JP1766795S - Semiconductor Light Emitting Module - Google Patents

Semiconductor Light Emitting Module

Info

Publication number
JP1766795S
JP1766795S JP2023020491F JP2023020491F JP1766795S JP 1766795 S JP1766795 S JP 1766795S JP 2023020491 F JP2023020491 F JP 2023020491F JP 2023020491 F JP2023020491 F JP 2023020491F JP 1766795 S JP1766795 S JP 1766795S
Authority
JP
Japan
Prior art keywords
light emitting
semiconductor light
emitting module
main body
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023020491F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2023020491F priority Critical patent/JP1766795S/en
Application granted granted Critical
Publication of JP1766795S publication Critical patent/JP1766795S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、半導体発光モジュールである。本体部の一方の面に発光部が設けられている。本体部の複数の面に電極が配置されている。本体部の発光部に対向する他方の面には、ソルダレジストが配置されている。使用状態を示す参考図に示すように、本物品を基板(図示省略)の上に実装する際には、複数の面の電極にはんだ付けを行なってはんだフィレットを形成する。電極と基板との間にはんだフィレットが形成されることで、本物品の基板への実装時の安定性が向上する。This article is a semiconductor light emitting module. A light emitting section is provided on one surface of the main body. Electrodes are arranged on multiple surfaces of the main body. A solder resist is arranged on the other surface of the main body facing the light emitting section. As shown in the reference diagram showing the state of use, when this product is mounted on a substrate (not shown), solder fillets are formed by soldering to the electrodes on multiple surfaces. By forming a solder fillet between the electrode and the board, stability when mounting the product on the board is improved.

JP2023020491F 2023-10-04 2023-10-04 Semiconductor Light Emitting Module Active JP1766795S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023020491F JP1766795S (en) 2023-10-04 2023-10-04 Semiconductor Light Emitting Module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023020491F JP1766795S (en) 2023-10-04 2023-10-04 Semiconductor Light Emitting Module

Publications (1)

Publication Number Publication Date
JP1766795S true JP1766795S (en) 2024-03-28

Family

ID=90367881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023020491F Active JP1766795S (en) 2023-10-04 2023-10-04 Semiconductor Light Emitting Module

Country Status (1)

Country Link
JP (1) JP1766795S (en)

Similar Documents

Publication Publication Date Title
RU2018145015A (en) Light emitting device
TW200633267A (en) Semiconductor light emitting device and its manufacturing
TW200507218A (en) Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
WO2007094476A8 (en) Light-emitting diode
MX2021011276A (en) Light-emitting device package and application thereof.
TW200717757A (en) Light emitting diode package structure
TWI457516B (en) Light-bar assembly
JP2010028601A5 (en)
TWM397590U (en) Flexible LED package structure
TW200739968A (en) Light-emitting diode
TW201431127A (en) LED package and a method for manufacturing the same
TW200729565A (en) Light emitting diode for top view type and side view type
TW200742113A (en) Package structure of light-emitting device
JP1766795S (en) Semiconductor Light Emitting Module
JP2017054942A5 (en)
JP1750180S (en) semiconductor light emitting module
JP1766796S (en) Semiconductor Light Emitting Module
TW200742512A (en) Soldered package, manufacturing method of the same, and utilization of the same
TW201608744A (en) LED encapsulation structure
US9761759B2 (en) Light emitting module
TWI419381B (en) Led lightbar and method for manufacturing the same
TW200738089A (en) Padless substrate for surface mounted components
JP2007149810A5 (en)
TW200742123A (en) Light-emitting diode and method for fabrication thereof
JP2006339629A5 (en)