JP2000031211A - Bonding device and its method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid the dispersion of the height position of substrates in bonding for securing the high bonding precision. SOLUTION: The edge part of a glass substrate 17 loaded on a Q axis table 24 is supported by an under supporter 16 and in the case of bonding an electronic component 5 on this edge part, this edge level position of the loaded glass 17c is detected by a position detector 15 and then a Z axis table 23 elevating the θ axis table 24 according to the level detection result is controlled by a controller 30 so that the relative level of the underside of the glass plate 17c may be held in a specific value. Through these procedures, even if the thickness of a polarizer 17d is dispersed, the relative level positions of the glass plate 17c and the under supporter 16 in the bonding time may be held in a specific value.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and a bonding method for bonding an electronic component to a glass substrate or the like.

[0002]

2. Description of the Related Art In a manufacturing process of a display panel such as a liquid crystal panel, an electronic component such as a semiconductor element is bonded to an edge of a glass substrate. In this bonding process,
The central portion of the glass substrate is sucked and held by the suction table, and the suction table is moved by the positioning means, whereby the edge on which the electronic component is mounted is held at the correct position. Then, at the time of bonding of the electronic component, the edge of the glass substrate is received by the lower receiving member and supports the pressure load at the time of bonding.

[0003]

By the way, a polarizing plate is adhered to the back surface of the glass substrate, and in the bonding step, the glass substrate is held on the suction table via the polarizing plate. However, the thickness of the polarizing plate is not uniform and has a variation of about several tens of microns. This variation amount is larger than the height position accuracy (about 10 microns) of the bonding surface required when bonding electronic components. For this reason, when placed on the suction table, the relative height position between the lower surface of the glass substrate and the lower receiving member is not properly maintained, and the pressing state at the time of bonding is not constant, so that the bonding accuracy is improved. There was a problem that it could not be maintained.

Accordingly, an object of the present invention is to provide a bonding apparatus and a bonding method capable of eliminating variations in the height position of a substrate during bonding and maintaining good bonding accuracy.

[0005]

According to a first aspect of the present invention, there is provided a bonding apparatus comprising a mounting stage for mounting a substrate, a positioning portion for positioning the substrate, a lifting means for raising and lowering the mounting stage, A bonding tool for bonding an electronic component to an edge of the substrate placed on the mounting stage, a lower receiving portion for receiving the edge during bonding, and a height position of the edge of the substrate placed above. There is provided a height detecting means for detecting, and a control means for controlling the elevating means based on a result of the height detection.

According to a second aspect of the present invention, there is provided a bonding method for receiving an edge of a substrate mounted on a mounting stage by a lower receiving portion and bonding an electronic component to the edge. The height position of the edge of the mounted substrate is detected by height detection means, and the lifting means for raising and lowering the mounting stage is controlled based on the height detection result. Relative to the lower surface of the substrate was kept constant.

According to the present invention, the height position of the substrate is detected before bonding, and the height of the substrate is controlled based on the height detection result. The relative height position of the parts can be kept constant.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is a partial side view of the bonding apparatus, and FIGS. 3 (a), 3 (b) and 3 (c) are process explanatory views of the bonding method. is there.

First, the structure of the bonding apparatus will be described with reference to FIG. In FIG. 1, two tray holders 3 are arranged on a base 2 of a supply unit 1 for electronic components. On the tray holder 3, a tray 4 in which a large number of electronic components 5 are stored is held. A Y-axis table 6 is provided along the base 2, and an X-axis table 7 having a transfer head 8 is mounted on the Y-axis table 6. By driving the Y-axis table 6 and the X-axis table 7, the transfer head 8 moves horizontally and picks up the electronic components 5 stored in the tray 4.

On the side of the supply section 1, a delivery section 10 for electronic components is provided. Delivery unit 10 is moving table 1
1 is provided with a holding plate 12 which moves in the X direction. The transfer head 8 picking up the electronic component 5 from the tray 4 moves onto the holding plate 12 indicated by a solid line, and transfers the picked up electronic component 5 onto the holding plate 12. The holding plate 12 that has received the electronic component 5 advances to the position indicated by the broken line in FIG.
The electronic component 5 is transferred to the third bonding tool 14.

The rotating head 13 has four 90 ° equidistant positions.
Bonding tools 14 are provided, and a bonding position is located below the bonding tool 14 at a position distant from the transfer unit 10 in the opposite direction, and is provided with a position detector 15 as height detecting means. Receiving member 1
6 are provided. The electronic component 5 is bonded to the glass substrate 17 by lowering the bonding tool 14 holding the electronic component 5 with the edge of the glass substrate 17 to be bonded positioned on the lower receiving member 16.

A positioning portion 20 is provided beside the lower receiving member 16.
Are arranged. The positioning unit 20 is an X-axis table 2
1, a Y-axis table 22, a Z-axis table 23 and a θ-axis table 24 are stacked. The upper surface of the θ-axis table 24 is a suction table as a mounting stage on which the glass substrate 17 is mounted, and sucks and holds the glass substrate 17. X-axis table 21, Y-axis table 2
By driving the glass substrate 17, the glass substrate 17 moves horizontally, and by driving the Z-axis table 23, the glass substrate 17 moves up and down. That is, the Z-axis table 23 serves as a means for elevating the glass substrate 17.

As shown in FIG. 2, the glass substrate 17 has two glass plates 17b and 17c and two glass plates 17b and 17c.
It is composed of polarizing plates 17a and 17d attached to the surface of c. The glass substrate 17 is held by the upper surface of the θ-axis table 24 via the polarizing plate 17c, and the glass substrate 17 is driven by driving the X-axis table 21, the Y-axis table 22, the Z-axis table 23, and the θ-axis table 24. Is positioned on the lower receiving member 16.

The lower receiving member 16 is divided at the center,
A position detector 15 is mounted on the division part. When the lower surface of the glass plate 17b contacts the probe 15a of the position detector 15, the position detector 15 detects the height position of the glass plate 17b. This height detection result is sent to the control unit 30 as control means. The control unit 30 controls the Z-axis table 23 based on the height detection result, so that even when the thickness t of the polarizing plate 17c varies, the lower surface of the glass plate 17b can be positioned on the upper surface of the lower receiving member 16. And the height position of the mounting surface A on the upper surface of the glass plate 17b can be accurately maintained. Anisotropic conductive tape 1 is attached to the edge of glass plate 17b whose height is maintained in this manner.
The electronic component 5 is bonded via the reference numeral 8.

This bonding apparatus is configured as described above, and its operation will be described below with reference to FIG. In FIG. 3A, a glass substrate 17 having an anisotropic conductive tape 18 previously bonded to a bonding position at an edge of a glass plate 17b is adsorbed on a θ-axis table 24 via a polarizing plate 17c. By driving each table of the positioning section 20, the glass substrate 17 is moved to the lower receiving section 16.
(Arrow a), and after the edge is correctly aligned with the lower receiving portion 16, the Z-axis table 23 is driven to lower the glass substrate 17 (arrow b).

At the measurement height position set during the lowering operation, the lower surface of the glass plate 17b contacts the probe 15a of the position detector 15, and the height of the lower surface of the glass plate 17b at the measurement height position is increased. Is detected. The height detection result is sent to the control unit 30. The control unit 30 calculates the correction amount of the drive amount of the Z-axis table 23 for correcting the height position shift due to the variation in the thickness of the polarizing plate 17c from the height detection result of the glass plate 17b at the measurement height position. It calculates and controls the Z-axis table 23 based on this correction amount. As a result, as shown in FIG.
The lower surface of 7 b accurately contacts the upper surface of the lower receiving member 16.
That is, even when the thickness of the polarizing plate 17c varies, the glass plate 17b is correctly received by the lower receiving member 16, and as a result, the bonding surface A of the glass plate 17b is always kept at a constant height. It is.

Next, the bonding tool 14 holding the electronic component 5 is lowered with respect to the edge of the glass plate 17b. Then, as shown in FIG. 3C, the electronic component 5 is heated while being pressed against the glass plate 17b via the anisotropic conductive tape 18. By holding this state for a predetermined time, the electronic component 5 is bonded to the glass substrate 17. At this time, since the height position of the bonding surface is always kept correct, the pressing state at the time of pressing can be made uniform,
Good bonding accuracy can be obtained with a predetermined bonding load.

In the present embodiment, an example is shown in which a contact type position detector is used as the height detecting means. In addition, an optical type position detector such as a laser displacement meter may be used. Is also good.

[0019]

According to the present invention, the height position of the substrate is detected before bonding, and the height of the substrate is controlled based on the height detection result. The relative height position of the parts can be kept constant. Therefore, a good bonding accuracy can be obtained while keeping the bonding load uniform at all times.

[Brief description of the drawings]

FIG. 1 is a perspective view of a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a partial side view of the bonding apparatus according to the embodiment of the present invention;

FIG. 3A is a diagram illustrating a process of a bonding method according to an embodiment of the present invention. FIG. 3B is a diagram illustrating a process of a bonding method according to an embodiment of the present invention. Process illustration of the method

[Description of Signs] 5 Electronic component 6 Y-axis table 7 X-axis table 8 Transfer head 15 Position detector 16 Lower receiving member 17 Glass substrate 20 Positioning unit 21 X-axis table 22 Y-axis table 23 Z-axis table 24 θ-axis table 30 control unit

Continued on the front page (72) Inventor Tadanobu Higashida 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F-term (reference) 4M105 AA06 BB09 EE17 EE18

Claims (2)

[Claims] A positioning section for positioning the substrate, a lifting / lowering means for raising and lowering the mounting stage, and an edge of the substrate mounted on the mounting stage. A bonding tool for bonding an electronic component, a lower receiving portion for receiving the edge portion during bonding, height detecting means for detecting a height position of the edge portion of the substrate placed above, and a result of the height detection And a control means for controlling the lifting / lowering means on the basis of (1). 2. A bonding method for receiving an edge of a substrate mounted on a mounting stage by a lower receiving portion and bonding an electronic component to the edge, wherein the edge of the substrate mounted on the mounting stage is provided. Height position is detected by height detection means,
A bonding method, wherein the height of the lower surface of the substrate with respect to the lower receiving portion at the time of bonding is kept constant by controlling the lifting means for lifting and lowering the mounting stage based on the height detection result. .