TWI449154B - Led lightbar and method for manufacturing the same - Google Patents

Description

Light-emitting diode light bar and manufacturing method thereof

The invention relates to a semiconductor structure, in particular to a light-emitting diode light bar and a manufacturing method thereof.

Compared with the traditional illumination source, the Light Emitting Diode (LED) has the advantages of light weight, small volume, low pollution and long life. It has been widely used as a new type of illumination source. .

A conventional light-emitting diode light bar generally includes a circuit board and a plurality of light-emitting diodes mounted on the circuit board, and the plurality of light-emitting diodes are attached to the same side surface of the circuit board. Such a light-emitting diode light strip can only achieve single-sided illumination. In order to achieve the effect of double-sided illumination, the industry generally uses two light-emitting diode strips of the same structure to be placed back to back on an intermediate carrier. However, the double-sided light-emitting structure not only requires adaptive configuration of the circuit board and the intermediate carrier of the light bar, but also increases the number of components, and greatly increases the thickness of the double-sided light-emitting diode light bar structure. The structure of the double-emitting light-emitting diode light bar is complicated and the cost is high.

In view of the above, it is necessary to provide a light-emitting diode light bar having a small thickness and a simple structure and a method of manufacturing the same.

Light-emitting diode light bar comprising a light-emitting diode and an electric device for carrying the light-emitting diode a circuit board having a through hole formed therein, wherein the circuit board is formed with a first circuit and a second circuit, wherein the light emitting diode comprises a carrier board, a first chip mounted on opposite sides of the carrier board, and a second a first electrode and a second electrode electrically connected to the first wafer and the second wafer, respectively, the first wafer is disposed away from the perforation of the circuit board, and the second wafer faces the perforation and is received in the perforation The first and second wafers are electrically connected to the first circuit and the second circuit of the circuit board by the first electrode and the second electrode, respectively.

A method for manufacturing a light-emitting diode light bar, comprising the steps of: providing a circuit board, wherein the circuit board is provided with a through hole, and the circuit board is formed with a first circuit and a second circuit; and a light emitting diode is provided, the light emitting diode The body includes a carrier, a first wafer mounted on opposite sides of the carrier, a second wafer, and first and second electrodes formed on the carrier and electrically connected to the first and second wafers; The second wafer is disposed in the through hole in the through hole, and electrically connects the first electrode to the first circuit and the second electrode to the second circuit.

Two opposite-emitting diode chips are packaged to form a double-sided light-emitting diode package, and the package body is matched and fixed in a circuit board, thereby forming a light-emitting diode capable of emitting light on both sides. The body light bar not only has a simple structure, but also has a convenient manufacturing process, and at the same time, the structure has a small size, which is more practical and beautiful.

The invention will now be further described with reference to the specific embodiments thereof with reference to the accompanying drawings.

100‧‧‧Lighting diode strip

10‧‧‧ boards

11‧‧‧ upper surface

12‧‧‧ Lower surface

13‧‧‧First circuit

131‧‧‧First circuit layer

132‧‧‧First line

14‧‧‧second circuit

141‧‧‧Second circuit layer

142‧‧‧second line

15‧‧‧Perforation

151‧‧‧ first side

152‧‧‧ second side

20‧‧‧Lighting diode

21‧‧‧ Carrier Board

211‧‧‧ first surface

212‧‧‧ second surface

213‧‧‧ first side

214‧‧‧ second side

22‧‧‧Electrode

221‧‧‧First electrode

2211‧‧‧First electrode pad

222‧‧‧second electrode

2221‧‧‧Second electrode pad

23‧‧‧First chip

231‧‧‧First wire

24‧‧‧second chip

241‧‧‧second wire

25‧‧‧First encapsulation layer

26‧‧‧Second encapsulation layer

1 is a cross-sectional view of a light-emitting diode light bar according to an embodiment of the present invention.

2 is a top plan view of a circuit board in the light emitting diode strip of FIG. 1.

3 is a top plan view of a light emitting diode in the light emitting diode light strip of FIG. 1.

4 is a bottom view of the light emitting diode in the light emitting diode strip of FIG. 1.

FIG. 5 is a flow chart of a method of manufacturing a light-emitting diode light bar according to an embodiment of the present invention.

Referring to FIG. 1 , a light-emitting diode light bar 100 according to an embodiment of the present invention includes a circuit board 10 and a light-emitting diode 20 mounted on the circuit board 10 .

The circuit board 10 is configured to carry the light emitting diode 20 and electrically connect the light emitting diode 20 to an external power source to supply electrical energy to the light emitting diode 20 . Referring to FIG. 2 at the same time, the circuit board 10 has a substantially strip shape including an upper surface 11, a lower surface 12 opposite to the upper surface 11, and a first circuit 13 and a second circuit 14 formed on the upper surface 11.

The circuit board 10 is provided with a plurality of through holes 15 extending from the upper surface 11 and penetrating the lower surface 12 for respectively mounting the light emitting diodes 20. Of course, the number of the through holes 15 may be one. The shape and size of the through hole 15 depend on the shape and size of the mounted light emitting diode 20. In the present embodiment, the perforations 15 are rectangular in cross-sectional shape along the lateral direction of the circuit board 10, and are equally spaced along the length direction of the circuit board 10, and the through holes 15 are arranged on the central axis of the circuit board 10. The size of the perforation 15 gradually increases from the upper surface 11 of the circuit board 10 to the lower surface 12 such that the cross-sectional shape of the perforation 15 in the longitudinal direction of the circuit board 10 is an isosceles trapezoid. The outline of each of the perforations 15 intersecting the upper surface 11 of the circuit board 10 includes two parallel opposing first side edges 151 and two second side edges 152 that are perpendicular to the first side edges 151.

The first circuit 13 includes a first circuit layer 131 respectively located on opposite sides of each of the through holes 15 and a first line 132 connecting the first circuit layers 131 located adjacent to the two through holes 15 in series. . The first circuit layer 131 and the first line 132 are both formed on the upper surface 11 of the circuit board 10. The first circuit layer 131 is respectively located on the first side 151 of the corresponding through hole 15 . Specifically, each of the first circuit layers 131 is formed from the first side 151 of the corresponding through hole 15 in a direction away from the through hole 15 . On the circuit board 10. The first circuit layers 131 are located on opposite sides of the central axis in the longitudinal direction of the circuit board 10 and are symmetrically distributed. The two ends of each of the first lines 132 are respectively connected between the two first circuit layers 131 on different sides of the adjacent through holes 15, so that the first circuit layers 131 of the adjacent two through holes 15 are sequentially connected in a zigzag manner to form a first A circuit 13.

The second circuit 14 includes a second circuit layer 141 on each of the opposite sides of each of the vias 15 and a second line 142 connected between the second circuit layers 141 of the adjacent two vias 15. The second circuit layer 141 and the second line 142 are also formed on the upper surface 11 of the circuit board 10. The second circuit layer 141 is respectively located on the second side 152 of the corresponding through hole 15 , wherein each second circuit layer 141 is formed on the circuit board from the second side 152 of the corresponding through hole 15 in a direction away from the through hole 15 . 10 on. The second circuit layers 141 are aligned in a line along the central axis of the length direction of the circuit board 10. The two ends of each of the second lines 142 are respectively connected to the second circuit layers 141 of the adjacent two through holes 15, so that the second circuit layers 141 are sequentially connected in series in a straight line to form the second circuit 14.

The light emitting diode 20 is a light emitting diode package structure, and includes a carrier 21, electrodes 22 formed on the carrier 21, and first electrodes disposed on opposite sides of the carrier 21 and electrically connected to the carrier 21. The wafer 23 and the second wafer 24, and the first encapsulation layer 25 and the second encapsulation layer 26 covering the first wafer 23 and the second wafer 24, respectively.

The carrier board 21 includes a first surface 211, a second surface 212 opposite to the first surface 211, and two first side surfaces 213 respectively connected to opposite sides of the first surface 211 and the second surface 212, and respectively connected to the first surface The surface 211 and the second surface 212 are opposite to each other The second second side 214 of the side. The first wafer 23 is mounted on the first surface 211, and the second wafer 24 is mounted on the second surface 212. The first wafer 23 and the second wafer 24 correspond to each other, and are respectively located at the center of the first surface 211 and the second surface 212 of the carrier 21, and the projection and corresponding portion of each of the first wafers 23 on the carrier 21 The projections of the two wafers 24 on the carrier 21 overlap.

Referring to FIG. 3 and FIG. 4 , the first electrode 221 includes two first electrode pads 2211 , and the first electrode pads 2211 of each of the first electrodes 221 are respectively adjacent to the first surface 211 of the carrier 21 . The positions of the opposite sides of a wafer 23 extend away from the direction of the first wafer 23, and the two first electrode pads 2211 are wound around the two opposite first side faces 213 of the overload board 21 to the second surface of the carrier board 21. Near the two sides of the corresponding second wafer 24 on 212. The second electrode 222 includes two separated second electrode pads 2221 respectively formed on the second surface 212 and located on the opposite sides of the corresponding second wafer 24, the first electrode The two electrode pads 2221 are attached to the other two opposite second sides 214 of the carrier 21 . The second electrode 222 and the first electrode 221 are not in contact with each other and are electrically insulated.

The first wafer 23 is connected to the first surface 211 by the first wire 231 and the two first electrodes 221 , and the second wire 24 is connected to the second surface 212 by the second wire 241 and the two second electrodes 222 . An extension of the projection of the first wire 231 of the first wafer 23 on the carrier plate and an extension of the projection of the second wire 241 of the second wafer 24 on the carrier 21 intersect.

The first encapsulation layer 25 covers the first wafer 23 and the first conductive line 231 on the first surface 211. The first encapsulation layer 25 further covers a portion of the first electrode 221 formed on the first surface 211. The second encapsulation layer 26 covers the second wafer 24 and the second wire 241 on the second surface 212. The second encapsulation layer 26 also covers the portion formed on the second surface 212. The first electrode 221 and the portion of the second electrode 222, in particular, each of the second encapsulation layers 26 is encapsulated in a portion electrically connecting the corresponding second wire 241 and the second electrode 222, so that the proximity is carried A portion of the first electrode 221 and a portion of the second electrode 222 of the first and second side faces 213, 214 of the board 21 are exposed outside the second encapsulation layer 26. Wherein, the second encapsulation layer 26 corresponds to the through hole 15 on the circuit board 10, and the size of the second encapsulation layer 26 is slightly larger than the minimum size of the perforation 15 on the circuit board 10, thereby adopting an interference fit manner The second encapsulation layer 26 is snapped into the through holes 15 of the circuit board 10. The first encapsulating layer 25 and the second encapsulating layer 26 may each contain phosphor powder to improve the optical characteristics of the first wafer 23 and the second wafer 24 to achieve the desired light-emitting effect.

The light emitting diodes 20 are respectively disposed at the position of the circuit board 10 where the through holes 15 are provided. Specifically, one of the light emitting diodes 20 is taken as an example, and the second of the carrier plates 21 of the light emitting diode 20 is used. The surface 212 is attached to the upper surface 11 of the circuit board 10. The second encapsulation layer 26 is disposed in the through hole 15 of the circuit board 10 so as to extend onto the second surface 212 of the carrier board 21 and be exposed to the second package. The first electrode 221 outside the layer 26 is bonded to the first circuit layer 131 of the upper surface 11 of the circuit board 10, and the second electrode 222 exposed outside the second package layer 26 is bonded to the second circuit layer 141. The first wafer 23 of the light emitting diode 20 is connected to the first circuit 13 , and the second chip 24 is connected to the second circuit 14 so as to be simultaneously provided on both sides of the light emitting diode 20 by the circuit board 10 . The first wafer 23 and the second wafer 24 provide electrical energy. Of course, the first circuit 13 and the second circuit 14 can be separately controlled, so that one of the circuits can be separately supplied or the two circuits can be powered at the same time to control the first chip 23 of the LED 20 and/or respectively. Or the second wafer 23 emits light. The surface of the circuit board 10 surrounding the through hole 15 is inclined from the upper surface 11 of the circuit board 10 in the direction of the lower surface 12 and is outwardly expanded to reduce the blocking of the light emitted from the second wafer 24. Of course, it is also possible to form a reflection in the perforation 15 The layers are such that the perforations 15 have the function of reflecting the cup.

In the embodiment of the present invention, the two LEDs are packaged back to back on opposite sides of the same circuit board 10, so that the packaged LEDs have the function of double-sided illumination, and the circuit board is used. A through hole 15 for mounting the light emitting diode 20 and a first circuit 13 electrically connectable to the first wafer 23 and a second circuit 14 electrically connected to the second chip 24 are formed on the 10 to form the light emitting diode While the pole body 20 is mounted in the through hole 15, the first wafer 23 and the second wafer 24 are respectively connected to the first circuit 13 and the second circuit 14 of the circuit board 10. Therefore, the light-emitting diode light bar 100 can realize the double-sided light emitting effect by using only one circuit board 10, and the structure and the manufacturing process are simple, the number of components is small, and the thickness of the light-emitting diode light bar 100 is small. And can achieve different lighting effects, such as multiple effects of front light and/or back light, to achieve a multi-purpose lamp.

Please refer to FIG. 5 , which is a manufacturing method of the LED strip 100 in the above embodiment. The method includes the following steps: providing a circuit board 10 , wherein the circuit board 10 is formed with a plurality of through holes 15 and on the circuit board 10 . A first circuit 13 and a second circuit 14 are formed on the same surface; the first circuit 13 is located on opposite sides of each of the through holes 15, and the second circuit 14 is located on the other opposite side of each of the through holes 15.

A light emitting diode 20 is provided. The light emitting diode 20 includes a carrier 21, a first wafer 23 mounted on one surface of the carrier 21, and a second wafer 24 mounted on the other surface of the carrier 21, formed on the carrier. a first electrode 221 and a second electrode 222 electrically connected to the first wafer 23 and the second wafer 24, respectively, and a first encapsulation layer 25 and a second encapsulating the first wafer 23 and the second wafer 24, respectively The encapsulation layer 26; the second encapsulation layer 26 corresponds to the through hole 15 on the circuit board 10, and the second encapsulation layer 26 is slightly larger than the circuit board 10 The size of the perforation 15 on it.

The light-emitting diodes 20 are disposed in the through holes 15 of the circuit board 10 , wherein the second package layer 26 is received and latched in the corresponding through holes 15 , and the first electrode 221 is electrically connected to the first circuit 13 , The second electrode 222 is electrically connected to the second circuit 14 .

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧Lighting diode strip

10‧‧‧ boards

11‧‧‧ upper surface

12‧‧‧ Lower surface

14‧‧‧second circuit

15‧‧‧Perforation

20‧‧‧Lighting diode

21‧‧‧ Carrier Board

211‧‧‧ first surface

212‧‧‧ second surface

213‧‧‧ first side

214‧‧‧ second side

22‧‧‧Electrode

221‧‧‧First electrode

222‧‧‧second electrode

23‧‧‧First chip

231‧‧‧First wire

24‧‧‧second chip

241‧‧‧second wire

25‧‧‧First encapsulation layer

26‧‧‧Second encapsulation layer

Claims (7)

A light-emitting diode light bar comprising a light-emitting diode and a circuit board carrying the light-emitting diode, wherein the circuit board is provided with a through hole, and the first circuit and the second circuit are formed on the circuit board The light emitting diode includes a carrier, a first wafer mounted on opposite sides of the carrier, a second wafer, and first and second electrodes electrically connected to the first and second wafers, respectively. a wafer is disposed away from the perforation of the circuit board, the second wafer faces the perforation and is received in the perforation, and the first and second wafers are respectively connected to the circuit board by the first electrode and the second electrode The first circuit and the second circuit are electrically connected to each other, the light emitting diode further includes a first encapsulation layer and a second encapsulation layer respectively encapsulating the first wafer and the second wafer, and the second encapsulation layer is received and latched Within the perforations of the board, the size of the perforations gradually increases from one side of the board to the other side. The light-emitting diode light bar of claim 1, wherein the carrier plate comprises a first surface, a second surface remote from the first surface, and a plurality of sides connecting the first surface and the second surface The first wafer is mounted on the first surface, and the second wafer is mounted on the second surface. The light-emitting diode light bar of claim 2, wherein the first electrode comprises two separated first electrode pads, and the first electrode pads are self-first on the first surface of the carrier The two sides extend toward the side of the carrier plate and extend around the side surface to the second surface, the second electrode includes two separated second electrode pads, and the two second electrode pads are formed on the second surface of the carrier board. The one electrode and the second electrode are not in contact with each other. The light-emitting diode light bar of claim 3, wherein the portions of the first electrode pad on the second surface of the carrier are respectively located on opposite sides of the second wafer, the second The electrode pads are located on opposite sides of the second wafer. The light-emitting diode light bar of claim 1, wherein a part of the first electrode and A portion of the second electrode is encapsulated in the second encapsulation layer, and another portion of the first electrode and the other portion of the second electrode protrude outside the second encapsulation layer. The light-emitting diode light bar of claim 1, wherein the first circuit comprises a plurality of first circuit layers respectively located on opposite sides of the through hole and the first circuit layer is connected in series In a first circuit, the second circuit includes a plurality of second circuit layers on opposite sides of the via and a second line connecting the second circuit layers in series. A method for manufacturing a light-emitting diode light bar, comprising the steps of: providing a circuit board, wherein the circuit board is provided with a through hole, and the circuit board is formed with a first circuit and a second circuit, the size of the through hole is from one side of the circuit board Gradually increasing to the opposite side; providing a light emitting diode comprising a carrier, a first wafer mounted on opposite sides of the carrier, a second wafer, and being formed on the carrier and associated with the first wafer and a first electrode and a second electrode electrically connected to the second chip, the light emitting diode further comprising a first encapsulation layer respectively encapsulating the first wafer and a second encapsulation layer encapsulating the second wafer; The first electrode is electrically connected to the first circuit, the second electrode is electrically connected to the second circuit, and the second package layer is connected to the second circuit through an interference fit. Inside the perforations of the board.