TWI419381B - Led lightbar and method for manufacturing the same - Google Patents

Description

Light-emitting diode light bar and manufacturing method thereof

The invention relates to a semiconductor structure, in particular to a light-emitting diode light bar and a manufacturing method thereof.

Compared with the traditional illumination source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been widely used as a new type of illumination source. .

A conventional light-emitting diode light bar generally includes a circuit board and a plurality of light-emitting diodes mounted on the circuit board, and the plurality of light-emitting diodes are attached to the same side surface of the circuit board. Such a light-emitting diode light strip can only achieve single-sided illumination. In order to achieve the effect of double-sided illumination, the industry generally uses two light-emitting diode strips of the same structure to be placed back to back on an intermediate carrier. However, the double-sided light-emitting structure not only requires adaptive configuration of the circuit board and the intermediate carrier of the light bar, but also increases the number of components, and greatly increases the thickness of the double-sided light-emitting diode light bar structure. The structure of the double-emitting light-emitting diode light bar is complicated and the cost is high.

In view of the above, it is necessary to provide a light-emitting diode light bar having a small thickness and a simple structure and a method of manufacturing the same.

A light-emitting diode light bar comprising at least one light-emitting diode and a circuit board carrying the light-emitting diode, wherein the circuit board defines a through hole, and the circuit board forms a first circuit having two first electrodes and a second circuit having two second electrodes, the light emitting diode includes a carrier, a first wafer and a second wafer disposed on opposite sides of the carrier, and the LED is provided with a second chip connected to the first wafer a pin and two second pins connected to the second chip, the carrier of the LED is latched in the through hole of the circuit board, and the two first pins are respectively connected to the first electrode, The two second pins are respectively connected to the second electrode.

A method for manufacturing a light-emitting diode light bar, comprising the following steps:

Providing a circuit board, the circuit board is provided with a through hole, and the circuit board is formed with a first circuit and a second circuit, the first circuit includes two first electrodes, and the second circuit includes two second electrodes;

Providing a light emitting diode, the light emitting diode comprising a carrier, a first wafer mounted on opposite sides of the carrier, a second wafer, and a first electrode formed on the carrier and electrically connected to the first wafer and the second wafer a pin and a second pin;

The first wafer and the second wafer are disposed away from the perforation of the circuit board, and the carrier of the LED is clamped in the perforation of the circuit board, and the two first pins are respectively An electrode is connected, and the two second pins are respectively connected to the second electrode.

The two light emitting diode chips are oppositely packaged to form a double-sided light emitting diode package, and the light emitting diode package is coupled to the first electrode and/or the second electrode by the first pin The pin is matched with the second electrode to fix the LED package in a circuit board, thereby forming a light-emitting diode lamp strip capable of emitting light on both sides, which is not only simple in structure, but also convenient in manufacturing process. At the same time, the structure has a smaller size, which is more practical and beautiful.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

Referring to FIG. 1 , a light-emitting diode light bar 100 according to an embodiment of the present invention includes a circuit board 10 and a light-emitting diode 20 that is mounted on the circuit board 10 . The circuit board 10 is configured to carry the light emitting diode 20 and electrically connect the light emitting diode 20 to an external power source to supply electrical energy to the light emitting diode 20 .

Referring to FIG. 2 at the same time, the circuit board 10 has a substantially strip shape, and includes an upper surface 11, a lower surface 12 opposite to the upper surface 11, a plurality of through holes 15 penetrating the upper surface 11 and the lower surface 12, and a circuit board formed on the circuit board. The first circuit 13 and the second circuit 14 on the 10th.

The first circuit 13 includes a first electrode 131 respectively located on opposite sides of each of the through holes 15 and a first line 132 connecting the first electrodes 131 located adjacent to the two through holes 15 in series. The two first electrodes 131 are protruded toward each other and have a triangular cross section in the lateral direction of the circuit board 10. It can be understood that the convex surfaces of the two first electrodes 131 only include a part of the conductive medium. The two ends of each of the first lines 132 are respectively connected between the two first electrodes 131 on different sides of the adjacent through holes 15, so that the first electrodes 131 of the adjacent two through holes 15 are sequentially connected in series in a zigzag shape to form a first circuit. 13.

The second circuit 14 includes a second electrode 141 on each of the opposite sides of each of the perforations 15 and a second line 142 connected between the second electrodes 141 of the adjacent two perforations 15. The two second electrodes 141 are protruded toward each other and have a triangular cross section in the longitudinal direction of the circuit board 10. It can be understood that the convex surfaces of the two first electrodes 131 only include a part of the conductive medium. The two ends of each of the second lines 142 are respectively connected to the second electrodes 141 of the adjacent two through holes 15, so that the second electrodes 141 are sequentially connected in series in a straight line to form the second circuit 14.

The light emitting diode 20 is a light emitting diode package structure, and includes a carrier 21, pins 22 formed on the carrier 21, and opposite sides of the carrier 21 and electrically connected to the carrier 21. A wafer 23 and a second wafer 24, and a first encapsulation layer 25 and a second encapsulation layer 26 covering the first wafer 23 and the second wafer 24, respectively.

The carrier board 21 includes a first surface 211, a second surface 212 opposite to the first surface 211, and two first side surfaces 213 respectively connected to opposite sides of the first surface 211 and the second surface 212, and respectively connected to the first surface The surface 211 and the second surface 214 of the other opposite sides of the second surface 212.

Referring to FIGS. 3 and 4 , the pin 22 includes two first pins 221 and two second pins 222 . The two first pins 221 are separated from each other and formed on the first surface 211. The two first pins 221 are located on opposite sides of the first wafer 23 and are adjacent to the two opposite first sides 213. The edge of the first surface 211. The two first pins 221 are recessed toward each other, and the recess depth is slightly smaller than the length of the two first electrodes 131 protruding. The two second pins 222 are separated from each other and formed on the second surface 212. The two second pins 222 are located on opposite sides of the corresponding second wafer 24 and are attached to the opposite second side surfaces 214. Near the edge of the second surface 212. The two second pins 222 are recessed toward each other, and the recess depth is slightly smaller than the length of the two second electrodes 141 protruding. The second pin 222 and the first pin 221 are not in contact with each other and are electrically insulated.

The first wafer 23 is mounted on the first surface 211, and the second wafer 24 is mounted on the second surface 212. The first wafer 23 and the second wafer 24 correspond to each other, and are respectively located at the center of the first surface 211 and the second surface 212 of the carrier 21, and the projection and corresponding portion of each of the first wafers 23 on the carrier 21 The projections of the two wafers 24 on the carrier 21 overlap.

The first wafer 23 is connected to the first surface 211 by the first wire 231 and the two first pins 221, and the second wire 24 is wired by the second wire 241 (not shown) and the two second pins 222. Connected to the second surface 212. The first wafer 23 and the second wafer 24 are each disposed away from the perforations 15 of the circuit board 10. The projection of the first wire 231 of the first wafer 23 on the carrier and the projection of the second wire 241 (not shown) of the second wafer 24 on the carrier 21 are perpendicular to each other.

The first encapsulation layer 25 covers the first wafer 23 and the first wire 231 on the first surface 211 and covers the first pin 221 formed on the first surface 211. The second encapsulation layer 26 covers the second wafer 24 and the second wire 241 (not shown) on the second surface 212 and covers the second pin 222 formed on the second surface 212. The first pin 221 and the second pin 222 are provided with a line by using the first surface 211 and the second surface 212 of the carrier, and the anode and the cathode are respectively exposed to the first surface 211 and the second surface 212 of the carrier 21; Both ends. The first encapsulating layer 25 and the second encapsulating layer 26 may each contain phosphor powder to improve the optical characteristics of the first wafer 23 and the second wafer 24 to achieve the desired light-emitting effect.

The LEDs 20 are respectively disposed on the circuit board 10 at the position where the through holes 15 are provided. Specifically, the first pins 221 of the LEDs 20 are recessed and the circuit board 10 is protruded. The two first electrode pairs 131 are correspondingly latched, and the two second pins 222 recessed by the carrier 21 of the LED body 21 are correspondingly latched with the two second electrodes 141 protruding from the circuit board 10. The first encapsulation layer 25 and the second encapsulation layer 26 of the LED 20 are exposed from the perforations 15 to the upper and lower surfaces of the circuit board 10. The two first pins 221 are electrically connected to the first electrodes 131 of the upper surface 11 of the circuit board 10, and the two second pins 222 are electrically connected to the two second electrodes 141. The first wafer 23 of the polar body 20 is connected to the first circuit 13 , and the second wafer 24 is connected to the second circuit 14 , so that the first wafer 23 located on both sides of the light emitting diode 20 is simultaneously provided by the circuit board 10 . The two wafers 24 provide electrical energy. Of course, the first circuit 13 and the second circuit 14 can be separately controlled, so that one of the circuits can be separately supplied or the two circuits can be powered at the same time to control the first chip 23 of the LED 20 and/or respectively. Or the second wafer 24 emits light.

In the embodiment of the present invention, the two LED chips 23 and 24 are respectively packaged back to back on opposite sides of the same circuit board 10, so that the packaged LEDs 20 have the function of double-sided illumination, and then borrowed. The circuit board 10 has a through hole 15 on which the light emitting diode 20 can be mounted, and a first circuit 13 that can be electrically connected to the first wafer 23 and a second circuit 14 that is electrically connected to the second wafer 24, respectively. The two first pins 221 of the carrier 21 of the LED body 21 are correspondingly latched with the first electrodes 131 of the circuit board 10 by the cassette design, and the two second pins 222 and the two boards of the circuit board 10 The two electrodes 141 are correspondingly disposed to mount the light emitting diode 20 in the through hole 15 while the first wafer 23 and the second wafer 24 are respectively connected to the first circuit 13 and the second circuit 14 of the circuit board 10. . Therefore, the light-emitting diode light bar 100 can realize the double-sided light-emitting effect by using only one circuit board 10. With the card design, not only the structure and the manufacturing process are simple, the number of components is small, the structure is relatively stable, and the light is made. The diode light bar 100 has a small thickness and can achieve different light-emitting effects, such as multiple effects of front light and/or back light, to achieve a multi-purpose lamp.

The method for fabricating the LED strip 100 in the above embodiment will be described below, and the steps thereof include:

A circuit board 10 is provided. The circuit board 10 is formed with a plurality of through holes 15 and a first circuit 13 and a second circuit 14 are formed on the circuit board 10. The first circuit 13 is located on opposite sides of each of the through holes 15. The second circuit 14 is located on the other opposite side of each of the perforations 15. The first circuit 13 includes two first electrodes 131 extending in a direction close to each other, and the two first electrodes 131 have a triangular cross section in the lateral direction of the circuit board 10. The second circuit 14 includes two second electrodes 141 extending in a direction close to each other, and the two second electrodes 141 have a triangular cross section in the longitudinal direction of the circuit board 10.

A light emitting diode 20 is provided. The light emitting diode 20 includes a carrier 21, a first wafer 23 mounted on one surface of the carrier 21, and a second wafer 24 mounted on the other surface of the carrier 21, formed on the carrier. Two first pins 221 and two second pins 222 electrically connected to the first wafer 23 and the second wafer 24, respectively, and a first encapsulation layer respectively encapsulating the first wafer 23 and the second wafer 24. 25 and a second encapsulation layer 26.

The two first pins 221 are separated from each other and recessed toward each other, and the recess depth is slightly smaller than the length of the two first electrodes 131 protruding. The two second pins 222 are separated from each other and recessed toward each other, and the recess depth is slightly smaller than the length of the two second electrodes 141 protruding.

The light-emitting diodes 20 are disposed in the through holes 15 of the circuit board 10. Specifically, the first pins 221 of the light-emitting diode 20 carrying the board 21 are recessed and the first electrodes protruding from the circuit board 10 The two second pins 222 recessed by the carrier 21 of the LED body 21 are correspondingly latched with the two second electrodes 141 protruding from the circuit board 10. The first wafer 23 and the second wafer 24 of the LED 20 are symmetrical with each other above and below the central axis of the circuit board 10. The first pin 221 is electrically connected to the first circuit 13 and the second pin 222 is electrically connected to the second circuit 14 .

It can be understood that, in other embodiments, only one pair of pins 221/222 on the carrier board 21 are recessed and protruded from the pair of electrodes 131/141 on the circuit board 10 to form a light-emitting diode. The connection to the circuit board 10 is fixed. At the same time, the first pin 221 and the second pin 222 of the carrier board 21 can also protrude away from each other, and the first electrode 131 and the second electrode 141 on the corresponding circuit board 10 are away from each other. The direction is recessed, and the convex elongation of the pins 221, 222 is slightly larger than the recessed depth of the electrodes 131, 141. Of course, the corresponding shapes of the two pairs of pins 221 and 222 and the two electrodes 131 and 141 are not limited thereto, as long as the interference fit of the two can be achieved and the card is fixed. In addition, the pins 221 and 222 of the LED 20 may not be recessed in a direction close to each other. At this time, the end portion of the corresponding carrier 21 is recessed and includes a portion of the conductive medium to form an electrical connection with the wafers 23 and 24. can.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Lighting diode strip

10‧‧‧ boards

11‧‧‧ upper surface

12‧‧‧ Lower surface

13‧‧‧First circuit

131‧‧‧First electrode

132‧‧‧First line

14‧‧‧second circuit

141‧‧‧second electrode

142‧‧‧second line

15‧‧‧Perforation

20‧‧‧Lighting diode

21‧‧‧ Carrier Board

211‧‧‧ first surface

212‧‧‧ second surface

213‧‧‧ first side

214‧‧‧ second side

22‧‧‧ pin

221‧‧‧First pin

222‧‧‧second pin

23‧‧‧First chip

231‧‧‧First wire

24‧‧‧second chip

241‧‧‧second wire

25‧‧‧First encapsulation layer

26‧‧‧Second encapsulation layer

1 is a cross-sectional view of a light-emitting diode light bar according to an embodiment of the present invention.

2 is a top plan view of a circuit board in the light emitting diode strip of FIG. 1.

FIG. 3 is an exploded perspective view of the light emitting diode in the light emitting diode strip of FIG. 1. FIG.

4 is a top plan view of a light emitting diode in the light emitting diode strip of FIG. 1.

100‧‧‧Lighting diode strip

10‧‧‧ boards

11‧‧‧ upper surface

12‧‧‧ Lower surface

15‧‧‧Perforation

20‧‧‧Lighting diode

221‧‧‧First pin

222‧‧‧second pin

Claims (10)

A light-emitting diode light bar comprising at least one light-emitting diode and a circuit board carrying the light-emitting diode, wherein the circuit board is provided with a through hole, and the circuit board is formed with two first electrodes a first circuit and a second circuit having two second electrodes, the light emitting diode includes a carrier, a first wafer and a second wafer disposed on opposite sides of the carrier, the LED is provided with the first chip a second first pin connected to the second chip and a second pin connected to the second chip, wherein the carrier plate of the light emitting diode is inserted in the through hole of the circuit board, and the two first pins are respectively respectively An electrode is connected, and the two second pins are respectively connected to the second electrode. The light-emitting diode light bar of claim 1, wherein the two first electrodes protrude from two opposite sidewalls in the through hole of the circuit board, and the two first pins are recessed toward the inner side. Matching the two first electrodes corresponding to the cassette. The light-emitting diode light bar of claim 2, wherein the two first electrodes are respectively tightly coupled to the two first pins. The light-emitting diode light bar of claim 1, wherein the two second electrodes protrude from two opposite sidewalls in the through hole of the circuit board, and the two second pins are recessed toward the inner side. Match the two second electrodes corresponding to the cassette. The light-emitting diode light bar of claim 4, wherein the two second electrodes are respectively tightly coupled to the second pin. The light-emitting diode light bar of claim 1, wherein the light-emitting diode further comprises a first encapsulation layer and a second encapsulation layer respectively encapsulating the first wafer and the second wafer. The light-emitting diode light bar of claim 1, wherein the first encapsulation layer and the second encapsulation layer are vertically equal in size with respect to a central axis of the circuit board. The light-emitting diode light bar of claim 1, wherein the first circuit comprises a plurality of first electrodes respectively located on opposite sides of the through hole and a first line connecting the first electrodes in series The second circuit includes a plurality of second electrodes on opposite sides of the via and a second line connecting the second electrodes in series. A method for manufacturing a light-emitting diode light bar, comprising the following steps:
Providing a circuit board, the circuit board is provided with a through hole, and the circuit board is formed with a first circuit and a second circuit, the first circuit includes two first electrodes, and the second circuit includes two second electrodes;
Providing a light emitting diode, the light emitting diode comprising a carrier, a first wafer mounted on opposite sides of the carrier, a second wafer, and a first electrode formed on the carrier and electrically connected to the first wafer and the second wafer a pin and a second pin;
The first wafer and the second wafer are disposed away from the perforation of the circuit board, and the carrier of the LED is clamped in the perforation of the circuit board, and the two first pins are respectively An electrode is connected, and the two second pins are respectively connected to the second electrode. The method for manufacturing a light-emitting diode light bar according to claim 9, wherein the two first electrodes protrude from two opposite sidewalls in the through hole of the circuit board, and the two first pins are inward. The recesses are configured to match the two first electrodes corresponding to the cassettes, and the two first electrodes are respectively tightly coupled to the two first pins.