JP2000061767A - Pallet for ingot carriage and wafer manufacturing system using pallet for ingot carriage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pallet for ingot carriage capable of carrying ingot of different shapes and a wafer manufacturing system using the pallet for ingot carriage. SOLUTION: An ingot support base 14 and a mounting plate support base 16 are installed and constituted on a pallet main body 12. Single ingot In is carried in a state where it is placed on the ingot support base 14. Additionally, the ingot In in a state where it is adhered to a mounting plate M or slide wafer is carried in a state where it is suspended by the mounting plate M by installing both end parts of the mounting plate M on the mounting plate support base 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ingot transfer pallet and a wafer manufacturing system using the ingot transfer pallet, and particularly to an ingot alone, an ingot adhered to a mounting plate, and a state adhered to a mounting plate. The present invention relates to an ingot transfer pallet for transferring the sliced wafers, and a wafer manufacturing system using the ingot transfer pallet.

[0002]

2. Description of the Related Art In a wafer manufacturing system using a wire saw, wafers are manufactured according to the following process flow. First, the ingot stored in the ingot stocker is conveyed to the ingot mount device, and the mounting plate is adhered to the ingot. Next, the ingot to which the mounting plate is attached is conveyed to a wire saw and cut into a large number of wafers. Next, the sliced wafers cut by the wire saw are conveyed to a peeling / cleaning apparatus, and the sliced wafers are peeled from the slice base one by one to be separated into single wafers, which are then cleaned and stored in a cassette.

The above is the flow of a series of processes in the wafer manufacturing system using the wire saw. By the way, in this wafer manufacturing system, the operator manually carries the ingot between the respective devices.
At this time, the operator tries to carry the ingot by using a dedicated carrying means, but there is a disadvantage that the same carrying means cannot be used because the ingot forms are different between the respective devices. .

That is, when the ingot is transported from the ingot stocker to the ingot mount device, the ingot has a columnar shape, so that the ingot cannot be placed on the transport carriage as it is. Therefore, the ingot is wrapped with cloth or the like. It is designed to be hung on a carrier. On the other hand, when transferring the ingot from the ingot mount device to the wire saw, or when transferring the sliced wafer from the wire saw to the peeling / cleaning device,
Since the mounting plate is adhered to the ingot or the sliced wafer, the mounting plate portion is placed on a carrier truck and transported.

[0005]

However, if the ingot is transferred between the respective devices by using the individual transfer means as described above, there is a drawback that the equipment cost is increased. Further, a system in which an operator manually conveys an ingot has a drawback that a wafer cannot be efficiently manufactured.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an ingot transfer pallet capable of transferring ingots of different forms and a wafer manufacturing system using the ingot transfer pallet. To aim.

[0007]

The invention according to claim 1 is
In order to achieve the above purpose, ingot transport pallet for transporting the ingot alone, the ingot adhered to the mounting plate and the sliced wafer adhered to the mounting plate, respectively, in the pallet body and the pallet body, Is provided,
By placing the single ingot, the ingot support for horizontally supporting the single ingot and the ingot support are arranged so as to sandwich the ingot, and both ends of the mounting plate are placed. , A pair of mounting plate support members that support the ingot or the sliced wafer in a state of being suspended above the ingot support base.

According to the present invention, a single ingot is transported while being placed on the ingot support base. Also,
The sliced wafer in the state of being adhered to the mounting plate and the state of being adhered to the mounting plate is placed on both ends of the mounting plate on the pair of mounting plate supporting members, so that the ingot or the sliced wafer is It is supported and transported while suspended.

In order to achieve the above-mentioned object, the invention according to claim 10 is an ingot stock device in which a large number of ingots are stocked, and an ingot mount device for adhering a mounting plate to the ingot via a slice base, A wire saw cutting device that presses the ingot adhered to the mounting plate against the traveling wire row to cut into a large number of wafers, and a peeling / cleaning process that peels the sliced wafer cut by the wire saw cutting device from the slice base. A cleaning device, a single ingot stocked in the ingot stock device, an ingot to which a mounting plate is adhered by the ingot mount device, and a sliced wafer cut by the wire saw cutting device are respectively conveyed. A pallet for transferring ingots, and a carrier for moving the pallets for transferring ingots between the respective devices to transfer the pallets for transferring ingots between the respective devices, and the single ingot stocked in the ingot stock device is transferred into the ingot. Placed on a pallet for transporting, the pallet for transporting the ingot is transported to the ingot mount device by the transport carriage, and the mounting plate is bonded to the single ingot by the ingot mount device via the slice base, and is bonded to the mounting plate. Place the ingot again on the pallet for ingot transport, transport the pallet for ingot transport to the wire saw cutting device by the transport carriage, and cut the ingot adhered to the mounting plate into a large number of wafers by the wire saw cutting device. And the A sliced wafer cut by an ear saw cutting device is placed on the ingot transfer pallet, the ingot transfer pallet is transferred to the peeling / cleaning device by the transfer carriage, and the sliced wafer is sliced by the peeling / cleaning device. It is characterized by being peeled off from the base and washed.

According to the present invention, the ingot transfer pallet according to claim 1 is used to transfer the ingot between the respective devices of the wafer manufacturing system. That is, a single ingot is placed on an ingot transport pallet and is transported by a transport vehicle from the stock to the ingot mount device to the ingot stock device. Further, the ingot to which the mounting plate is adhered is placed on an ingot transport pallet and is transported by the transport carriage from the ingot mount device to the wire saw cutting device. Further, the sliced wafer cut by the wire saw cutting device is placed on an ingot transfer pallet and transferred to a peeling / cleaning device by a transfer carriage.
As described above, by using the ingot transfer pallet according to the first aspect, the transfer means can be shared.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an ingot carrying pallet and a wafer manufacturing system using the ingot carrying pallet according to the present invention will be described below in detail with reference to the accompanying drawings. 1, 2, and 3 are a front view, a side view, and a plan view, respectively, of an embodiment of an ingot carrying pallet according to the present invention.

As shown in the figure, the ingot carrying pallet 10 of this embodiment has a pallet body 12 formed in a rectangular shape, and a single ingot In is supported on the pallet body 12. Ingot support 14
And a mounting plate support 16 for supporting the mounting plate M is installed and configured. The ingot support base 14 is arranged at the center of the pallet body 12 and is composed of a base portion 14A, legs 14B and 14B, and ingot support portions 14C and 14C. The base portion 14A is formed in a rectangular plate shape,
It is fixed to the pallet body 12. Legs 14B,
14B are erected vertically on both sides of the base portion 14A. The ingot support portions 14C and 14C are the leg portions 14B,
It is formed by bending the upper end of 14B outward by a predetermined angle, and is formed so as to form a V shape as a whole. The ingot In is placed on the ingot support portions 14C and 14C.

The ingot support base 14 is made of metal such as SUS. The ingot support parts 14C and 14C on which the ingot In is placed have resin plates 14D and 14D made of resin such as silicon on their upper surfaces. It is attached so that the ingot In does not directly contact the metal part. The mounting plate support base 16 is composed of a pair of ingot support brackets 16A, 16A arranged symmetrically with respect to the ingot support base 14. This pair of ingot support brackets 1
As shown in FIG. 2, 6A and 16A are each composed of a pair of plate members 16a and 16a, and the plate members 16a and 16a are erected vertically on the pallet body 12 with a predetermined interval. ing.

Also, a pair of mounting plate support fittings 16B and 16B are fixed to the pair of ingot support brackets 16A and 16A on the plate members 16a and 16a, respectively. By mounting both ends of the mounting plate M on the metal fittings 16B and 16B, the mounting plate M is horizontally supported.

By the way, the mounting plate M supported by the mounting plate support 16 has recesses Ma, Ma, ... As shown in FIG. 4, the mounting plate M of the recesses Ma, Ma, ...
When mounted on 6B, 16B, ..., The mounting plate support fittings 16B, 16B, ... Are fitted to position the mounting plate M at a predetermined position.

Further, the pair of ingot support brackets 16A, 16A are mutually provided with three ribs 16C, 16A.
Connected by C and 16C, the rigidity of the whole stand is enhanced. In addition, these three ribs 16C, 16C, 16
C is a wafer W that has dropped from the slice base S at the same time.
Are prevented from being discharged from the pallet body 12. That is, the wafer W dropped from the slice base S is
The ribs 16C, 16C and 16C receive the ribs on the ingot support base 14 and restrict the lateral movement thereof. This prevents the wafer W from being discharged from the outside of the pallet body 12.

The three ribs 16C, 16C, 1
The peripheral surface of 6C is covered with a cover made of resin such as silicon, so that even if the wafer W comes into contact with it, chipping or the like does not occur. The configuration of the main part of the ingot transport pallet 10 of the present embodiment is as described above.

By the way, the ingot transfer pallet 10 can be placed on a transfer device and transferred. In this case, it is necessary to allow the ingot transfer pallet 10 to be transferred in a stable state. Therefore, the pallet body 12 is provided with a pair of locating members 20, 20 for the carrier. Locating members 20, 20 for the carrier
Are provided with locating holes 20A, 20A for the transporting machine, into which the locating pins provided in the transporting machine can be inserted. When the ingot transporting pallet 10 is placed on the transporting machine, the locating holes for the transporting machine are used. The locating pin is inserted into 20, 20 and placed on the carrier.

Thus, the ingot transfer pallet 1
No. 0 is positioned at a predetermined position on the carrier and its movement in the horizontal direction is restricted, so that the carrier can be carried in a stable state. When the ingot In is carried in and out of the ingot carrying pallet 10 by using a carrying in / out machine instead of the operator, the ingot carrying pallet 1
It is necessary that 0 is positioned at a predetermined position with respect to the carry-in / carry-out device.

For this reason, the pair of positioning members 22, 2 are provided on the pair of mounting plate support brackets 16A, 16A constituting the mounting plate support base 16.
Two are provided. This pair of positioning members 22, 2
Reference numeral 2 has locating holes 22A, 22A for the unloading machine into which the locating pin provided in the unloading machine is inserted,
When carrying in and out the ingot In using the carry-in / carry-out machine,
The locate pin of the carry-in / carry-out machine is inserted into the carry-in / carry-out machine locate holes 22A, 22A.

As a result, the ingot transfer pallet 1
0 is positioned at a predetermined position with respect to the carry-in / carry-out device, and horizontal movement is restricted. In addition, the locating pin has a tapered tip, and the locating hole 22 for the loading / unloading machine
By making the shapes of A and 22A also tapered, the locating pin can be easily inserted and the positioning is facilitated.

The operation of the ingot transfer pallet 10 of the present embodiment configured as described above is as follows.
When supporting a single ingot In, as shown in FIG. 5, the ingot In is placed and supported on the ingot support base 14. At this time, the ingot In has a pair of ingot support portions 14C, 14 arranged to form a V shape.
Since it is supported by C, ingots of various diameters can be supported in a stable state.

When supporting the ingot In in a state of being adhered to the mounting plate M, as shown in FIGS. 1 and 2 (shown by a two-dot chain line), the mounting plate M is mounted on the mounting plate support 16 as shown in FIG.
Place on top of and support. At this time, the mounting plate M has recesses Ma, M formed at the corners of both ends thereof.
a, ... are mounting plate support fittings 16B, 16
.. so as to fit on the mounting plate support fittings 16B, 16B ,. As a result, the mounting plate M is positioned at a predetermined position, its movement in the horizontal direction is restricted, and it can be supported in a stable state.

The same applies to the case where a wafer adhered to the mounting plate M (hereinafter referred to as "sliced wafer SW") is supported. As shown in FIG. 6, the mounting plate M is supported by the mounting plate M. It is placed on and supported by the table 16. In this case, even if the wafer W is dropped from the mounting plate M, the dropped wafer W is received by the ingot support base 14 and its lateral movement is restricted by the rib 16C, so that the pallet is moved. It will not be released from the body 12.

As described above, in the ingot transfer pallet 10 of this embodiment, the single ingot In, the ingot In adhered to the mounting plate M, and the sliced wafer SW adhered to the mounting plate M are included. Each can be supported. Therefore, the ingot transfer pallet 1 of the present embodiment
If 0 is used as the transfer means of the wafer manufacturing system,
It is possible to share the ingot transporting means between the respective devices.

In addition, in the ingot carrying pallet 10 of the present embodiment, the operator may carry in and out the ingot In, or the ingot carrying-in / out machine 1 as shown in FIG. 7 may be used. The ingot carrying-in / out machine 1 includes a traveling body 3 traveling on a guide rail 2, a slide body 4 provided on the traveling body 3 and movable up and down.
It comprises an ingot chuck device 5 provided at the lower end of the slide body 4. The ingot chuck device 5 includes a chuck device body 6 and a pair of gripping claws 7, 7 movably provided on the chuck device body 6.
By holding both ends of the ingot In with the pair of gripping claws 7, 7, the ingot In is chucked and the ingot In is carried in and out. Similarly, by gripping both ends of the mounting plate M with the pair of gripping claws 7, 7, the mounting plate M is chucked and the ingot In and the sliced wafer SW are carried in and out.

Further, since the slurry supplied at the time of cutting adheres to the surface of the sliced wafer SW immediately after being cut by the wire saw, the slurry is dripped and accumulated on the pallet body 12. Therefore, as shown in FIG. 8, a drainage hole 24 may be formed in the pallet body 12 and the slurry accumulated through the drainage hole 24 may be discharged. The drain hole 24 may be opened at all times, or may be closed by the cap 26 when not in use, as shown at the same time.

However, when the slurry dropped from the sliced wafer SW is directly recovered by the pallet body 12 as described above, there is a drawback that the pallet body 12 becomes dirty. Therefore, as shown in FIG. 8, a dedicated slurry tray 28 may be mounted on the ingot support base 14 and the slurry may be collected by the slurry tray 28. The bottom of this slurry tray 28 is formed in a V shape, and its inclined surfaces 28A, 28A are set at the same inclination angle as the ingot support portions 14C, 14C of the ingot support base 14. Therefore, when it is mounted on the ingot support base 14, it can be fixed simply by placing the inclined surfaces 28A, 28A on the ingot support parts 14C, 14C of the ingot support base 14, so that it can be easily mounted,
Can be removed.

In addition, in the above-described embodiment, one ingot support base 14 and one mounting plate support base 16 are provided.
A plurality of ingot support bases 14 and a plurality of mounting plate support bases 16 are arranged on the upper surface of the plurality of ingot I supports.
n or the sliced wafer SW may be supported. As a result, a large number of ingots In or sliced wafers SW can be transported at one time.

Since each ingot In has unique data such as its length, diameter, crystal orientation, thickness to be sliced, and number of sheets, this ingot-specific data can be recorded in the ingot transport pallet 10. You may do it. For example, as shown in Fig. 2, ingot-specific data is encoded by a bar code,
The ingot-specific data may be recorded on the ingot transport pallet 10 by holding the plate 30 on which the barcode is printed on the barcode holder 32 provided on the mounting plate support bracket 16A. In this case, each device in the wafer manufacturing system uses the ingot transfer pallet 10
The bar code recorded in is read by the bar code reader, and each process is performed based on the read data. As a result, it becomes possible to manufacture wafers in a fully automatic manner without requiring any manpower.

The means for recording the ingot data is not limited to the bar code, but it may be recorded on an IC or the like. Further, in the ingot transfer pallet 10 of the present embodiment, by inserting the locate pin provided in the carry-in / out machine into the carry-in / out machine locate holes 22A, 22A formed in the positioning members 22, 22, the ingot carry is carried. The pallet 10 is configured to be positioned at a predetermined position with respect to the carry-in / out machine, but the configuration of the positioning members 22, 22 is not limited to this. For example, a plurality of guide rollers may be arranged on a concentric circle at equal intervals, and a locate pin may be inserted into the center of the guide rollers so that the guide rollers regulate the movement of the locate pin to position the guide rollers.

Next, a wafer manufacturing system using the ingot transfer pallet 10 of the present embodiment will be described. FIG. 9 is an overall configuration diagram of the wafer manufacturing system of the present embodiment. As shown in the figure, the wafer manufacturing system 100 according to the present embodiment includes an ingot stocker 110, an ingot mounter 120, and a wire saw 14.
0A, 140B, a peeling / cleaning device 160, and an ingot carrier 180.

The ingot stocker 110 is a device for stocking ingots In to be cut by the wire saws 140A and 140B, and as shown in FIG. 10, an ingot storage rack 112 having a large number of ingot storage chambers 112a, 112a ,. The self-propelled carriage 126 that takes out the ingot In stored in the ingot storage rack 112 and conveys the ingot In onto the predetermined cargo receiving base 114.

The ingot In is stored in the ingot storage rack 112 while being supported by the ingot transport pallet 10 described above. The ingot mounter 120 is a device that adheres the mounting plate M to the ingot In via the slice base S. The ingot mounter 120 is of a type in which the mounting plate M is simply attached to the peripheral surface of the ingot In via the slice base S regardless of the crystal orientation of the ingot In, and the type of the ingot In based on the crystal orientation of the ingot In. There is a type in which a mounting plate M is adhered to the peripheral surface via a slice base S.

The ingot mounter 120 of the type in which the mounting plate M is adhered based on the crystal orientation of the ingot In adheres the mounting plate M to the ingot In as follows. As shown in FIG. 12, first, the ingot In carried in the carry-in / out section 121
Transfer device 122 for measuring and conveying device 12
4 above. Then, it is conveyed to a predetermined crystal orientation measuring position by the measuring and conveying device 124.

Next, the crystal orientation of the ingot In conveyed to the crystal orientation measuring position is measured by the crystal orientation measuring device 126. Next, the ingot In is transferred to the measuring conveyance device 1
It is conveyed by 24 to a predetermined slice base bonding position. Then, the ingot In is rotated around the ingot axis by a predetermined angle based on the measurement result of the crystal orientation, and the crystal axis of the ingot In is positioned on the horizontal plane. The rotation around the ingot axis is given by the measuring transport device 124.

Next, the slice base S is adhered to the peripheral surface of the ingot In by the slice base adhering device 128 with the crystal axis of the ingot In being located on the horizontal plane. Next, the ingot I to which the slice base S is adhered
n is conveyed by the transfer device 122 onto the mounting plate adhering conveying device 130, and is conveyed to a predetermined mounting plate adhering position by the mounting plate adhering conveying device 130. And
The mounting plate M is tilted in a horizontal direction at a predetermined angle so as to be parallel to the crystal axis of the ingot In, and in this state, the mounting plate M is bonded to the slice base S by the mounting plate bonding device 132.

The ingot In to which the mounting plate M is adhered is carried to the carry-in / carry-out section 121 by the transfer device 122. When the mounting plate M is adhered to the ingot In as described above, it becomes unnecessary to adjust the crystal orientation again when cutting with the wire saws 140A and 140B. In this regard, regardless of the crystal orientation of the ingot In, the ingot In in which the mounting plate M is simply bonded via the slice base S
After being mounted on the work table of the wire saw, it is necessary to position it so that it is cut in a predetermined crystal orientation by a chilling device provided on the work table.

The wire saws 140A, 140B press the ingot In against the wire train 142 traveling at a high speed and supply the slurry to the contact portion between the ingot In and the wire train 142, so that the ingot In is formed into a large number of wafers. It is a device that cuts at the same time. Ingot I
The wire row 142 for cutting n is, as shown in FIG.
The wire 144 is connected to three groove rollers 146, 146,
It is formed by winding it around 146. And the wire 14
4 is supplied from the supply-side wire reel 148, and is wound on a winding-side wire reel (not shown) to run at high speed.

The ingot In is mounted on the work table 150 installed above the wire row 142, and the work table 150 is lowered toward the wire row 142 to be pressed against the wire row 142. Wire row 142
Slurry is supplied from a nozzle (not shown) to the contact portion between the ingot In and the ingot In, and the ingot In is simultaneously cut into a large number of wafers by the lapping action of this slurry.

By the way, wire saws 140A, 140B
All the wafers cut in step 1 are in a state of being bonded to the slice base S. Therefore, first, this wire saw 1
Sliced wafer SW cut by 40A, 140B
Need to be separated from the slice base S to be single-wafered. The sliced wafer SW immediately after being cut by the wire saws 140A and 140B has the slurry supplied at the time of cutting attached to the surface thereof. Therefore, the wafer W separated from the slice base S needs to be cleaned.

The peeling / cleaning device 160 is a sliced wafer S cut by the wire saws 140A and 140B.
It is an apparatus for separating W from the slice base S to form a single wafer, cleaning it, and then storing it in a cassette. Wire saw 140
The sliced wafer SW cut by A and 140B is
First, it is set in the carry-in section (not shown). Next, as shown in FIG. 13, the slurry is conveyed to the rough cleaning section 162 and is shower-cleaned there, whereby the slurry adhering to the surface is roughly cleaned.

Next, the sliced wafers SW are conveyed to the wafer peeling sheet unit 164, where they are peeled from the slice base S one by one. In the peeling method here, the portion of the slice base S to which the sliced wafer SW is bonded is immersed in hot water, and in this state, the end face of the wafer W is suction-held by a suction pad to give a swing. .
Since the bonded portion between the wafer W and the slice base S is thermally softened by immersing it in hot water, it can be easily peeled off by shaking.

The wafer W separated from the slice base S is transferred to the conveyor 166 and is conveyed to the cleaning section 168 by the conveyor 166. Then, the cleaning unit 168 performs brush cleaning. The wafer W cleaned by the cleaning unit 168 is transferred to the recovery stage 170, and then the wafer W is recovered by the recovery robot 172.
The sheets are stored one by one in the cassettes set at 4, 174.

The ingot carrier 180 is self-propelled along the carrier path 182 shown in FIG. 9 and carries the ingot In between the devices. This ingot carrier 180 is
As shown in FIG. 14, a placing portion 184 of the ingot conveying pallet 10 is formed on the upper portion thereof, and the ingot conveying pallet 10 is set on the placing portion 184 and conveyed.

The placing pin 184 is attached to the mounting portion 184.
6 and 186 are provided, and when the ingot transfer pallet 10 is set on the mounting portion 184, the locate pins 186 and 186 are fitted into the transfer device locate holes 20A and 20A formed in the ingot transfer pallet 10. Put in. As a result, the ingot transfer pallet 10 can always be positioned at a fixed position.

The operation of the wafer manufacturing system 100 of the present embodiment configured as described above is as follows. First, the self-propelled carriage 116 takes out the ingot In stored in the predetermined ingot storage chamber 112a of the ingot stocker 110. Here, since the taken out ingot In is already supported by the ingot carrying pallet 10, the operator directly holds the ingot carrying pallet 10 by the ingot carrying machine 180.
Set on top.

Next, the ingot transporting machine 180 is used to load the ingot transporting pallet 10 into the ingot mounter 1.
Transport to 20. Then, the operator takes out the ingot In from the ingot transport pallet 10 and sets it in the carry-in / out section 121 of the ingot mounter 120.
The crystal orientation of the ingot In set in the carry-in / out section 121 is automatically measured, and the mounting plate M is bonded via the slice base S based on the measurement result.

Since the ingot In having the mounting plate M adhered thereto is conveyed to the carry-in / carry-out section 121, the operator takes out the ingot In having the mounting plate M adhered from the carry-in / carry-out section 121 and places it again on the ingot carrying pallet 10. Place it. At this time, since the mounting plate M is adhered to the ingot In, by mounting both ends of the mounting plate M on the mounting plate support 16, the ingot In is transferred to the ingot transfer pallet 1.
0 support. At this time, the ingot In is supported by being suspended from the mounting plate M.

Next, the operator sets the ingot transfer pallet 10 on the ingot transfer machine 180. Then, the ingot transfer machine 180 transfers the ingot transfer pallet 10 to the wire saws 140A and 140B. Here, since two wire saws are installed, the wire saw is transported to the wire saw that has not been cut.
Here, it is conveyed to the wire saw 140A on the right side in FIG.

When the ingot transfer pallet 10 is transferred to the wire saw 140A, the operator takes out the ingot In from the ingot transfer pallet 10 and mounts the ingot In on the work table 150 of the wire saw 140A. At this time, the ingot In is mounted on the work table 150 by supporting the part of the mounting plate M on the work table 150.

The ingot In mounted on the work table 150 is cut into a large number of wafers at the same time by being supplied with the slurry while being pressed against the traveling wire array 142. When the cutting by the wire saw 140A is completed, the operator removes the sliced wafer SW from the work table 150 and places it on the ingot transfer pallet 10 again.

At this time, since the sliced wafer SW is adhered to the mounting plate M, both ends of the mounting plate M are placed on the mounting plate support 16 so that the sliced wafer SW is It is supported on the ingot transfer pallet 10. At this time, the sliced wafer SW is supported by being suspended from the mounting plate M.

Here, since the slurry has adhered to the sliced wafer SW immediately after being cut by the wire saw 140A, in order to collect the slurry dropped from the sliced wafer SW, the ingot transfer pallet 10 is collected.
A slurry tray 28 is mounted on the ingot support base 14 in advance, and the slurry is collected by the slurry tray 28.

Next, the operator sets the ingot transfer pallet 10 on the ingot transfer machine 180. Then, the ingot transfer pallet 10 is transferred to the peeling / cleaning device 160 by the ingot transfer device 180. Ingot transfer pallet 10 is a peeling / cleaning device 1
When transported to 60, the operator takes out the sliced wafer SW from the ingot transport pallet 10,
It is set in the carry-in section of the peeling / cleaning device 160. The sliced wafers SW set in the carry-in section are roughly cleaned, and then separated from the slice base S one by one to be separated into individual sheets. Then, the separated wafers are cleaned precisely with a brush and then stored and collected one by one in a cassette.

The above is a series of wafer manufacturing steps in the wafer manufacturing system 100 of the present embodiment. The ingot transfer pallet 10 that has transferred the sliced wafer SW to the peeling / cleaning device 160 is transferred to the ingot stocker 110 by the ingot transfer device 180 and returned to the original ingot storage chamber 112a. As described above, according to the wafer manufacturing system 100 of the present embodiment, it is possible to reduce the equipment cost by sharing the transportation means of the ingot In or the sliced wafer SW between the respective devices. Further, by making the pallet 10 for ingot transportation common, it becomes possible to easily manage the pallet and reduce the number of maintenance and inspection steps.

In the present embodiment, the operator takes out the ingot In or the sliced wafer SW from the ingot transfer pallet 10 and sets it in each device.
An n or sliced wafer SW carry-in / out machine may be provided and automatically set. As a result, the wafer manufacturing line can be automated.

At this time, the data unique to the ingot is coded by a bar code, and the plate 30 on which the bar code is printed is held by the bar code holder 32. And
Each device of the wafer manufacturing system 100 is provided with a bar code reader for reading the bar code, and the ingot In and the sliced wafer SW are processed based on the data read by the bar code reader. As a result, erroneous cutting and transmission of erroneous data to the next process can be prevented, and a highly accurate wafer can be automatically manufactured.

In the present embodiment, the ingot In
Are stocked in the ingot stocker 110 while being previously supported by the ingot transport pallet 10, but only the ingot In is stored in the ingot stocker 110.
It may be stocked in advance and placed on the ingot transfer pallet 10 for transfer. In this case, if there is at least one ingot transfer pallet 10, the ingot In can be transferred.

Further, in the above-described wafer manufacturing system 100 of the present embodiment, one ingot carrier 180 is used.
Although the ingot transfer pallet 10 is transferred by the above method, it may be transferred by using a plurality of ingot transfer machines 180. Also, as shown in FIG.
Ingot Stocker 110-Ingot Mounter 1
Between 20 and ingot mounter 120-wire saw 1
Ingot transfer pallet 10A used between 40A and 140B, and ingot transfer pallet 10B used between wire saws 140A and 140B and peeling / cleaning device 160.
By separately using the ingots, it is possible to effectively prevent the ingot In transported on the ingot transport pallet 10A from being contaminated.

That is, the ingot transfer pallet 10
Is contaminated by transporting the sliced wafer SW cut by the wire saws 140A and 140B, and the ingot I is transported using the contaminated ingot transport pallet 10.
The ingot In becomes dirty by transporting n. Therefore, the ingot stocker 110 and the ingot mounter 120 are separately used as described above.
Between and ingot mounter 120-wire saw 140
The ingot In can be transported by the ingot transport pallet 10A that is always clean between A and 140B, and the contamination of the ingot In can be prevented. Further, in this way, even in a device such as the ingot mounter 120 which does not like to be contaminated, the wafer can be manufactured without contaminating the device.

In the figure, an ingot carrier 180A for carrying the ingot carrying pallet 10A.
Although the ingot carrier 180B for carrying the ingot carrying pallet 10B is separate, it may be carried by one ingot carrier 180. Further, as shown in the figure, a pallet cleaning device 190 for cleaning the dirty ingot transport pallet 10 may be incorporated in the wafer manufacturing system 100. By incorporating such a pallet cleaning device 190 into the wafer manufacturing system 100, even in the wafer manufacturing system 100 of the type in which the ingot In is stocked in the ingot stocker 110 while being supported by the ingot transfer pallet 10 in advance. The transfer pallet 10 can be returned to the ingot stocker 110 in a cleaned state. As a result, the ingot stocker 1
It is possible to prevent the stain of 10.

By the way, as described above, the wire saw 140
In the wafer manufacturing system 100 using A and 140B, when the wire 144 used in the wire saw 140A and 140B is worn, the wire 144 needs to be replaced together with the wire reel 148. Also, the wire row 142
Even when the groove roller 146 forming the groove is worn, it is necessary to replace the groove roller 146.

Conventionally, when replacing the wire reel, the wire reel stored in the wire reel stocker is carried to a wire saw by a dedicated carrier machine and replaced. The same applies to the case of exchanging the groove roller, and the groove roller stored in the groove roller stocker is conveyed to the wire saw by a dedicated conveying machine and is exchanged.

However, in the above wafer manufacturing system 100, it is extremely useful if the wire reels and groove rollers can be carried by the same ingot carrier 180 as the ingot carrier pallet 10. 16, 17, and 18 are a front view, a side view, and a plan view showing the configuration of a wire reel carrying pallet 200 for carrying the wire reel and the groove roller by using the ingot carrying machine 180.

As shown in the figure, the wire reel carrying pallet 200 is the ingot carrying pallet 1 described above.
It has a pallet body 202 formed in a rectangular shape like 0, and the wire reel 1 is mounted on the pallet body 202.
A guide 204 for the wire reel that supports the groove 48 and a groove roller support base 206 that supports the groove roller 146.
Is installed and configured.

The wire reel guide 204 is formed in a columnar shape having substantially the same diameter as the inner diameter of the wire reel 148, and is erected at substantially the center of the pallet body 202. The wire reel 148 is supported on the pallet body 202 by inserting its inner diameter portion into the wire reel guide 204 and placing it on the pallet body 202.

The groove roller support base 206 includes a pair of groove roller support brackets 204A and 2A arranged in symmetrical positions with the wire reel guide 204 interposed therebetween.
It has 04A. V-shaped holders 204B, 204B, 204B are arranged at three positions on the inner side surfaces of the pair of ingot support brackets 204A, 204A.
By placing the shaft core of the groove roller 146 on 04B, the groove roller 146 is supported on the pallet body 202.

In FIG. 16, the numbers 208 and 20 are used.
Numeral 8 is a locating hole for a carrier, and is numbered 210 and 21.
Reference numeral 0 is a positioning member for carrying in and out. FIG. 19 is an overall configuration diagram of a wafer manufacturing system 220 in which the wire reel and groove rollers are exchanged using the wire reel transfer pallet 200 described above.

As shown in the figure, in the wafer manufacturing system 220, a wire reel stocker 230 and a groove roller stocker 240 are incorporated in the wafer manufacturing system 100 described above. When replacing the wire reel, first, the ingot carrier 180 is moved to the wire reel stocker 230. Then, the wire reel transfer pallet 200 is attached to the ingot transfer machine 180.
Is set, and the wire reel is placed on the wire reel transfer pallet 200. And the ingot carrier 1
The wire reel carrying pallet 200 is carried by 80 to the wire saw 140A.

The operator lowers the wire reel from the wire reel carrying pallet 200 carried to the wire saw 140A and replaces the wire reel. Then, the exchanged wire reel is placed on the wire reel transfer pallet 200 again, and is transferred to the wire reel stocker 230 by the ingot transfer machine 180. When replacing the groove rollers, first, the ingot carrier 180 is moved to the groove roller stocker 240. Next, the wire reel transfer pallet 200 is set on the ingot transfer machine 180, and the wire reel transfer pallet 2 is set.
The groove roller is placed at 00. Then, the pallet 20 for carrying the wire reel is carried out by the ingot carrying machine 180.
0 is conveyed to the wire saw 140A.

The operator lowers the groove roller from the wire reel carrying pallet 200 carried to the wire saw 140A and replaces the groove roller. Then, the replaced groove roller is placed on the wire reel transfer pallet 200 again, and is transferred to the groove roller stocker 240 by the ingot transfer device 180. As described above, by using the wire reel transfer pallet 200 described above, the wire reel and the groove roller can be transferred using the ingot transfer device 180 that transfers the ingot transfer pallet 10.

[0073]

As described above, according to the ingot carrying pallet of the present invention, it is possible to carry different forms of ingots. By using this ingot transfer pallet as the transfer means of the wafer manufacturing system, the transfer means can be made common and the facility cost can be reduced.

[Brief description of drawings]

FIG. 1 is a front view of an ingot transfer pallet.

FIG. 2 is a side view of an ingot transfer pallet.

FIG. 3 is a plan view of a pallet for ingot transportation.

FIG. 4 is an enlarged perspective view of a main part of an ingot transfer pallet.

FIG. 5 is a side sectional view for explaining the action of the ingot transfer pallet.

FIG. 6 is a front sectional view for explaining the operation of the ingot transfer pallet.

FIG. 7 is a front view showing the configuration of an ingot carry-in / out machine.

FIG. 8 is a side sectional view showing the structure of another embodiment of the ingot transport pallet.

FIG. 9 is an overall configuration diagram of a wafer manufacturing system.

FIG. 10 is a perspective view showing the structure of an ingot stocker.

FIG. 11 is a front view showing the structure of an ingot mounter.

FIG. 12 is a perspective view showing the configuration of a wire saw.

FIG. 13 is a plan view showing the configuration of a peeling / cleaning device.

FIG. 14 is a perspective view showing a configuration of an ingot carrier.

FIG. 15 is an overall configuration diagram of another embodiment of a wafer manufacturing system.

FIG. 16 is a front view showing the configuration of a wire reel carrying pallet.

FIG. 17 is a side view showing a configuration of a wire reel carrying pallet.

FIG. 18 is a plan view showing the configuration of a wire reel carrying pallet.

FIG. 19 is an overall configuration diagram of another embodiment of a wafer manufacturing system.

[Explanation of symbols] 10 ... Ingot transport pallet 12 ... Pallet body 14 ... Ingot support 16 ... Mounting plate support 22 ... Positioning member 100 ... Wafer manufacturing system 110 ... Ingot stocker 120 ... Ingot mounter 140A, 140B ... Wire saw 160 ... Peeling / cleaning device In ... Ingot SW ... Sliced wafer M ... Mounting plate S ... Slice base

Claims (12)

[Claims] 1. An ingot transport pallet for transporting a single ingot, an ingot adhered to a mounting plate, and a sliced wafer adhered to a mounting plate, wherein a pallet body and a pallet body are provided, By mounting the single ingot, the ingot support for horizontally supporting the single ingot, the ingot support is arranged so as to sandwich the ingot, by mounting both ends of the mounting plate. ,
An ingot transfer pallet comprising: a pair of mounting plate support members that support the ingot or the sliced wafer in a state of being suspended above the ingot support base. 2. The pallet body includes a plurality of the ingot supports and a plurality of the mounting plate support members, a plurality of single ingots, an ingot adhered to the plurality of mounting plates, and a plurality of mounting plates. The sliced wafer adhered to the substrate can be transported.
Pallet for ingot transportation described. 3. The mounting plate support member is formed with a convex portion that fits into a concave portion formed in the mounting plate, and the concave portion is fitted into the convex portion to mount the mounting plate to the mounting plate. The pallet for ingot transport according to claim 1 or 2, wherein the mounting plate is positioned and supported at a predetermined position by being mounted on a plate support member. 4. The ingot support base comprises a pair of ingot support members arranged horizontally above the pallet body at a predetermined interval, and by placing the single ingot on the ingot support member. , Supporting the ingot.
Pallet for ingot transportation described. 5. The ingot transport pallet according to claim 4, wherein the ingot support member has a contact portion with a placed ingot coated with resin. 6. The pallet for ingot transportation according to claim 1, wherein the pallet body is provided with an openable / closable discharge port for discharging the slurry dropped from the sliced wafer. . 7. The slurry tray for receiving slurry falling from the sliced wafer is detachably attached to the ingot support base.
Alternatively, the pallet for ingot transportation described in 2. 8. A positioning pin is provided on a loading / unloading means for loading / unloading an ingot or a sliced wafer to / from the ingot transport pallet, and a positioning member is provided on the ingot transport pallet to insert the positioning pin. 3. The pallet for ingot transportation according to claim 1, wherein the pallet for ingot transportation is positioned at a predetermined position with respect to the loading / unloading means by inserting a pin into the positioning member. 9. The pallet for carrying an ingot according to claim 1, further comprising recording means for recording information of the ingot to be carried. 10. An ingot stock device in which a large number of ingots are stocked, an ingot mount device for adhering a mounting plate to the ingot via a slice base, and an ingot adhered to the mounting plate is pressed against a traveling wire row. A wire saw cutting device for cutting into a large number of wafers, a peeling / cleaning device for peeling and cleaning a sliced wafer cut by the wire saw cutting device from a slice base, and a single ingot stocked in the ingot stock device, The pallet for ingot transport according to claim 1, which transports an ingot to which a mounting plate is adhered by the ingot mount device and a sliced wafer sliced by the wire saw cutting device, respectively, and is moved between the devices. A transport carriage for transporting the serial ingot conveying pallet between the respective devices, is composed of,
A single ingot stocked in the ingot stock device is placed on the ingot transport pallet, the ingot transport pallet is transported to the ingot mount device by the transport carriage, and the ingot mount device slices the single ingot on the slice base. The mounting plate is adhered via, and the ingot adhered to the mounting plate is placed on the ingot transfer pallet again, and the ingot transfer pallet is transferred to the wire saw cutting device by the transfer carriage, and the wire saw cutting device The ingot adhered to the mounting plate is cut into a large number of wafers, the sliced wafer cut by the wire saw cutting device is placed on the ingot transfer pallet, and the ingot transfer pallet is transferred by the transfer carriage. Wafer fabrication system characterized by serial transported to the peeling and cleaning device, for cleaning by peeling the sliced wafer from the slice base in the release-cleaning device. 11. An ingot stock device in which a large number of ingots are stocked, an ingot mount device for adhering a mounting plate to the ingot via a slice base, and an ingot adhered to the mounting plate is pressed against a traveling wire row. A wire saw cutting device that cuts into a large number of wafers, a sliced wafer cut by the wire saw cutting device is separated from the slice base into single wafers, and a peeling / cleaning device that stores them in a cassette after cleaning, and the ingot stock The first ingot transport pallet according to claim 1, which transports a single ingot stocked in the device and an ingot to which a mounting plate is adhered by the ingot mount device, the ingot stock device, the ingot. A first transfer carriage that moves between a mounting device and the wire saw cutting device to transfer the first ingot transfer pallet between the devices, and a sliced wafer cut by the wire saw cutting device. 2. A second ingot transport pallet according to 1, and a second transport carriage that moves between the wire saw cutting device and the peeling / cleaning device to transport the second ingot transport pallet between the devices. The single ingot stocked in the ingot stock device is placed on the first ingot transfer pallet,
The ingot transfer pallet is transferred to the ingot mount device by the first transfer carriage, the mounting plate is bonded to the single ingot by the ingot mount device via the slice base, and the ingot bonded to the mounting plate is again mounted. The wafer is placed on the first ingot transfer pallet, the first ingot transfer pallet is transferred to the wire saw cutting device by the first transfer carriage, and the ingot bonded to the mounting plate by the wire saw cutting device is a large number of wafers. The sliced wafer cut by the wire saw cutting device is placed on the second ingot transfer pallet, and the second ingot transfer pallet is transferred to the peeling / cleaning device by the second transfer carriage, Remove the sliced wafer with a peeling / cleaning device Wafer fabrication system characterized by washing peeled from rice-based. 12. The ingot transfer pallet comprises a recording unit in which information of an ingot or sliced wafer to be transferred is recorded, and each of the devices is operated based on the information recorded in the recording unit. The wafer manufacturing system according to claim 10 or 11.