JP2000012600A - Lead frame fixing jig - Google Patents

Lead frame fixing jig

Info

Publication number
JP2000012600A
JP2000012600A JP10171800A JP17180098A JP2000012600A JP 2000012600 A JP2000012600 A JP 2000012600A JP 10171800 A JP10171800 A JP 10171800A JP 17180098 A JP17180098 A JP 17180098A JP 2000012600 A JP2000012600 A JP 2000012600A
Authority
JP
Japan
Prior art keywords
lead frame
receiving portion
pressing
frame receiving
mounting table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10171800A
Other languages
Japanese (ja)
Inventor
Nobuyuki Iwashita
信幸 岩下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10171800A priority Critical patent/JP2000012600A/en
Publication of JP2000012600A publication Critical patent/JP2000012600A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame fixing jig having a lead frame receiving part which can be easily exchanged in a short time without using a tool. SOLUTION: This lead frame fixing jig is provided with a lead frame receiving part 19 for mounting a lead frame where tapered surfaces 19c, 19d are formed on one side and the other side, a mounting table 21 which has a step- difference part having a tapered surface fitting to the other side tapered surface 19c, a rotating shaft 31 installed on the mounting table 21, a pressing part 29a which is rotatably attached to the rotating shaft 31 and whose protruding part 29b presses the receiving part 19, a spring 33 whose both ends are connected with a base end portion of the pressing part 29a and the mounting table 21, and a lead frame holding part which holds down the lead frame to the receiving part 19 side when the lead frame is mounted on the receiving part 19.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、リードフレームを
固定するリードフレーム固定治具に関するものである。
特には、短時間で工具を使わずに容易に交換できるリー
ドフレーム受け部を備えたリードフレーム固定治具に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame fixing jig for fixing a lead frame.
In particular, the present invention relates to a lead frame fixing jig provided with a lead frame receiving portion that can be easily replaced in a short time without using a tool.

【０００２】[0002]

【従来の技術】ワイヤボンディング装置は、リードフレ
ーム固定治具を有しており、このリードフレーム固定治
具によってリードフレームを固定保持し、半導体チップ
とインナーリードとを金線で電気的に接続するものであ
る。2. Description of the Related Art A wire bonding apparatus has a lead frame fixing jig. The lead frame is fixed and held by the lead frame fixing jig, and a semiconductor chip and inner leads are electrically connected to each other by a gold wire. Things.

【０００３】従来のリードフレーム固定治具は、リード
フレームを載置するリードフレーム受け手段、及び、リ
ードフレームを押さえるリードフレーム押さえ手段等か
ら構成されている。このリードフレーム受け手段は、リ
ードフレームを載置する板状のリードフレーム受け部を
有し、このリードフレーム受け部の上にリードフレーム
を載置する構成となっている。上記リードフレーム押さ
え手段は、インナーリードを押さえるインナーリード押
さえ部を有している。A conventional lead frame fixing jig includes lead frame receiving means for mounting a lead frame, lead frame holding means for holding the lead frame, and the like. The lead frame receiving means has a plate-shaped lead frame receiving portion on which the lead frame is placed, and the lead frame is placed on the lead frame receiving portion. The lead frame holding means has an inner lead holding portion for holding the inner lead.

【０００４】[0004]

【発明が解決しようとする課題】ところで、上記従来の
リードフレーム固定治具においては、異なる種類のリー
ドフレームを保持する場合には、そのリードフレームに
対応するリードフレーム受け部及びインナーリード押さ
え部それぞれに交換する必要がある。この交換の際、リ
ードフレーム受け部は取付台にネジ止めによって固定さ
れているため、ネジを外す等の作業をしなければならな
い。このため、それらを交換するのには時間がかかって
しまう。さらに、ワイヤボンディングの際にはリードフ
レーム固定治具が約２５０℃に加熱されるので、ネジに
破損が生じたり、ワイヤボンディングによる振動によっ
てネジに緩みが生じる等のトラブルが起こることがあ
る。In the above-described conventional lead frame fixing jig, when holding different types of lead frames, each of the lead frame receiving portion and the inner lead holding portion corresponding to the lead frame. Need to be replaced. At the time of this replacement, the lead frame receiving portion is fixed to the mounting base by screws, so that operations such as removing screws must be performed. Therefore, it takes time to replace them. Furthermore, since the lead frame fixing jig is heated to about 250 ° C. during wire bonding, troubles such as breakage of the screw and loosening of the screw due to vibration due to the wire bonding may occur.

【０００５】本発明は上記のような事情を考慮してなさ
れたものであり、その目的は、短時間で工具を使わずに
容易に交換できるリードフレーム受け部を備えたリード
フレーム固定治具を提供することにある。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a lead frame fixing jig having a lead frame receiving portion which can be easily replaced in a short time without using a tool. To provide.

【０００６】[0006]

【課題を解決するための手段】上記課題を解決するた
め、本発明に係るリードフレーム固定治具は、段差部を
有する載置台と、リードフレームを載置するためのリー
ドフレーム受け部と、該リードフレーム受け部を該載置
台上に載置した際、該リードフレーム受け部の一方側を
押圧することによって該段差部に該リードフレーム受け
部の他方側を押し当てることにより、該載置台上に該リ
ードフレーム受け部を保持するめの押圧手段と、該リー
ドフレーム受け部上にリードフレームを載置した際、該
リードフレームを該リードフレーム受け部側に押さえる
リードフレーム押さえ部と、を具備することを特徴とす
る。In order to solve the above-mentioned problems, a lead frame fixing jig according to the present invention includes a mounting table having a step, a lead frame receiving portion for mounting a lead frame, and a lead frame receiving portion. When the lead frame receiving portion is placed on the mounting table, the other side of the lead frame receiving portion is pressed against the step portion by pressing one side of the lead frame receiving portion. Pressing means for holding the lead frame receiving portion, and a lead frame pressing portion for pressing the lead frame toward the lead frame receiving portion when the lead frame is placed on the lead frame receiving portion. It is characterized by the following.

【０００７】また、上記リードフレーム受け部の一方側
にはテーパー面が設けられ、上記押圧手段は該テーパー
面を押圧するものであることが好ましい。これにより、
リードフレーム受け部を載置台に高い保持固定力で保持
することができる。It is preferable that a tapered surface is provided on one side of the lead frame receiving portion, and the pressing means presses the tapered surface. This allows
The lead frame receiving portion can be held on the mounting table with high holding and fixing force.

【０００８】また、上記リードフレーム受け部の他方側
にはテーパー面が設けられ、該段差部には該テーパー面
に適合するテーパー面が設けられていることが好まし
い。これにより、リードフレーム受け部を段差部に押し
当てるとテーパー同士が接触し、リードフレーム受け部
が載置台から外れにくくなる。It is preferable that a tapered surface is provided on the other side of the lead frame receiving portion, and that the step portion is provided with a tapered surface adapted to the tapered surface. Accordingly, when the lead frame receiving portion is pressed against the step portion, the tapered portions come into contact with each other, and the lead frame receiving portion is less likely to come off the mounting table.

【０００９】また、上記押圧手段は、該載置台に設けら
れた回転軸と、該回転軸に回転自在に取り付けられた押
圧部材であってその先端部で該リードフレーム受け部を
押圧する押圧部材と、該押圧部材の基端部と該載置台に
両端が接続されたバネと、を有するものであることが好
ましい。The pressing means includes a rotating shaft provided on the mounting table, and a pressing member rotatably mounted on the rotating shaft, the pressing member for pressing the lead frame receiving portion at its tip end. And a spring whose both ends are connected to the mounting table and both ends of the pressing member.

【００１０】本発明に係るリードフレーム固定治具は、
一方側及び他方側にテーパー面が設けられた、リードフ
レームを載置するためのリードフレーム受け部と、該他
方側のテーパー面に適合するテーパー面を備えた段差部
を有する載置台と、該載置台に設けられた回転軸と、該
回転軸に回転自在に取り付けられた押圧部材であってそ
の先端部で該リードフレーム受け部を押圧する押圧部材
と、該押圧部材の基端部と該載置台に両端が接続された
バネと、該リードフレーム受け部上にリードフレームを
載置した際、該リードフレームを該リードフレーム受け
部側に押さえるリードフレーム押さえ部と、を具備し、
上記リードフレーム受け部を上記載置台上に載置した
際、該リードフレーム受け部の一方側のテーパー面を上
記押圧部材の先端部で押圧することによって上記段差部
のテーパー面に該リードフレーム受け部の他方側のテー
パー面を押し当てることにより、該載置台上に該リード
フレーム受け部を保持することを特徴とする。また、上
記載置台は該段差部と押圧手段との間に位置するレール
状の凸部を有し、上記リードフレーム受け部は該レール
状の凸部に嵌め込まれる凹部を有することが好ましい。[0010] The lead frame fixing jig according to the present invention comprises:
A tapered surface provided on one side and the other side, a lead frame receiving portion for mounting a lead frame, and a mounting table having a step portion having a tapered surface adapted to the tapered surface on the other side; A rotating shaft provided on the mounting table, a pressing member rotatably attached to the rotating shaft, a pressing member for pressing the lead frame receiving portion at a distal end thereof, a base end of the pressing member, A spring having both ends connected to a mounting table, and a lead frame pressing portion for pressing the lead frame toward the lead frame receiving portion when the lead frame is mounted on the lead frame receiving portion,
When the lead frame receiving portion is placed on the mounting table, the tapered surface on one side of the lead frame receiving portion is pressed by the distal end of the pressing member so that the tapered surface of the step portion is pressed against the tapered surface of the step portion. The lead frame receiving portion is held on the mounting table by pressing a tapered surface on the other side of the portion. Further, it is preferable that the mounting table has a rail-shaped convex portion located between the step portion and the pressing means, and the lead frame receiving portion has a concave portion fitted into the rail-shaped convex portion.

【００１１】上記リードフレーム固定治具では、リード
フレーム受け部を短時間で工具を使わずに容易に交換す
ることができる。すなわち、リードフレーム押さえ部を
リードフレーム受け部の上からエスケープさせた後、押
圧部材の基端部を、回転軸を中心にバネが引っ張る方向
と逆方向に回転させる。これにより、押圧部材の先端部
によるリードフレーム受け部への押圧を解除し、自由に
なったリードフレーム受け部をオペレータが載置台から
取り外すことができ、リードフレーム受け部を交換する
ことができる。したがって、リードフレーム受け部の交
換作業（ワイヤボンド切り替え作業）に締結用要素部
品、工具、熟練した技術が不要となり、交換作業時間を
大幅に短縮することができる。In the lead frame fixing jig, the lead frame receiving portion can be easily replaced in a short time without using any tool. That is, after the lead frame pressing portion is escaped from above the lead frame receiving portion, the base end of the pressing member is rotated about the rotation axis in a direction opposite to the direction in which the spring pulls. Thus, the pressing of the leading end of the pressing member against the lead frame receiving portion is released, the operator can remove the free lead frame receiving portion from the mounting table, and can replace the lead frame receiving portion. Therefore, the replacement work of the lead frame receiving portion (wire bond switching work) does not require fastening element parts, tools, and skilled techniques, and the replacement work time can be greatly reduced.

【００１２】[0012]

【発明の実施の形態】以下、図面を参照して本発明の一
実施の形態について説明する。図１（ａ）は、本発明の
実施の形態によるリードフレーム固定治具のリードフレ
ーム受け部を示す平面図であり、図１（ｂ）は、図１
（ａ）に示すリードフレーム受け部を分解した平面図で
ある。図２は、本発明の実施の形態によるリードフレー
ム固定治具を示す斜視図である。図３は、図２に示すリ
ードフレーム固定治具を分解した様子を示す斜視図であ
る。図４は、図２に示すリードフレーム固定治具によっ
てリードフレームを固定する方法を説明するための断面
図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view showing a lead frame receiving portion of the lead frame fixing jig according to the embodiment of the present invention, and FIG.
It is the top view which decomposed | disassembled the lead frame receiving part shown to (a). FIG. 2 is a perspective view showing a lead frame fixing jig according to the embodiment of the present invention. FIG. 3 is a perspective view showing a state in which the lead frame fixing jig shown in FIG. 2 is disassembled. FIG. 4 is a cross-sectional view for explaining a method of fixing the lead frame by the lead frame fixing jig shown in FIG.

【００１３】リードフレーム固定治具は、図４に示すよ
うに、半導体チップ２５とインナーリード２３とをツー
ル２２を用いてワイヤ（金線）２４で電気的に接続する
ワイヤボンディングを行う際に、ワイヤボンディング装
置内にリードフレーム３を固定するための治具であり、
この治具はワイヤボンディング装置に内蔵されるもので
ある。なお、リードフレーム３は半導体チップ２５をマ
ウントするダイパット２７を有し、このダイパット２７
の周囲にはインナーリード２３が配置されており、この
インナーリード２３の一端はタイバー２６を介してアウ
ターリード２８に連結されている。As shown in FIG. 4, the lead frame fixing jig performs wire bonding for electrically connecting a semiconductor chip 25 and an inner lead 23 with a wire (gold wire) 24 using a tool 22. A jig for fixing the lead frame 3 in the wire bonding apparatus,
This jig is built in the wire bonding apparatus. The lead frame 3 has a die pad 27 on which the semiconductor chip 25 is mounted.
An inner lead 23 is arranged around the inner lead 23. One end of the inner lead 23 is connected to an outer lead 28 via a tie bar 26.

【００１４】図２のリードフレーム固定治具１は、リー
ドフレーム３を載置するリードフレーム受け手段５、リ
ードフレーム３を押さえるリードフレーム押さえ手段
７、及び、リードフレーム受け手段５とリードフレーム
押さえ手段７を取り付ける略直方体形状からなる取付台
９から構成されている。The lead frame fixing jig 1 shown in FIG. 2 includes lead frame receiving means 5 for mounting the lead frame 3, lead frame pressing means 7 for pressing the lead frame 3, and lead frame receiving means 5 and lead frame pressing means. 7 comprises a mounting base 9 having a substantially rectangular parallelepiped shape.

【００１５】図３に示すように、リードフレーム押さえ
手段７は、インナーリードを押さえるインナーリード押
さえ部１１、この押さえ部１１を取り付ける取付部材１
３、及び、回転軸１５を中心として回転可能に取付台９
に取り付けられる回転部材１７から構成されている。As shown in FIG. 3, the lead frame holding means 7 includes an inner lead holding portion 11 for holding the inner lead, and a mounting member 1 for attaching the holding portion 11.
3, and the mounting base 9 rotatable about the rotation shaft 15
, And a rotating member 17 attached to.

【００１６】インナーリード押さえ部１１は、図４に示
すインナーリード２３を押さえた際に該インナーリード
２３の一部と半導体チップ２５を露出させるための穴１
１ａを有している。また、インナーリード押さえ部１１
の下面には、インナーリード２３を押さえるための突起
１１ｂが設けられている。また、回転部材１７は、取付
台１３が取り付けられる上面部材１７ａ、この上面部材
１７ａを支持する第１及び第２の支持部材１７ｂ，１７
ｃから構成されている。第１及び第２の支持部材１７
ｂ，１７ｃは、互いに所定の間隔を有して配置されてい
る。第１及び第２の支持部材１７ｂ，１７ｃそれぞれの
下端部には回転軸１５を挿入する穴１７ｄ，１７ｅが設
けられている。The inner lead holding portion 11 has a hole 1 for exposing a part of the inner lead 23 and the semiconductor chip 25 when the inner lead 23 shown in FIG.
1a. Also, the inner lead holding portion 11
A projection 11b for holding down the inner lead 23 is provided on the lower surface of. The rotating member 17 includes an upper surface member 17a to which the mounting base 13 is attached, and first and second support members 17b and 17 for supporting the upper surface member 17a.
c. First and second support members 17
b and 17c are arranged at a predetermined interval from each other. Holes 17d and 17e into which the rotating shaft 15 is inserted are provided at lower ends of the first and second support members 17b and 17c, respectively.

【００１７】図３に示すように、取付台９の一側面に
は、回転部材１７を回転可能に取り付ける取付部３５が
設けられている。この取付部３５の上部には、第１及び
第２の支持部材１７ｂ，１７ｃを取り付ける際に回転軸
１５が挿入される穴３５ａが設けられている。また、取
付部３５の上部には回転可能に形成されたくさび３７が
設けられている。このくさび３７は、図２に示すよう
に、第１の保持部材１７ｂに設けられた凹部１７ｆに嵌
め込むためのものである。このようにくさび３７を嵌め
込むことによってくさび効果が生じ、リードフレーム３
が固定される状態に回転部材１７がロックされる。As shown in FIG. 3, a mounting portion 35 is provided on one side surface of the mounting base 9 to rotatably mount the rotating member 17 thereon. A hole 35a into which the rotating shaft 15 is inserted when the first and second support members 17b and 17c are mounted is provided in an upper portion of the mounting portion 35. In addition, a rotatable wedge 37 is provided on an upper portion of the mounting portion 35. As shown in FIG. 2, the wedge 37 is for fitting into a concave portion 17f provided in the first holding member 17b. The wedge effect is generated by fitting the wedge 37 in this manner, and the lead frame 3
The rotating member 17 is locked in a state where is fixed.

【００１８】上記リードフレーム受け手段５は、図１及
び図３に示すように、リードフレーム３を載置する板状
のリードフレーム受け部１９及びこの受け部１９を載置
する載置台２１から構成されている。この載置台２１は
取付台９の上面に固定されている。載置台２１の上面に
はリードフレーム受け部１９の後記凹部１９ｂを嵌め込
むレール（凸部）２１ａが設けられている。このレール
２１ａの一方側には段差部２１ｂが設けられている。レ
ール２１ａの他方側には、リードフレーム受け部１９を
段差部２１ｂに押圧して固定保持する保持手段２９が取
り付けられている。As shown in FIGS. 1 and 3, the lead frame receiving means 5 comprises a plate-shaped lead frame receiving portion 19 on which the lead frame 3 is mounted and a mounting table 21 on which the receiving portion 19 is mounted. Have been. The mounting table 21 is fixed to the upper surface of the mounting table 9. On the upper surface of the mounting table 21, a rail (projection) 21a into which a recess 19b described later of the lead frame receiving portion 19 is fitted is provided. A step 21b is provided on one side of the rail 21a. On the other side of the rail 21a, a holding means 29 for pressing and holding the lead frame receiving portion 19 against the step portion 21b is fixed.

【００１９】リードフレーム受け部１９の上面には、図
４に示すリードフレーム３のダイパット２７を収納する
凹部１９ａが設けられている。リードフレーム受け部１
９の下面には、載置台２１の上面のレール２１ａをスラ
イド自在に嵌め込む凹部１９ｂが設けられている。この
リードフレーム受け部１９の一方側（該受け部１９をレ
ール２１ａ上に嵌め込んだ際に段差部２１ｂ側に位置す
る側）の面にはテーパー１９ｃが設けられている。この
テーパー１９ｃに適合するテーパーが段差部２１ｂにも
設けられており、該受け部１９を段差部２１ｂに押し当
てるとテーパー同士が接触し、該受け部１９が載置台２
１から外れにくくなる。また、図１に示すように、リー
ドフレーム受け部１９の他方側（該受け部１９をレール
２１ａ上に嵌め込んだ際に押圧部２９ａ側に位置する
側）の面にはテーパー１９ｄが設けられている。A recess 19a for accommodating the die pad 27 of the lead frame 3 shown in FIG. Lead frame receiving part 1
On the lower surface of 9, there is provided a concave portion 19 b into which the rail 21 a on the upper surface of the mounting table 21 is slidably fitted. A taper 19c is provided on a surface of one side of the lead frame receiving portion 19 (the side located on the step portion 21b side when the receiving portion 19 is fitted on the rail 21a). A taper conforming to the taper 19c is also provided on the step portion 21b. When the receiving portion 19 is pressed against the step portion 21b, the tapers contact each other, and the receiving portion 19
1 is hard to come off. As shown in FIG. 1, a taper 19d is provided on the surface of the other side of the lead frame receiving portion 19 (the side located on the pressing portion 29a side when the receiving portion 19 is fitted on the rail 21a). ing.

【００２０】上記保持手段２９は、約２５０℃の熱を考
慮したメタル軸受に支持された回転軸３１、この軸３１
に回転可能に取り付けられた押圧部２９ａ、この押圧部
２９ａの基端と載置台２１とに両端が取り付けられたバ
ネ３３から構成されている。押圧部２９ａの先端側には
棒状の突出部２９ｂがネジで取り付けられており、この
ネジによって突出部２９ｂの押圧部２９ａからの長さを
調整できるようになっている。The holding means 29 includes a rotating shaft 31 supported by a metal bearing considering heat of about 250 ° C.
And a spring 33 having both ends attached to the base end of the pressing portion 29a and the mounting table 21. A rod-shaped protrusion 29b is attached to the tip side of the pressing portion 29a with a screw, and the length of the protrusion 29b from the pressing portion 29a can be adjusted by the screw.

【００２１】この押圧部２９ａは、その中央部近傍で回
転軸３１に回転可能に支持され、その基端部がバネ３３
で引っ張られることによりその先端側の突出部２９ｂが
レール２１ａ上に置かれたリードフレーム受け部１９の
他方側のテーパー面１９ｄを段差部２１ｂの方に押し付
ける構成とされている。このようにバネ力を利用してテ
ーパー面１９ｄを突出部２９ｂによって横方向（レール
２１ａ表面と平行方向）に押圧することにより、リード
フレーム受け部１９を斜め下方向（レール２１ａ側に押
さえ付ける方向）に押圧することができる。その結果、
この保持手段２９は該受け部１９に高い保持固定力を発
生させることとなる。The pressing portion 29a is rotatably supported by a rotating shaft 31 near its center, and its base end is formed by a spring 33.
As a result, the projecting portion 29b on the tip side presses the tapered surface 19d on the other side of the lead frame receiving portion 19 placed on the rail 21a toward the step portion 21b. By pressing the tapered surface 19d in the lateral direction (parallel to the surface of the rail 21a) by the projecting portion 29b by using the spring force in this manner, the lead frame receiving portion 19 is obliquely moved downward (toward the rail 21a). ). as a result,
The holding means 29 generates a high holding and fixing force in the receiving portion 19.

【００２２】また、異なる種類のリードフレームにワイ
ヤボンディングを行うためにリードフレーム受け部１９
を別のものに交換する際は、図１（ｂ）に示すように、
押圧部２９ａの基端部を、回転軸３１を中心にバネ３３
が引っ張る方向と逆方向に回転させる。これにより、突
出部２９ｂは矢印のように動き、リードフレーム受け部
１９への押圧が解除される。すると、リードフレーム受
け部１９が載置台２１上から自由になり、オペレータが
リードフレーム受け部１９を載置台２１から取り外すこ
とができる。In order to perform wire bonding to different types of lead frames, a lead frame receiving portion 19 is provided.
When replacing with another, as shown in FIG. 1 (b),
The proximal end of the pressing portion 29 a is
Rotate in the direction opposite to the direction of pulling. As a result, the protruding portion 29b moves as shown by the arrow, and the pressing on the lead frame receiving portion 19 is released. Then, the lead frame receiving portion 19 is free from the mounting table 21, and the operator can remove the lead frame receiving portion 19 from the mounting table 21.

【００２３】次に、リードフレーム固定方法について図
４及び図５を参照しつつ説明する。図５（ａ），（ｂ）
は、リードフレーム固定方法を説明するための断面図で
ある。Next, a method of fixing the lead frame will be described with reference to FIGS. FIG. 5 (a), (b)
FIG. 4 is a cross-sectional view for explaining a lead frame fixing method.

【００２４】図４に示すように、リードフレーム受け部
１９にリードフレーム３を載置する。この際、凹部１９
ａ内にダイパット２７が収納される。そして、インナー
リード押さえ部１１の突起１１ｂがインナーリード２３
のタイバーに近い部分を下方に押さえることにより、リ
ードフレーム受け部１９の上にリードフレーム３を保持
する。As shown in FIG. 4, the lead frame 3 is placed on the lead frame receiving portion 19. At this time, the recess 19
The die pad 27 is stored in a. Then, the protrusion 11b of the inner lead holding portion 11 is
The lead frame 3 is held on the lead frame receiving portion 19 by pressing the portion close to the tie bar downward.

【００２５】図５（ａ），（ｂ）に示すように、リード
フレーム固定方法は、インナーリード２３のタイバー２
６から所定の距離ｃだけ離した位置（インナーリードの
根元、即ちタイバーのすぐ内側）に突起１１ｂでインナ
ーリード２３を押さえ付けることにより固定するもので
ある。これにより、ワイヤボンディングを行う際のイン
ナーリード２３のバタツキを完全に抑えることができ、
インナーリード側へのボンディング（セカンドボンド）
を良好に行うことができる。As shown in FIGS. 5A and 5B, the lead frame is fixed by the tie bar 2 of the inner lead 23.
The inner lead 23 is fixed by pressing the inner lead 23 with a protrusion 11b at a position (the root of the inner lead, that is, immediately inside the tie bar) at a predetermined distance c from 6. As a result, flapping of the inner lead 23 during wire bonding can be completely suppressed,
Bonding to inner lead side (second bond)
Can be performed favorably.

【００２６】次に、図２のリードフレーム固定治具１に
おいてリードフレーム受け部１９を交換する手順につい
て図１、図６及び図７を参照しつつ説明する。リードフ
レーム３の種類を変更してワイヤボンディングを行う際
にはリードフレーム受け部１９を交換する必要がある。Next, a procedure for replacing the lead frame receiving portion 19 in the lead frame fixing jig 1 of FIG. 2 will be described with reference to FIGS. 1, 6, and 7. FIG. When performing wire bonding by changing the type of the lead frame 3, the lead frame receiving portion 19 needs to be replaced.

【００２７】まず、図６に示すように、第１の支持部材
１７ｂの凹部１７ｆからくさび３７を９０°程度回転さ
せる。この後、リードフレーム押さえ手段７を図１の矢
印のように回転軸１５を中心として９０°程度回転させ
る。これにより、インナーリード押さえ部１１をリード
フレーム３から外すことができる。First, as shown in FIG. 6, the wedge 37 is rotated by about 90 ° from the recess 17f of the first support member 17b. Thereafter, the lead frame holding means 7 is rotated about the rotation shaft 15 by about 90 ° as shown by the arrow in FIG. Thereby, the inner lead holding portion 11 can be removed from the lead frame 3.

【００２８】次に、図７に示すように、リードフレーム
３を取り外した後、バネ３３が引っ張る力とは逆方向に
押圧部２９ａの基端側を動かすことにより、回転軸３１
を中心として押圧部２９ａを図１（ｂ）に示す矢印のよ
うに少し回転させる。これによって、リードフレーム受
け部１９を押圧している突出部２９ｂを該受け部１９か
ら解除し、自由になったリードフレーム受け部１９を載
置台２１のレール２１ａから取り外すことができる。Next, as shown in FIG. 7, after the lead frame 3 is detached, the proximal end side of the pressing portion 29a is moved in a direction opposite to the pulling force of the spring 33, so that the rotating shaft 31 is moved.
The pressing part 29a is slightly rotated about the center as shown by the arrow shown in FIG. As a result, the projecting portion 29b pressing the lead frame receiving portion 19 is released from the receiving portion 19, and the free lead frame receiving portion 19 can be removed from the rail 21a of the mounting table 21.

【００２９】次に、別のリードフレーム受け部を準備
し、上記のように押圧部２９ａの基端側を動かし、その
リードフレーム受け部をレール２１ａに嵌め込んだ後、
バネ３３の力によってその受け部の一端を突出部２９ｂ
の先端で押圧する。これにより、その受け部の他端を段
差部２１ｂに押しつけ、該受け部を載置台２１に保持す
る。この後、該受け部の上にリードフレームを載置し、
リードフレーム押さえ手段７を回転させ、第１の保持部
材１７ｂの凹部１７ｆにくさび３７を嵌め込む。このく
さび３７によってリードフレーム押さえ手段７を固定
し、更にダブルロックとしてボールプランジャー（図示
せず）によってインナーリード押さえ部１１を両サイド
より保持し、その結果、インナーリード押さえ部１１に
よってリードフレーム３を固定する。このようにしてリ
ードフレーム受け部１９を交換することができる。Next, another lead frame receiving portion is prepared, the base end side of the pressing portion 29a is moved as described above, and the lead frame receiving portion is fitted into the rail 21a.
One end of the receiving portion is projected by the force of the spring 33 to the projecting portion 29b.
Press with the tip of. Thereby, the other end of the receiving part is pressed against the step part 21 b, and the receiving part is held on the mounting table 21. Thereafter, a lead frame is placed on the receiving portion,
The lead frame holding means 7 is rotated, and the wedge 37 is fitted into the recess 17f of the first holding member 17b. The lead frame pressing means 7 is fixed by the wedge 37, and furthermore, the inner lead pressing section 11 is held from both sides by a ball plunger (not shown) as a double lock. As a result, the lead frame 3 is Is fixed. Thus, the lead frame receiving portion 19 can be replaced.

【００３０】上記実施の形態のリードフレーム固定治具
によれば、オペレータがくさび３７を外し、インナーリ
ード押さえ部１１を回転軸（支点軸）１５を用いた回転
動作によりリードフレーム受け部１９の上からエスケー
プさせた後、押圧部２９ａの基端部を、回転軸３１を中
心にバネ３３が引っ張る方向と逆方向に回転させる。こ
れにより、突出部２９ｂによるリードフレーム受け部１
９への押圧を解除し、自由になったリードフレーム受け
部１９をオペレータが載置台２１から取り外すことがで
き、リードフレーム受け部１９を交換することができ
る。したがって、リードフレーム受け部１９の交換作業
（ワイヤボンド切り替え作業）に締結用要素部品、工
具、熟練した技術が不要となり、交換作業時間を大幅に
短縮することができる。また、熟練した交換技術が必要
でないため、交換作業についての教育、訓練を受けなく
ても良く、誰でも交換作業を行うことが可能となる。According to the lead frame fixing jig of the above-described embodiment, the operator removes the wedge 37 and moves the inner lead holding portion 11 on the lead frame receiving portion 19 by rotating operation using the rotating shaft (fulcrum shaft) 15. After having escaped from, the proximal end of the pressing portion 29a is rotated about the rotation shaft 31 in the direction opposite to the direction in which the spring 33 pulls. Thereby, the lead frame receiving portion 1 by the protruding portion 29b is provided.
The operator can remove the lead frame receiving portion 19 released from the mounting table 21 by releasing the pressing on the lead frame 9 and replace the lead frame receiving portion 19. Therefore, the replacement work (wire bond switching work) of the lead frame receiving portion 19 does not require fastening element parts, tools, and skilled skills, and the replacement work time can be greatly reduced. Further, since skilled exchange technology is not required, there is no need to receive education and training on the exchange operation, and anyone can perform the exchange operation.

【００３１】また、リードフレーム受け部１９を従来の
もののようにネジで固定していないので、ワイヤボンデ
ィングの際にリードフレーム固定治具が約２５０℃に加
熱されても、ネジに破損が生じることがなく、ワイヤボ
ンディングによる振動によってネジに緩みが生じる等の
トラブルが起こることもない。Also, since the lead frame receiving portion 19 is not fixed with screws unlike the conventional one, even if the lead frame fixing jig is heated to about 250 ° C. during wire bonding, the screws may be damaged. There is no trouble such as loosening of the screw due to the vibration caused by wire bonding.

【００３２】尚、上記実施の形態では、押圧部２９ａの
先端側にネジで突出部２９ｂを取り付けているが、この
突出部２９ｂは必ずしも必要ではなく、押圧部の先端部
で直接リードフレーム受け部１９を押圧することも可能
である。In the above embodiment, the protrusion 29b is attached to the tip of the pressing portion 29a by a screw. However, the protrusion 29b is not always necessary, and the lead frame receiving portion is directly connected to the tip of the pressing portion. It is also possible to press 19.

【００３３】[0033]

【発明の効果】以上説明したように本発明によれば、短
時間で工具を使わずに容易に交換できるリードフレーム
受け部を備えたリードフレーム固定治具を提供すること
ができる。As described above, according to the present invention, it is possible to provide a lead frame fixing jig having a lead frame receiving portion which can be easily replaced in a short time without using a tool.

【図面の簡単な説明】[Brief description of the drawings]

【図１】図１（ａ）は、本発明の実施の形態によるリー
ドフレーム固定治具のリードフレーム受け部を示す平面
図であり、図１（ｂ）は、図１（ａ）に示すリードフレ
ーム受け部を分解した平面図である。FIG. 1 (a) is a plan view showing a lead frame receiving portion of a lead frame fixing jig according to an embodiment of the present invention, and FIG. 1 (b) is a lead shown in FIG. 1 (a). It is the top view which decomposed | disassembled the frame receiving part.

【図２】本発明の実施の形態によるリードフレーム固定
治具を示す斜視図である。FIG. 2 is a perspective view showing a lead frame fixing jig according to the embodiment of the present invention.

【図３】図２に示すリードフレーム固定治具を分解した
様子を示す斜視図である。FIG. 3 is a perspective view showing a state in which the lead frame fixing jig shown in FIG. 2 is disassembled.

【図４】図２に示すリードフレーム固定治具によってリ
ードフレームを固定する方法を説明するための断面図で
ある。FIG. 4 is a cross-sectional view for explaining a method of fixing the lead frame by the lead frame fixing jig shown in FIG.

【図５】図５（ａ），（ｂ）は、リードフレーム固定方
法を説明するための断面図である。FIGS. 5A and 5B are cross-sectional views illustrating a method of fixing a lead frame.

【図６】図２に示すリードフレーム固定治具においてリ
ードフレーム受け部を交換する手順を説明するための斜
視図である。FIG. 6 is a perspective view for explaining a procedure for replacing a lead frame receiving portion in the lead frame fixing jig shown in FIG. 2;

【図７】図２に示すリードフレーム固定治具においてリ
ードフレーム受け部を交換する手順を説明するものであ
り、図６の次の手順を示す斜視図である。FIG. 7 is a perspective view for explaining a procedure for replacing a lead frame receiving portion in the lead frame fixing jig shown in FIG. 2, and showing a procedure subsequent to FIG. 6;

【符号の説明】[Explanation of symbols]

１…リードフレーム固定治具、３…リードフレーム、５
…リードフレーム受け手段、７…リードフレーム押さえ
手段、９…取付台、１１…インナーリード押さえ部、１
１ａ…穴、１１ｂ…突起、１３…取付部材、１５…回転
軸、１７…回転部材、１７ａ…上面部材、１７ｂ…第１
の支持部材、１７ｃ…第２の支持部材、１７ｄ，１７ｅ
…穴、１７ｆ…凹部、１９…リードフレーム受け部、１
９ａ，１９ｂ…凹部、１９ｃ，１９ｄ…テーパー、２１
…載置台、２１ａ…レール、２１ｂ…段差部、２２…ツ
ール、２３…インナーリード、２４…ワイヤ（金線）、
２５…半導体チップ、２６…タイバー、２７…ダイパッ
ト、２８…アウターリード、２９…保持手段、２９ａ…
押圧部、２９ｂ…突出部、３１…回転軸、３３…バネ、
３５…取付部、３５ａ…穴、３７…くさび。1 ... lead frame fixing jig, 3 ... lead frame, 5
... Lead frame receiving means, 7 ... Lead frame holding means, 9 ... Mounting stand, 11 ... Inner lead holding section, 1
1a: hole, 11b: protrusion, 13: mounting member, 15: rotating shaft, 17: rotating member, 17a: upper surface member, 17b: first
Support member, 17c... Second support member, 17d, 17e
... Hole, 17f ... Recess, 19 ... Lead frame receiving part, 1
9a, 19b: recess, 19c, 19d: taper, 21
... Mounting table, 21a ... rail, 21b ... stepped part, 22 ... tool, 23 ... inner lead, 24 ... wire (gold wire),
25: semiconductor chip, 26: tie bar, 27: die pad, 28: outer lead, 29: holding means, 29a ...
Pressing part, 29b ... projecting part, 31 ... rotating shaft, 33 ... spring,
35: mounting portion, 35a: hole, 37: wedge.

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 段差部を有する載置台と、 リードフレームを載置するためのリードフレーム受け部
と、 該リードフレーム受け部を該載置台上に載置した際、該
リードフレーム受け部の一方側を押圧することによって
該段差部に該リードフレーム受け部の他方側を押し当て
ることにより、該載置台上に該リードフレーム受け部を
保持するめの押圧手段と、 該リードフレーム受け部上にリードフレームを載置した
際、該リードフレームを該リードフレーム受け部側に押
さえるリードフレーム押さえ部と、 を具備することを特徴とするリードフレーム固定治具。1. A mounting table having a step, a lead frame receiving section for mounting a lead frame, and one of the lead frame receiving sections when the lead frame receiving section is mounted on the mounting table. A pressing means for holding the lead frame receiving portion on the mounting table by pressing the other side of the lead frame receiving portion against the step portion by pressing a side, and a lead on the lead frame receiving portion. And a lead frame pressing portion for pressing the lead frame toward the lead frame receiving portion when the frame is mounted. 【請求項２】 上記リードフレーム受け部の一方側には
テーパー面が設けられ、上記押圧手段は該テーパー面を
押圧するものであることを特徴とする請求項１記載のリ
ードフレーム固定治具。2. The lead frame fixing jig according to claim 1, wherein a tapered surface is provided on one side of said lead frame receiving portion, and said pressing means presses said tapered surface. 【請求項３】 上記リードフレーム受け部の他方側には
テーパー面が設けられ、該段差部には該テーパー面に適
合するテーパー面が設けられていることを特徴とする請
求項１記載のリードフレーム固定治具。3. The lead according to claim 1, wherein a tapered surface is provided on the other side of the lead frame receiving portion, and a tapered surface matching the tapered surface is provided in the step portion. Frame fixing jig. 【請求項４】 上記押圧手段は、該載置台に設けられた
回転軸と、該回転軸に回転自在に取り付けられた押圧部
材であってその先端部で該リードフレーム受け部を押圧
する押圧部材と、該押圧部材の基端部と該載置台に両端
が接続されたバネと、を有するものであることを特徴と
する請求項１記載のリードフレーム固定治具。4. The pressing means is a rotating shaft provided on the mounting table, and a pressing member rotatably attached to the rotating shaft, and a pressing member for pressing the lead frame receiving portion at a tip end thereof. 2. The lead frame fixing jig according to claim 1, wherein the jig has a base end of the pressing member and a spring having both ends connected to the mounting table. 【請求項５】 一方側及び他方側にテーパー面が設けら
れた、リードフレームを載置するためのリードフレーム
受け部と、 該他方側のテーパー面に適合するテーパー面を備えた段
差部を有する載置台と、 該載置台に設けられた回転軸と、 該回転軸に回転自在に取り付けられた押圧部材であって
その先端部で該リードフレーム受け部を押圧する押圧部
材と、 該押圧部材の基端部と該載置台に両端が接続されたバネ
と、 該リードフレーム受け部上にリードフレームを載置した
際、該リードフレームを該リードフレーム受け部側に押
さえるリードフレーム押さえ部と、 を具備し、 上記リードフレーム受け部を上記載置台上に載置した
際、該リードフレーム受け部の一方側のテーパー面を上
記押圧部材の先端部で押圧することによって上記段差部
のテーパー面に該リードフレーム受け部の他方側のテー
パー面を押し当てることにより、該載置台上に該リード
フレーム受け部を保持することを特徴とするリードフレ
ーム固定治具。5. A lead frame receiving portion provided with a tapered surface on one side and the other side for mounting a lead frame, and a step portion having a tapered surface adapted to the tapered surface on the other side. A mounting table, a rotating shaft provided on the mounting table, a pressing member rotatably attached to the rotating shaft, a pressing member for pressing the lead frame receiving portion at a tip end thereof, A spring having both ends connected to the base end and the mounting table; and a lead frame pressing portion for pressing the lead frame toward the lead frame receiving portion when the lead frame is mounted on the lead frame receiving portion. When the lead frame receiving portion is placed on the mounting table, the tapered surface on one side of the lead frame receiving portion is pressed by a tip end of the pressing member to thereby form the step portion. By pressing the tapered surface on the other side of the lead frame receiving portion the tapered surface, the lead frame fixture, characterized by holding the lead frame receiving section on mounting table. 【請求項６】 上記載置台は該段差部と押圧手段との間
に位置するレール状の凸部を有し、上記リードフレーム
受け部は該レール状の凸部に嵌め込まれる凹部を有する
ことを特徴とする請求項１又は５記載のリードフレーム
固定治具。6. The mounting table according to claim 1, further comprising a rail-shaped projection located between the step portion and the pressing means, and wherein the lead frame receiving portion has a recess fitted into the rail-shaped projection. The lead frame fixing jig according to claim 1 or 5, wherein:
JP10171800A 1998-06-18 1998-06-18 Lead frame fixing jig Pending JP2000012600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10171800A JP2000012600A (en) 1998-06-18 1998-06-18 Lead frame fixing jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10171800A JP2000012600A (en) 1998-06-18 1998-06-18 Lead frame fixing jig

Publications (1)

Publication Number Publication Date
JP2000012600A true JP2000012600A (en) 2000-01-14

Family

ID=15929953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10171800A Pending JP2000012600A (en) 1998-06-18 1998-06-18 Lead frame fixing jig

Country Status (1)

Country Link
JP (1) JP2000012600A (en)

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