JP2000025070A - Molded wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a release or a warp or a crack by providing a step on a retaining pin of a mold, charging resin in a stepwise extracted cavity, and forming a secondary resin molding. SOLUTION: A metal frame 5 is fixed by a retaining pin 6 of a mold in which a diameter of a part brought into contact with the frame 5 is reduced. Resin is insert molded in this state. Here, a primary resin molding 7 is the state of covering peripheries of the frame 5 and the pin 6. Then, at the time of completion, the resin is charged in an extracted cavity 9 with a step 8 at the cavity in which the pin 6 is drawn to form a secondary resin molding 10. At this time, the step 8 is also formed at the molding 10. The molding 7 and the molding 10 are increased in contact areas thereof with one another, and strongly bonded to one another in the form of engaging at the step 8 with one another. Thus, a release, a warp or a crack is prevented, and a deterioration of its insulating performance can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded wiring board used for general household appliances such as an air conditioner.

[0002]

2. Description of the Related Art Conventionally, a molded wiring board used for the purpose of soldering or passing a current through a connector to an electronic control device of a general household appliance such as an air conditioner, is manufactured as shown in FIG. As shown in the side cross-sectional view during the production of a), insert molding with resin is performed in a state where a metal frame 1 obtained by punching a plate-shaped metal plate with a mold is fixed on the mold with a press pin 2 of the mold. And the primary resin molding section 3
Covers the metal frame 1 and the presser pin 2 and, when completed, is shown in a side sectional view at the time of completion of FIG. 7 (b) and a top view at the time of completion of FIG. 7 (c). As described above, the resin is filled into the trace where the holding pin 2 in FIG. 7A is pulled out to form the secondary resin molded part 4.

[0003]

However, in the above-mentioned conventional molded wiring board, particularly when the metal frame is long, the self-heating due to the energization of the metal frame and the molding wiring are not performed due to the difference in the coefficient of thermal expansion between the metal frame and the molding resin. Due to a change in the ambient temperature of the plate, stress is applied between the metal frame and the molding resin during expansion and contraction, and when the temperature change is repeated, between the primary resin molding portion and the secondary resin molding portion and between the metal frame and the molding resin. When the adhesion is lost, a gap is generated, or when the stress is locally concentrated, a warp or a crack is generated in the molding resin, and as a result, moisture or the like invades the gap or the crack to induce corrosion of the metal frame. However, there is a problem that the insulation between the metal frames is deteriorated or the insulation distance is insufficient. To solve the problem, a large insulation distance between the metal frames is required. Ri, it is necessary or to increase the thickness of the resin mold, in addition to reliability, has been a major obstacle cost for miniaturization.

[0004] The present invention solves the above-mentioned problems, and it is not necessary to increase the insulation distance between the metal frames or increase the thickness of the resin mold, which is an obstacle in terms of reliability, cost, and miniaturization. It is an object to provide a molded wiring board without any.

[0005]

In order to solve the above-mentioned problems, a molded wiring board according to the present invention comprises a metal frame for fixing a metal frame used when forming a primary resin molded portion by insert resin molding. A step is formed on the pressing pin of the mold, and the resin is filled into the punched trace portion to form a secondary resin molded part. Peeling may occur between the primary resin molded part and the secondary resin molded part. In addition, warpage and cracks do not occur, the insulation distance between adjacent metal frames can be ensured, and the deterioration of insulation performance can be prevented without increasing the thickness of the resin mold accompanying an increase in cost.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a stepping step for a holding pin of a metal frame fixing die used when forming a primary resin molded portion by insert resin molding of a metal frame. A molded wiring board in which a secondary resin molded part is formed by filling a resin into a punched trace part having a step. The contact area between the primary resin molded part and the secondary resin molded part increases due to the step. In addition, the primary resin molded portion and the secondary resin molded portion have an action of being engaged with each other and being strongly coupled.

According to a second aspect of the present invention, a metal frame is fixed with a pressing pin of a mold, a primary resin molded portion is formed by insert resin molding, and the traces of the pressing pin are connected. A molded wiring board in which a groove is formed and a resin is continuously filled in the punched trace portion and the groove to form a secondary resin molded portion, and a groove connecting the punched trace portion of the holding pin,
This has an effect that a plurality of traces can be filled with resin at one time.

According to a third aspect of the present invention, there is provided the molded wiring board according to the second aspect, wherein a part of the groove is a curved groove. The moldings have the effect of increasing the contact area between them.

According to a fourth aspect of the present invention, an independent primary resin molded portion is formed by insert-molding a metal frame for each conduction pattern, and the metal frame is formed on the outer surface of each primary resin molded portion. Molded wiring in which independent primary resin molded portions are overlapped so that the curved protrusions face each other, and a resin is filled in a space between the overlapped primary resin molded portions to form a secondary resin molded portion. It is a plate, and the primary resin molded portion and the secondary resin molded portion have an effect of increasing the contact area of each other by the curved projections, and improving the bonding strength.

According to a fifth aspect of the present invention, a metal frame is fixed with a press pin of a mold, a primary resin molded portion is formed by insert resin molding, and a resin trace is formed on a trace of the press pin. To form a secondary resin molded part, and a recessed groove formed in the surface of the primary resin molded part between opposing secondary resin molded parts. The recessed groove on the surface has the effect of ensuring an insulation distance corresponding to the depth of the groove.

The invention according to claim 6 of the present invention is the molded wiring board according to claim 5, wherein a protrusion is formed on the surface of the primary resin molding around the groove. Thereby, the strength of the primary resin molded portion thinned by the groove portion is enhanced.

According to a seventh aspect of the present invention, a metal frame having a resin thickness different on both sides of the metal frame is formed by insert resin molding while fixing the metal frame with a pressing pin of a mold. This is a molded wiring board in which the shape of the trace of the holding pin, which is the thinner, is smaller than the shape of the trace of the retainer pin, which is the thicker resin. The thicker the thickness, the larger the insulation distance is secured, and the smaller the thickness of the resin molded portion, the smaller the shape of the trace of the retaining pin, so that the degree of exposure of the metal frame is reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1A is a sectional side view of a molded wiring board according to Embodiment 1 of the present invention in the process of manufacturing, and FIG. 1B is a sectional side view of the completed molded wiring board. As shown in the side cross-sectional view in the middle of the manufacturing of FIG. 1A, the metal frame 5 obtained by punching a plate-shaped metal plate with a metal mold has a diameter of a portion in contact with the metal frame 5. Insert molding with resin is performed while being fixed on the mold with the holding pin 6 of the reduced mold.
The next resin molding part 7 covers around the metal frame 5 and the holding pin 6.
As shown in the side sectional view at the time of completion of (b), FIG.
In FIG. 5A, a resin is filled into a withdrawn portion 9 having a step 8 where the holding pin 6 is removed to form a secondary resin molded portion 10.

In the molded wiring board according to the first embodiment, a resin is used while being fixed on the mold with the press pin 6 of the mold having a small diameter at the portion that comes into contact with the metal frame 5 during the primary molding. Since the insert molding is performed, a step 8 is formed in the trace 9 of the pressing pin 6 of the mold, and the secondary resin molded portion 10 formed by filling the trace 9 with the resin by the secondary resin molding is also formed. Since the primary resin molded portion 7 and the secondary resin molded portion 10 have an increased contact area with each other and have a shape in which they are meshed with each other at the step 8 portion, they are strongly connected to each other. The resin molded part 7 and the secondary resin molded part 10 do not peel or warp or crack, so that the insulation between the adjacent metal frames 5 can be increased without increasing the thickness of the resin mold which increases the cost. Ensuring release, those that can prevent the deterioration of insulation performance.

(Embodiment 2) FIG. 2 is a top view of a completed molded wiring board according to Embodiment 2 of the present invention.
At the manufacturing stage, similar to the first embodiment,
The metal frame 11 obtained by stamping a plate-shaped metal plate with a mold is insert-molded with a resin in a state where the metal frame 11 is fixed on the mold with a holding pin of the mold. It covers around the holding pin,
Next, a resin is filled into the punched trace portion where the holding pin has been pulled out to form the secondary resin molded portion 13. In the second embodiment, the groove 14 connecting the punched trace portion where the holding pin has been pulled out is formed. Is formed on the surface of the primary resin molding portion 12 and the groove 14 is formed into a curved groove 15 so that the resin is filled into the trace where the holding pin is removed to form the secondary resin molding portion 13. In doing so, the groove 14 and the curved groove 1
5, the resin can be filled into a plurality of traces at a time, resin can be saved in each trace where the holding pin is removed, and information management for resin filling positioning is not required. Furthermore, it is economical because it is not necessary to change a plurality of filling ports necessary to fill all the punched traces with the resin at a time and a mold of a filling device which is required every time the position of the holding pin is changed. .

Further, by forming the curved grooves 15 in some places of the grooves 14, the contact area between the primary resin molded portion 12 and the secondary resin molded portion 13 is increased, and the bonding strength is improved. No peeling, warping or cracking occurs in the primary resin molded part 12 and the secondary resin molded part 13,
The insulation distance between the adjacent metal frames 11 can be ensured and the deterioration of insulation performance can be prevented without increasing the thickness of the resin mold accompanying the cost increase.

(Embodiment 3) FIG. 3 is a side sectional view of a molded wiring board according to Embodiment 3 of the present invention. In addition, insert molding with resin is performed for each energization pattern, the primary resin molded portion 17 covers the periphery of the metal frame 16, and a curved projection 18 formed on the outer surface of each primary resin molded portion 17 is formed. The primary resin molded portions 17 are overlapped with each other so that the primary resin molded portions 17 are alternately arranged.
7 is filled with a resin to form a secondary resin molded portion 19.

In the case of a molded wiring board in which the metal frame to be molded is elongated and the energization pattern is dense, it is very difficult to punch the metal frame into the energization pattern using a press die. However, in this regard, in the molded wiring board according to the third embodiment, the primary resin molding portion 17 is formed by primary resin molding of the metal frame 16 for each conduction pattern, and a plurality of independent primary resin moldings are formed. The part 17 is formed by forming a secondary resin molded part 19 by secondary resin molding and joined.
Since the secondary resin molded portions 17 are overlapped with each other via the curved projections 18 formed on the outer surface of each primary resin molded portion 17 to form the secondary resin molded portions 19, the primary resin molded portions 17 are formed. The molding area 17 and the secondary resin molding area 19 have an increased contact area with each other, so that the bonding strength can be improved. If the metal frame to be molded is elongated, the molding resin is likely to be warped. By utilizing it as a dowel for positioning during resin molding, distortion can be reduced and assembly accuracy can be easily obtained.

Further, by forming a step in the projection 18 as in the first embodiment, an insulation distance between the metal frames 16 can be ensured.

(Embodiment 4) FIG. 4 is a side sectional view of a molded wiring board according to Embodiment 4 of the present invention. As in Embodiment 1, a plate-like metal plate is stamped out with a die. The metal frame 20 is fixed on the mold with a press pin of the mold, and insert molding with resin is performed, and a primary resin molded portion 21 covers around the metal frame 20 and the press pin. Then, a resin is filled into a punched trace portion where the holding pin is pulled out to form a secondary resin molded portion 22. In the fourth embodiment, however, two opposite resin portions are formed.
The front and back surfaces of the primary resin molded portion 21 between the secondary resin molded portions 22 are processed to form a recessed groove portion 23, whereby an insulation distance corresponding to the depth of the groove portion 23 can be secured, Since the insulation can be maintained without increasing the thickness of the device, the effects of weight reduction, size reduction, and cost reduction can be obtained.

The groove 23 is formed in the primary resin molded part 2.
1 is formed by processing the front and back surfaces, but the height of the curved projections 18 formed on the outer surface of the primary resin molded portion 17 in the third embodiment is reduced to reduce the height of the secondary resin molded portion. A method of reducing the thickness of the primary resin molded portion 17 by matching the thickness of the projection 19 with the height of the projection 18 may be adopted.

(Embodiment 5) FIG. 5A is a side sectional view of a molded wiring board according to Embodiment 5 of the present invention.
5B is a top view of the same, and FIG. 5C is a plan view of FIGS.
FIG. 13B is a cross-sectional view taken along the line AA in FIG. 12B, and a metal frame 24 obtained by punching a plate-shaped metal plate with a mold is placed on the mold with a holding pin of the mold, as in the case of the fourth embodiment. Insert molding with resin is performed in a state where the fixing pin is fixed, and the primary resin molded portion 25 covers the periphery of the metal frame 24 and the holding pin. A groove 27 is formed by forming a secondary resin molded portion 26 and processing the front and back surfaces of the primary resin molded portion 25 between the opposed secondary resin molded portions 26.
In the fifth embodiment, the projections 28 are formed by processing the front and back surfaces of the primary resin molded portion 25 around the groove 27, and thus, there is a concern that the groove 27 is provided. Warpage and strength deterioration of the secondary resin molded portion 25 can be reduced.

The protrusions 28 are provided by processing the front and back surfaces of the primary resin molded portion 25. The protrusions 28 are formed on the outer surface of the primary resin molded portion 17 in the third embodiment. By increasing the height of the projections 18 and decreasing the thickness of the primary resin molding 17, the grooves 27 and the projections 28 in the fifth embodiment can be provided.

(Embodiment 6) FIG. 6 is a side sectional view of a molded wiring board according to Embodiment 6 of the present invention in the course of manufacturing, and shows a metal frame 29 obtained by stamping a plate-shaped metal plate with a mold. Insert molding with resin is performed in a state where the resin is fixed on the mold with the pressing pins 30 of the mold, and the resin molded portion 3 is formed.
Reference numeral 1 denotes a metal frame which covers the metal frame 29 and the pressing pin 30.
The resin thickness a of the resin molded part 31 above the upper part 9 is thick, and the resin thickness b below the resin molded part 31 is thin.

For the thinner resin thickness b,
Since the stress applied to the holding pin 30 during molding is small, the holding pin 32 having a smaller resin thickness b is correspondingly smaller.
Can be made smaller and elliptical in comparison with the shape of the holding pin 33 having the thicker resin thickness a.
As a result, the resin molded portion 31 having the resin thickness a has a large insulation distance ensured by the thickness, and the resin pin b has a small shape of the holding pin 32 at the time of insert molding.
The traces are also small, and the degree of exposure of the metal frame 29 is reduced. As a result, the insulation distance between the end faces of the metal frame 29 can be ensured. There is no change in the amount of resin and no increase in cost is caused.

[0026]

As described above, according to the molded wiring board of the present invention, a step is formed on a holding pin of a metal frame fixing die used when a metal frame is formed by insert resin molding to form a primary resin molded portion. A secondary resin molded part is formed by filling a resin into the punched trace part having the step.
The contact area between the secondary resin molded part and the secondary resin molded part is increased, and the primary resin molded part and the secondary resin molded part are engaged with each other at the stepped part and are strongly connected to each other. No warping or cracking occurs,
Without increasing the thickness of the resin mold with increased cost, secure the insulation distance between adjacent metal frames,
Deterioration of insulation performance can be prevented.

[Brief description of the drawings]

FIG. 1 (a) is a side cross-sectional view during the manufacture of a molded wiring board according to Embodiment 1 of the present invention.

FIG. 2 is a top view of a finished product of a molded wiring board according to Embodiment 2 of the present invention.

FIG. 3 is a side sectional view of a molded wiring board according to Embodiment 3 of the present invention;

FIG. 4 is a side sectional view of a molded wiring board according to a fourth embodiment of the present invention.

5 (a) is a side sectional view of a molded wiring board according to a fifth embodiment of the present invention. FIG. 5 (b) is a top view of the same. FIG. 5 (c) is a sectional view taken along line AA in (a) and (b).

FIG. 6 is a side cross-sectional view of a molded wiring board according to Embodiment 6 of the present invention during the manufacturing thereof.

FIG. 7A is a side cross-sectional view of a conventional molded wiring board in the process of being manufactured. FIG.

[Explanation of symbols]

 1,5,11,16,20,24,29 Metal frame 2,6,30,32,33 Holding pin 3,7,12,17,21,25 Primary resin molded part 4,10,13,19, 22, 26 Secondary resin molded part 8 Step 9 Drain mark 14 Groove 15 Curved groove 18, 28 Projection 23, 27 Groove 31 Resin molded

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F202 AD03 AD18 AG02 AG28 AH33 AH36 AM32 AM35 CA11 CB01 CB12 CK25 CK27 CK52 CK89 CL45 CQ05 4F206 AD03 AD18 AG02 AG28 AH33 AH36 AM32 AM35 JA07 JB12 JB21 JL02 JM32 JM12 JM32 AA05 AA16 BB02 BB19 BB28 BB61 BB63 CC01 CD11 EE11 EE22

Claims (7)

[Claims] 1. A step is provided on a holding pin of a metal frame fixing die used for forming a primary resin molded portion by insert resin molding of a metal frame, and a resin is filled into a punched trace portion having the step. A molded wiring board having a secondary resin molded part formed thereon. 2. A metal frame is fixed with a press pin of a mold, a primary resin molded portion is formed by insert resin molding, a groove connecting a trace portion of the press pin is formed, and the groove portion and the groove are formed. A molded wiring board in which a secondary resin molded part is formed by continuously filling a resin. 3. The molded wiring board according to claim 2, wherein a part of the groove is a curved groove. 4. An independent primary resin molded part is formed by subjecting a metal frame to insert resin molding for each energization pattern,
Independent primary resin molded parts are overlapped so that the curved protrusions formed on the outer surface of each primary resin molded part face each other, and the space between the overlapped primary resin molded parts is filled with resin. A molded wiring board having a secondary resin molded part formed thereon. 5. A metal frame is fixed with a press pin of a mold, a primary resin molded portion is formed by insert resin molding, and a resin is filled into a trace of the press pin to form a secondary resin molded portion. A molded wiring board formed and having a recessed groove formed on a surface of a primary resin molded portion between opposed secondary resin molded portions. 6. The molded wiring board according to claim 5, wherein a projection is formed on a surface of the primary resin molding around the groove. 7. The metal frame is fixed with a press pin of a mold, and a resin molded portion having a different resin thickness is formed on both sides of the metal frame by insert resin molding. Molded wiring board whose shape is smaller than the shape of the trace of the holding pin, which corresponds to the thicker resin.