JP2000022484A - Piezoelectric vibrator, piezoelectric oscillator and manufacture of them - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric vibrator and a piezoelectric oscillator with excellent shock resistance performance and where the resistance is suppressed low and no complicated manufacture process causing a cost increase is required and to provide a method for the manufacture of them. SOLUTION: A piezoelectric vibration chip 27 is fixed and supported to an electrode formed to a support 13 with silicon-base conductive adhesive 31, 32. The silicon-base conductive adhesive 31, 32 are cured by increasing the temperature of them and heating them at the temperature rising state that the distribution of conductive particles contained in the adhesives is solidified in a uniform state from preliminary drying to a prescribed curing temperature.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator using a piezoelectric vibrating reed and an improvement of a piezoelectric oscillator equipped with the piezoelectric vibrator.

[0002]

2. Description of the Related Art Conventionally, such a piezoelectric vibrator is configured, for example, as shown in FIG.

[0003] In the figure, a piezoelectric vibrator 1 has a conductive base 2 formed on the upper surface of a ceramic base 8 and a support 3 fixed thereon with silver paste. Electrodes 7 and 7 are formed on the upper surface of the support 3, and the piezoelectric vibrating reed 4 is fixed on the upper surface of the support 3. External electrodes 6 and 6 are provided on the piezoelectric vibrating reed 4, and the electrodes 6 and 6 are electrically connected to the conductive pattern 2 of the base 8 via the electrodes 7 and 7 of the support 3. The conductive pattern 2 is guided to the back side of the base portion 8 and is connected to the outside. And the piezoelectric vibrating reed 4
Is covered by a cap 5 so as to cover from above.

According to such a piezoelectric vibrator 1, when a predetermined drive current is applied from the outside, the piezoelectric vibrating reed 4 vibrates at a specific frequency, and is electrically extracted to obtain a predetermined driving current. Can be obtained.
By combining this with a predetermined oscillation circuit, a clock signal for a computer, a reference clock for a clock, and the like can be obtained.

[0005] A piezoelectric oscillator in which the above-described piezoelectric vibrator is combined with an oscillation circuit or the like which is integrated is also widely used.

[0006]

By the way, in the above-described piezoelectric vibrator 1, the base 8 or the support 3
In contrast, a conductive adhesive is used to hold and fix the piezoelectric vibrating reed 4 while maintaining electrical continuity.

As such a conductive adhesive, those made of a silicone resin, conductive silver powder and a solvent are widely used. By using such an adhesive, adhesion and fixation can be easily performed while ensuring conduction.

However, as shown in FIG. 19, the silicon-based adhesive has a lower adhesive strength than other adhesives, and therefore various measures have to be taken to obtain the mechanical strength required for the product. Is being done.

For example, according to Japanese Patent Application Laid-Open No. 8-139426, the exposed portion of the crystal chip constituting the piezoelectric vibrating reed is enlarged, or the exposed portion of the base portion is enlarged, and these exposed portions are bonded by an adhesive. Is a part of. According to this, the adhesive strength can be improved as compared with the case where the adhesive is applied only to the electrode portion and bonded.

However, in this case, the area of the electrode portion to be formed on the piezoelectric vibrating piece necessarily decreases. For this reason, when the driving power becomes as small as about 0.01 μW, the equivalent series resistance value (crystal impedance) (hereinafter referred to as “CI value”) of the piezoelectric vibrating piece 4 made of quartz increases, 4 hardly vibrates. That is,
There is a disadvantage that the drive level of the piezoelectric vibrator is deteriorated. Therefore, in order to improve the drive level while keeping the electrode portion narrow, it is necessary to increase the thickness of the electrode film forming the electrode portion.

Here, if an attempt is made to increase the thickness of the electrode film, the time required for forming the electrode will be prolonged, and a large amount of expensive target materials and vapor deposition sources will be consumed, thereby increasing the manufacturing cost. Further, in miniaturizing the product, it is necessary to solve many other problems, such as improvement in the mounting accuracy of the crystal vibrating piece and the positioning accuracy of the bonding position, proper management of the amount of the adhesive, and the like.

Further, as another method, for example,
As disclosed in Japanese Patent Application Laid-Open No. 2-75214 and Japanese Utility Model Application Laid-Open No. 5-25822, when bonding a quartz vibrating piece, not only a silicon-based conductive adhesive but also another adhesive having a high adhesive strength is used. Thus, a method of compensating for the insufficient adhesive strength can be considered. However, when a plurality of types of adhesives are used as described above, the manufacturing process becomes complicated accordingly, and there is a disadvantage that the manufacturing cost is increased due to an increase in man-hours.

On the other hand, for example, Japanese Patent No. 266858
According to No. 5, as shown in FIG. 20, when the piezoelectric vibrating reed 4 is adhered to the supporting portion 3 on the base portion 8, the adhesive 9 is applied opposite to the supporting portion 3 of the piezoelectric vibrating reed 4. Applied to the side surface, whereby the adhesive 9 contracts in the process of curing, so that the side opposite to the fixed end of the piezoelectric vibrating reed 4 is lifted as shown by the arrow, and the stress is relieved. Some attempts have been made.

However, in this case, the adhesive 9 is
Since the piezoelectric vibrating reed 4 is applied to the upper surface side of the piezoelectric vibrating reed 4, the product size becomes thicker and the product becomes smaller and smaller.
This is an obstacle to thinning.

Also, unlike the above, the amount of the adhesive to be applied is increased, and in this case, the shape of the support portion or the like is devised so as to increase the adhesive strength so that the adhesive does not short-circuit the electrodes. Some ingenuity has been attempted. This type of technology includes Japanese Utility Model Laid-Open No. 4-119126 and Japanese Patent Laid-Open No. 7-74.
576, JP-A-7-240653, JP-A-5-48
No. 369 and the like. Among them, Japanese Patent Application Laid-Open No. 5-48369
In FIG. 21, the groove 3 is formed on the upper surface of the support base 3 as shown in FIG.
The b, 3b and the side grooves 3a, 3a are formed so that the applied adhesive is released so that the applied adhesive does not short-circuit the electrodes 6, 6.

However, if a groove or the like is formed to allow the adhesive to escape as described above, stress concentration tends to occur in the structure, and there is a danger that the portion will be destroyed due to a rapid rise in temperature during sealing. There is.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is excellent in impact resistance, suppresses the resistance value, and does not require a complicated manufacturing process which causes an increase in cost. It is an object of the present invention to provide a vibrator, a piezoelectric oscillator, and a manufacturing method thereof.

[0018]

For this purpose, a piezoelectric vibrator according to the first aspect of the present invention comprises: a support having an electrode portion provided on a surface thereof;
A piezoelectric vibrating reed fixedly supported by a silicon-based conductive adhesive with respect to the electrode portion formed on the support portion, wherein the silicon-based conductive adhesive is heated from a preliminary drying to a predetermined curing temperature. In a heating state where the distribution of the conductive particles contained in the adhesive is solidified in a uniform state, the conductive particles are cured by heating and heating.

According to the first aspect of the present invention, the distribution of the conductive particles contained in the adhesive from the preliminary drying to the predetermined curing temperature of the silicon-based conductive adhesive for bonding the supporting portion and the piezoelectric vibrating reed is maintained. The temperature is raised and heated in a state where the temperature is solidified in a uniform state. Here, the present inventors have found that the heating time and the resistance value for curing the silicon-based conductive adhesive have the following relationship.

In the curing process, when the conductive particles contained in the adhesive, such as silver powder and silicon resin, are unevenly distributed and cured, the silicon-based conductive adhesive is in a state where the silver powder is coarse, that is, the density is low. It was found that the resistance value increased at the position where the value was low. That is, in the silicon-based conductive adhesive, the silicone resin shrinks as the solvent evaporates during the curing process. In the process of this contraction, the silicon resin acts to pull the conductive particles in the contraction direction. Therefore, if the curing time is relatively long, the conductive particles concentrate near the center of the adhesive, and solidify in a state where the density of the surrounding resin is high.

Therefore, in order to avoid such a problem, the temperature of the silicon-based conductive adhesive for curing is measured in advance, and the silicone-based conductive adhesive is cured for such a time. As a result, a rise in the resistance value is suppressed, and the necessary adhesive strength is obtained.

According to a second aspect of the present invention, in the configuration of the first aspect, the silicon-based conductive adhesive is heated at a temperature of about 4 degrees Celsius per minute or more from predrying to a predetermined curing temperature. The configuration is as follows.

According to the second aspect of the present invention, in order to obtain the effect of the first aspect, the heating time confirmed by the present inventors is preferably set to be approximately 1 degree Celsius per minute from the preliminary drying to the predetermined curing temperature. 4 degrees or more.

According to a third aspect of the present invention, in the configuration of the first or second aspect, the silicon-based conductive adhesive is heated at a temperature of 7.5 degrees Celsius per minute from a pre-drying to a predetermined curing temperature. It is configured to be heated.

According to the third aspect of the present invention, in order to obtain the effect of the first aspect, the temperature rising time applicable to various adhesive surface materials is preferably substantially every time from the preliminary drying to the predetermined curing temperature. 7.5 degrees Celsius.

According to the invention of claim 4, according to claim 1,
In any one of the constitutions (1) to (3), all of the bonding surfaces of the support portion bonded to the piezoelectric vibrating reed are constituted by the electrode portions.

According to the fourth aspect of the present invention, by curing the silicon-based conductive adhesive under the conditions of the first to third aspects, sufficient adhesion can be achieved even if all of the adhesive surfaces are the surfaces on which the electrodes are formed. Strength is obtained. In addition, since it is not necessary to unnecessarily narrow the electrode portion, the resistance value can be sufficiently reduced without unnecessarily increasing the resistance value.

According to a fifth aspect of the present invention, in the first to fourth aspects, the electrode portion is formed of gold or silver.

According to the structure of claim 5, the electrode portion is made of gold (A).
By using u) or silver (Ag), the resistance value can be suppressed lower than that of other materials, and an efficient device can be configured. Here, as shown in FIG. 22, the silicon-based conductive adhesive may not be compatible with the material of the bonding surface under normal conditions such as a temperature rising rate of about 2 to 3 degrees Celsius per minute in the curing step. The curing reaction time varies depending on the relationship. In this case, by setting the curing temperature rise time to the condition according to any one of claims 1 to 4, even in the case of the bonding surface made of gold (Au) or silver (Ag), unlike FIG. As a result, the adhesive does not harden unevenly and the resistance value does not increase.

According to a sixth aspect of the present invention, in the configuration of the first to fifth aspects, the silicon-based conductive adhesive is applied to a region between the base and the piezoelectric vibrating reed, and Is configured not to apply to the opposite side.

According to the seventh aspect of the present invention, there is provided a base having a conductive pattern formed on a surface thereof, a support disposed on the base and provided with an electrode on the surface, A piezoelectric vibrating reed fixedly supported by a silicon-based conductive adhesive with respect to the formed electrode portion, and an integrated circuit electrically connected to the conductive pattern of the base portion; From the pre-drying to a predetermined curing temperature, the conductive adhesive is cured by heating and heating in a temperature-raising state where the distribution of the conductive particles contained in the adhesive is solidified in a uniform state. It is an oscillator.

According to the seventh aspect of the present invention, the same principle as in the first aspect is applied to the silicon-based conductive adhesive.
It is possible to provide a sufficient adhesive strength without increasing the resistance value.

According to an eighth aspect of the present invention, in the configuration of the seventh aspect, the silicon-based conductive adhesive is heated and heated at a temperature of about 4 degrees Celsius per minute or more from predrying to a predetermined curing temperature. .

According to a ninth aspect of the present invention, in the configuration of the seventh or eighth aspect, the silicon-based conductive adhesive is heated at a temperature of 7.5 degrees Celsius per minute from a preliminary drying to a predetermined curing temperature. Heated.

According to a tenth aspect of the present invention, in the configuration of the seventh to ninth aspects, the entirety of the bonding surface of the supporting portion bonded to the piezoelectric vibrating reed is formed of the electrode portion.

According to an eleventh aspect of the present invention, in the configuration of the seventh to tenth aspects, the bonding portion is formed of gold or silver.

According to the twelfth aspect of the present invention, the silicon-based conductive adhesive is applied to a region between the base and the piezoelectric vibrating reed, and is not applied to the surface of the piezoelectric vibrating reed opposite to the base. It is a configured piezoelectric oscillator.

According to a thirteenth aspect of the present invention, there is provided a method for manufacturing a piezoelectric vibrator, comprising the step of fixing a piezoelectric vibrating reed to an electrode portion formed on a ceramic supporting portion with a silicon-based conductive adhesive. A curing step in which the silicon-based conductive adhesive is heated and heated in a temperature-raising state in which the distribution of the conductive particles contained in the adhesive is solidified in a uniform state from the preliminary drying to a predetermined curing temperature. Have.

According to the structure of the thirteenth aspect, a piezoelectric vibrator having the function of the first aspect can be suitably manufactured.

According to the fourteenth aspect of the present invention, the ceramic base having the conductive pattern formed on the surface thereof is provided with a ceramic support part integrally with or separate from the base part. A method for manufacturing a piezoelectric oscillator, comprising the step of fixing a piezoelectric vibrating reed with a silicon-based conductive adhesive to a formed electrode portion, wherein the silicon-based conductive adhesive is bonded from a pre-drying to a predetermined curing temperature. The method includes a curing step of heating and heating in a heated state in which the distribution of the conductive particles contained in the agent is solidified in a uniform state.

According to the structure of the fourteenth aspect, it is possible to preferably manufacture the piezoelectric oscillator having the function of the sixth aspect.

[0042]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 12 show the manufacturing process of the piezoelectric oscillator according to the embodiment of the present invention. The steps will be sequentially described, and the configuration will be described together.

FIG. 1 is a plan view of the first step, FIG. 2 is a sectional view taken along line AA, FIG. 3 is a bottom view, and FIG. 4 is a right side view of FIG.

In these figures, ceramic supporting members 12, 13, and 14 are sequentially laminated and fixed on a base portion 11, which is a ceramic plate, and a peripheral portion of the supporting member 14 is provided with a metal. Ring 15 made of silver is fixed with silver brazing. Here, the entire lower unit of the piezoelectric oscillator is referred to as a base 40, and the base 40 refers to the whole of the base unit 11 on which the support members 12, 13, and 14 are laminated and fixed. And this base 4
The reference numeral 0 may be such that the above-mentioned separate supporting member is fixed to the base portion 11 or the whole may be formed of a ceramic material or the like integrated with the base portion 11 without using the supporting member.

As shown in FIG. 1, a conductive pattern 16 on which an integrated circuit to be described later is mounted and fixed is formed near the center of the upper surface of the base portion 11, as shown in FIG. The conductive pattern of the present embodiment is formed of gold (Au) which has a small electric resistance and is hard to form an oxide film. Specifically, after printing tungsten, nickel (Ni) is electrolytically plated, and further, gold is applied to, for example, 0.5 to 1.27.
It is constituted by electrolytic plating to a thickness of μm. Here, the nickel plating is performed to increase the adhesion strength of gold. Further, although the corrosion resistance is slightly lower than that of gold, the conductive pattern may be formed of silver (Ag) for the same reason as gold.

[0047] As shown in FIG.
A conductive pattern 21 is formed on the back side of the device to be connected to the outside.

As shown in FIG. 2, the support member 12 fixed on the base portion 11 is shaped so as to form a space S1 large enough to accommodate an integrated circuit described later. On the upper surface of the support member 12, the conductive pattern 1 to which the connection terminal of the integrated circuit is to be wire-bonded is provided.
7 and 18 are formed. In addition, the support member 13
The shape is such that a space S2 is formed inside. As shown in FIG. 1, an electrode portion 1 formed of a conductive pattern by gold plating or the like is
9 and 20 are formed. Further, the support member 14
Is formed so as to form a space S3 inside, and the above-described seal ring 15 is fixed to a peripheral portion of the upper surface of the support member.

Next, as shown in FIGS. 5 and 6, the integrated circuit 23 is fixed on the conductive pattern 16 of the base portion 11 by an adhesive 26 by die bonding or the like. The integrated circuit 23 is housed in the space S1 as shown in FIG.

Next, as shown in FIGS. 7 and 8, the connection terminals 25 of the integrated circuit 23 and the corresponding conductive patterns 17 and 18 are wire-bonded with gold wires 24 to be electrically connected. . As shown, the connected gold wire 24 and the like are accommodated in the space S2.

Next, as shown in FIGS. 9 and 10, the piezoelectric vibrating reed is fixed to the support member 13. In this case, the piezoelectric vibrating reed is constituted by, for example, a crystal vibrating reed 27 using quartz. On the quartz-crystal vibrating piece 27, an electrode 28 and an electrode 29 as shown in FIG. Each of the electrodes 28 and 29 is, as shown in FIG.
At the end in the width direction of No. 7, it is formed so as to extend around the back side. That is, in FIG. 10, the crystal vibrating piece 27 is formed continuously so as to be exposed on the lower surface of the right end portion.

Then, as shown in FIGS. 9 and 10, a silicon-based conductive adhesive material 31 and 32 is applied on each of the electrode portions 19 and 20 of the support member 13, and the quartz vibrating piece 2 is placed thereon.
7, the silicon-based conductive adhesives 31 and 32 are cured and fixed. So, in this case,
The bonding surfaces of the support member 13 and the quartz-crystal vibrating piece 27 are all electrode portions.

Preferably, the silicon-based conductive adhesives 31 and 32 are not applied to the upper surface of the quartz-crystal vibrating piece 27 on the side opposite to the support member 13. With such a structure, the thickness of the product can be reduced. Moreover, since the amount of the adhesive used can be reduced, it is possible to prevent the characteristics of the piezoelectric vibrator from being changed by the gas generated from the adhesive.

Here, the silicon-based conductive adhesives 31 and 3
2 used FA-730 of Fujikura Kasei Co., Ltd. This adhesive is composed of irregularly shaped silver powder as conductive particles, a silicon resin, and an aromatic hydrocarbon solvent. The composition is 17.7% by weight of silicon resin and 71.0% of silver powder by weight. Percent, solvent 11.3 percent.

As the silicon-based conductive adhesive, in addition to the above, for example, 3303 manufactured by Three Bond Co., Ltd., TSE3212 manufactured by Toshiba Silicone, or the like can be suitably used.

The drying and curing of the silicon-based conductive adhesives 31 and 32 were performed by a process shown in FIG. 13 using a belt furnace. First, as preliminary drying, the ambient temperature was set to 65 degrees Celsius.
And heated at 65 to 75 degrees Celsius for about 20 minutes (plus 5 minutes minus 0 minutes) to sufficiently volatilize the solvent. Next, the belt speed was set to about 9 mm / min.
180 degrees or more at a temperature rise rate of 7.5 degrees Celsius / minute
The temperature was raised to 90 degrees or less, and the resin was cured by heating for about 60 minutes (plus 5 minutes minus 0 minutes).

This curing step is particularly important in the present embodiment. After the above-mentioned preliminary drying, by setting a constant heating time up to the curing temperature, the silicon-based conductive adhesive can be cured under the condition that the conductive particles are almost uniformly present in the silicone resin. . Thus, it has been found that a suitable conduction performance can be obtained, and a sufficiently high adhesive strength can be obtained by making the mechanical strength uniform.

Further, by employing such a curing step, a sufficient adhesive strength can be obtained even when the electrode portion is used as the adhesive surface as described above. That is, the electrode portion 19,
20 is plated with gold or silver as described above. When such an electrode surface is used as an adhesive surface, if an adhesive such as the present embodiment is simply used under ordinary conditions,
As described with reference to FIG. 22, the reaction time at the boundary surface becomes relatively long. If a long time is required for the curing reaction, the conductive particles are guided to the center of the adhesive, and the density decreases at the boundary surface. However, in the curing step of the present embodiment, since the curing step is performed with the short heating time as described above after the preliminary drying, the curing reaction speed is increased even when the electrode surface as described above is used as the adhesive surface. Thus, the curing can be performed in a state where the conductive particles are uniformly present in the silicone resin. by this,
To obtain sufficient adhesive strength with a small amount of adhesive without forming a means such as a groove in the support portion to allow fluid to escape, as in the past, so as to avoid a short circuit between the electrode portions 19 and 20. Is possible. In addition, sufficient conduction performance can be obtained by using all of the bonding surfaces as electrodes, and in particular, since the gold or silver electrode surface is sufficient, the resistance value can be sufficiently reduced. In addition, the electrode portion can secure a sufficient area because the means such as the groove of the support portion is not formed as in the related art, and also in this respect, an excellent conduction function can be obtained. Also,
Since a means such as a groove is not formed in the support member, a structurally weak point where stress is concentrated when an external force or the like is applied is not provided, so that a structurally strong product can be obtained. In addition, by not forming the means such as the groove in the support member, a product having a smaller width dimension can be obtained. Here, in order to obtain a sufficiently low resistance value and adhesive strength as a result of various attempts by the present inventors, the temperature rise time after the preliminary drying is set to 4 degrees Celsius per minute as the temperature rise time (temperature rise rate). It has been confirmed that the above is necessary within the range of variation in quality of the silicon-based conductive adhesive. In addition, as the heating time, in particular, 5 degrees Celsius per minute or more, in the effect,
The range of tolerance which does not cause any problem in practical use was obtained, and the most stable result was obtained at 7.5 degrees Celsius per minute. It is to be noted that although a higher heating rate is preferable, a heating rate of 10 degrees Celsius per minute or less is suitable as an upper limit due to current technical restrictions.

Next, the quartz vibrating piece 27 is aged by heating at 200 degrees Celsius for about 2 hours, and FIG.
As shown in FIG. 2, a cap 35 made of Kovar pre-plated with nickel is placed on the seal ring 15,
Sealing is performed by seam welding, and the piezoelectric oscillator 1
Complete 0.

FIG. 14 is a schematic sectional view showing an embodiment of the piezoelectric vibrator according to the present invention. The portions denoted by the same reference numerals as used in the description of the above-described piezoelectric oscillator 10 have almost the same configuration. The duplicate description will be omitted, and the following description will focus on the differences.

In the figure, a piezoelectric vibrator 50 has a base portion 11 made of a ceramic substrate, and ceramic support members 13 and 14 fixed on the base portion 11 sequentially.
And a piezoelectric vibrating piece 27 fixed to the support member 14. The cap 3 is placed on the support member 13 via the seal ring 15 so as to cover the piezoelectric vibrating piece 27.
5 are arranged and sealed.

The support 13 and the piezoelectric vibrating reed 27
The ceramic oscillators 31 and 32 are bonded by the same process as the piezoelectric oscillator 10 described above.

As a result, the same effect as the above-described piezoelectric oscillator 10 can be obtained in the piezoelectric vibrator 50 as well.

Note that the support members 13 and 14 are
And the same material.

FIG. 15 shows the result of measuring the CI value of the piezoelectric vibrator 50 constructed in each of the above-described embodiments in order to confirm the resistance value.

FIG. 15 shows that a driving current is applied using terminal electrodes on the end face of the base portion 11 and the power is reduced to 0.01 μW.
And 100 μW, the CI values at 41 locations were measured, and FIG. 15A shows the maximum CI value, and FIG. 15B shows ΔCI which is the CI maximum value minus the CI minimum value. In the case of the piezoelectric vibrator 50 manufactured by the above-described method, a sufficiently low resistance value could be obtained.

FIGS. 16 and 17 show that the piezoelectric vibrator 50 constructed according to the above embodiment was subjected to a drop test for examining the shock resistance. FIG.
Is a value obtained by measuring the CI value before dropping and the CI value after dropping at each drop height on the horizontal axis, and calculating the difference between the samples individually. The CI value was measured at a driving current of 100 μW. FIG. 17 shows how the frequency of the product before the drop has changed after the drop at each drop height on the horizontal axis.

As described above, the piezoelectric vibrator 50 according to the present embodiment has excellent impact resistance in terms of not only mechanical strength but also performance.

It goes without saying that the characteristics of the piezoelectric vibrator 50 described above are the same in the piezoelectric oscillator 10.

[0070]

As described above, according to the first and seventh aspects of the present invention, a complicated manufacturing process which is excellent in impact resistance, suppresses the resistance value and raises the cost. Unnecessary piezoelectric vibrators and piezoelectric oscillators can be provided.

According to the second and eighth aspects of the present invention, favorable conditions can be provided to obtain the effects of the first and seventh aspects, respectively. According to this, in order to obtain the effects of claims 1 and 7, more preferable conditions can be provided.

According to the fourth and tenth aspects of the present invention, in addition to the effects of the first and sixth aspects, there is provided a piezoelectric vibrator or a piezoelectric oscillator excellent in conduction performance without deteriorating the adhesive strength. Can be.

According to the fifth and eleventh aspects of the present invention, in addition to the effects of the first and sixth aspects, the piezoelectric vibrator or the piezoelectric oscillator excellent in conduction performance with a low resistance value without deteriorating the adhesive strength. Can be provided.

According to the sixth and twelfth aspects of the present invention, since no adhesive is provided on the piezoelectric vibrating reed, it is possible to provide a piezoelectric vibrator or a piezoelectric oscillator having a small thickness.

According to the eleventh and twelfth aspects of the invention,
It is possible to provide a method of manufacturing a piezoelectric vibrator and a method of manufacturing a piezoelectric oscillator that can obtain a sufficient adhesive strength, suppress a resistance value, and do not require a complicated manufacturing process that causes an increase in cost.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a first step of a manufacturing process of a piezoelectric oscillator according to an embodiment of the present invention.

FIG. 2 is a schematic sectional side view of the step of FIG. 1;

FIG. 3 is a schematic bottom view of the step of FIG. 1;

FIG. 4 is a schematic right side view of the step of FIG. 1;

FIG. 5 is a schematic plan view of a step that follows the step of FIG. 1;

FIG. 6 is a schematic sectional view of the step of FIG. 5;

FIG. 7 is a schematic plan view of a step that follows the step of FIG. 5;

FIG. 8 is a schematic sectional view of the step of FIG. 7;

FIG. 9 is a schematic plan view of a step that follows the step of FIG. 7;

FIG. 10 is a schematic side view of the step of FIG. 9;

FIG. 11 is a schematic plan view of a final step in a manufacturing process of the piezoelectric oscillator according to the present embodiment, and shows an overall configuration of the piezoelectric oscillator.

FIG. 12 is a schematic side sectional view of the step of FIG. 11, showing the overall configuration of the piezoelectric oscillator.

FIG. 13 is a view illustrating a curing step of the adhesive in the steps of FIGS. 9 and 10;

FIG. 14 is a schematic cross-sectional view illustrating a configuration example of a piezoelectric vibrator according to an embodiment of the present invention.

FIG. 15 shows the CI of the piezoelectric vibrator according to the embodiment of the present invention.
It is a figure showing a value.

FIG. 16 is a diagram showing a result of a drop test of the piezoelectric vibrator according to the embodiment of the present invention.

FIG. 17 is a diagram showing a result of a drop test of the piezoelectric vibrator according to the embodiment of the present invention.

FIG. 18 is a schematic perspective view showing an example of a configuration of a conventional piezoelectric vibrator.

FIG. 19 is a diagram showing the relationship between the type of adhesive and the adhesive strength.

FIG. 20 is a schematic front view illustrating a configuration example of a piezoelectric vibrator.

FIG. 21 is a schematic perspective view showing a configuration example of a piezoelectric vibrator.

FIG. 22 is a diagram showing the relationship between the type of the bonding target surface of the adhesive and the curing reaction time.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Piezoelectric oscillator 11 Base part 12 Support member 13 Support member 14 Support member 15 Seal ring 19 Electrode part 20 Electrode part 23 Integrated circuit 27 Quartz crystal vibrating piece (piezoelectric vibrating piece) 31 Silicon conductive adhesive 32 Silicon conductive adhesive 35 Cap 40 Base 50 Piezoelectric vibrator

Claims (14)

[Claims] 1. A base having an electrode portion provided on a surface thereof, and a piezoelectric vibrating reed fixedly supported by a silicon-based conductive adhesive with respect to the electrode portion formed on the base; The system-based conductive adhesive is cured by heating and heating in a temperature-raising state where the distribution of the conductive particles contained in the adhesive solidifies in a uniform state from the pre-drying to a predetermined curing temperature. A piezoelectric vibrator characterized by the following. 2. The piezoelectric vibrator according to claim 1, wherein the silicon-based conductive adhesive is heated at a temperature of about 4 ° C. or more per minute from preliminary drying to a predetermined curing temperature. 3. The piezoelectric vibrator according to claim 1, wherein the silicon-based conductive adhesive is heated at a rate of 7.5 degrees Celsius per minute from preliminary drying to a predetermined curing temperature. 4. The piezoelectric vibrator according to claim 1, wherein the entire surface of the base to be bonded to the piezoelectric vibrating reed comprises the electrode portion. 5. The piezoelectric vibrator according to claim 1, wherein said electrode portion is made of gold or silver. 6. The method according to claim 1, wherein the silicon-based conductive adhesive is applied to a region between the base and the piezoelectric vibrating reed, and is not applied to a surface of the piezoelectric vibrating reed opposite to the base. 6. The piezoelectric vibrator according to any one of items 5 to 5. 7. A base having a predetermined conductive pattern and an electrode portion provided on a surface thereof, an integrated circuit electrically connected and fixed to the conductive pattern of the base, and an electrode portion formed on the base. A piezoelectric vibrating reed fixedly supported by a system-based conductive adhesive, wherein the silicon-based conductive adhesive has a distribution of conductive particles contained in the adhesive from a preliminary drying to a predetermined curing temperature. A piezoelectric oscillator, wherein the piezoelectric oscillator is cured by heating and heating in a temperature-raising state that solidifies in a uniform state. 8. The piezoelectric oscillator according to claim 7, wherein the silicon-based conductive adhesive is heated at a temperature of not less than 4 degrees Celsius per minute from preliminary drying to a predetermined curing temperature. 9. The piezoelectric oscillator according to claim 7, wherein the silicon-based conductive adhesive is heated at a rate of approximately 7.5 degrees Celsius per minute from predrying to a predetermined curing temperature. 10. The bonding portion of the base, which is bonded to the piezoelectric vibrating reed, is entirely formed of the electrode portion.
10. The piezoelectric oscillator according to any one of claims 9 to 9. 11. The piezoelectric oscillator according to claim 7, wherein said electrode portion is made of gold or silver. 12. The method according to claim 7, wherein the silicon-based conductive adhesive is applied to a region between the base and the piezoelectric vibrating reed, and is not applied to a surface of the piezoelectric vibrating reed opposite to the base. 12. The piezoelectric oscillator according to any one of claims 11 to 11. 13. A method for manufacturing a piezoelectric vibrator, comprising a step of fixing a piezoelectric vibrating reed to an electrode portion formed on a ceramic base with a silicon-based conductive adhesive, wherein the silicon-based conductive adhesive is From a pre-drying to a predetermined curing temperature, in a temperature-raising state in which the distribution of the conductive particles contained in the adhesive is solidified in a uniform state, comprising a curing step of heating and heating, A method for manufacturing a vibrator. 14. A ceramic base having a conductive pattern formed on a surface thereof is provided with a ceramic support part integrally with or separate from the base part, and an electrode part formed on the ceramic support part is provided. A method for manufacturing a piezoelectric oscillator, comprising fixing a piezoelectric vibrating reed with a silicon-based conductive adhesive, wherein the silicon-based conductive adhesive is electrically conductive contained in the adhesive from a pre-drying to a predetermined curing temperature. A method for manufacturing a piezoelectric oscillator, comprising: a curing step of heating and heating in a temperature-raising state where particles are solidified in a uniform state.