JP2000100707A - Substrate treatment equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain substrate treatment equipment, where a holding member holding a substrate does not affect on the state of treatment liquid discharged from a treatment liquid discharging nozzle and the holding member is prevented from interference of the treatment liquid discharging nozzle. SOLUTION: A spin base 11 of a substrate holding part 1 is provided with a plurality of retaining pins 14 retaining the back of a substrate 100, and a plurality of rotation type holding pins 15 for regulating a horizontal position of the substrate 100. The spin base 11 is provided with an outward slanting part 11b which slants downward. The rotating holding pins 15 is fixed on the outward slanting part 11b, pivotably around a shaft perpendicular to the outside slanting part 11b. When a pin member 16 is isolated from the outer peripheral end portion of the substrate 100 by the pivoting of a pin retaining part 17, the upper end of the pin member 16 is positioned lower than the surface of the substrate 100.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for performing a predetermined processing on a substrate by supplying a processing liquid to the substrate.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a glass substrate for an optical disk. For example, a rotary developing device is used for developing a photosensitive film formed on the surface of a substrate.

FIG. 10 is a schematic sectional view of a conventional developing device. In FIG. 10, the substrate holder 51 includes a circular plate-shaped spin base 52. The spin base 52 is horizontally fixed to the tip of the rotating shaft 2 of the motor 3 and is driven to rotate about a vertical axis.

On the upper surface of the spin base 52, an annular support portion 5 is provided.
3 are fixed, and a plurality of substrate support pins 54 for supporting the back surface of the substrate 100 are provided on the annular support portion 53.
A plurality of substrate holding pins 57 that regulate the horizontal position of the substrate 100 are attached to the spin base 52 by a bearing 58 so as to be rotatable around a vertical axis. A bar-shaped permanent magnet 59 is provided below each substrate holding pin 57.
Is attached.

An annular magnet 61 is provided below the spin base 52.
Are arranged. The annular magnet 61 is provided with a magnet support member 6 provided vertically movable by a driving device (not shown).
It is fixed to 2.

Above the substrate holder 51, a developing solution discharge nozzle 63 for discharging the developing solution is provided so as to be movable in the vertical and horizontal directions. This developer discharge nozzle 63
Before the developing process and after the developing process, the device stands by at a position separated from above the substrate 100, and moves above the central portion of the substrate 100 during the developing process.

The operation of the above-described developing device during the developing process will be described below. The development processing of the substrate using this developing device includes the steps of supplying a developing solution, holding the developing solution, washing with pure water, and drying.

First, in the developing solution supply step, the annular magnet 61
Rises, and the substrate 100 is horizontally held by the plurality of substrate holding pins 57. Thereafter, the substrate holding unit 51 is rotationally driven by the motor 3, and the substrate 100 rotates at a low speed around the vertical axis. In this state, the developer discharge nozzle 6
From 3, the developer is discharged onto the substrate 100. Substrate 100
The developer is uniformly spread over the entire surface of the substrate 100 by the rotation of.

In the developing solution holding step, the rotation of the substrate holding section 51 stops. Next, the ring magnet 61 descends, and the substrate holding pins 57 separate from the substrate 100. In this state in which the developer is loaded on the substrate 100, the state is maintained for a certain time.
During this time, development of the photosensitive film on the substrate 100 proceeds.

In the pure water cleaning step, the substrate holder 51 is driven to rotate again, and the substrate 1 is supplied through a pure water supply nozzle (not shown).
Pure water is supplied to the surface of the substrate 100, and the surface of the substrate 100 is cleaned with pure water.

In the drying step, after the supply of the pure water is stopped, the substrate holding unit 51 is driven to rotate at a high speed, and the pure water is shaken off the surface of the substrate 100 by the centrifugal force accompanying the rotation. Thereby, the substrate 100 dries. Thereafter, the rotation of the substrate holding unit 51 stops, and the development processing of the substrate 100 ends.

[0012]

In the above-mentioned conventional rotary developing device, the photosensitive film on the substrate is subjected to a large impact when the rotating substrate is exposed to the developing solution at the start of discharge. Bubbles are generated in the developer by the impact, and minute bubbles remaining on the surface of the photosensitive film may cause development defects. Further, the photosensitive film may be damaged by the impact of the developer at the start of the discharge.

Therefore, the developer is discharged from a developer discharge nozzle having a slit-like discharge port, and the developer discharge nozzle is linearly moved from one end to the other end of the substrate to thereby supply the developer in an initial stage. There has been proposed a developing method of supplying a developer with a uniform impact force on a substrate while suppressing the flow of the developer on the substrate.

In this developing method, the gap between the slit-shaped discharge port and the upper surface of the substrate is set to about 1.5 mm. Then, the developer discharge nozzle moves while the substrate holding pins are separated from the substrate, and the developer is discharged from the slit-shaped discharge port onto the substrate.

The substrate holding pin includes a pin member that contacts the outer peripheral edge of the substrate, and the pin member protrudes by about 1 mm from the upper surface of the substrate. Therefore, the gap between the slit-shaped discharge port and the upper end of the pin member is about 0.5 mm.

As described above, when the pin member is provided in the vicinity of the slit-shaped discharge port, when the developer discharge nozzle linearly moves on the substrate from one end to the other end and supplies the developer onto the substrate, The state of the developing solution flowing out of the slit-shaped discharge port in a strip shape is disturbed by the pin member protruding above the substrate. As a result, there may be a case where the development uniformity is deteriorated or the development is poor.

Also, if the developing solution discharge nozzle shakes during movement, the pin member protruding above the substrate may interfere with the developer discharge nozzle.

An object of the present invention is to prevent the holding member holding the substrate from affecting the state of the processing liquid discharged from the processing liquid discharge nozzle and preventing the processing liquid discharge nozzle from interfering with the holding member. It is to provide a substrate processing apparatus.

[0019]

Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention is a substrate processing apparatus for supplying a processing liquid onto a substrate and performing predetermined processing on the substrate. A base member placed on the base member, a plurality of holding members disposed along an outer peripheral portion of the substrate placed on the base member, for regulating a position of the substrate, and a process performed on the substrate placed on the base member. A processing liquid discharge nozzle for discharging a liquid, wherein each of the plurality of holding members is provided on the base member so as to be rotatable around an axis inclined outward, and with the rotation of the support portion And a holding portion provided on the support portion eccentrically with respect to a rotation axis of the support portion so as to contact an outer peripheral end portion of the substrate.

In the substrate processing apparatus according to the first invention, the position of the substrate placed on the base member is regulated by the plurality of holding members. Thereby, the substrate is held on the base member. Since the holding portion of the holding member is provided on the support portion eccentrically with respect to the rotation axis of the support portion, the holding portion abuts on the outer peripheral edge of the substrate by rotating the support portion in one direction. . In addition, when the support portion rotates in the opposite direction, the holding portion is separated from the outer peripheral end of the substrate.

Since the supporting portion is provided on the base member so as to be inclined outward, when the holding portion is separated from the outer peripheral edge of the substrate, the upper end of the holding portion is in contact with the outer peripheral edge of the substrate. It will be lower than usual.

In this state, when the processing liquid is discharged from the processing liquid discharge nozzle onto the substrate, the holding portion of the holding member is at a low position. The influence is suppressed. Further, the processing liquid discharge nozzle does not easily interfere with the holding portion of the holding member.

According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the holding portion has an inverted truncated cone shape.

In this case, the holding portion has an inverted truncated cone shape,
In addition, since the holding portion is provided on the base member so as to be rotatable around an outwardly inclined axis, the outer peripheral surface of the holding portion can abut substantially perpendicularly to the outer peripheral end of the substrate. This makes it possible to hold the substrate reliably.

According to a third aspect of the present invention, in the configuration of the substrate processing apparatus according to the first or second aspect, when the holding unit is separated from the outer peripheral end of the substrate with the rotation of the support unit. In addition, the height of the holding unit is set such that the upper end of the holding unit is lowered to a position lower than the substrate.

In this case, when the holding portion of the holding member is separated from the outer peripheral end of the substrate, the upper end of the holding portion is at a position lower than the substrate, so that the holding portion is discharged from the processing liquid discharge nozzle onto the substrate. Affects the condition of the processing solution. Further, the processing liquid discharge nozzle moving on the substrate does not interfere with the holding portion of the holding member.

The substrate processing apparatus according to the fourth invention comprises:
In the configuration of the substrate processing apparatus according to any one of the third aspects of the invention, the processing liquid discharge nozzle includes a slit-shaped discharge port, and a holding portion of each holding member extends from an outer peripheral end of the substrate placed on the base member. A moving means for moving the processing liquid discharge nozzle from one position outside the substrate mounted on the base member to a position outside the substrate by passing the upper part of the substrate when the nozzles are separated from each other; It is a thing.

In this case, when the processing liquid discharge nozzle moves from the position on one side outside the substrate to the position on the other side outside the substrate and moves on the substrate, the holding portions of the holding members are moved to the position on the substrate. It is separated from the outer peripheral end and descends. Therefore, the state of the processing liquid flowing out in a band shape is suppressed from being disturbed by the holding portion of the holding member. Further, the moving processing liquid discharge nozzle is less likely to interfere with the holding portion of the holding member.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a developing device will be described as an example of a substrate processing apparatus according to the present invention.

FIG. 1 is a plan view of a developing device according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line XX of a main part of the developing device of FIG. 1, and FIG. FIG. 4 is a plan view of a substrate holding portion of the developing device of FIG.

As shown in FIGS. 2 and 3, the developing device includes a substrate holding unit 1. The substrate holder 1 is a spin base 1
1, the spin base 11 has a circular flat inner flat surface portion 11a and an outwardly downwardly inclined annular outer inclined portion 11b. In the present embodiment, the outer inclined portion 11b
Are inclined by 20 ° with respect to the inner flat surface portion 11a. The spin base 11 is horizontally fixed to the tip of the rotation shaft 2 of the motor 3 via a base attachment member 12 and is driven to rotate around the axis in the vertical direction.

On the upper surface of the spin base 11, an annular support 1 is provided.
3 are provided. The outer peripheral portion of the annular support portion 13 is inclined along the outer inclined portion 11b of the spin base 11. A plurality of support pins 14 for supporting the rear surface of the substrate 100 are provided on the upper surface of the annular support portion 13.

As shown in FIG. 4, a plurality of notches 13a are provided on the outer peripheral portion of the annular support portion 13. Rotary holding pins 15 for regulating the horizontal position of the substrate 100 are respectively arranged in the plurality of notches 13 a of the annular support portion 13. The rotary holding pin 15 is used for the spin base 11.
Is attached vertically to the outer inclined portion 11b, and is rotatable around an axis perpendicular to the outer inclined portion 11b. The structure of the rotary holding pin 15 will be described later.

As shown in FIGS. 2 and 3, below the spin base 11, an annular magnet 6 is provided. The annular magnet 6 is fixed to a magnet support member 7 provided to be vertically movable by a driving device (not shown).

The rotating shaft 2 of the motor 3 is constituted by a hollow shaft, and a back rinse nozzle 9 (see FIG. 4) for cleaning the back surface of the substrate 100 is inserted therein. The back rinse nozzle 9 penetrates through the base mounting member 12 and protrudes to the rear surface side of the substrate 100. At the tip of the back rinse nozzle 9, a truncated conical cap 8 is attached. The cap 8 is provided to prevent a rinsing liquid such as pure water discharged from the back rinsing nozzle 9 from entering the inside of the rotating shaft 2.

As shown in FIGS. 1 and 2, a circular inner cup 30 is provided so as to freely move up and down so as to surround the substrate holding portion 1. A square outer cup 31 is provided around the inner cup 30. Outer cup 3
Standing pots 32, 33 are arranged on both sides of the device 1, respectively.

As shown in FIG. 1, a guide rail 34 is provided on one side of the outer cup 31. The nozzle arm 35 is provided so as to be movable in the scanning direction A and the opposite direction along the guide rail 34 by the arm driving unit 36. A pure water discharge nozzle 38 for discharging pure water is provided on the other side of the outer cup 31 so as to be rotatable in the direction of arrow R. In the nozzle arm 35,
A developer discharge nozzle 37 having a slit-shaped discharge port 39 (see FIG. 2) at the lower end is mounted perpendicular to the guide rail 34. Thereby, the developer discharge nozzle 37 is
From the position of the standby pot 32, it is possible to move linearly in parallel in the scanning direction A from the position of the standby pot 32 to the position of the standby pot 33 through the substrate 100.

As shown in FIG. 3, the developing solution discharge nozzle 37
Is supplied with a developer by a developer supply system 40. The control unit 41 controls the rotation operation of the motor 3, the scanning of the developing solution discharge nozzle 37 by the arm driving unit 36,
The operation of the developing solution from the developing device 7 and the operation of the rotary holding pin 15 by the vertical movement of the magnet support member 7 are controlled.

As shown in FIG. 5, the developing solution discharge nozzle 37
Are disposed perpendicular to the scanning direction A of the developer discharge nozzle 37. The slit width t of the slit-shaped discharge port 39 is 0.05 to 1.0 mm, and is 0.2 mm in the present embodiment. Further, the discharge width L of the slit-shaped discharge port 39 is set to be equal to or larger than the diameter of the substrate 100 to be processed, and when processing the substrate 100 having a diameter of 8 inches, it is set to 210 mm in the embodiment. Is set.

The developing solution discharge nozzle 37 has a bottom surface
The scanning is performed in the scanning direction A so as to maintain a state parallel to the surface of the zero. The distance between the slit-shaped discharge port 39 and the surface of the substrate 100 is 0.2 to 5 mm, more preferably 0.5 to 5 mm.
It is 2 mm, and 1.5 mm in this embodiment.

FIG. 6 is a sectional view taken along the line BB in FIG.
FIG. 2 is an exploded perspective view of a rotary holding pin of the developing device of FIG.

6 and 7, the rotary holding pin 15 includes an inverted triangular pyramid-shaped pin member 16, a substantially cylindrical pin support 17, a mounting member 18, and a magnet housing 21. The pin member 16 is provided on the upper surface of the pin support 17 eccentrically with respect to the center of the pin support 17.

The rotary holding pin 15 is
Is mounted on the outer inclined portion 11b so as to be rotatable about an axis perpendicular to the outer inclined portion 11b, and the pin member 16 has an inverted triangular pyramid shape.
00 substantially perpendicularly to the outer peripheral end. Thus, the substrate 100 can be reliably held.

The pin support 17 includes a lid 17 a, an insertion portion 17 b inserted into a bearing 20 of a mounting member 18 described later, and a connecting portion 1 connected to the magnet housing 21.
7c.

The magnet storage section 21 has an inverted truncated cone-shaped storage section 21a for storing a rod-shaped permanent magnet 22 having both end surfaces inclined.
And a connecting portion 21b fixed to the connecting portion 17c of the pin supporting portion 17 by the screw 25 of FIG. Permanent magnet 2
Since the two end surfaces of the annular magnet 6 are inclined, when the annular magnet 6 rises, the end surface of the permanent magnet 22 faces the outer peripheral surface of the annular magnet 6 in parallel. Thereby, the magnetic force acts between the annular magnet 6 and the permanent magnet 22 efficiently.

The mounting member 18 includes a fixing portion 18a fixed to the outer inclined portion 11b of the spin base 11, and a cylindrical insertion portion 1 inserted into a mounting hole of the outer inclined portion 11b.
8b and a cylindrical protruding portion 18c protruding above the outer inclined portion 11b. Insertion portion 18b and protrusion 18
A bearing 20 is housed inside c, and a bearing support member 24 for preventing the bearing 20 from dropping is inserted (see FIG. 6).

As shown in FIG. 7, a pair of mounting holes 19 are formed in the fixing portion 18a of the mounting member 18, and the fixing portion 18a is inserted by inserting a screw (not shown) into the mounting hole 19. Is the outer inclined portion 1 of the spin base 11
1b. The protrusion 18c of the mounting member 18 protrudes upward from the upper surface of the outer inclined portion 11b of the spin base 11. The insertion portion 17b of the pin support 17 is inserted into the bearing 20 inserted inside the protrusion 18c of the mounting member 18. Further, the connecting portion 21 of the magnet housing portion 21 is provided in the bearing 20 from the lower end side of the mounting member 18.
b is inserted, and the pin support 17 and the magnet housing 21 are connected by the screw 25 of FIG. As a result, the pin support portion 17 and the magnet storage portion 21 are integrated, and the outer inclined portion 1 of the spin base 11 is rotatable by the bearing 20.
1b.

In FIG. 6, the dashed line indicates the position of the pin member 16 while holding the substrate 100. When the substrate 100 is held, the upper end of the pin member 16 projects upward from the upper surface of the substrate 100. When releasing the substrate 100, the pin support 17 of the rotary holding pin 15 rotates around an axis perpendicular to the outer inclined portion 11 b of the spin base 11. As a result, the pin member 16 moves to the position indicated by the solid line, and the upper end of the pin member 16 is at a position lower than the upper surface of the substrate 100. Therefore, even if the developing solution discharge nozzle 37 is scanned close to the surface of the substrate, the developing solution discharge nozzle 37 does not interfere with the pin member 16. The state of the developing solution flowing out of the slit-shaped discharge port 39 in a strip shape is changed to the pin member 1.
Not disturbed by 6.

In this embodiment, when the rotary holding pins 15 hold the substrate 100, the distance from the upper surface of the substrate 100 to the upper end of the pin member 16 is 1 mm, and the distance between the holding state of the substrate 100 and the released state of the substrate 100 is 1 mm. The moving distance M of the pin member 16
Is set to 3 mm. The movement locus of the upper end of the pin member 16 is parallel to the outer inclined portion 11b of the spin base 11, and the inclination angle of the outer inclined portion 11b is 20 °. Accordingly, the height H in the vertical direction from the upper end of the pin member 16 in the released state of the substrate 100 to the upper end of the pin member 16 in the held state of the substrate 100 is 3 × tan (20 °) = 1.09. Therefore, when the substrate 100 is released, the upper end of the pin member 16 is at a position lower than the upper surface of the substrate 100.

When the substrate is released, the substrate 100 is supported only by the plurality of support pins 14. In this state, the developing solution discharge nozzle 37 scans the substrate 100 while scanning the substrate 1.
The developer is supplied on the top of the surface. At this time, a plurality of support pins 1
Since the frictional force between the substrate 4 and the substrate 100 is greater than the force of the developer pulling the substrate 100 due to the viscosity, the substrate 100
Does not move.

In this embodiment, the spin base 11 corresponds to a base member, the rotary holding pin 15 corresponds to a holding member, the developing solution discharge nozzle 37 corresponds to a processing liquid discharge nozzle, and the pin support 17 is The pin member 16 corresponds to a support portion.
Corresponds to the holding portion, and the slit-shaped discharge port 39 corresponds to the slit-shaped discharge port.

Next, the operation of the developing device of FIG. 1 will be described with reference to FIG. As shown in FIG. 8, the motor 3 is stopped, and the substrate 100 is stationary on the plurality of support pins 14 of the substrate holding unit 1. At this time, the annular magnet 6 is lowered, and the pin member 16 of the rotary holding pin 15 is
0 from the outer peripheral end. Therefore, the pin member 1
The upper end of 6 is lower than the surface of the substrate 100.

During standby, the developing solution discharge nozzle 37 is waiting at a position P0 in the standby pot 32. During the development process, the developer discharge nozzle 37 is raised and then moved in the scanning direction A.
At the scanning start position P1 in the outer cup 31.

Thereafter, the developing solution discharge nozzle 37 starts scanning at a predetermined scanning speed from the scanning start position P1. At this time, the discharge of the developer from the developer discharge nozzle 37 is not performed. In the present embodiment, the scanning speed is 10 to 500 mm
/ Sec.

After the scanning of the developing solution discharging nozzle 37 is started, the slit-shaped discharging port 39 of the developing solution discharging nozzle 37
Before reaching the upper side, the discharge of the developer by the developer discharge nozzle 37 is started at a predetermined flow rate at the discharge start position P2.
In this embodiment, the flow rate of the developer is set to 1.2 L / min.

The developer discharge nozzle 37 scans the substrate 100 from the discharge start position P2 in the scanning direction A while discharging the developer.
(See FIG. 9). Thereby, the substrate 1
The developer is continuously supplied to the entire surface of No. 00. The supplied developer is held on the substrate 100 by the surface tension (a liquid level).

In the developing solution supply step, since the pin member 16 of the rotary holding pin 15 is located at a position lower than the surface of the substrate 100, the pin member 16 affects the state of the developing solution flowing in a strip shape from the slit-shaped discharge port 39. Has no effect. Therefore, the discharge state of the developing solution is stable, and the developing solution is uniformly supplied to the entire surface of the substrate.

After the developer discharge nozzle 37 has passed over the substrate 100, the discharge of the developer by the developer discharge nozzle 37 is stopped at the discharge stop position P3 off the substrate 100. Then, when the developing solution discharge nozzle 37 reaches the scanning stop position P4 in the outer cup 31, the scanning of the developing solution discharge nozzle 37 is stopped.

Thereafter, the developer discharge nozzle 37 moves up to the position P5 of the other standby pot 33 after rising at the scanning stop position P4, and descends into the standby pot 33.

After completion of the liquid filling, the state in which the developing solution is supplied to the stationary substrate 100 is maintained for a predetermined time. Thereby, development of the photosensitive film on the substrate 100 proceeds. During this time, the developer discharge nozzle 37 passes from above the standby pot 33 to above the substrate 100 and returns to the standby pot 32.

Thereafter, the ring-shaped magnet 6 rises, the rotary holding pin 15 rotates, and the substrate 100 is held by the pin member 16. Then, for example, a rotation speed of 100
The substrate 100 is rotated at about 0 rpm, pure water is supplied from the pure water discharge nozzle 38 for cleaning (see FIG. 1) to the substrate 100, development is stopped, and a rinsing process is performed with pure water.

Finally, the supply of pure water by the pure water discharge nozzle 38 is stopped, the substrate 100 is rotated at, for example, 4000 rpm, the pure water is shaken off from the substrate 100, and the substrate 100 is dried. After that, the rotation of the substrate 100 is stopped, and the developing process ends.

As described above, in the developing device of this embodiment, when the substrate 100 is released, the pin member 1 of the rotary holding pin 15
6 is set at a position lower than the surface of the substrate 100. Therefore, in the developing solution supply step, the state of the developing solution in which the holding pin 16 flows in a band shape from the slit-shaped discharge port 39 does not influence. Therefore, the discharge state of the developing solution is stable, and the developing solution is uniformly supplied to the entire surface of the substrate.

Further, even when the developing solution discharge nozzle 37 is scanned close to the surface of the substrate 100, the moving developing solution discharge nozzle 37 does not interfere with the holding pins 16 of the rotary holding pins 15.

Further, the pin member 1 of the rotary holding pin 15
6 has an inverted triangular pyramid shape, the outer peripheral surface of the pin member 16 abuts the outer peripheral end of the substrate 100 almost perpendicularly,
Can be held more reliably.

[Brief description of the drawings]

FIG. 1 is a plan view of a developing device according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of a main part of the developing device of FIG.

FIG. 3 is a sectional view taken along line YY of a main part of the developing device of FIG.

FIG. 4 is a plan view of a substrate holding unit of the developing device of FIG. 1;

FIG. 5 is a view showing a slit-shaped discharge port of a developer discharge nozzle.

FIG. 6 is a sectional view taken along line XX in FIG. 4;

FIG. 7 is an exploded perspective view of a rotary holding pin of the developing device of FIG.

FIG. 8 is a view for explaining the operation of the developing device of FIG. 1;

FIG. 9 is a plan view showing scanning of a developing solution discharge nozzle on a substrate.

FIG. 10 is a schematic sectional view of a conventional developing device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate holding part 11 Spin base 11b Outer inclined part 15 Rotary holding pin 16 Pin member 17 Pin support part 20 Bearing 37 Developer discharge nozzle 39 Slit discharge port

Claims (4)

[Claims] 1. A substrate processing apparatus for performing a predetermined processing on a substrate by supplying a processing liquid onto the substrate, comprising: a base member on which the substrate is mounted; and an outer periphery of the substrate mounted on the base member. A plurality of holding members that are disposed along the portion and regulate a position of the substrate; and a processing liquid discharge nozzle that discharges a processing liquid to the substrate placed on the base member; Each of: a support portion rotatably provided around an axis inclined outward on the base member; and the support portion so as to abut against an outer peripheral end of the substrate with the rotation of the support portion. And a holding part provided on the support part eccentrically with respect to the rotation axis of the substrate processing apparatus. 2. The substrate processing apparatus according to claim 1, wherein the holding unit has an inverted truncated cone shape. 3. The height of the holding portion such that the upper end of the holding portion is lowered to a position lower than the substrate when the holding portion is separated from the outer peripheral end of the substrate with the rotation of the support portion. The substrate processing apparatus according to claim 1, wherein the value is set. 4. The processing liquid discharge nozzle has a slit-shaped discharge port, and when the holding portion of each holding member is separated from an outer peripheral end of a substrate mounted on the base member, Moving means for moving the processing liquid discharge nozzle from a position on one side outside the substrate placed on the base member to a position on the other side outside the substrate by passing above the substrate is further provided. The substrate processing apparatus according to claim 1.