JP2000003807A - Manufacture of chip electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent oblique cracks on the top face of a raw-material substrate, and to reduce the damage on a terminal electrode film, by notching vertical or horizontal stripe grooves for breaking at every insulating substrate in the raw material substrate to a surface reverse to one to which a resistance film and the terminal electrode film are formed, in both upper and lower surfaces of the raw material substrate. SOLUTION: In a raw material substrate A, a large number of chip insulating substrates 1 are arranged crosswise and formed integrally, and V-shaped sectional vertical stripe grooves A1 and horizontal stripe grooves A2 breaking at every each insulating substrate 1 in the raw material substrate A are notched to the undersides of the chip type insulating substrate 1. Terminal electrode films 2 to both ends of resistance films 3 are formed at the places of each insulating substrate 1 in the substrate A, and the resistance films 3 are formed. The substrate A is fed between a pair of rotating large and small rollers so that the top face of the substrate A is brought into contact with the large roller, and broken at every insulating substrate 1 along the vertical and horizontal stripe grooves A1, A2. Accordingly, the electrode films 2 formed onto the top face of the substrate A do not hinder the opening of the vertical and horizontal stripe grooves, and no crack is formed to the electrode films 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip-type electronic component such as a fixed or variable resistor formed by forming a thick resistive film on the upper surface of a chip-type insulating substrate. It is about.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a fixed type chip resistor among such chip type electronic components, generally, methods shown in FIGS. 7 to 12 are employed. That is,. First, as shown in FIG. 7, a material substrate A 'is prepared by integrating a large number of chip-type insulating substrates 1' vertically and horizontally, and on the upper surface thereof, the material substrate A 'is attached to each of the insulating substrates. A vertical streak groove A1 'and a horizontal streak groove A2' having a V-shaped cross section are formed in order to break every 1 '. . Next, as shown in FIG. 8, a resistive film 3 'to be described later is formed on each insulating substrate 1' on the upper surface of the material substrate A '.
After forming the terminal electrode film 2 'at both ends of the substrate so as to cross the transverse groove A2', a resistive film 3 'is formed as shown in FIG. 9, or after forming the resistive film 3'. A terminal electrode film 2 'is formed. . Next, as shown in FIG.
A cover coat 4 'made of glass or the like covering the entire resistive film 3' is formed so as to cross the longitudinal groove A2 '. . Next, as shown in FIGS. 11 and 12, a pair of large and small rollers B1 'and B2'
Between the insulating substrates 1 'along the vertical streak grooves A1' and the horizontal streak grooves A2 '. It is a method to say.

[0003]

By feeding the material substrate A 'between a pair of rotating large and small rollers B1' and B2 ', the material substrate A' is formed along the longitudinal groove A1 'and the horizontal groove A2'. When breaking each of the insulating substrates 1 ', for example, as described in JP-B-63-32602 and JP-B-3-56004, the material substrate A' is separated from both rollers B1 ', Between the upper and lower rollers B1 'and B2' between the large and small rollers B1 'and B2', between the upper and lower rollers B1 'and B2' between the upper and lower surfaces of the material substrate A 'between the upper and lower surfaces of the material substrate A'. Roller B
By feeding so as to be in contact with 1 ', the longitudinal groove A1' and the horizontal groove A2 'must be bent in the opening direction.

However, in the above-mentioned conventional manufacturing method, the depths of the vertical groove A1 'and the horizontal groove A2' for breaking the material substrate A 'for each insulating substrate 1' are set to about 40% of the plate thickness. The terminal electrode film 2 'and the terminal electrode film 2' are formed on the upper and lower surfaces of the material substrate A 'on which the vertical groove A1' and the horizontal groove A2 'are engraved. Since the cover coat 4 'is formed so as to cross the vertical streak groove A1' and the horizontal streak groove A2 ', the terminal is provided in a part of the vertical streak groove A1' and the horizontal streak groove A2 '. The electrode film 2 ′ and the cover coat 4 ′ become clogged, in other words, the vertical groove A 1 ′ and the horizontal groove A 1
The terminal electrode film 2 ′ and the cover coat 4 ′ that are partially clogged in the inside 2 ′ serve as an adhesive which prevents the vertical groove A 1 ′ and the horizontal groove A 2 ′ from opening when the material substrate A is broken. Will be.

[0005] Therefore, a large external force is required during the above-mentioned breaking, so that not only the material substrate A 'does not break at right angles to the upper surface but also obliquely to the upper surface, and the terminal electrode The vertical groove A1 ′ and the horizontal groove A2 ′ of the film 2 ′ and the cover coat 4 ′
The portion clogged inside is not excessively broken at the middle line of the vertical streak groove A1 'and the horizontal streak groove A2', and an excessively large amount adheres to one or the other of the two insulating substrates 1 'adjacent to each other. Then, each of the broken insulating substrates 1 '
The shape of each side surface is likely to be considerably irregular, and the terminal electrode film 2 ′ and the cover coat 4 ′ are damaged so that a part thereof may be bald or cracked during the breaking. Therefore, there is a problem that the yield rate of manufacturing good products is low, in other words, the occurrence rate of defective products is high.

Further, in a chip type variable resistor, as described in Japanese Patent Publication No. 7-48410, for example, both ends of an arc-shaped resistive film formed on the upper surface of each insulating substrate in a material substrate. Is formed so as to cross the vertical or horizontal grooves for breaks engraved on the upper surface of the material substrate.

An object of the present invention is to provide a manufacturing method which solves this problem.

[0008]

In order to achieve this technical object, a manufacturing method according to the present invention is directed to a method of manufacturing a semiconductor device comprising the steps of: "at least a plurality of chip-type insulating substrates are arranged side by side and integrated; Or a step of preparing a material substrate formed by engraving a horizontal streak groove, and a terminal electrode film at a location of each insulating substrate on the upper surface of the material substrate, and the terminal electrode film crosses the vertical or horizontal streak groove. Forming, and a step of breaking the material substrate along each of the vertical or horizontal streaks for each of the insulating substrates, wherein the material substrate is broken for each of the insulating substrates. Vertical or horizontal grooves are formed on the upper and lower surfaces of the material substrate, the surfaces being opposite to the surfaces on which the resistive film and the terminal electrode film are formed. "

[0009]

As described above, the vertical or horizontal groove for breaking the material substrate for each insulating substrate is formed on the upper and lower surfaces of the material substrate on the side opposite to the surface on which the terminal electrode film is formed. By engraving on the surface, it is possible to reliably avoid clogging of the terminal electrode film in a part of the vertical or horizontal groove, so that the material substrate is formed by the vertical or horizontal groove. By bending in the opening direction, the terminal electrode film on each insulating substrate does not hinder the opening of the vertical or horizontal groove when breaking each insulating substrate.

As a result, according to the present invention, when the material substrate is broken for each insulating substrate, it is possible to prevent the material substrate from being broken obliquely with respect to the upper surface of the material substrate and from being damaged such as baldness of the terminal electrode film. Since the yield can be greatly reduced as compared with the conventional case, the yield of manufacturing a good product is high, in other words, the occurrence rate of defective products is low, and the manufacturing cost can be reduced.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 to 6 show a case where a fixed chip resistor is manufactured among chip-type electronic components. That is,. First, as shown in FIG. 1, a material substrate A is prepared by integrating a large number of chip-type insulating substrates 1 vertically and horizontally, and on the lower surface, the material substrate A is provided for each of the insulating substrates 1. V-shaped vertical streak groove A for breaking
1 and the transverse groove A2 are engraved. In this case, the depth of the vertical streak groove A1 and the horizontal streak groove A2 is
Is about 40 to 60% of the plate thickness. . Next, as shown in FIG. 2, after forming terminal electrode films 2 on both ends of a resistive film 3 to be described later on each insulating substrate 1 on the upper surface of the material substrate A, as shown in FIG. The terminal electrode film 2 is formed after forming the film 3 or after forming the resistance film 3. . Next, as shown in FIG. 4, a cover coat 4 made of glass or the like is formed to cover the entire resistive film 3 in each of the insulating substrates 1. . Then, as shown in FIGS. 5 and 6, the upper surface of the upper and lower surfaces of the material substrate A is placed between the two rollers B1 and B2, between the pair of rotating large and small rollers B1 and B2. By feeding so as to contact the large-diameter roller B1, the insulating substrate 1 is broken along the vertical streak grooves A1 and the horizontal streak grooves A2.

As described above, on the lower surface of the upper and lower surfaces of the material substrate A, the vertical groove A1 and the horizontal groove A2 for breaking the material substrate A for each insulating substrate 1 are engraved. By forming the terminal electrode film 2, the resistance film 3, and the cover coat 4 on the upper surface of the substrate A,
Since it is possible to reliably prevent the terminal electrode film 2 and the cover coat 4 from being partially clogged in the vertical streak grooves A1 and the horizontal streak grooves A2, as shown in FIGS. When the material substrate A is fed between a pair of rotating large and small rollers B1 and B2 and the material substrate A is bent in a direction in which the vertical streak groove A1 and the horizontal streak groove A2 open, the material substrate A is broken. The terminal electrode film 2 and the cover coat 4 formed on the upper surface of the
In addition, the material substrate A can be broken with a smaller external force than before, without hindering the opening of the lateral groove A2, and the terminal electrode film 2 and the cover coat 4 are damaged so as to be bald or cracked. This can be reliably reduced.

On the lower surface of the material substrate A, that is, on the surface opposite to the surface on which the resistive film 3, the terminal electrode film 2 and the cover coat 4 are to be formed, the longitudinal grooves A1 for breaking and the horizontal lines are provided. In addition to providing the groove A2, as shown by a two-dot chain line in FIG. 1, a sub-vertical groove A1 having a very shallow depth for break (within about 10% of the plate thickness) is provided on the upper surface thereof. ″
And the horizontal streak groove A2 "may be provided so as to extend along the deep vertical streak groove A1 and the horizontal streak groove A2.

Further, as described above, the present invention is not limited to the case of manufacturing a fixed type chip resistor among the chip type resistors, but the variable type described in Japanese Patent Publication No. 7-48410. It goes without saying that the present invention can be applied not only to the chip resistor described above but also to the case of manufacturing other chip type electronic components such as a chip type capacitor having a capacitor formed on the upper surface of a chip type insulating substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a material substrate used in an embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a terminal electrode film is formed on the material substrate of FIG. 1;

FIG. 3 is a perspective view showing a state in which a resistance film is formed on the material substrate of FIG. 1;

FIG. 4 is a perspective view showing a state in which a cover coat is formed on the material substrate of FIG. 1;

FIG. 5 is an enlarged sectional view taken along line VV of FIG. 4;

FIG. 6 is an enlarged sectional view taken along line VI-VI of FIG. 4;

FIG. 7 is a perspective view showing a material substrate used in a conventional manufacturing method.

8 is a perspective view showing a state in which a terminal electrode film is formed on the material substrate of FIG. 7;

FIG. 9 is a perspective view showing a state in which a resistance film is formed on the material substrate of FIG. 7;

FIG. 10 is a perspective view showing a state in which a cover coat is formed on the material substrate of FIG. 7;

FIG. 11 is an enlarged sectional view taken along line XI-XI of FIG. 10;

FIG. 12 is an enlarged sectional view taken along the line XII-XII of FIG.

[Explanation of symbols]

 Reference Signs List A Material substrate A1 Vertical streak groove A2 Horizontal streak groove 1 Insulating substrate 2 Terminal electrode film 3 Resistive film 4 Cover coat B1, B2 Breaking roller

Claims (1)

[Claims] At least a step of preparing a material substrate having a plurality of chip-type insulating substrates arranged side by side and integrated and engraved with vertical or horizontal grooves for breaking each of the insulating substrates; A step of forming a terminal electrode film on each insulating substrate on the upper surface of the substrate so that the terminal electrode film crosses the vertical or horizontal groove, and forming the material substrate along the vertical or horizontal groove; A step of breaking for each of the insulating substrates, wherein the vertical or horizontal grooves for breaking the material substrate for each of the insulating substrates are formed on the upper and lower surfaces of the material substrate. A method for manufacturing a chip-type electronic component, wherein the engraving is performed on a surface opposite to a surface on which an electrode film is formed.