | 2021-12-28 | 2023-07-06 | 芝浦メカトロニクス株式会社 | 基板搬送用台車 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
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| A521 | Written amendment |
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| A02 | Decision of refusal |
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