JP2000058719A - Semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and the device which can prevent the warping of a semiconductor chip resulting from the difference between the coefficients of thermal expansion of an intermediate and a sealing resin, by obtaining electrical connection reliability and a mechanical strength at the time of electrically connecting the semiconductor chip to a wiring board. SOLUTION: A semiconductor device is provided with a semiconductor chip 2 having an integrated circuit, a wiring board 20 having electrical wiring, an intermediate 1 which is arranged between the board 20 and the chip 2 and electrically connects the chip 2 to the board 20 when the chip 2 is mounted on and electrically connected to the board 20, and a sealing member 80 which protects the wiring portion of the chip 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor device having a semiconductor chip having an integrated circuit and a method of manufacturing the semiconductor device.

[0002]

2. Description of the Related Art Currently, a multi-terminal semiconductor package has a QFP (Q
uad Flat Package) is the mainstream. In recent years, the number of terminals of a semiconductor chip such as an LSI (Large Scale Integrated Circuit) has increased due to a demand for higher performance of electronic devices, and the QFP has to be enlarged. However, at the same time, there is a demand for lighter, thinner and smaller electronic devices, and QFPs cannot meet the contradictory demands. Therefore, in order to realize high-density mounting of a semiconductor chip with a large number of terminals and to realize light-weight and small size, instead of the conventional packaging technology, a CSP (packaging technology) in which the semiconductor chip is almost the same size as the semiconductor chip is used. Chip Size Packag
e) has begun to be adopted. Among them, wire bonding (WB) type CS
P is a method that can realize a CSP while inheriting the conventional packaging technology, and is relatively inexpensive. However, in this method, the wire is exposed, and it is necessary to cover the entire wire with a sealing resin in order to protect the wire. At the same time, CS
Since P aims at a package of the same size as the semiconductor chip, there is a demand that the thickness of the interposer (an intermediate between the semiconductor chip and the motherboard) be as small as possible.

FIG. 7 shows an example of a conventional semiconductor device, in which a WB type CSP 1 is mounted on a wiring board 1000.
002 is electrically connected to the interposer 10
01 is used. Au of WB type CSP1002
The wire 1005 is electrically connected to the wiring electrode 1004. The Au wire 1005 is connected to the wiring electrode 1
004 and the chip electrode 1003 are electrically connected.
In such a case, a sealing resin 1008 is used to protect the Au wires 1005 of the semiconductor chip 1002.

[0004]

However, such a W
When the B-type CSP 1002 is mounted on a wiring board 1000 such as a motherboard, in a heating step such as reflow soldering, the sealing resin 1008 covering the whole and the thin interposer (intermediate) 10
01, the interposer 10
01 generates a stress due to warpage. Interposer 10
Numeral 01 is made of a glass epoxy base material or the like, and if the Young's modulus of the interposer 1001 is low, the CSP 1002 will also be warped, resulting in poor contact at the solder joint. Therefore, the present invention solves the above-mentioned problems, and
When electrically connecting P to a wiring board, it is possible to obtain electrical connection reliability and mechanical strength to prevent the CSP from warping due to the difference in thermal expansion coefficient between the intermediate and the sealing resin. It is an object of the present invention to provide a semiconductor device that can be manufactured and a method for manufacturing the semiconductor device.

[0005]

According to the present invention, there is provided a semiconductor chip having an integrated circuit, a wiring board having electrical wiring, and a semiconductor chip mounted on the wiring board to be electrically connected. An intermediate that is disposed between the wiring substrate and the semiconductor chip and electrically connects the wiring substrate and the semiconductor chip, the intermediate having a reinforcing member for ensuring mechanical strength; and And a sealing member for protecting the wiring portion.

In the present invention, the semiconductor chip has an integrated circuit. The wiring board has electric wiring. When a semiconductor chip is mounted on a wiring board and electrically connected,
An intermediate is provided between the wiring board and the semiconductor chip. This intermediate electrically connects the wiring board and the semiconductor chip, and has a reinforcing member to secure mechanical strength. This can prevent the intermediate from warping due to the difference in thermal expansion coefficient between the intermediate and the sealing member. Accordingly, it is possible to prevent the package from being warped, such as the CSP, and to obtain the electrical connection reliability and the mechanical strength between the CSP and the wiring board.

In the present invention, preferably, the intermediate reinforcing member is a mold for molding the sealing resin. Accordingly, the intermediate reinforcing member can be used as a molding die when forming the sealing resin, so that the amount of the sealing resin to be supplied can be controlled and the shape of the sealing resin can be reliably set.
The use amount of the sealing resin can be optimized.

In the present invention, the intermediate reinforcing member is preferably a mold for molding the sealing resin, and the reinforcing member is a metal member.

In the present invention, preferably, the intermediate reinforcing member is provided on one surface of the intermediate.

In the present invention, preferably, the intermediate reinforcing members are provided at four corners of one surface of the intermediate. Thus, the amount of the sealing resin can be controlled by the reinforcing members arranged at the four corners of one surface of the intermediate, and the shape can be set to a predetermined shape.

In the present invention, the intermediate reinforcing member is preferably provided at one of four corners of one surface of the intermediate using an adhesive or a fixing tool.

In the present invention, the intermediate reinforcing member is preferably formed inside the intermediate.

According to the present invention, when a semiconductor chip having an integrated circuit is mounted and electrically connected to a wiring board having electric wiring, the present invention provides When electrically connecting the wiring board and the semiconductor chip by arranging an intermediate material, a material having a reinforcing member is used as the intermediate material to secure mechanical strength, and a seal is used to protect the wiring part. This is achieved by a method of manufacturing a semiconductor device, wherein a sealing resin is molded using a reinforcing member as a molding die when forming a sealing resin.

According to the present invention, it is possible to prevent the intermediate from warping due to the difference in the coefficient of thermal expansion between the intermediate and the sealing member. Therefore,
The warpage of the semiconductor chip can be prevented, and the electrical connection reliability and the mechanical strength between the semiconductor chip and the wiring board can be obtained. Moreover, the sealing resin can be reliably molded by the reinforcing member, the amount of the sealing resin can be controlled, and the amount of the sealing resin used can be optimized.

[0015]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limits are given, the scope of the present invention is not limited to these modes unless otherwise specified in the following description.

FIGS. 1 and 2 show a preferred embodiment of a semiconductor device according to the present invention. This semiconductor device 10
So-called wire bonding (Wire Bondi)
ng: WB (Type) CSP (Chip Size P)
package). The semiconductor device 10 roughly includes a wiring board 20 such as a motherboard, an interposer (intermediate) 1, a reinforcing member 6, a semiconductor chip 2, a sealing resin 8, and the like. The semiconductor chip 2 is a semiconductor chip having an integrated circuit, and is, for example, a WB-type CSP as described above. A wire 5 made of, for example, Au is electrically connected between the chip electrode 3 of the semiconductor chip 2 and the wiring electrode 4 of the interposer 1. The semiconductor chip 2 is fixed to the interposer 1 by bonding with, for example, an adhesive 2A. The interposer 1 is made of an insulating material, for example, a glass epoxy resin or the like, and has a rectangular cross section and a rectangular or square planar shape in the examples of FIGS.

A reinforcing member 6 is fixed to one surface 1A of the interposer 1 with an adhesive 7 interposed therebetween. The reinforcing member 6 is made of, for example, metal or other material having excellent mechanical strength. When the reinforcing member 6 is made of a metal, for example, a metal such as copper (Cu) or aluminum (Al) having a large Young's modulus can be used. 1 and 2, the reinforcing member 6 is formed in a square shape and a frame shape. Therefore, the reinforcing member 6 is adhered to the vicinity of four corners on one surface of the interposer 1 by a strong adhesive 7. As the strong adhesive, for example, polychloroprene or the like can be adopted. Reinforcing member 6
Can adopt a metal plate prepared in advance by a mold or plating.

In FIG. 3, one surface 1 of the interposer 1 is shown.
A frame-shaped reinforcing member 6 is fixed to A through an adhesive 7. After the reinforcing member 6 is formed on one surface of the interposer 1 in this manner, the semiconductor chip 2 is mounted on one surface 1A of the interposer 1, and a chip electrode (for example, an Al electrode) 3 of the semiconductor chip 2 is formed. The wiring electrodes 4 of the interposer 1 are electrically connected using wires 5 by a wire bonding method. As the wiring electrode 4, for example, a Cu wiring electrode can be used.

Thereafter, the semiconductor chip 2 which is exposed as it is and the wires 5 of the semiconductor chip 2 are exposed.
Is protected from the outside by being sealed with a sealing resin 8. That is, as shown in FIG. 4, the sealing resin is supplied from the sealing resin supply means 30 into the space formed on the reinforcing member 6 and one surface 1A of the interposer 1. As the sealing resin 8, for example, a solventless liquid epoxy sealing material can be used.

The sealing resin 8 thus supplied is:
It may spread when placed in high temperature such as a reflow furnace. Further, the expanded sealing resin 8 applies a warping stress to the interposer 1 at the time of reflow, causing a warpage of the semiconductor chip 2 and possibly causing a solder defect as described above. Therefore, in the embodiment of the present invention, the following measures are taken for this measure. That is, the reinforcing member 6 functions as a molding die when supplying and molding the sealing resin 8. Therefore, the size of the reinforcing member 6 needs to be surrounded by a larger volume than the area including the semiconductor chip 2 and the wires 5 and the wiring electrodes 4. By doing so, the molded sealing resin 8 can surely cover the semiconductor chip 2, the chip electrode 3, the wire 5, and the wiring electrode 4, and particularly, the protection of the wire 5 can be achieved. As described above, the reinforcing member 6 functions as a dam at the time of molding the sealing resin, so that the productivity of the resin supply step when supplying the sealing resin 8 can be increased, and the sealing at a high temperature can be performed. The sealing resin 8 is prevented while preventing the resin from flowing out.
Accordingly, the semiconductor chip 2, the wire 5, and the like can be sealed.

Next, another embodiment of the reinforcing member 6 will be described with reference to FIGS. In another embodiment of the invention according to FIG.
The interposer 1 can be mechanically fixed to one surface 1A of the interposer 1 by such fixing means. FIG. 5 (B)
As shown in (1), such screws (fixing means) 9 can be arranged at four corners of the substrate 1, for example. In the embodiment shown in FIG. 6, when forming the interposer 1, the removed portion 1E is formed by using, for example, a lithography method or a cutting machine.
As a result, the reinforcing member 6 can be formed. According to this configuration, it can be formed without using fixing means or an adhesive.

In the embodiment of the present invention described above,
There are the following merits. (1) The reinforcing member 6 of the interposer 1 controls the amount of the sealing resin 8, and the cost can be reduced. (2) By controlling the region of the sealing resin 8 at the center, the sealing resin 8 in the peripheral portion of the semiconductor chip 2 can be eliminated, and the CSP is mounted on the motherboard, which is effective in suppressing warpage during reflow. Work. (3) The process of pouring the sealing resin 8 can be simplified,
The productivity of the semiconductor device can be improved. (4) The area in which the sealing resin 8 is to be placed can be controlled by the metal plate on the interposer that has been applied in advance, a molding effect can be obtained, and it becomes easy to produce a standardized CSP. And the like.

In the embodiment of the present invention, the reinforcing member 6 is formed on the interposer 1 of the CSP to improve the mechanical strength of the interposer 1 so that the interposer 1 and the sealing resin at the time of soldering (reflow) the CSP are formed. 8
Defective solder connection due to warpage stress due to the difference in thermal expansion coefficient of the solder. In the embodiment of the present invention,
By efficiently flowing the sealing resin into the central portion, the force acting on the interposer 1 due to the difference in thermal expansion coefficient is concentrated on the central portion, so that the warpage stress can be suppressed as compared with the conventional case, and the warpage of the interposer 1 can be suppressed. be able to.

In the embodiment of the present invention, by using the reinforcing member 6 formed on the interposer 1 as a guide, the process of pouring the sealing resin can be performed efficiently, and the productivity can be improved. In the embodiment of the present invention, since the reinforcing member 6 formed on the interposer 1 is used as a dam, the sealing resin can be saved. In the embodiment of the present invention,
Since the reinforcing member 6 formed on the interposer 1 is used as a dam, a sealing resin can be molded. When a semiconductor chip is mounted on a wiring board such as a mounting board, a high-hardness material is applied as a reinforcing member to the interposer connecting the semiconductor and the mounting board, thereby increasing the elastic strength of the interposer and suppressing the warpage of the interposer and providing a high connection. Along with obtaining reliability, high productivity is obtained by efficient supply of the sealing resin.

The reinforcing member is preferably formed not only on one surface of the interposer but also around it, around one surface of the interposer as described above, or inside the interposer. That is, by making the reinforcing member slightly smaller than the size of the interposer, the sealing resin is supplied within the range of the reinforcing member.

[0026]

As described above, according to the present invention,
To obtain electrical connection reliability and mechanical strength when electrically connecting a semiconductor chip to a wiring board to prevent CSP warpage due to the difference in thermal expansion coefficient between the intermediate and the sealing resin. Can be.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a preferred embodiment of a semiconductor device of the present invention.

FIG. 2 is a plan view of the semiconductor device of FIG. 1;

FIG. 3 is a diagram showing a state in which a reinforcing member is fixed to an interposer (intermediate) with an adhesive.

FIG. 4 is a diagram illustrating an example in which a sealing resin is supplied into a reinforcing member of the interposer.

FIG. 5 is a diagram showing another embodiment of the semiconductor substrate of the present invention.

FIG. 6 is a diagram showing still another embodiment of the semiconductor device of the present invention.

FIG. 7 illustrates a conventional semiconductor device.

[Description of Signs] 1 ... Interposer (intermediate), 2 ... Semiconductor chip, 3 ... Chip electrode, 4 ... Wiring electrode, 5 ...
・ Wire, 6 ・ ・ ・ Reinforcing member, 7 ・ ・ ・ Adhesive, 8 ・
..Sealing resin (sealing member), 20... Wiring board, 30
... Supplying means for sealing resin

Claims (9)

[Claims] A semiconductor chip having an integrated circuit; a wiring board having electrical wiring; and a semiconductor chip mounted on the wiring board and electrically connected to the wiring board when the semiconductor chip is mounted on the wiring board. An intermediate for electrically connecting the wiring board and the semiconductor chip, the intermediate having a reinforcing member for ensuring mechanical strength, a sealing member for protecting a wiring portion of the semiconductor chip,
A semiconductor device comprising: 2. The semiconductor device according to claim 1, wherein the intermediate reinforcing member is a mold for molding the sealing resin. 3. The reinforcing member as an intermediate is a mold for molding the sealing resin, and the reinforcing member is a metal member.
3. The semiconductor device according to claim 1. 4. The semiconductor device according to claim 1, wherein the intermediate reinforcing member is provided on one surface of the intermediate. 5. The semiconductor device according to claim 4, wherein the intermediate reinforcing members are provided at four corners of one surface of the intermediate. 6. The semiconductor device according to claim 5, wherein the intermediate reinforcing members are provided at four corners of one surface of the intermediate using an adhesive or a fixing tool. 7. The semiconductor device according to claim 1, wherein the intermediate reinforcing member is formed inside the intermediate. 8. When a semiconductor chip having an integrated circuit is mounted and electrically connected to a wiring board having electric wiring, an intermediate is arranged between the wiring board and the semiconductor chip to form a wiring board. When electrically connecting the semiconductor chip to the semiconductor chip, an intermediate product that has a reinforcing member to ensure mechanical strength is adopted.When forming a sealing resin to protect the wiring, A method for manufacturing a semiconductor device, comprising molding a sealing resin using a member as a mold. 9. The method according to claim 8, wherein the intermediate reinforcing members are provided at four corners of one surface of the intermediate.