JP2000049452A - Heating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable to reliably heat substrates to a specified temperature by forming slits for exhaust in clearance between plural lower heat blocks, by jetting inert gas from above the lower heat blocks and by transporting semiconductor substrates onto the lower heat blocks intermittently in sequence. SOLUTION: Lower heat blocks 1 comprise heat block main bodies 12 having heater inserting parts 10 and inert gas passages 11 and heating pieces 13 provided on the top of the heat block main bodies 12. Slits 14 for exhaust passing through exhaust tubes are formed between adjacent lower heat blocks 1. Then one end of the inert gas passages 11 is closed and inert gas such as nitrogen gas is supplied through an inert gas supply part provided at the other end to the inert gas passages 11. The inert gas is jet out from jetting outlet in the heating pieces 13 into a heating chamber. Semiconductor substrates are intermittently transported in sequence onto the lower heat blocks.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a heating device,
More specifically, the present invention relates to a heating device used when melting solder of a solder-processed semiconductor substrate.

[0002]

2. Description of the Related Art CSP and BGA in a semiconductor manufacturing process
In a package technology called "printing technology", a semiconductor device such as an LSI chip is mounted on one surface of a plastic printed circuit board, and terminals of the semiconductor device and wiring of the printed circuit board are connected by soldering on the other surface side of the substrate. .

The above soldering is performed by setting a solder ball coated with a flux at a predetermined position on the other side of the substrate and then heating the substrate. This heating is performed by a heating device generally called a reflow furnace. Is used.

[0004] A conventional reflow furnace is usually formed of a heating chamber in an inert gas atmosphere and a conveyor for transporting substrates in the heating chamber. The heating chamber is
It is divided into a plurality of heating zones each having a heater, hot air circulation means, etc., and the substrate is heated in a predetermined heating pattern by sequentially transporting the substrate to each heating zone (Japanese Patent Laid-Open No. 8-8529). Gazette, JP-A-8-125327, etc.).

[0005]

However, in the conventional apparatus, for example, in the case where a heater is disposed in proximity to the substrate, it is not possible to smoothly exhaust the flux, the organic solvent, the paste, etc. which evaporate during the heat treatment. There is a possibility that heating may not be performed sufficiently due to adhesion to a surface or a substrate surface, quality may be deteriorated, and cleaning work may be troublesome. In addition, in the hot air circulation system, since the substrate is heated indirectly by heating the indoor atmosphere, it takes time to raise the temperature of the substrate, and there is a disadvantage that the furnace becomes large and precise temperature control is difficult. . Further, there is a problem that the surface of the solder and the like are oxidized by the inflow of the air into the heating chamber.

Accordingly, the present invention provides a heating apparatus which can surely heat a substrate to a predetermined temperature, and can also smoothly exhaust evaporative gas, thereby improving heating efficiency and miniaturizing the apparatus. It is an object.

[0007]

In order to achieve the above object, a heating apparatus according to the present invention is a heating apparatus having a heating chamber for melting and processing solder of a semiconductor substrate subjected to solder processing, wherein the heating chamber has a heating chamber. A lower heat block having a heater insertion portion and an inert gas flow path therein, and having an ejection port for ejecting the inert gas supplied from the inert gas flow path on the upper surface, in a predetermined direction in the substrate transfer direction. A plurality of rows are arranged at intervals, and an exhaust slit communicating with an exhaust pipe is formed in a gap between each lower heat block, and inert gas ejecting means for ejecting inert gas from above each lower heat block,
And a transfer means for intermittently transferring the semiconductor substrate onto the lower heat block, particularly, a heater and an inert gas flow path inside the heating chamber above the lower heat block. And an upper heat block having an ejection port for ejecting the inert gas supplied from the inert gas flow path on the lower surface thereof is disposed to face each other.

In the heating apparatus of the present invention, the lower heat block is installed on a lower support, the upper heat block is installed on an upper support, and the upper support is moved up and down with respect to the lower support. It is characterized by being formed to be movable in the direction. Further, the transfer means includes a blade provided in the slit provided in the substrate transfer direction of the lower heat block so as to be movable in the vertical direction and the substrate transfer direction, and raising the blade to move the blade in the substrate transfer direction. And a driving means for lowering and moving in the anti-substrate transport direction. Further, the inert gas is heated to a predetermined temperature by a heater inserted in the heater insertion portion while passing through the inert gas flow path in the lower heat block,
An air curtain for ejecting an inert gas is provided at an entrance of the heating chamber.

Further, the lower heat block includes a heat block main body having the heater insertion portion and the inert gas flow path, and a heat block provided on an upper surface of the heat block main body. A gas reservoir communicating with an inert gas outlet provided in the heat block main body and the jet outlet provided in the heat block, and a lower heat block is provided on a bottom plate of the lower support base. A pair of exhaust gas guide members provided in the
The exhaust block guide is supported by a heat block support member provided on the exhaust gas guide member, the heat block support member has a slit communicating with the exhaust slit, and the exhaust gas guide member is provided on one side of the bottom plate. Exhaust gas that has a length from the exhaust port portion provided on the side to the middle portion in the width direction of the lower heat block, exhaust gas sucked from the exhaust slit between the lower heat blocks, through the slit of the heat block support member It was formed to flow between the heat block support member and the bottom plate, and to be discharged from the exhaust port to the discharge pipe through the space between the exhaust gas guide members from the end of the exhaust gas guide member opened at the widthwise middle portion of the lower heat block. In addition, an upper opening communicates with the exhaust port on a lower surface of a bottom plate of the lower support, and an exhaust pipe connection portion is provided on a lower portion. Providing the exhaust manifold removably having provided with a trap in the path of the exhaust pipe, it is characterized by comprising an exhaust fan in the path termination.

One end of the inert gas flow path is closed, and the other end is provided with an inert gas supply section. The inert gas supply section penetrates the heating chamber side wall and has a tip. A gas supply short pipe which is in close contact with the flow path opening end of the inert gas flow path, a cap provided so as to cover an outer portion of a side wall of the gas supply short pipe, and a gas supply chamber provided in the cap are provided with a gas supply chamber. An inert gas supply path for supplying an active gas, and an urging means for pressing the gas supply short pipe in the inert gas flow path direction.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an embodiment of a heating apparatus according to the present invention. FIG. 1 is a partially sectional front view of the heating apparatus, and FIG.
3 is a perspective view of the main part of the lower half of the heating device, FIG. 3 is a plan view of the same, FIG. 4 is a cross-sectional front view of the main part of the same, FIG. FIG. 7 is a schematic sectional view of a trap provided in an exhaust path, and FIG. 7 is a sectional view of an inert gas supply unit.

This heating device includes a lower heating section 2 having a plurality of lower heat blocks 1 and an upper heating section 4 having a plurality of upper heat blocks 3. The two heating units 2 and 4 are each configured by installing the lower heat block 1 and the upper heat block 3 and the like on a box-shaped lower support 5 and an upper support 6 which are open at the top or bottom. The female screw members 7 provided at the four corners are screwed and supported by the screw 8.

The upper heating unit 4 moves up and down by the rotation of the screw 8, and when the upper heating unit 4 is lowered to a predetermined position, a heating chamber of a predetermined size is provided between the two heating units 2 and 4. 9 (see FIG. 4) is formed.

The lower heat block 1 is formed by a heat block body 12 having a heater insertion portion 10 and an inert gas flow path 11 therein, and a heat piece 13 provided on the upper surface of the heat block body 12. ,
An exhaust slit 14 is provided between adjacent lower heat blocks. A rod-shaped heater (not shown) is inserted into the heater insertion portions 10 provided on both sides of the heat block main body 12. One end of the central inert gas flow path 11 is closed, and the inert gas flow path 1 is provided through an inert gas supply unit 15 provided at the other end.
An inert gas such as a nitrogen gas is supplied into 1.

The inert gas supplied to the inert gas flow path 11 flows from a through hole 16 provided in an upper part of the flow path 11 into a gas storage chamber 17 provided on the lower surface of the heat piece 13, The gas is ejected from the ejection port 18 provided in the heat top 13 into the heating chamber 9.

The heat top 10 is arranged in the width direction of the heating chamber,
That is, a plurality of heat blocks are arranged at predetermined intervals in the longitudinal direction of the heat block main body 12, and slits 21 are formed between the respective heat pieces, into which the blades 20 of the substrate transfer means 19 enter. Substrate transfer means 19
Is a plurality of blades 20 longer than the entire length of the heating chamber 9.
And a support member 22 for supporting both ends of the blade 20,
The drive unit 23 drives the blade 20 via the support member 22. This driving device 23
The blade 20 is moved in the substrate transfer direction with the blade 20 raised, and is moved in the anti-substrate transfer direction with the blade 20 lowered, and is formed by appropriately combining an air cylinder and the like.

At the inlet 24 and outlet 25 of the lower heating section 2, gas ejection blocks 26 and 27 for ejecting inert gas are provided, respectively. The gas ejection blocks 26 and 27 form an air curtain at the entrance and exit of the heating chamber by ejecting an inert gas from the surface thereof to prevent air from flowing into the heating chamber. The ejection block 27 also serves to cool the substrate after the heat treatment. Both gas ejection blocks 26 and 27 are formed by a main body 29 having an inert gas flow path 28 at the center and a gas ejection piece 31 for forming a slit 30 corresponding to the blade 20. Channel 2
8, an inert gas supply pipe (not shown) is connected to each.

The upper heat block 3 is disposed so as to face the lower heat block 1, respectively, and includes a heat block body 32 similar to the lower heat block 1 and a lower surface of the heat block body 32. Is formed by the heat top 33 provided at the bottom.
The heat block main body 32 has a heater insertion portion 3.
4 and an inert gas channel 35 are provided, and a rod-shaped heater is inserted into the heater insertion portion 34. One end of the inert gas flow path 35 is closed as described above, an inert gas is supplied from an inert gas supply unit 36 provided at the other end, and is provided on the upper surface of the heat piece 33 through a through hole 37. The gas is ejected from the ejection port 39 into the heating chamber 9 through the gas storage chamber 38. In addition, at the entrances at both ends of the upper support 6, cover sides 4 that cover the upper portions of the gas ejection blocks 26 and 27 are provided.
0, 41 are provided.

The substrate P is sequentially conveyed onto the lower heat block 1 by the above-described box movement of the blade 20, and is directly heated by the lower heat block 1 heated to a predetermined temperature by the heater inserted into the heater insertion section 10. Is done. Further, the heater blocks 10 and 34 are provided in each of the heat blocks 1 and 3, and the heaters are inserted into each of the heat blocks. Therefore, by adjusting the voltage or the like applied to each heater, each of the heat blocks 1 and 3 can be mounted. The temperature can be set to a predetermined temperature without fail, and it is possible to cope with various heating patterns.

The inert gas ejected from the lower heat block 1 and the upper heat block 3 into the heating chamber 9 is as follows:
It is jetted into the heating chamber 9 while being heated to the same temperature as each of the heat blocks 1 and 3 by the heaters inserted into the heater insertion sections 10 and 34. Therefore, the substrate is lifted by the blade 20 during transfer, and the lower heat block 1
The temperature hardly changes even if it is away from.
Further, a gas storage chamber 1 is provided on the back of the heat tops 13 and 33.
By providing the outlets 18 and 39 by providing the nozzles 7 and 38, respectively, it is possible to average the amount of gas ejected from the outlets 18 and 39. Gas storage chambers 17 and 38
Can be formed at arbitrary positions within the range, so that the jet ports 18 and 39 can be formed at optimal positions according to the state of the substrate to be processed.

The gas in the heating chamber 9 is finally discharged to the exhaust pipe 42 through the exhaust slit 14 between the lower heat blocks 1 together with the flux, organic solvent, paste and the like evaporated from the solder portion of the substrate. Is done. An exhaust path from the exhaust slit 14 to the exhaust pipe 42 is formed by several members that support the lower heat block 1.

That is, the lower heat block 1 includes a pair of exhaust gas guide members 44 provided on the upper surface of the bottom plate 43 of the lower support base 5, a heat block support member 45 provided on the exhaust gas guide members 42, and a support piece. 46, and between the heat block support members 45,
A slit 47 communicating with the exhaust slit 14 is provided. Further, the exhaust gas guide member 44 has a length from an exhaust port 48 provided on one side of the bottom plate 43 to an intermediate portion in the width direction of the lower heat block 1,
A suction port 49 is formed at the tip. Further, an opening 50 communicating with the exhaust port 48 is provided on the lower surface of the bottom plate 41.
An exhaust manifold 51 having the following structure is detachably mounted. The exhaust pipe 42 is connected to the center of the bottom plate of the exhaust manifold 51.

Therefore, the gas (exhaust gas) in the heating chamber 9 flowing into the exhaust slit 14 is
From the bottom plate 43 and the heat block support member 45 through the slit 47 between the heat block support members 45, and then flow into the exhaust gas guide member 44 from the suction port 49 at the tip of the exhaust gas guide member 44. , Exhaust port 4
8 flows into the exhaust manifold 51 through the opening 50 and flows into the exhaust pipe 40.

As described above, the exhaust port 4 is provided on one side of the bottom plate 43.
By disposing the manifold 8 and attaching the manifold 51 to the lower surface of the side end portion of the lower support 5, it is possible to easily attach and detach the manifold 51 when removing the flux or the like adhered to the inside of the manifold 51. Also, the exhaust slit 14
Exhaust gas is supplied to the exhaust port 48 through the exhaust gas guide member 44 having the intake port 49 opened at the widthwise middle portion of the lower heat block 1, so that the gas flow rate on the exhaust port 48 side is increased. Exhaust gas can be exhausted uniformly from the entire exhaust slit 14 without generating one-sided flow. Therefore, the flux or the like evaporated from the solder portion can be effectively discharged from the heating chamber 9, so that the flux or the like can be prevented from adhering to the inside of the heating chamber or the substrate, and the pressure difference in the width direction of the heating chamber can be reduced. Since it does not occur, there is no inflow of air into the low-pressure part.

A trap 52 as shown in FIG. 6 is provided in the exhaust path. This trap 52
Is a relatively large diameter horizontal pipe 53 communicating with the exhaust pipe 42.
A vertical pipe 54 branched upward from the horizontal pipe 53;
3 is formed by a closing plate 55 for closing the opening end of the opening 3, and an exhaust fan 56 is provided above the standing pipe 54.

As described above, the trap 5 is located in the middle of the exhaust path.
With the provision of 2, the flux or the like flowing down the exhaust pipe 42 and flowing down together with the exhaust gas can be captured by the large-diameter horizontal pipe 53, and the flux or the like adheres to the exhaust fan 56 and the exhaust capacity is reduced. Disappears. Moreover,
Since the trap 52 is formed by the horizontal pipe 53 to which the closing plate 55 is attached, the inside of the trap 52 can be easily cleaned by removing the closing plate 55.

As shown in FIG. 7, the inert gas supply section 15 penetrates the side wall 57 of the heating chamber 5 and has a gas supply short end whose tip is in close contact with the flow path opening end of the inert gas flow path 11. A pipe 58, a cap 59 provided so as to cover an outer portion of a side wall of the gas supply short pipe 58, and an inert gas supply path 61 for supplying an inert gas to a gas supply chamber 60 provided in the cap 59. And a biasing means (coil spring) 63 provided between the flange portion 62 of the gas supply short pipe 58 and the inner surface of the gas supply chamber 60 to press the gas supply short pipe 58 toward the inert gas flow path 11. Are formed. The inert gas supply unit 15 formed as described above can absorb a change in the position of the flow path opening end of the inert gas flow path 11 due to the thermal expansion of the lower heat block 1. The upper inert gas supply section 36 can be formed in the same manner.

As shown in FIG. 3, the heating device thus formed has a substrate loading device 64 for transferring the substrate having undergone the preceding process into the heating chamber 9 and a substrate having undergone the heating process. A substrate unloading device 65 for sending out to the process is provided. The substrate loading device 64 is formed by a guide rail 66 that can be adjusted to the width of the substrate P and a transport roller (not shown). The substrate P transferred to a predetermined position on the guide rail 66 is Is transferred to the entrance-side stage 68 by the blade 20 entering the slit 67 provided at a predetermined position, and then conveyed onto the lower heat block 1 in the heating chamber 9 through the entrance-side gas ejection block 26. .

The substrate unloading device 65 is formed by a conveyor 69 which can move up and down and a guide rail 70. The substrate P transported from the inside of the heating chamber 9 onto the gas ejection block 27 on the outlet side is a blade. After being transferred to the exit side stage 71 by 20, it is transferred to the guide rail 70 by the conveyor 69, and is transported by rollers (not shown)
Is sent to the next process.

In the heating device thus formed, the soldered substrates are sequentially placed on the plurality of lower heat blocks 1 each provided with a heater, and are directly heated.
The substrate can be surely heat-treated with a predetermined temperature rising pattern. In addition, the inert gas is ejected from the lower heat block 1 and the inert gas is also ejected from the upper portion, and the gas is exhausted from the exhaust slits 14 provided on both sides of the lower heat block.
Organic solvents, pastes and the like can be evacuated smoothly.

In particular, by providing the upper heat block 3 formed in the same manner as the lower heat block 1 above the lower heat block 1, the substrate can be efficiently heated from both sides, and the inert gas ejected from the upper heat block 3 can be heated. The temperature of the gas can be set to a temperature corresponding to the substrate heating temperature, and the temperature of the substrate lifted from the lower heat block 1 during transportation does not decrease.

Further, since the upper heat block 3 is formed so as to be vertically movable, maintenance and inspection and replacement of each heat block can be easily performed. Further, by providing the ejection port of the heat piece through the gas reservoir, even if an arbitrary number of ejection ports are formed at an arbitrary position, it is possible to average out the inert gas to be ejected. By changing the diameter of the spout, the amount of inert gas spout can be adjusted.

In addition, by providing an air curtain for ejecting an inert gas at the entrance and exit of the heating chamber 9, the inflow of air into the heating chamber can be prevented, and the occurrence of poor quality due to oxidation can be prevented. Further, by forming the exhaust gas from the central portion by the exhaust gas guide member 44, the flow of the exhaust gas can be made uniform and the inflow of the atmosphere can be prevented.

Further, by providing an exhaust manifold 51 in an exhaust path from the heating chamber 9 to the exhaust pipe 42, it becomes difficult for vaporized components such as flux to flow into the exhaust pipe 42, and cleaning of flux and the like is performed by removing the exhaust manifold 51. Can be easily performed, and it is possible to prevent the exhaust path from being blocked by the flux or the like. Moreover, by providing the trap 52 on the upstream side of the exhaust fan 56, the exhaust fan 56 is not contaminated with flux or the like.

Further, since the inert gas is supplied to the inert gas flow paths 11 and 35 through the gas supply short pipe 58 urged by the coil spring 63, the heat of the heat block can be simplified. Can absorb swelling,
Inert gas leakage and air inflow can be prevented.

[0036]

As described above, according to the heating apparatus of the present invention, it is possible to reliably perform the heating process on the solder applied to the substrate. Evacuation of evaporating flux and the like can be effectively performed, and the size of the apparatus can be reduced and maintenance work can be simplified.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional front view showing one embodiment of a heating device of the present invention.

FIG. 2 is a perspective view of a main part of a lower half of the heating device.

FIG. 3 is a plan view of a lower half of the heating device.

FIG. 4 is a cross-sectional front view of a main part in the same manner.

FIG. 5 is a plan view for explaining a mounting state of a heat block.

FIG. 6 is a schematic sectional view of a trap provided in an exhaust path.

FIG. 7 is a sectional view of an inert gas supply unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Lower heat block, 2 ... Lower heating part, 3 ... Upper heating block, 4 ... Upper heating part, 5 ... Lower support, 6 ...
Upper support base, 7 female screw member, 8 screw, 9 heating chamber, 10 heater insertion section, 11 inert gas flow path,
12 ... heat block body, 13 ... heat top, 14 ...
Exhaust slit, 15: inert gas supply unit, 17: gas storage chamber, 18: jet port, 19: substrate transfer means, 20: blade, 21: slit, 23: driving device, 26, 27
... gas ejection block, 42 ... exhaust pipe, 44 ... exhaust gas guide member, 45 ... heat block support member, 48 ... exhaust port, 49 ... intake port, 51 ... exhaust manifold, 52 ... trap, 55 ... closing plate, 56 ... exhaust Fan, 58 ... gas supply short pipe, 59 ... cap, 60 ... gas supply chamber, 61 ...
Inert gas supply path, 63: coil spring, 64: substrate loading device, 65: substrate loading device

Claims (11)

[Claims] 1. A heating device having a heating chamber for melting and processing solder of a semiconductor substrate subjected to solder processing, wherein the heating chamber has a heater insertion portion and an inert gas flow path therein, A plurality of rows of lower heat blocks provided with ejection ports for ejecting the inert gas supplied from the inert gas channel on the upper surface are arranged at predetermined intervals in the substrate transfer direction, and an exhaust pipe is provided in a gap between the respective lower heat blocks. In addition to forming an exhaust slit that communicates with the lower heat block, an inert gas jetting unit that jets an inert gas from above each lower heat block, and a conveying unit that intermittently conveys the semiconductor substrate onto the lower heat block sequentially. A heating device, comprising: 2. A spout having a heater and an inert gas flow path therein inside a heating chamber above the lower heat block, and jetting out an inert gas supplied from the inert gas flow path on a lower surface. The heating device according to claim 1, wherein the upper heat block provided with: 3. The lower heat block is installed on a lower support, the upper heat block is installed on an upper support, and the upper support is formed to be vertically movable with respect to the lower support. 3. The method according to claim 2, wherein
A heating device as described. 4. A transporting means comprising: a blade provided in a slit provided in the lower heat block in a substrate transport direction so as to be movable in a vertical direction and a substrate transport direction; Move it,
2. The heating device according to claim 1, further comprising a driving unit configured to move down and move in a direction opposite to the substrate transport direction. 5. The heater according to claim 1, wherein the inert gas is heated to a predetermined temperature by a heater inserted in the heater insertion portion while passing through the inert gas flow path in the lower heat block. Item 2. The heating device according to Item 1. 6. The heating apparatus according to claim 1, wherein an air curtain for ejecting an inert gas is provided at an entrance and exit of the heating chamber. 7. The lower heat block has a heat block main body having the heater insertion portion and the inert gas flow path, and a heat block provided on an upper surface of the heat block main body, and a back surface of the heat block. 2. The heating apparatus according to claim 1, wherein a gas storage chamber is provided, which communicates with an inert gas outlet provided in the heat block main body and the jet port provided in the heat block. 8. The lower heat block includes a pair of exhaust gas guide members provided on a bottom plate of the lower support,
The exhaust block guide is supported by a heat block support member provided on the exhaust gas guide member, the heat block support member has a slit communicating with the exhaust slit, and the exhaust gas guide member is provided on one side of the bottom plate. Exhaust gas that has a length from the exhaust port portion provided on the side to the middle portion in the width direction of the lower heat block, exhaust gas sucked from the exhaust slit between the lower heat blocks, through the slit of the heat block support member It was formed to flow between the heat block support member and the bottom plate, and to be discharged from the exhaust port to the discharge pipe through the space between the exhaust gas guide members from the end of the exhaust gas guide member opened at the widthwise middle portion of the lower heat block. The heating device according to claim 1, wherein: 9. An exhaust manifold having an upper opening communicating with the exhaust port and an exhaust manifold having an exhaust pipe connection portion at a lower portion is detachably provided on a lower surface of a bottom plate of the lower support base. Heating equipment. 10. The heating apparatus according to claim 1, wherein the exhaust pipe includes a trap in a path of the exhaust pipe, and an exhaust fan at a terminal end of the path. 11. The inert gas flow path has one end closed and the other end provided with an inert gas supply unit, and the inert gas supply unit penetrates a heating chamber side wall and has a tip. A gas supply short pipe which is in close contact with the flow path opening end of the inert gas flow path, a cap provided so as to cover an outer portion of a side wall of the gas supply short pipe, and a gas supply chamber provided in the cap are provided with a gas supply chamber. And an inert gas supply path for supplying an active gas.
The heating device according to claim 1, further comprising an urging unit that presses the gas supply short tube in a direction of an inert gas flow path.