JP2000031280A5 - - Google Patents
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- Publication number
- JP2000031280A5 JP2000031280A5 JP1999171020A JP17102099A JP2000031280A5 JP 2000031280 A5 JP2000031280 A5 JP 2000031280A5 JP 1999171020 A JP1999171020 A JP 1999171020A JP 17102099 A JP17102099 A JP 17102099A JP 2000031280 A5 JP2000031280 A5 JP 2000031280A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/099093 | 1998-06-17 | ||
| US09/099,093 US6137178A (en) | 1998-06-17 | 1998-06-17 | Semiconductor metalization system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000031280A JP2000031280A (ja) | 2000-01-28 |
| JP2000031280A5 true JP2000031280A5 (US07585860-20090908-C00083.png) | 2006-06-01 |
Family
ID=22272661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11171020A Withdrawn JP2000031280A (ja) | 1998-06-17 | 1999-06-17 | 集積回路のためのメタライゼ―ション装置 |
Country Status (7)
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2786609B1 (fr) * | 1998-11-26 | 2003-10-17 | St Microelectronics Sa | Circuit integre a capacite interlignes reduite et procede de fabrication associe |
| US6849923B2 (en) | 1999-03-12 | 2005-02-01 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method of the same |
| US20060017162A1 (en) * | 1999-03-12 | 2006-01-26 | Shoji Seta | Semiconductor device and manufacturing method of the same |
| US6420252B1 (en) * | 2000-05-10 | 2002-07-16 | Emcore Corporation | Methods of forming robust metal contacts on compound semiconductors |
| US7892962B2 (en) * | 2007-09-05 | 2011-02-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nail-shaped pillar for wafer-level chip-scale packaging |
| KR101654820B1 (ko) | 2008-07-09 | 2016-09-06 | 인벤사스 코포레이션 | 감소된 도전체 공간을 가진 마이크로전자 상호접속 소자, 및 그것을 형성하는 방법 |
| TWI390756B (zh) | 2008-07-16 | 2013-03-21 | Applied Materials Inc | 使用摻質層遮罩之混合異接面太陽能電池製造 |
| WO2010068331A1 (en) | 2008-12-10 | 2010-06-17 | Applied Materials, Inc. | Enhanced vision system for screen printing pattern alignment |
| US9064968B2 (en) * | 2013-08-19 | 2015-06-23 | Phison Electronics Corp. | Non-volatile memory device and operation and fabricating methods thereof |
| US8772951B1 (en) | 2013-08-29 | 2014-07-08 | Qualcomm Incorporated | Ultra fine pitch and spacing interconnects for substrate |
| US9159670B2 (en) | 2013-08-29 | 2015-10-13 | Qualcomm Incorporated | Ultra fine pitch and spacing interconnects for substrate |
| KR102377372B1 (ko) * | 2014-04-02 | 2022-03-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 인터커넥트들을 형성하기 위한 방법 |
| US20190067178A1 (en) * | 2017-08-30 | 2019-02-28 | Qualcomm Incorporated | Fine pitch and spacing interconnects with reserve interconnect portion |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3057975B2 (ja) * | 1993-09-27 | 2000-07-04 | 日本電気株式会社 | 集積回路の配線 |
| US5471093A (en) * | 1994-10-28 | 1995-11-28 | Advanced Micro Devices, Inc. | Pseudo-low dielectric constant technology |
| JPH08293523A (ja) * | 1995-02-21 | 1996-11-05 | Seiko Epson Corp | 半導体装置およびその製造方法 |
| US5702982A (en) * | 1996-03-28 | 1997-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for making metal contacts and interconnections concurrently on semiconductor integrated circuits |
| US5846876A (en) * | 1996-06-05 | 1998-12-08 | Advanced Micro Devices, Inc. | Integrated circuit which uses a damascene process for producing staggered interconnect lines |
| US5753976A (en) * | 1996-06-14 | 1998-05-19 | Minnesota Mining And Manufacturing Company | Multi-layer circuit having a via matrix interlayer connection |
| KR100219508B1 (ko) * | 1996-12-30 | 1999-09-01 | 윤종용 | 반도체장치의 금속배선층 형성방법 |
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1998
- 1998-06-17 US US09/099,093 patent/US6137178A/en not_active Expired - Lifetime
-
1999
- 1999-05-31 DE DE69930027T patent/DE69930027T2/de not_active Expired - Lifetime
- 1999-05-31 EP EP99110469A patent/EP0966035B1/en not_active Expired - Lifetime
- 1999-06-08 TW TW088109515A patent/TW417204B/zh not_active IP Right Cessation
- 1999-06-17 JP JP11171020A patent/JP2000031280A/ja not_active Withdrawn
- 1999-06-17 KR KR1019990022670A patent/KR100598256B1/ko not_active IP Right Cessation
- 1999-06-17 CN CNB991086899A patent/CN1139112C/zh not_active Expired - Fee Related
