JP1766796S - Semiconductor Light Emitting Module - Google Patents
Semiconductor Light Emitting ModuleInfo
- Publication number
- JP1766796S JP1766796S JP2023020492F JP2023020492F JP1766796S JP 1766796 S JP1766796 S JP 1766796S JP 2023020492 F JP2023020492 F JP 2023020492F JP 2023020492 F JP2023020492 F JP 2023020492F JP 1766796 S JP1766796 S JP 1766796S
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- semiconductor light
- emitting module
- electrodes
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
Abstract
本物品は、半導体発光モジュールである。本体部の一方の面に発光部が設けられている。本体部の複数の面に電極が配置されている。本体部の発光部に対向する他方の面には、ソルダレジストが配置されている。使用状態を示す参考図に示すように、本物品を基板(図示省略)の上に実装する際には、複数の面の電極にはんだ付けを行なってはんだフィレットを形成する。電極と基板との間にはんだフィレットが形成されることで、本物品の基板への実装時の安定性が向上する。This article is a semiconductor light emitting module. A light emitting section is provided on one surface of the main body section. Electrodes are arranged on multiple surfaces of the main body section. A solder resist is arranged on the other surface of the main body section facing the light emitting section. As shown in a reference diagram showing the usage state, when this article is mounted on a substrate (not shown), solder is applied to the electrodes on the multiple surfaces to form solder fillets. The formation of solder fillets between the electrodes and the substrate improves the stability of this article when mounted on the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023020492F JP1766796S (en) | 2023-10-04 | 2023-10-04 | Semiconductor Light Emitting Module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023020492F JP1766796S (en) | 2023-10-04 | 2023-10-04 | Semiconductor Light Emitting Module |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1766796S true JP1766796S (en) | 2024-03-28 |
Family
ID=90367880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023020492F Active JP1766796S (en) | 2023-10-04 | 2023-10-04 | Semiconductor Light Emitting Module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP1766796S (en) |
-
2023
- 2023-10-04 JP JP2023020492F patent/JP1766796S/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200717757A (en) | Light emitting diode package structure | |
TW200739949A (en) | Gallium nitride type compound semiconductor light-emitting device and process for producing the same | |
TW200633267A (en) | Semiconductor light emitting device and its manufacturing | |
TW200729543A (en) | Light emitting device and method of forming the same | |
TW200520257A (en) | Light-emitting diode packaging structure | |
JP2009027166A5 (en) | ||
JP2015119123A (en) | Light-emitting chip | |
ATE430987T1 (en) | POWER SEMICONDUCTOR MODULE WITH CONTACT SPRINGS | |
TW200644285A (en) | Semiconductor light emitting device, semiconductor light emitting apparatus, and method of manufacturing semiconductor light emitting device | |
DE10336283A1 (en) | Surface luminous element | |
TWD210297S (en) | Substrate carrier | |
DE60330683D1 (en) | LUMINAIRE DIODE WITH SILICON CARBIDE SUBSTRATE | |
TW200739968A (en) | Light-emitting diode | |
JP2010028601A5 (en) | ||
EA201892565A1 (en) | CONTROL LIGHTING MULTILAYER MATERIAL AND GLASS PACKAGE | |
TW200729565A (en) | Light emitting diode for top view type and side view type | |
TW200505062A (en) | Light-emitting diode | |
JP1766796S (en) | Semiconductor Light Emitting Module | |
JP2007095786A5 (en) | ||
TW200514273A (en) | High-efficiency nitride series light-emitting device | |
TW200601583A (en) | Light emitting diode having an adhesive layer and manufacturing method thereof | |
JP1750180S (en) | semiconductor light emitting module | |
JP1766795S (en) | Semiconductor Light Emitting Module | |
TW200802979A (en) | Light emitting diode chip | |
TW200717849A (en) | Package structure for a solid-state lighting device and method of fabricating the same |