JP2000026131A - Firing treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a firing treatment apparatus capable of dealing with the trend of a PDP toward a larger size, higher quality and mass production in the manufacture of the front surface plate and rear surface plate of the PDP. SOLUTION: The firing treatment apparatus 100 for firing blanks for working of substrates to be treated for plasma display while transporting these substrates is successively provided with a substrate to be treated feeding section 110 for feeding the substrates to be treated, a heating section 120 for firing the blanks for working of the substrates to be treated and a first cooling section 130 for slowly cooling the treating substrate down to their distortion point in the upper stage and is provided, successively from the first cooling section side, with a second cooling section 150 for rapidly cooling the substrates to be treated nearly down to ordinary temp. after attaining the distortion point of the substrates to be treated or below, a speed changing section 160 capable of transporting the substrates to be treated after the firing treatment by properly changing the speed to at least one of the plural desired speeds, a buffer section for stocking the substrates to be treated and a section for taking out the substrates to be treated and is provided with a first elevator 140 for executing the movement from the upper stage to the lower stage of the substrates 171 to 3 to be treated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a baking apparatus for baking a processing material, and more particularly, to a baking apparatus for processing a substrate for a plasma display.

[0002]

2. Description of the Related Art In recent years, plasma display panels (hereinafter, also referred to as PDPs) have been used in various display devices because of their small depth, light weight, clear display, and wide viewing angle compared to liquid crystal panels. It is being used.
Generally, a plasma display panel (PDP) has two
A pair of regularly arranged electrodes are provided on a pair of opposed glass substrates, and a gas mainly containing neon, xenon, or the like is sealed between the pair of electrodes. Then, a voltage is applied between these electrodes, and a discharge is generated in minute cells around the electrodes, so that each cell emits light and display is performed. In particular, in order to display information, regularly arranged cells are selectively discharged to emit light.

Here, the configuration of the PDP is shown in FIG.
An example of the type PDP will be described. FIG. 7 is a perspective view of the PDP structure, but shows the front plate (glass substrate 710) and the rear plate (glass substrate 720) apart from the actual case for easy understanding. As shown in FIG. 7, two glass substrates 710 and 720 are disposed in parallel and opposed to each other, and both are provided on a glass substrate 720 serving as a back plate in parallel with each other (cell barrier). 730)
Are held at regular intervals. On the back side of the glass substrate 710 serving as a front plate, composite electrodes composed of a transparent electrode 740 serving as a discharge sustaining electrode and a metal electrode 750 serving as a bus electrode are formed in parallel with each other.
A dielectric layer 760 is formed, and a protective layer (MgO layer) 770 is further formed thereon. In addition, on the front side of a glass substrate 720 serving as a back plate, an address electrode 780 is positioned between barriers 730 so as to be orthogonal to the composite electrode.
Are formed in parallel with each other, and a fluorescent surface 790 is provided so as to cover the wall surface of the barrier 730 and the cell bottom surface. The barrier 730 is for defining a discharge space, and each partitioned discharge space is called a cell or a unit light emitting region.
This AC type PDP is a surface discharge type, and has a structure in which an AC voltage is applied between composite electrodes on the front panel to cause discharge. In this case, since the alternating current is applied, the direction of the electric field changes according to the frequency. Then, the phosphor 790 is caused to emit light by the ultraviolet light generated by the discharge, and the light transmitted through the front plate can be visually recognized by an observer. In addition, DC type PDP
In the above, the electrode is different from the AC type in that the electrode has a structure not coated with the dielectric layer, but the discharge effect is the same. 7 has a structure in which an underlayer 767 is provided on one surface of a glass substrate 720 and a dielectric layer 765 is provided thereon, but the underlayer 767 and the dielectric layer 765 are not provided.
Is not necessarily required.

An AC type plasma display (PDP) has been manufactured, for example, as shown in FIG. FIG. 6 shows an AC type PDP manufacturing process, in which a back plate and a front plate are manufactured in separate steps, respectively, and a PDP is assembled using both. First,
The manufacturing process of the back plate will be described. Note that S51 to S74 represent processing steps. First, prepare a glass substrate (S
51) An electrode wiring paste is applied on one surface of a glass substrate, dried, and processed into a predetermined shape through a plate making process, or the electrode wiring paste is formed on a glass substrate by a thick film printing method. Then, it is baked to form an electrode wiring. (S52) Next, a dielectric layer is formed on the entire surface of the formed electrode so as to cover the glass substrate surface. (S53) Next, a barrier (also called a barrier rib) is formed on the dielectric layer of the glass substrate by a printing method or a sandblast method. (S54) In the case of the printing method, a paste for forming a barrier (barrier rib) is printed in a predetermined pattern on a glass substrate by a thick film printing method,
This is dried. The thickness of the barrier is large (for example, 100 to 2).
(Thickness of 00 μm) Since this film thickness cannot be obtained by one thick film printing, printing and drying of the barrier forming paste are performed a plurality of times. After a predetermined film thickness is obtained, the paste is fired. In the case of the sand blast method, a barrier forming material is applied on a glass substrate, and after forming a predetermined resist pattern thereon, abrasive sand is sprayed to process the barrier forming material into a shape corresponding to the resist pattern. This is fired to form a barrier. Further, a paste for a phosphor (for example, a paste for a phosphor containing indium oxide) is printed in a predetermined pattern on the substrate on which the barrier is formed by a thick film printing method, and then dried and fired (S55). Form a faceplate. (S56)

Next, a process for manufacturing the front plate will be described. First, a glass substrate is prepared (S61), and a deposition layer of, for example, ITO (Indium Tin Oxide) is patterned on the glass substrate. (S62) The patterning is performed by a normal photolithography process (lithography technology). Next, three layers of Cr-Cu-Cr (chromium, copper, chromium) are formed by vapor deposition or sputtering, and a photolithography process (lithography technology) is performed similarly.
To form an electrode wiring for discharge together with the patterned ITO film. (S63) Next, a transparent dielectric layer is formed by solid printing of paste-like low melting point glass (S64), and a front plate is obtained. (S65)

Next, a PDP is manufactured using the back plate and the front plate thus obtained as follows. First, the front plate and the back plate are aligned, and in that state, lead glass for sealing is applied to the edges of both substrates, and then sealing is performed. (S71) Next, after the inside of the gap surrounded by both substrates (the back plate and the front plate) and the seal portion is exhausted through the exhaust pipe, the discharge gas is sealed in the above-mentioned gap through the exhaust pipe. . (S72) Thereafter, the exhaust pipe is burned off (chip off), and a driver IC is mounted (S73), whereby a PDP (plasma display panel) is obtained. (S74) As described above, the back plate and the front plate used for the production of the PDP are subjected to various processes to form an electrode wiring portion, a barrier portion, a phosphor portion, a dielectric layer portion, and the like. And PDP
Becomes

In the production of such a PDP, formation of an electrode wiring portion, formation of a barrier, and the like have recently been performed by sandblasting in terms of productivity, quality, and the like. In this sandblasting process, a processing material composed of a low-melting glass paste for forming an electrode wiring portion and a barrier is applied onto a glass substrate, respectively, and a predetermined resist pattern is formed thereon. Processing the barrier forming material into a shape corresponding to the spray resist pattern,
This is fired to form an electrode wiring portion and a barrier, respectively. However, as the glass substrate, an annealed substrate is used, and each process is performed. Since such a baking process is performed a plurality of times, the management of expansion and contraction of the glass substrate itself is also performed in each process. Required.
For this reason, the baking treatment referred to here is a process of baking the working material after forming a working material made of these low-melting glass pastes on a glass substrate, as shown in FIG. After holding at a temperature Tk for a predetermined time, the glass substrate is gradually cooled to a strain point Ts,
Further, the glass substrate is cooled to room temperature, thereby controlling the expansion and contraction of the glass substrate itself in each process. FIG.
In the graph, T0 indicates normal temperature. In addition, the annealing step
Briefly, it is a process for removing permanent distortion of the glass substrate.
The strain point of the glass substrate is a temperature at which there is no possibility of newly generating permanent distortion due to the rapid cooling, no matter how rapidly the glass substrate is cooled from this temperature. When the temperature is rapidly cooled from the strain point (temperature) to normal temperature, the glass substrate shrinks even during this time, but if the quenching rate is kept constant, the shrinking value can be fixed. That is, the amount of expansion and contraction can be controlled by the value of the cooling rate from the peak temperature to the strain point. In addition, the peak temperature in the firing step is usually a temperature for sintering the working material, and is maintained at this peak temperature for a predetermined time. Usually, the conductive paste for forming the electrode wiring is made of metal fine particles (for example, Ag), a low-melting glass frit, a resin, and a solvent, and the paste for forming the dielectric layer is made of the low-melting glass frit, a resin, and a solvent. And fillers, pigments and the like are added as necessary. The paste for forming the barrier is made of a low-melting glass frit, a filler (alumina, zirconia, etc.), a pigment, a resin, and a solvent. These pastes are generally referred to as low-melting glass or low-melting glass paste because they contain, as a main component, a low-melting glass frit for flowing and fixing in a firing process.

[0008]

Under these circumstances, in recent years, PDPs have been required to be large-sized, high-quality, and mass-produced. There has been an increasing demand for a sintering processing apparatus that can satisfy the quality requirements. The present invention has been made to address this, and it is an object of the present invention to provide a baking treatment apparatus capable of coping with an increase in the size, quality, and mass production of a PDP in manufacturing a back plate and a front plate for a PDP.

[0009]

A baking treatment apparatus according to the present invention is a baking treatment apparatus for baking a processing material for a processing substrate while transporting a processing substrate for a plasma display. A processing substrate input section for inputting a processing substrate, a heating section for firing a processing material of the processing substrate, and a first cooling section for gradually cooling the processing substrate to a strain point or lower. In order from the cooling unit side, after reaching the strain point of the processing substrate or less, a second cooling unit that rapidly cools the processing substrate to almost normal temperature, and a processing substrate after the baking process are appropriately subjected to at least one of a plurality of desired speeds. A speed change unit that can transfer the substrate at a single speed, a buffer unit that stocks the processing substrate, and a take-out unit for the processing substrate, and a first elevator that moves from the upper stage to the lower stage of the processing substrate. Characterized by Than it is. In the above, the heating unit and the first cooling unit are provided with a plurality of heating heaters along the transport direction, and the second cooling unit cools the cooling water through a tube. And the heater can be divided for each of a plurality of predetermined distances in the transport direction, and can separately control the temperature. Further, in the above, the processing substrate is placed on a heat-resistant glass substrate, and is transported by a roller-type conveyor. 2nd moving substrate or heat resistant glass substrate
Is provided. Further, a heat-resistant glass substrate loading / unloading section for loading / unloading the heat-resistant glass substrate from / to the lower buffer section is provided. Here,
A mechanism in which a plurality of rollers are rotated at substantially the same rotation speed to transport a processing substrate is called a roller type conveyor or simply a conveyor. Usually, one roller type conveyor uses a single drive source to make a plurality of rollers substantially the same. Rotate at speed.

[0010]

The baking treatment apparatus of the present invention having such a structure can provide a baking treatment apparatus capable of coping with the increase in size, quality, and mass production of PDPs in manufacturing back and front plates for PDPs. It is possible to provide. Specifically, a baking processing apparatus for baking a processing material of the processing substrate while transporting the processing substrate for the plasma display, and a processing substrate loading unit for loading the processing substrate in order in the upper stage, A heating unit for baking the processing material of the processing substrate and a first cooling unit for gradually cooling the processing substrate to a temperature below the strain point are provided, and the lower stage is, in order from the first cooling unit side, below the strain point of the processing substrate. A second cooling unit that rapidly cools the processing substrate to approximately room temperature after reaching, a speed changing unit that can appropriately transfer the processing substrate after the firing process to at least one of a plurality of desired speeds, This is achieved by providing a buffer unit for stocking the processing substrate and a take-out unit for the processing substrate, and providing a first elevator for moving the processing substrate from the upper stage to the lower stage. More specifically, the heating unit and the first cooling unit are provided with a plurality of heating heaters along the transport direction, and the second cooling unit is provided with cooling water for cooling through a tube. And, the heater is divided for each of a plurality of predetermined distances in the transport direction,
Since the temperature can be separately controlled, it is possible to obtain a desired firing temperature profile for the processing substrate as shown in FIG. Thereby, plate making for electrode wiring formation on a glass substrate for plasma display, plate making for barrier formation, etc., apply a low melting point glass paste, and after drying, make plate making using a photomask. In the patterning method, it is possible to eliminate a problem in manufacturing a photomask and a problem in management due to expansion and contraction of a glass substrate. In particular, in the case of PDP, since the temperature of the processing substrate is raised to a temperature at which the processing substrate is deflected and baked, a method of transporting the processing substrate includes a method in which the processing substrate is placed on a heat-resistant glass substrate and transported by a roller type conveyor. Also, at the bottom,
A speed change unit that can appropriately transfer the processed substrate after baking processing to one of a plurality of desired speeds, a buffer unit that stocks the processed substrate, and a unit that takes out the processed substrate are provided. Accordingly, the substrate after the baking treatment can be appropriately transported and taken out or stocked as appropriate, and it is easy to cope with any transport trouble. Further, by providing the second elevator for moving the processing substrate or the heat-resistant glass substrate from the processing substrate take-out part to the processing substrate input part, the heat-resistant glass substrate on which the processing substrate is mounted can be continuously arranged from the lower stage to the upper stage. It can be moved to. Further, by providing a heat-resistant glass substrate taking-in / out portion for taking in / out the heat-resistant glass substrate from the lower buffer portion, it is made more practical.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A sintering apparatus according to the present invention will be described by way of an embodiment. FIG. 1 shows a schematic cross-sectional view of an example of an embodiment of a baking treatment apparatus of the present invention.
FIG. 2 is a diagram schematically illustrating zone division and tact transfer for explaining a heating method of an upper heating unit and a first cooling unit, and FIG. 3 is a diagram illustrating a heating profile of a processing substrate. . FIG. 1 schematically shows the arrangement of each part with the A1 side being the top (top), and the dotted arrows in FIG. 1 show the direction of movement of the processing substrate during processing. . Also, in FIG. 2, numerals 1 to 17 indicate the respective zones, dotted arrows indicate the continuous operation of transport, and the end points indicate the stop positions.
In FIG. 1, 100 is a baking processing apparatus, 110 is a processing substrate loading section, 120 is a heating section, 130 is a first cooling section, 140 is a first elevator, 150 is a second cooling section, and 160 is a speed change section. (Variable transport unit), 165 is a transport unit, 17
1, 172 and 173 are buffer units, 180 is a processing substrate take-out unit, and 190 is a second elevator.

In this embodiment, a back plate (processing substrate) for a PDP provided with a processing material made of a low-melting glass paste for forming a barrier is placed on a heat-resistant glass substrate, and is processed substantially horizontally while being conveyed. This is a baking processing apparatus for baking a material. The baking processing apparatus is provided in two stages and has a small processing area, and can cope with an increase in the size, quality and mass production of a PDP. As shown in FIG. 1, a processing substrate input section 110 for inputting a processing substrate, a heating section 120 for firing a processing material of the processing substrate, and a processing substrate The first to slowly cool to the point
The first cooling unit 130 is provided at the lower stage.
In order from the side, after reaching the strain point of the processing substrate or less, the second cooling unit 150 that rapidly cools the processing substrate to almost room temperature, and the processing substrate after the baking process is appropriately subjected to at least one of a plurality of desired speeds. Speed change unit 160 that can convey while changing the speed
And a buffer section 170 for stocking the processing substrate and a take-out section 180 for processing substrate, and a first elevator 140 for moving the processing substrate from the upper stage to the lower stage.

In the apparatus 100 of this embodiment, FIG.
As shown in the figure, the upper stage is divided into 17 zones at substantially equal intervals along the transport direction of the processing substrate. Usually, the heating unit 120 has 1 to 11 zones, and the first cooling unit 130 has , 12 zones to 17 zones, but is not limited thereto. Zones 1 to 10 can perform one temperature control (heating control), and zones 11 to 17 can independently perform temperature control (heating control). Note that, in each zone along the transport direction of the upper heating unit 110 and the first cooling unit 120, heating heaters are arranged vertically so as to heat the upper and lower surfaces of the processing substrate, respectively.
Temperature control is performed by driving these heaters. Further, in the device 100 of this example, FIG.
(B) As shown in (a), only continuous conveyance at a predetermined speed can be performed between zones 1 to 10;
Each of the 17 zones can be tact-conveyed. One roller-type conveyor driven by one drive source (also simply referred to as a conveyor) between 1 zone and 10 zones, and one roller-type conveyor driven by one drive source in each of 11 zones through 17 zones , Each of which is independently controlled. Of course, if necessary, as shown in FIG.
It is also possible to continuously convey between 17 zones at a predetermined speed.

As described above, the zones are divided, and the temperature is controlled (heated) in each of the predetermined zones, and the transport method can be switched to the tact transport. By appropriately performing temperature control (heating control) in each of the predetermined zones and appropriately taking the transport method,
That is, each zone of 11 to 17 zones (usually corresponding to a first cooling section for performing cooling) is tact-conveyed to each zone, as shown in FIG. The temperature rise process, keep temperature keeping process,
It is possible to cope with the slow cooling process, and a desired firing profile of the processed substrate can be obtained as shown in FIG. Since FIG. 3 has already been described, the description is omitted here.

As the heater, a far-infrared heater is preferable from the viewpoint of dustproof effect, but is not limited thereto. The material of the roller and the material of the wall of the roller-type conveyor to be conveyed must withstand the baking treatment temperature. Here, a stainless roller is used, and the contact portion with the setter is made of ceramic. The wall is made of glass fiber. Here, the tact transfer is a transfer method in which the processing substrate is transferred from each zone to the next adjacent zone, and is stopped for a predetermined time. In addition, various apparatus conditions such as a conveyor speed, heating conditions, and cooling conditions are set according to the material and size of the processing substrate, the type of the processing material to be fired, and the like.
When soda glass having a size of 0 mm × 1000 mm and a thickness of 2.8 mm is used and a processing material for forming a barrier made of low-melting glass is fired, if the overall length of the apparatus is set to about 25 m, the components are arranged so as to function sufficiently. be able to.

In the device 100 of the present embodiment, the second cooling unit
Cooling water for cooling is passed through a tube to cool.

In the apparatus 100, as shown in FIG. 4A, the processing substrate 200 is set on the mounting table 191 of the second elevator 190, and the position of the processing substrate 200 is adjusted to the position of the conveyor 221. And is fed into the upper conveyor 211. Further, the processed substrate 200 is transferred from the lower conveyor 216 to the conveyor 2.
At 22, it is taken out, and its position is
In the state adjusted to the position of No. 2, the mounting table 191 of the second elevator 190 with a roller (not shown)
It is sent via a roller, where the processed substrate is taken out.

The loading of the processing substrate 200 from the upper conveyor 212 to the first elevator 140 and the movement of the processing substrate 200 from the first elevator 140 to the lower conveyor 215 are appropriately performed in the predetermined direction. Elevator 140
The roller (not shown) attached to is rotated. That is, as shown in FIG. 4B, the processing board 200 is moved from the upper conveyor 212 to the first elevator 140 with the mounting table 141 of the first elevator 140 being aligned with the upper conveyor 212. In the state where the position of the mounting table 141 of the first elevator 140 is adjusted to the position of the lower conveyor 215,
From the mounting table 141 of the first elevator 140, it is moved to the lower conveyor 215.

As shown in FIG. 5, a take-out portion 230 for taking out the heat-resistant glass substrate 205 for taking out the heat-resistant glass substrate from the lower buffer portion 171 is provided. In the present apparatus 100, the heat-resistant glass substrate 205 serving as a setter for setting the processing substrate 200 can be taken in and out via a conveyor 241 provided on the side surface of the lower buffer unit 171. Conveyor 241 and cart 2
The heat-resistant glass substrate 205 is carried to 45. Thereby, it is possible to cope with transport troubles of the processing.

The speed change section 160 is a transfer section that can change the speed of the conveyor, and can change the speed of the conveyor. The transport speed can be controlled independently of the subsequent transport unit 165. This device 1
In 00, a transport unit 165 that cannot switch the transport speed is provided following the speed change unit 160. Following the transport section 165, buffer sections 171, 172, and 173 capable of independently performing transport are provided. Thus, it is possible to appropriately take out the processed substrate as needed, and to cope with a transport trouble.

The example shown in FIG. 1 is an embodiment of the present invention, and the present invention is not limited to this. For example, the transfer method is not limited to the transfer using a plurality of conveyors. In this example, the heat-resistant glass substrate is used as the setter to transfer the processing substrate. However, another heat-resistant setter may be used.

[0022]

As described above, the present invention makes it possible to provide a baking treatment apparatus for performing a baking treatment of a processing material in PDP production so as to be efficient and satisfy the quality. As a result, the PDP can respond to the increase in size, quality, and mass production of PDPs.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of an embodiment of a baking treatment apparatus of the present invention.

FIG. 2 is a diagram simply showing upper zone division and tact transfer.

FIG. 3 is a diagram showing a heating profile of a processing substrate.

FIG. 4 is a schematic diagram for explaining the operation of the elevator.

FIG. 5 is a diagram for explaining a portion where a heat-resistant glass substrate is inserted and removed.

FIG. 6 is a process chart for explaining a PDP manufacturing process.

FIG. 7 is a diagram illustrating a PDP substrate.

[Explanation of symbols]

REFERENCE SIGNS LIST 100 Baking processing apparatus 110 Processing substrate input section 120 Heating section 130 First cooling section 140 First elevator 141 Mounting table 150 Second cooling section 160 Speed shift section (shifting transfer section) 165 Transfer section 171, 172, 173 Buffer Unit 180 Processing substrate take-out unit 190 Second elevator 191 Mounting table 200 Processing substrate 205 Heat-resistant glass substrate (also referred to as setter) 211, 212, 221, 222, 215, 216
Conveyor 240 Heat-resistant glass substrate loading / unloading section 241 Conveyor 245 Cart

Continued on the front page F term (reference) 3K058 BA19 CB12 4G015 CA08 CA10 CB02 CC02 GA01 4K050 AA04 BA17 CA13 CD06 CF06 CF16 CG04 CG06 5C012 AA09 BD05 5C040 FA01 JA22 MA22 MA24 MA25

Claims (5)

[Claims] 1. A baking processing apparatus for baking a processing material of a processing substrate while transporting a processing substrate for a plasma display, comprising: a processing substrate loading section for loading a processing substrate in order in an upper stage; A heating unit for baking the processing material of the processing substrate and a first cooling unit for gradually cooling the processing substrate to a temperature below the strain point are provided, and the lower stage is, in order from the first cooling unit side, below the strain point of the processing substrate. After the temperature reaches the second cooling unit for rapidly cooling the processing substrate to almost room temperature,
A speed shifting unit capable of shifting at least one of a plurality of desired speeds for conveyance, a buffer unit for stocking a processing substrate, and a processing substrate take-out unit are provided, and the processing substrate is moved from an upper stage to a lower stage. A sintering processing apparatus, comprising a first elevator for performing the following. 2. A heating device according to claim 1, wherein the heating unit and the first cooling unit are provided with a plurality of heating heaters along the transport direction, and the second cooling unit supplies cooling water for cooling to a tube. Wherein the heating heater is divided for each of a plurality of predetermined distances in the conveying direction and can be separately temperature-controlled. 3. The baking processing apparatus according to claim 1, wherein the processing substrate is placed on a heat-resistant glass substrate and transported by a roller type conveyor. 4. The baking processing apparatus according to claim 3, further comprising a second elevator for moving the processing substrate or the heat-resistant glass substrate from the processing substrate take-out section to the processing substrate loading section. 5. The baking treatment apparatus according to claim 3, further comprising a heat-resistant glass substrate loading / unloading section for loading and unloading a heat-resistant glass substrate from a lower puffer section.