JP2000012661A - Jig and method for fitting work and method and device for cutting work - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the throughput of a work without detecting the size, shape, and position of the work. SOLUTION: A wafer 82 is fitted to a frame 84 at a specific position through the fitting jig 88, and, after an image of the wafer 82 is picked up according to position information showing the fitting position of the wafer 82, the wafer is aligned and cut. The wafer 82 is fitted on the frame at the determined position by the fitting jig 88, so the image of the wafer 82 is picked up at the position and the wafer is cut after aligned.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work mounting jig, a work mounting method, and a work cutting method and apparatus, and more particularly to a work for cutting a semiconductor wafer (work) into a dice along a street. The present invention relates to a mounting jig, a work mounting method, and a work cutting method and apparatus.

[0002]

2. Description of the Related Art A dicing apparatus for cutting a semiconductor wafer into dice generally mounts a disc-shaped semiconductor wafer on a frame, aligns the wafer by pattern matching means, and cuts the dice along a street. By the way, conventionally, a dicing apparatus for cutting an irregular or irregular semiconductor wafer has been proposed. As this dicing apparatus, Japanese Patent Laid-Open No.
In the apparatus disclosed in Japanese Patent No. 47, a semiconductor wafer having the above shape is mounted on a frame, and the size, shape and position of the semiconductor wafer are detected by a work shape recognition device having a CCD camera. Then, after aligning the semiconductor wafer based on the information detected by the work shape recognition device, the semiconductor wafer is cut into a dice shape by a blade.

[0003]

However, the conventional cutting device disclosed in Japanese Patent Application Laid-Open No. Hei 4-363047 discloses an expensive workpiece shape recognition device for detecting the size, shape and position of a semiconductor wafer. So we have
There is a disadvantage that the dicing apparatus becomes very expensive.
In addition, there is a disadvantage in that it is not possible to improve the throughput because it takes time to recognize the workpiece shape.

The present invention has been made in view of such circumstances, and a work mounting jig and a work mounting method capable of improving the throughput of a work without detecting the size, shape and position of the work. And a method and apparatus for cutting a workpiece.

[0005]

According to the present invention, there is provided a work mounting jig for positioning and mounting a work on a frame, wherein the mounting jig has substantially the same shape as the frame. And a positioning opening for inserting a work into the mounting jig is formed,
After the mounting jig is overlaid on the frame, the work is inserted into the positioning opening of the mounting jig, and the work is positioned and mounted on the frame.

In order to achieve the above object, the present invention provides a method of mounting a work in which a work is positioned and mounted on a frame, the work being formed in substantially the same shape as the frame and having an opening through which the work can be inserted. The provided mounting jig is superimposed on a frame, a work is inserted into an opening of the mounting jig superimposed on the frame, and the work is positioned and mounted on the frame.

In order to achieve the above object, the present invention provides a method for cutting a workpiece by positioning and mounting the workpiece on a frame, wherein the workpiece is formed in substantially the same shape as the frame and the workpiece can be inserted. The mounting jig having an opening formed thereon is superimposed on a frame, the work is inserted into the opening of the mounting jig superimposed on the frame, the work is positioned on the frame and mounted, and the work is mounted. While holding the frame on the table, based on the position information indicating the position of the opening of the mounting jig, image the work located in the opening, and perform alignment of the work based on the image information of the imaged work. After the alignment is completed, the workpiece is cut by designating the area of the opening of the mounting jig as a cutting range based on the position information. It is characterized by a door.

In order to achieve the above object, the present invention provides a frame on which a work is mounted, a table for holding the frame, an imaging means for imaging the work on the frame held on the table, A cutting device comprising: an alignment means for aligning the work based on image information of the work imaged by the means; and a cutting means for cutting the work aligned by the alignment means. Mounting jig having a work insertion opening for mounting the work to the frame, and inputting position information indicating the position of the opening of the mounting jig. And controlling the imaging means based on the position information input to the input means to control the position in the opening. That work is imaged, and the alignment of the workpiece is performed on the basis of the image information by controlling the alignment means work captured by the imaging means,
Control means for controlling the cutting means and designating the area of the opening as a cutting range to execute cutting.

According to the present invention, since the work is mounted on the frame at a position determined by the opening of the mounting jig, the work is imaged, aligned, and cut using the position of the opening as the position of the work. I do. By using the mounting jig in this way, the work mounting position can be specified without using an expensive work shape recognition device. In addition, since the workpiece shape recognition is not performed, the throughput is improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a work mounting jig, a work mounting method, and a work cutting method and apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of a semiconductor wafer dicing apparatus 1 to which the present invention is applied, and FIG. 2 is a plan view thereof. As shown in FIG. 1, the dicing apparatus 1 mainly includes a cutting unit 10, a cleaning unit 20, a cassette storage unit 30, an elevator unit 40, a transport device 50, and the like.

The process of cutting a wafer W by the dicing apparatus 1 will be described. Including)
The wafers W which are sequentially pulled out by the elevator unit 40 and are drawn out are set at a position P4 shown in FIG. Next, the wafer W is placed on the cutting table (position P2) of the cutting unit 10 via the preload stage at the position P1 by the transfer device 50. Here, the wafer W is held by suction on the cutting table. The wafer W held by suction is moved to the CCD camera 18,
At the same time, the pattern on the wafer W is image-recognized by the image processing unit and aligned based on the image. Then, in the aligned wafer W, two streets are cut at the same time by the movement of the cutting unit 10 in the Y-axis direction indicated by arrows A and B and the cutting table by the movement in the X-axis direction indicated by arrows C and D. . When the first two streets are cut, the cutting section 1
The spindle 0 is moved in the Y-axis direction by the pitch of the street, and the cutting table is moved again in the X-axis direction. As a result, the next two streets are cut. This cutting operation is repeatedly performed, and when the cutting of all the streets in one direction (X direction) is completed, the cutting table is rotated by 90 ° and the other direction orthogonal to the cut street (Y direction in FIG. 2) ) Is cut sequentially. Thereby, the wafer W is finally cut into a die shape. In the present embodiment,
Although the CCD cameras 18 and 19 are provided on the upstream side of the cutting unit 10, the present invention is not limited to this, and they may be provided on the carriages 72 and 74 of the cutting unit 10.

After the cut wafer W is returned to the position P2 by the cutting table, the transfer device 50
Is transported to the spinner table of the cleaning unit 20 at the position P3. Here, the wafer W is dried by the air blow after being washed with the washing water. The dried wafer W is transferred to the position P4 by the transfer device 50, transferred to the cassette unit 30 by the elevator unit 40, and stored in a predetermined cassette. The flow of the process of cutting one wafer W by the dicing apparatus 1 has been described above.

As shown in FIG. 2, the cutting section 10 of the dicing device 1 has a pair of cutting devices 14 and 16, and the cutting devices 14 and 16 include motors 60 and 62 and a spindle 6
4, 66, and blades 68, 70 mounted on the tips of the spindles 64, 66. The cutting device 1
4 and 16 are independently moved in the Y-axis direction by the spindle controller.

On the other hand, as shown in FIG.
Has a four-stage structure.
Inspection cassette storage section 32, first from top
It comprises a cassette storage section 34, a second cassette storage section 36, and a utility cassette storage section 38.
The first and second cassette storage sections 34 and 36 are, for example, 5
This is a storage section of a cassette that stores general disk-shaped wafers of inches and 6 inches.

The utility cassette 80 of FIG. 3 stored in the utility cassette storage section 38 is formed in a tray shape. Then, in this cassette 80, B
GA or CSP rectangular wafers 82, 82 are mounted on a frame 84 with an adhesive tape 86 mounted thereon. In this embodiment, the cassette 80
Is formed in a tray shape. However, the present invention is not limited to this. In the case of continuously processing a large number of frames 84 to which the wafers 82 are attached, a plurality of wafer storage shelves are formed similarly to a normal cassette. May be applied.

Next, cutting means for efficiently cutting the wafer 82 will be described. The wafer 82
When the small and irregular shaped wafer 82 is cut by an ordinary method, it takes time to search for the wafer 82 with the CCD cameras 18 and 19, and as a result, it takes a long time for alignment. Further, if the cutting stroke of the cutting stage 100 is set to a stroke corresponding to a disk-shaped wafer which is considerably larger than the wafer 82, the useless stroke becomes extremely large, so that it takes time for cutting. Furthermore, by the useless stroke,
Blade 6 for cutting adhesive tape 86 that does not need to be cut
There is a problem in that the life of 8, 70 is shortened. In order to solve such a problem, the cutting device disclosed in Japanese Patent Application Laid-Open No. Hei 4-363047 is equipped with a work shape recognition device. However, the dicing device becomes very expensive and the throughput is not improved.

Therefore, in the present embodiment, a mounting jig 88 shown in FIG.
Is mounted at a position determined on the frame 84, the wafer 82 is imaged based on positional information indicating the wafer mounting position by the mounting jig, and then aligned and cut. The mounting jig 88 is, as shown in FIG.
It is formed in a substantially disk shape, and is formed in the same shape as the frame 84. A notch 88A for positioning with respect to the frame 84 is provided on the outer peripheral surface of the mounting jig 88.
And a notch 88A are formed. That is, the notch 88
A is matched with the notch 84A on the frame 84 side, and the notch 88B is matched with the notch 84B on the frame 84 side. As a result, the mounting jig 88 is superimposed on the frame 84 and positioned.

Further, the mounting jig 88 includes the wafer 8
2, rectangular openings 90 are formed at predetermined positions. The wafer 82 indicated by the two-dot chain line in FIG. 4 before attachment is attached to the frame 84 through the openings 90, 90 with the attachment jig 88 positioned with respect to the frame 84. The opening 90
The number is not limited to two, and may be formed at three places like the mounting jig 92 shown in FIG.
4 may be formed as in a mounting jig 94 shown in FIG.

When the wafer 82 is mounted on the frame 84 via the mounting jig 88, the wafer 82 is
It is mounted on the frame 84 at a position corresponding to the opening 90 of the mounting jig 88. Therefore,
The position information of the opening 90 of the mounting jig 88 is given to the dicing device 1, and the dicing device 1
If the wafer 82 is imaged at the position (within the opening area), and alignment is performed based on the image information, and the position is designated as a cutting range, cutting is performed.
The wafer 82 can be efficiently cut.

Next, a method of cutting the wafer 82 will be described with reference to FIG.
This will be described with reference to the control system block diagram shown in FIG. First, the two wafers 82 are mounted on the frame 84 using the mounting jig 88 (step). Next, the position information of the opening 90 of the mounting jig 88 is input from the terminal 96 to the CPU 98 (step). The CPU 98 controls the entire dicing apparatus 1 and, in FIG.
Axis controller 10 for driving and controlling the X, Y, and θ directions
2, a speed controller 104 for moving the blades 68 and 70 in the Y direction, cameras 18 and 19, an image processing unit 106, and the like.

Next, the frame 84 is supplied to the cutting stage 100 (step). Then, when the frame 84 is attracted to the cutting stage 100, the CPU 98 executes alignment of the wafers 82, 82 according to the input position information (step).
That is, the CPU 98 controls each axis control 102 to position an area corresponding to the opening 90 at a position where the camera 18 (or the camera 19) can capture an image. Accordingly, the wafer 82 is located at a position where the image is immediately captured by the camera 18. Thereafter, the CPU 98 controls the alignment device to execute alignment of the wafer 82 by a known pattern matching unit. As described above, if the wafer 82 is imaged and aligned based on the position information of the opening 90, the labor for searching for the wafer 82 can be omitted, and the alignment time can be shortened.

When the alignment is completed, the CPU 98
Starts cutting the wafers 82 in accordance with the position information (step). That is, the CPU 98 controls each axis control 102 to reciprocate the cutting stage 100 in the area corresponding to the opening 90, and controls the speed controller 104 to feed the blades 68 and 70 in the pitch in the area. . Thereby, the cutting stage 100 and the blades 68, 70
Since unnecessary movement is eliminated, the cutting time can be reduced.

When such a cutting operation is repeatedly performed, and the cutting of all the wafers 82 is completed, the CPU 9
8 controls the transport device 50 shown in FIG. 1 to transport the processed frame 84 toward the spinner table 108 shown in FIG. The cut wafer 82 is held and cleaned by the spinner table 108 (step).

As described above, the dicing apparatus 1 of the present embodiment mounts the wafer 82 on the frame 84 via the mounting jig 88, and based on the position information indicating the mounting position of the wafer 82 by the mounting jig 88. Wafer 82
Are aligned and cut, so that the throughput of the wafer 82 can be improved without detecting the size, shape, and position of the wafer 82.

Further, the dicing apparatus 1 transfers the wafer 82 through the opening 90 of the mounting jig 88 to the frame 84.
And the alignment and cutting are performed in the area of the opening 90, so that the wafer 82 can be efficiently aligned and cut. In the present embodiment,
Although the position information of the opening 90 is directly input from the terminal 96 to control the alignment and the cutting, the invention is not limited to this. For example, the position information is stored in the memory of the CPU 98 in advance. That is, position information of a plurality of different types of mounting jigs is stored in the memory. Then, when only the model number of the mounting jig is input from the terminal 96,
The CPU 98 may read out the position information corresponding to the model number from the memory and control the alignment device and each axis control 102.

In this embodiment, the opening 90 having substantially the same size as the wafer 82 is formed in the mounting jig 88. The size of the opening 88 allows the wafer 82 to be mounted on the frame 84. Any size is acceptable. Note that the wafer 82 may be placed in the frame 84 other than in the opening 90.
A mounting position specifying portion that can be mounted at a specific position above may be formed on the mounting jig 88.

Further, in this embodiment, cutting of the rectangular wafer 82 has been described. However, the shape of the wafer is not limited to this. Any wafer can be used as long as it can be attached to the frame 84 through the opening 90.
In this case, if the wafer is extremely small with respect to the size of the opening 84, the moving stroke of the cutting stage 100 and the blades 68 and 70 is wasted, and therefore, the wafer has the opening 90 according to the size of the wafer. Preferably, the mounting jig is selected from other mounting jigs.

In this embodiment, an example of a dicing apparatus for cutting a semiconductor wafer has been described. However, the present invention is not limited to this apparatus, and any work that can be mounted on a frame by a mounting jig can be used. It does not matter which cutting device is used.

[0029]

As described above, according to the work mounting jig, the work mounting method, and the work cutting method and apparatus according to the present invention, the work is mounted on the frame through the opening of the mounting jig. Since the workpiece is imaged with the position of the opening as the position of the workpiece, the workpiece is aligned and cut, so that the throughput of the workpiece can be improved without detecting the size, shape and position of the workpiece.

[Brief description of the drawings]

FIG. 1 is a perspective view of a dicing apparatus to which the present invention is applied.

FIG. 2 is a plan view of the dicing apparatus shown in FIG.

FIG. 3 is a diagram showing an example in which an irregular wafer is mounted on a frame and stored in a cassette;

FIG. 4 is a diagram showing a method of mounting an irregular-shaped wafer to a frame using a mounting jig.

FIG. 5 is a view showing an example of a mounting jig in which three openings for mounting a wafer are formed.

FIG. 6 is a view showing an example of a mounting jig in which four openings for mounting a wafer are formed.

FIG. 7 is a block diagram showing a control system of the dicing apparatus shown in FIG. 1;

FIG. 8 is a flowchart for cutting a wafer using a mounting jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Dicing apparatus 10 ... Cutting part 18, 19 ... CCD camera 68, 70 ... Blade 82 ... Wafer 84 ... Frame 88, 92, 94 ... Mounting jig 90 ... Opening 96 ... Terminal 98 ... CPU

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] October 18, 1999 (1999.10.
18)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction contents]

[0005]

In order to achieve the above object, the present invention provides a work mounting jig for positioning a work on a frame and mounting the work on an adhesive tape affixed to the frame. The mounting jig is formed in substantially the same shape as the frame, and a positioning opening through which a work can be inserted is formed in the mounting jig. After the mounting jig is overlaid on the frame, the positioning jig positioning opening is formed. The work is inserted into the frame, the work is positioned on the frame, and attached to the adhesive tape.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006] In order to achieve the above object, the present invention provides a method of mounting a work, which positions the work on a frame and attaches the work to an adhesive tape attached to the frame, wherein the work is formed in substantially the same shape as the frame. A mounting jig having an opening through which a work can be inserted is superimposed on a frame, a work is inserted into the opening of the mounting jig superimposed on the frame, the work is positioned on the frame, and attached to the adhesive tape. It is characterized by the following.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

In order to achieve the above object, the present invention provides a method of cutting a work, comprising positioning the work on a frame, attaching the work to an adhesive tape attached to the frame, and cutting the work. A mounting jig formed and formed with an opening through which a work can be inserted is superimposed on a frame, a work is inserted into an opening of the mounting jig superimposed on the frame, and the work is positioned on the frame. Attached to the adhesive tape, while holding the frame with the work attached to the table, based on the position information indicating the position of the opening of the mounting jig, the work located in the opening was imaged and imaged. The work is aligned based on the image information of the work, and after the alignment is completed, the mounting jig is opened based on the position information. Characterized by cutting the work space parts by specifying the cutting range.

Claims (4)

[Claims] 1. A work mounting jig for positioning and mounting a work on a frame, wherein the mounting jig is formed in substantially the same shape as the frame, and a positioning jig for inserting the work into the mounting jig is provided. The work mounting jig is characterized in that, after the mounting jig is overlaid on the frame, the work is inserted into the positioning opening of the mounting jig, and the work is positioned and mounted on the frame. . 2. A method of mounting a work, wherein the work is positioned on a frame, and a mounting jig formed in substantially the same shape as the frame and having an opening through which the work can be inserted is overlapped with the frame. A method of mounting a work, comprising inserting a work into an opening of the mounting jig superimposed on the frame, positioning the work on the frame, and mounting the work. 3. A method for cutting a workpiece by positioning the workpiece on a frame and mounting the workpiece on the frame, wherein the mounting jig is formed in substantially the same shape as the frame and has an opening through which the workpiece can be inserted. A work is inserted into the opening of the mounting jig superimposed on the frame, the work is positioned on the frame and mounted, and the frame on which the work is mounted is held on a table, and the mounting is performed. Based on the position information indicating the position of the opening of the jig, an image of the work located at the opening is taken, the work is aligned based on the image information of the taken work, and after the alignment is completed, based on the position information, Cutting the work by designating the area of the opening of the mounting jig as a cutting range by cutting 4. A frame on which a work is mounted, a table holding the frame, an image pickup means for picking up an image of the work on the frame held by the table, and image information of the work picked up by the image pickup means. A cutting device comprising: an alignment unit that aligns the work based on the alignment unit; and a cutting unit that cuts the work aligned by the alignment unit.The cutting device is formed in substantially the same shape as the frame and is superimposed on the frame. A mounting jig having a work insertion opening for mounting the work on a frame, input means for inputting position information indicating a position of the opening of the mounting jig, and the input means input to the input means. On the basis of the position information, the imaging means is controlled to cause the work located at the opening to be imaged, and the alignment is performed. Controlling the cutting means to perform alignment of the work based on the image information of the work imaged by the imaging means, and controlling the cutting means to execute the cutting by designating the area of the opening as a cutting range. A work cutting device, comprising: control means;