JP2000068223A5 - - Google Patents

Download PDF

Info

Publication number
JP2000068223A5
JP2000068223A5 JP1999229157A JP22915799A JP2000068223A5 JP 2000068223 A5 JP2000068223 A5 JP 2000068223A5 JP 1999229157 A JP1999229157 A JP 1999229157A JP 22915799 A JP22915799 A JP 22915799A JP 2000068223 A5 JP2000068223 A5 JP 2000068223A5
Authority
JP
Japan
Prior art keywords
temperature
reflector
radiant heating
radiant
energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999229157A
Other languages
English (en)
Japanese (ja)
Other versions
JP4565365B2 (ja
JP2000068223A (ja
Filing date
Publication date
Priority claimed from US09/134,865 external-priority patent/US6023555A/en
Application filed filed Critical
Publication of JP2000068223A publication Critical patent/JP2000068223A/ja
Publication of JP2000068223A5 publication Critical patent/JP2000068223A5/ja
Application granted granted Critical
Publication of JP4565365B2 publication Critical patent/JP4565365B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP22915799A 1998-08-17 1999-08-13 放射加熱装置及びその方法 Expired - Fee Related JP4565365B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/134,865 US6023555A (en) 1998-08-17 1998-08-17 Radiant heating apparatus and method
US134865 1998-08-17

Publications (3)

Publication Number Publication Date
JP2000068223A JP2000068223A (ja) 2000-03-03
JP2000068223A5 true JP2000068223A5 (enExample) 2006-07-20
JP4565365B2 JP4565365B2 (ja) 2010-10-20

Family

ID=22465368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22915799A Expired - Fee Related JP4565365B2 (ja) 1998-08-17 1999-08-13 放射加熱装置及びその方法

Country Status (3)

Country Link
US (1) US6023555A (enExample)
EP (1) EP0981153A3 (enExample)
JP (1) JP4565365B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771895B2 (en) * 1999-01-06 2004-08-03 Mattson Technology, Inc. Heating device for heating semiconductor wafers in thermal processing chambers
US6294394B1 (en) * 1999-07-01 2001-09-25 Voyan Technology Ramp rate limiter to control stress during ramping
US6947665B2 (en) * 2003-02-10 2005-09-20 Axcelis Technologies, Inc. Radiant heating source with reflective cavity spanning at least two heating elements
KR100807120B1 (ko) * 2006-11-21 2008-02-27 코닉시스템 주식회사 급속열처리 장치
JP5077198B2 (ja) 2008-11-13 2012-11-21 ウシオ電機株式会社 光照射装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4640224A (en) * 1985-08-05 1987-02-03 Spectrum Cvd, Inc. CVD heat source
US5158644A (en) * 1986-12-19 1992-10-27 Applied Materials, Inc. Reactor chamber self-cleaning process
US4891499A (en) * 1988-09-09 1990-01-02 Texas Instruments Incorporated Method and apparatus for real-time wafer temperature uniformity control and slip-free heating in lamp heated single-wafer rapid thermal processing systems
JPH0693440B2 (ja) * 1990-01-19 1994-11-16 ジー スクウェアード セミコンダクター コーポレイション 急速加熱装置及び方法
US5155336A (en) * 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5179677A (en) * 1990-08-16 1993-01-12 Applied Materials, Inc. Apparatus and method for substrate heating utilizing various infrared means to achieve uniform intensity
US5436172A (en) * 1991-05-20 1995-07-25 Texas Instruments Incorporated Real-time multi-zone semiconductor wafer temperature and process uniformity control system
CA2081055C (en) * 1991-11-05 1999-12-21 John R. Eppeland Method and apparatus for heat treatment of metal parts utilizing infrared radiation
US5418885A (en) * 1992-12-29 1995-05-23 North Carolina State University Three-zone rapid thermal processing system utilizing wafer edge heating means
US5504831A (en) * 1993-11-10 1996-04-02 Micron Semiconductor, Inc. System for compensating against wafer edge heat loss in rapid thermal processing
US5561612A (en) * 1994-05-18 1996-10-01 Micron Technology, Inc. Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine
US5740314A (en) * 1995-08-25 1998-04-14 Edison Welding Institute IR heating lamp array with reflectors modified by removal of segments thereof
JP3972379B2 (ja) * 1995-12-14 2007-09-05 信越半導体株式会社 加熱炉
EP1136590A3 (en) * 1996-05-21 2002-01-02 Applied Materials, Inc. Apparatus and method for controlling the temperature of a wall of a reaction chamber

Similar Documents

Publication Publication Date Title
US4493977A (en) Method for heating semiconductor wafers by a light-radiant heating furnace
US7912359B2 (en) Heating device of the light irradiation type
JPH05114571A (ja) 照射による半導体ウエーハの急速熱処理方法
KR20040028647A (ko) 개선된 급속 열처리 챔버용 램프헤드
CN100394544C (zh) 发光型热处理设备
TWI567857B (zh) 基板處理用加熱裝置及含有該加熱裝置的基板液處理裝置
JPH0845863A (ja) 半導体基板の枚葉式熱処理装置
TW201903903A (zh) 熱處理方法
JP2000068223A5 (enExample)
US7038173B2 (en) Thermal processing apparatus and thermal processing method
JP3531567B2 (ja) 閃光照射加熱装置
TWI741226B (zh) 熱處理方法
JP4565365B2 (ja) 放射加熱装置及びその方法
JP2008042127A (ja) 熱処理装置および熱処理用サセプタ
JP3789366B2 (ja) 熱処理装置
JPH0234164B2 (enExample)
KR100291568B1 (ko) 디스크형정보저장매체를코팅시키는장치
JP2515883B2 (ja) 半導体装置製造用ランプアニ―ル装置
JP3609380B2 (ja) 熱処理装置
JPH0420253B2 (enExample)
US4540911A (en) Halogen lamp unit
KR100807120B1 (ko) 급속열처리 장치
JP2002075899A (ja) 円形状平板試料の均熱装置
JPH11121391A (ja) 半導体ウェーハの熱処理装置および半導体ウェーハの熱処理方法
JPH04206141A (ja) ランプ加熱装置