JP2000049480A - Heatsink cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to package a three-dimensional highly concentrated head radiator by forming an air flow where a cooling air injected from a tip of a nozzle is collided to an opposedly located heat radiation substrate and released outside through a gap between an external circumference of the nozzle and the heat radiation substrate. SOLUTION: A heat radiation substrate polyhedron 11 opens a side plate comprising a heat radiation substrate 12 as a bottom plate and heat radiation substrates 13a to 13b as side plates, and a nozzle 15 is inserted for cooling air injection. The nozzle 15 connected to a blower and the like through piping feeds a cooling air into the heat radiation substrate polyhedron 11, collides the cooling air to the heat radiation substrate 12, and releases the air from the opening by flowing it through a path 17 sandwiched by the heat radiation substrate 13a to 13d and the nozzle 15. The cooling air flow forcibly cools an inner surface of the heat radiation substrate 13a to 13d heated by conduction from LSI packages 14b and 14c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink cooling device used for cooling various heating elements such as microprocessors, power transistors, and other electronic components that generate heat.

[0002]

2. Description of the Related Art LSIs (Large Scale Integrated Circuits) constituting electronic components such as microprocessors and power transistors.
Are very weak to heat and fail at about 130-150 ° C. Further, even if the temperature is lower than that, the reliability of the performance is remarkably reduced as the temperature increases. Therefore, to operate the LSI below the allowable temperature conventionally,
A package containing an LSI chip (hereinafter referred to as an LSI package) can be directly cooled or
A radiator called a heat sink is attached to the package to cool the LSI.

When the heat value of the LSI is small, cooling can be performed by natural air cooling. However, when the heat value of the LSI increases, forced air cooling for supplying cooling air to the heat sink by a fan or a blower becomes necessary.

Various types of cooling devices and mounting structures have been proposed so far in order to efficiently perform forced air cooling of electronic components constituted by an LSI package having a large heat generation. For example, Japanese Unexamined Patent Publication No. 57-11856 discloses "LSI mounting structure".
Is disclosed.

FIG. 7 shows a cooling device disclosed in the publication, FIG. 7 (a) is a perspective view, and FIG. 7 (b) is a sectional view. As shown in the figure, this cooling device is a rectangular tubular heat sink 10 having a plate-shaped heat radiation fin inside.
This is a mounting structure in which an LSI package 3 as a heating element is mounted on four outer surfaces of a to 10d, and a fan for sending cooling air to fins is mounted. This structure makes it possible to mount the LSI package three-dimensionally, and achieves both high-density mounting and high-efficiency cooling.

However, in this mounting structure, it is necessary to open two opposing surfaces of the rectangular parallelepiped for ventilation.
The SI package can be mounted only on the four sides of the rectangular parallelepiped. Further, when it is necessary to mount the LSI package only on one plane, this structure requires one cooling device per package, and the cooling device occupies a large pace and cannot be adopted.

[0007] As another example, a heat sink cooling device having flat fins is shown in Proceedings of the Japan Society of Mechanical Engineers Thermal Engineering Conference (1994, pp. 275-277).

This cooling device has a structure in which an LSI package as a heating element is mounted on the back surface of a heat sink substrate on which plate-shaped fins stand upright, and cooling air is directly blown from above the fins to the fins. LSI
When there are a plurality of packages, this cooling device is attached to each LSI package so that the cooling air that flows in and the air that is discharged do not mix. With such a structure, efficient cooling of the LSI package mounted two-dimensionally is achieved.

[0009] However, this cooling device is limited to a case where the LSI package is mounted two-dimensionally, and cannot be mounted three-dimensionally. Further, when cooling a plurality of LSI packages, piping on the inflow side and the discharge side is required for each LSI package, and the structure of the device becomes complicated. Furthermore, since the air ejected from the nozzle is decelerated when flowing between the fins of the plate fin,
The cooling effect peculiar to the impinging jet cannot be obtained for the substrate.

[0010]

An object of the present invention is to provide an LS
It is an object of the present invention to provide a heat sink cooling device capable of three-dimensional high-density mounting of a heating element such as an I package and having higher forced air cooling performance than a conventional cooling device.

Another object of the present invention is to provide a heat sink cooling device that can obtain high forced air cooling performance with a compact device even in cooling a plurality of heating elements mounted on a plane.

[0012]

The gist of the present invention relating to the heat sink cooling device is as follows.

(1) A heat dissipating substrate polyhedron in the shape of a three-dimensional container having one surface opened, and a nozzle for injecting cooling air inserted from the opening into the heat dissipating substrate polyhedron, Each surface of the radiating substrate polyhedron is composed of a flat radiating substrate for mounting a heating element on the outer surface, and after the cooling air injected from the tip of the nozzle collides with the radiating substrate facing the nozzle tip, A heat sink cooling device provided so as to form a flow path that is discharged between the outer peripheral surface of the nozzle and the heat radiating substrate to the outside.

(2) The heat sink cooling device according to the above (1), wherein the heat radiation fins are provided on the inner peripheral surface of the heat radiation substrate polyhedron.

(3) A heat radiating portion of a heat pipe is adhesively fixed to an outer surface of a heat radiating substrate of the heat sink cooling device according to the above (1) or (2), and a heat receiving portion of the heat pipe can be fitted with a heating element. Heat sink cooling device.

The present inventors have conducted various experiments and studies to develop a cooling device capable of mounting a heating element of an electronic component at a high density and having high air cooling performance. Thus, the present invention has been completed.

1) A heat-dissipating substrate for mounting a heat sink is a three-dimensional container-shaped polyhedron, one surface of the heat-dissipating substrate polyhedron is opened, a nozzle is inserted from this opening, and cooling air is injected. High-density mounting of heating elements is possible by causing the cooling air that has collided with the heat radiation substrate facing the nozzle tip to be released outside through the nozzle and the heat radiation substrate as a flow path and cooling the heat radiation substrate. And high air cooling performance can be obtained.

2) If the heat radiating portion of the heat pipe is bonded and fixed to the outer surface of the heat radiating substrate, and a heat generating element is mounted on the heat receiving surface of the heat pipe, a large number of heat generating elements can be efficiently formed without being restricted by their positions. Can be cooled.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an example of a heat sink cooling device for an LSI package in which an LSI is sealed as a heating element will be described.

FIG. 1 is a view showing an example of a cooling device of the present invention in which an LSI package is mounted, and FIG.
FIG. 1B is a cross-sectional view taken along the line AA ′ of FIG. 1A, and FIG. 1C is a plan view.

As shown in FIG. 1, the heat sink cooling device is in the form of a multi-sided three-dimensional container.
A heat radiation substrate polyhedron 11 having an opening on one surface including heat radiation substrates 13 a to 13 d serving as side plates and a side plate, and a cooling air injection nozzle 15 inserted from the opening.

Each of the heat radiating substrates is made of a material having a high thermal conductivity, such as an aluminum alloy or a copper alloy, and the heat radiating substrates are joined to each other by welding, brazing, or the like so that there is no gap.

On the outer surface of each of the heat radiating substrates 12, 13a to 13d, an LSI package 1 in which an LSI as a heating element is sealed is provided.
4a to 14e are attached in a state of being tightly fixed by screws, adhesives and the like.

If a thermal compound or the like is interposed between each heat dissipation board and the LSI package, the heat conduction between them becomes better. A small part of the heat generated from the LSI packages 14a to 14e is dissipated into the atmosphere by natural convection, radiation, and the like, but most of the remaining heat is transferred to the closely adhered and fixed heat dissipation boards, and from the heat dissipation boards. Dissipated into the atmosphere by forced convection heat transfer described below.

The nozzle 15 is connected to a blower or the like (not shown) by piping, and supplies cooling air to the heat dissipation substrate polyhedron. The cooling air is ejected as a jet at the nozzle outlet, and cools the heat dissipation substrate 12 by colliding with the inner surface of the heat dissipation substrate 12. At this time, since the heat dissipation substrate 12 can achieve high cooling performance due to the high heat transfer characteristic of the impinging jet, the LSI package 14a attached here should have the largest heat generation and heat density among the attached LSI packages. Is good.

After the cooling air collides with the heat radiating substrate 12 as a jet, the cooling air and the nozzles 15a to 13d
Flows through the flow path 17 sandwiched between the openings, and is released into the atmosphere from the opening. This cooling air flow causes the LSI package 14b
Radiating substrates 13a-13 raised by heat transfer from -14e
Forced air cooling is performed on the inner surface of d.

The air flowing outside the nozzle 15 is an LSI
Since the temperature is raised by the heat from the package, it is desirable not to exchange heat with the cooling air flowing inside the nozzle. For this reason, the material of the nozzle 15 is desirably a material having a small thermal conductivity. However, when a material having a large thermal conductivity (metal or the like) is used to secure the strength, a material such as polyurethane foam is provided outside the nozzle 15. Even if the heat insulating material 16 is wound, a sufficient effect can be obtained.

With the cooling device having the above structure, a plurality of heating elements can be mounted three-dimensionally at high density, and high air cooling performance can be obtained.

FIG. 2 is a view showing another embodiment of the cooling device of the present invention. FIG. 2 (a) is a perspective view, and FIG.
FIG. 2A is a cross-sectional view taken along line AA ′, and FIG. 2C is a plan view.

This cooling device comprises heat radiating substrates 13a to 13d
This is the same as FIG. 1 except that a flat fin 22 is provided inside each of them, and is a device in which the cooling capacity of the cooling device shown in FIG. 1 is further enhanced.

Flat fin 22 and heat radiating substrates 13a to 13d
May be a structure joined by brazing, welding or the like, or a structure integrated by extrusion or the like. However, when they are joined, they need to be thermally connected at the joining surface.

As a material of the fin, A having a high thermal conductivity is used.
1 alloy (including pure Al), Cu alloy (including pure Cu) and the like are desirable.

In the cooling device shown in FIG. 1, the heat radiating substrates 13a to 13a to 1
The cooling of 3d is quite poor. For this reason, as shown in FIG. 2, the cooling ability can be increased by providing the flat plate fins 22 on the inner surfaces of the heat dissipation boards 13a to 13d and enlarging the heat dissipation area.

Here, the fin shape is not limited to 22 flat fins. If a flat fin having a cutout in the main air flow direction is used to further increase the surface area of the flat fin, the cooling performance is further improved. . Also, good cooling performance can be obtained by using pin fins or corrugated fins instead of flat fins.

FIG. 3 is a view showing another example of the cooling device of the present invention. FIG. 3 (a) is a perspective view, FIG. 4 (b) is a cross-sectional view taken along AA 'of FIG. 3 (a), FIG. 3C is a plan view.

This cooling device is composed of heat radiating substrates 13a to 13d.
Except that the heat radiating portions of the heat pipes 42a to 42d are attached to the outside of each, and the LSI packages 14a to 14d, which are the heat generating elements, are attached to the heat receiving portions of each of the heat pipes. This cooling device is a device suitable for arranging many heating elements on the same plane.

As is well known, one end of the heat pipe is a heat receiving section and the other end is a heat radiating section.
The heat radiating portion 42d is tightly fixed to the side plates 13a to 13d with screws, an adhesive or the like. LSI package 14b ~
14e is a screw in the heat receiving part of the heat pipes 42a to 42d,
It is attached and fixed in close contact with an adhesive or the like.

Since the heat transfer performance of the heat pipe is extremely excellent, the thermal resistance between the LSI package and the heat sink can be kept very small even if the LSI package is mounted on the heat dissipation board via the heat pipe.

As shown in FIG. 3, the LSI package 14
Since b to 14e are attached to the side plates 13a to 13d via the heat pipes 42a to 42d, the degree of freedom in the layout of the LSI package is greatly increased. For example, if the position is adjusted so that the LSI package 14a attached to the heat dissipation board 12 and the LSI packages 14b to 14e attached to the heat pipes 42a to 42d are arranged on the same plane, all of the LSI packages 14a to 14e become one. Can be mounted on a printed wiring board.

As described above, the cooling device of the present invention
It can also support planar mounting, which is the mainstream of the I package mounting method.

Further, since cooling of a plurality of LSI packages can be handled by one heat sink cooling device, the entire mounting space including the cooling device is compact.

In the example of the cooling device shown in FIG. 3, the narrow portion between the heat receiving portion and the heat radiating portion of the heat pipes 42a to 42d is because other electronic components are mounted around the LSI package during planar mounting. In many cases, this is to secure a space for that.

The shapes of the heat pipes 42a to 42d are not limited to the shapes shown in the drawing.

FIG. 4 is a perspective view showing a heat pipe of another shape. FIG. 4 (a) is an L-shaped flat plate type, and FIG. 4 (b) is an assembly of a plurality of rod-shaped heat pipes. The shape of the heat pipe may be an appropriate shape depending on the installation space of the cooling device.

FIG. 5 is a view showing another embodiment of the cooling device of the present invention. FIG. 5 (a) is a perspective view, and FIG.
FIG. 5A is a cross-sectional view taken along line AA ′, and FIG. 5C is a plan view.

This cooling device is composed of heat radiating substrates 13a to 13d.
3 except that it has a flat plate fin 62 on its inner surface.
This is a device in which the cooling capacity is further improved from the cooling device shown in FIG. In the cooling device shown in FIG. 3, the cooling degree of the heat radiating substrates 13a to 13d is considerably inferior to that of the heat radiating substrate 12 cooled by the impinging jet as described in FIG. For this reason, as shown in FIG. 5, the cooling ability can be enhanced by providing the plate fins 62 on the inner surfaces of the heat dissipation boards 13a to 13d and enlarging the heat transfer area.

As described above, the fins provided on the heat radiating substrate may be of various shapes.

In the above cooling device, a case has been described where the LSI packages are mounted one by one on the heat radiating substrate, but a plurality of LSI packages may be mounted on one heat radiating substrate.
However, in that case, it is necessary to consider that the temperature rises further downstream of the cooling air flow.

FIG. 6 shows two radiating substrates of the radiating substrate polyhedron.
FIG. 7 is a diagram showing an example in which LSI packages are mounted.
7A is a perspective view, FIG. 7B is a cross-sectional view taken along line AA ′ of FIG. 7A, and FIG. 7C is a plan view.

In this cooling device, two LSI packages are mounted on each of the heat radiating substrates 12, 13a and 13c, no LSI package is mounted on the heat radiating substrates 13b and 13d, and It is the same as FIG. 1 except that 75 is a rectangular cross section. The cooling performance and effects are as described for the cooling device of FIG.

Although the radiator polyhedron has been described as a pentahedron, it may be a hexahedron or more.

[0052]

EXAMPLES Example 1 A cooling device shown in FIG. 1 equipped with a heat radiating board and a nozzle having the following dimensions was manufactured, and the cooling performance was measured.

The dimensions of the heat radiation substrate 12 (material: aluminum alloy A)
1100) 54 mm × 54 mm × 2.0 mm Dimensions of the heat radiation substrates 13 a to 13 d (material: aluminum alloy A1
100) 52 mm x 50 mm x 2.0 mm Nozzle inner diameter x wall thickness x length (Material: SUS316) 12 mm x 1 mm x 50 mm Thickness of nozzle heat insulator (Material: polyurethane resin) 3 mm The inside size is 50
A cubic container-shaped polyhedral substrate of mm × 50 mm × 50 mm was manufactured. The nozzle was fixed vertically to the heat radiating substrate 12 so that the nozzle opening was at a position 25 mm from the inner surface of the heat radiating substrate 12, and the heat insulating material was wound around the nozzle.

A 40 mm × 40 mm sheet heater simulating a package is provided at the center of the outer surface of each of the heat radiating substrates.
A total of 5 pieces are stuck on the other side of the sheet heater and a thickness of 1
A heat-insulating material AC lumbar of 0 mm was attached to prevent heat generated from the heater from leaking to a portion other than the cooling surface.

The sheet heater affixed to the outer surface of the heat radiating substrate 12 is 30 W, the four sheet heaters affixed to the outer surface of the heat radiating substrates 13 a to 13 d are each 10 W, and heat is generated under the condition of a constant heat flow rate. × 10 ^-3 m ³ / s
Cooling air at a temperature of 20 ° C. at the nozzle outlet was ejected.
The average temperature difference between the nozzle outlet temperature and the surface of the sheet heater attached to the outer surface of the heat radiating substrate 12 is 8.5 ° C., and the average temperature difference between the nozzle outlet temperature and the surface of the sheet heater attached to the outer surface of the heat radiating substrates 13a to 13d is 21. 2 ° C., and the above-mentioned temperature difference and the heat transfer coefficient based on the area of the heat dissipation substrate 12 are 1210 W
/ (° C. · m ² ), the above temperature difference and the heat dissipation boards 13a to 13d
Was 180 W / (° C. · m ² ).

FIG. 7 is a diagram showing a cooling device used as a comparative example.

In this cooling device, flat fins are provided on the inner surfaces of the heat dissipation boards 10a to 10d assembled in a cylindrical shape, and cooling air is sent from the openings to the fins by the fan 4, and the heating element mounted on the outer surface of the board is provided. 3 is cooled. The dimensions of the radiator board, fins, etc. were as follows.

Heat radiation board dimensions (material: aluminum alloy A110)
0) 52 mm × 50 mm × 2.0 mm Flat plate fin dimensions (material: aluminum alloy A1100) 50 mm × (2 to 24) mm × 1.0 mm Fin pitch and number of fins 2.0 mm, 23 pcs. A heat sink with upright fins was manufactured by cutting, assembled into a rectangular tube by welding, and a fan was fixed to the opening so as to be in close contact with the opening surface.

One 40 mm × 40 mm sheet heater simulating a package is attached to the center of the four heat radiation board outer surfaces 10 a to 10 d, and a 10 mm thick heat insulating material AC lumbar is attached to the other surface of the sheet heater. Affixed.

The sheet heater attached to the outer surface of the heat dissipation board is
Heat was generated at 0 W and a constant heat flow rate, and cooling air having a volume flow rate of 4.4 × 10 ⁻³ m ³ / s (temperature at the inlet of 20 ° C.) was supplied from the fan. The average temperature difference between the inlet temperature and the surface of the sheet heater attached to the outer surface of the heat dissipation board is 12.5 ° C on average,
Each of the above-mentioned temperature difference and the heat transfer coefficient based on the area of the heat dissipation board is 3
08 W / (° C. · m ² ).

From this, it can be seen that the heat sink cooling device according to the present invention has improved the average cooling performance by about 25%, can further increase the mounting density, and has a sufficiently practical cooling performance. .

Example 2 A cooling device shown in FIG. 2 equipped with a radiating board and a nozzle having the following dimensions was manufactured, and the cooling performance was measured.

The dimensions of the heat radiation substrate 12 (material: aluminum alloy A)
1100) 54 mm × 54 mm × 2.0 mm Dimensions of the heat radiation substrates 13 a to 13 d (material: aluminum alloy A1
100) 52 mm x 50 mm x 2.0 mm Flat plate fin dimensions (material: aluminum alloy A1100) 45 mm x 14 mm x 1.0 mm Fin pitch and number of fins 2.0 mm, 17 nozzles Inner diameter x wall thickness x length (material: SUS316) 12mm x 1mm x 50mm Nozzle insulation material thickness (Material: Polyurethane resin) 3mm Flat fins are integrally formed on the heat radiating board by machining, each heat radiating board is welded, and the inner dimension with one open side is 50
A cubic heat dissipation substrate polyhedron of mm × 50 mm × 50 mm was manufactured. The nozzle was fixed to the nozzle so that the nozzle opening was at a position 25 mm from the inner surface of the substrate, and the heat insulating material was wound around the nozzle and fixed.

A 40 mm × 40 mm sheet heater simulating a package is provided at the center of the outer surface of each of the heat radiating substrates.
A total of five pieces each were attached, and a heat insulating material AC lumbar having a thickness of 10 mm was attached to the other surface of these sheet heaters.

The sheet heater attached to the outer surface of the heat radiating substrate 12 is 30 W, the four sheet heaters attached to the outer surfaces of the heat radiating substrates 13 a to 13 d are each 10 W, and heat is generated under the condition of a constant heat flow rate. × 10 ^-3 m ³ / s
Cooling air at a temperature of 20 ° C. at the nozzle outlet was ejected.
The average temperature difference between the nozzle outlet temperature and the surface of the sheet heater attached to the outer surface of the heat dissipation board 12 is 8.7 ° C., and the average temperature difference between the nozzle exit temperature and the surface of the sheet heater attached to the outer surface of the heat dissipation board 13a to 13d is 17 .4 ° C., and the above-mentioned temperature difference and the heat transfer coefficient based on the area of the heat dissipation substrate 12 are 1180 W
/ (° C. · m ² ), the above temperature difference and the heat dissipation boards 13a to 13d
Was 220 W / (° C. · m ² ).

From this result, it can be seen that by attaching the flat plate fins to the inner surface of the heat radiating substrate, the cooling performance at the heat radiating substrate 12 is almost the same, and the cooling performance at the heat radiating substrates 13a to 13d can be improved by about 20%. .

Example 3 A cooling device shown in FIG. 3 equipped with a heat-dissipating substrate and a nozzle having the following dimensions was manufactured, and the cooling performance was measured.

The dimensions of the heat radiation substrate 12 (material: aluminum alloy A)
1100) 54 mm × 54 mm × 2.0 mm Dimensions of the heat radiation substrates 13 a to 13 d (material: aluminum alloy A1
100) 52 mm × 50 mm × 2.0 mm Heat pipe dimensions (Material: Cu, working fluid: distilled water) Heat receiving part: 50 mm × 50 mm × 3.0 mm Heat radiating part: 50 mm × 50 mm × 3.0 mm Relay part 42: 15 mm × 50mm x 3.0mm Nozzle inner diameter x wall thickness x length (Material: SUS316) 12mm x 1mm x 50mm Nozzle insulation material thickness (Material: polyurethane resin) 3mm A heat dissipation substrate polyhedron was manufactured and implemented in the same manner as in Example 1. The nozzle was fixed as in Example 1. Further, one sheet heater was fixed to the heat radiating substrate 12 as in the first embodiment.

The heat radiating portion of the heat pipe is tightly fixed to the center of the outer surface of the heat radiating substrates 13a to 13d via a thin layer of a thermal compound with screws, and the heat receiving portion of the heat pipe is made of the same sheet as in the first embodiment. One heater was attached.

In this manner, a heat insulating material AC lumbar having a thickness of 10 mm was adhered to the heat radiating substrates of the four sheet heaters and the other surfaces of the sheet heaters, which were adhered to the heat radiating substrate 12 and the heat pipe heat receiving portion, respectively.

The sheet heater attached to the outer surface of the heat radiating substrate 12 was 30 W, and the four sheet heaters attached to the heat pipe heat receiving portion each generated heat at 10 W at a constant heat flow rate.
When cooling air with a volume flow rate of 4.4 × 10 ⁻³ m ³ / s (temperature at the nozzle outlet: 20 ° C.) was jetted from the nozzle, the temperature difference between the nozzle outlet temperature and the surface of the sheet heater attached to the outer surface of the substrate 12 Is 8.5 ° C. on average, the temperature difference between the nozzle outlet temperature and the surface of the sheet heater attached to the heat pipe heat receiving portion is 22.0 ° C. on average, and the above-mentioned temperature difference and the heat transfer coefficient based on the area of the heat dissipation substrate 12 are 1210 W. / (° C. · m ² ), and the above-mentioned temperature difference and the heat transfer coefficient based on the area of the heat radiating substrates 13a to 13d were 175 W / (° C. · m ² ).

From these results, it is found that the heat pipes are attached to the outer surfaces of the heat radiating substrates 13a to 13d,
The cooling performance in the part 2 is completely the same,
It can be seen that the cooling performance at the 13d portion is almost the same, and that the degree of freedom in arrangement is further improved, making it possible to cope with various mounting forms.

Example 4 A cooling device shown in FIG. 5 equipped with a heat radiating substrate and a nozzle having the following dimensions was manufactured, and the cooling performance was measured.

The dimensions of the heat radiation substrate 12 (material: aluminum alloy A)
1100) 54 mm × 54 mm × 2.0 mm Dimensions of the heat radiation substrates 13 a to 13 d (material: aluminum alloy A1
100) 52 mm x 50 mm x 2.0 mm Flat fin dimensions (material: aluminum alloy A1100) 45 mm x 14 mm x 1.0 mm Fin pitch and number of fins 2.0 mm, 17 heat pipe dimensions (Material: Cu, working fluid: distillation) Water) Heat receiving part: 50 mm x 50 mm x 3.0 mm Heat radiating part: 50 mm x 50 mm x 3.0 mm Relay part 42: 15 mm x 50 mm x 3.0 mm Nozzle inner diameter x wall thickness x length (material: SUS316) 12 mm x 1 mm x 50mm Nozzle heat insulating material thickness (Material: polyurethane resin) 3mm The above-mentioned heat dissipation board, which is formed integrally with a flat plate fin by machining, is welded, and the inner dimension with one side open is 50mm x 50mm
A cubic heat dissipation substrate polyhedron having a size of 50 mm was manufactured.
The above nozzle was fixed thereto in the same manner as in Example 1, and one sheet heater was further fixed to the heat dissipation substrate 12 as in Example 1.

The heat radiating portion of the heat pipe is closely fixed to the center of the outer surface of the heat radiating substrates 13a to 23d with a screw through a thin layer of a thermal compound. One heater was attached.

In this way, a heat insulating material 10 mm thick is attached on the substrate of the four sheet heaters and the other surface of the sheet heat, which are stuck on the heat radiating substrate 12 and the heat pipe heat receiving portion, respectively.
C lumbar was attached.

The sheet heater attached to the outer surface of the heat radiating substrate 12 was 30 W, and the four sheet heaters attached to the heat pipe heat receiving portion each generated heat at 10 W at a constant heat flow rate.
When cooling air with a volume flow rate of 4.4 × 10 ⁻³ m ³ / s (temperature at the nozzle outlet: 20 ° C.) was jetted from the nozzle, the nozzle outlet temperature and the temperature of the surface of the sheet heater attached to the outer surface of the heat dissipation substrate 12 The difference is 8.8 ° C on average, and the difference between the nozzle outlet temperature and the surface of the sheet heater attached to the heat receiving part is 1 on average.
8.2 ° C., the above-mentioned temperature difference and the heat transfer coefficient based on the area of the radiating substrate 12 are 1170 W / (° C. · m ² ), and the above-mentioned temperature difference and the heat transfer coefficient based on the area of the radiating substrate 13 a to 13 d are 2
10 W / (° C. · m ² ).

From this result, even when the heat pipe is attached to the outer surface of the heat radiating substrate, the cooling performance at the heat radiating substrate 12 is almost equal and the cooling performance at the heat receiving portion is reduced by attaching the flat plate fin to the inner surface of the heat radiating substrate. It can be seen that it can be improved by about 20%.

[0079]

According to the present invention, it is possible to mount a heating element of an electronic component at a high density by three-dimensional mounting, and to perform forced air cooling higher than that obtained by a conventional cooling device. Further, even in the cooling of a plurality of heating elements mounted on the same plane, higher forced air cooling can be performed with a compact device, which greatly contributes to the development of the electronics industry.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of a cooling device of the present invention.

FIG. 2 is a diagram showing an example of a cooling device using a heat dissipation board provided with fins of the present invention.

FIG. 3 is a diagram showing an example of a cooling device using the heat pipe of the present invention.

FIG. 4 is a diagram showing an example of a shape of a heat pipe provided on a heat dissipation substrate.

FIG. 5 is a diagram showing an example of a cooling device using a heat dissipation board provided with a heat pipe and fins of the present invention.

FIG. 6 is a diagram showing an example of a cooling device according to the present invention in which two heat generating elements are mounted on one heat radiation board.

FIG. 7 is a diagram showing a conventional cooling device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 11 Heat dissipation board polyhedron 16 Heat insulation material 12, 13a-13d Heat dissipation board 17 Cooling air flow path 14a-14e Heating body 22 Fin 15 Nozzle 42a-4
2d heat pipe

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E322 AA01 AA07 AA11 AB01 AB06 BA01 BA03 BB03 DB10 FA01 FA02 FA05 5F036 AA01 BA04 BA07 BA23 BB03 BB05 BB21 BB33 BB35 BB44 BB53 BB56 BB60 BC03 BC05 BD03

Claims (3)

[Claims] 1. A heat dissipating substrate polyhedron in the shape of a three-dimensional container having an opening on one side, and a nozzle for ejecting cooling air inserted from the opening into the heat dissipating substrate polyhedron. Each surface of the substrate polyhedron is composed of a flat heat-radiating substrate for mounting a heating element on the outer surface, and after the cooling air injected from the tip collides with the heat-radiating substrate facing the nozzle tip, the nozzle A heat sink cooling device, which is provided so as to form a flow passage that is discharged to the outside through an outer peripheral surface and a heat radiation substrate. 2. The heat sink cooling device according to claim 1, wherein heat radiating fins are provided on an inner peripheral surface of the heat radiating substrate polyhedron. 3. A heat radiating portion of a heat pipe is adhered and fixed to an outer surface of a heat radiating substrate of the heat sink cooling device according to claim 1 or 2, and a heat receiving portion of the heat pipe can be fitted with a heating element. A heat sink cooling device, characterized in that: