JP1760971S - - Google Patents

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Publication number
JP1760971S
JP1760971S JP2023017720F JP2023017720F JP1760971S JP 1760971 S JP1760971 S JP 1760971S JP 2023017720 F JP2023017720 F JP 2023017720F JP 2023017720 F JP2023017720 F JP 2023017720F JP 1760971 S JP1760971 S JP 1760971S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023017720F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP2023017720F priority Critical patent/JP1760971S/ja
Application granted granted Critical
Publication of JP1760971S publication Critical patent/JP1760971S/ja
Priority to TW113300447F priority patent/TWD242108S/zh
Priority to US29/927,474 priority patent/USD1079661S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023017720F 2023-08-31 2023-08-31 Active JP1760971S (show.php)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023017720F JP1760971S (show.php) 2023-08-31 2023-08-31
TW113300447F TWD242108S (zh) 2023-08-31 2024-01-29 半導體製造裝置用發熱體
US29/927,474 USD1079661S1 (en) 2023-08-31 2024-02-05 Susceptor of semiconductor manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023017720F JP1760971S (show.php) 2023-08-31 2023-08-31

Publications (1)

Publication Number Publication Date
JP1760971S true JP1760971S (show.php) 2024-01-10

Family

ID=89452006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023017720F Active JP1760971S (show.php) 2023-08-31 2023-08-31

Country Status (3)

Country Link
US (1) USD1079661S1 (show.php)
JP (1) JP1760971S (show.php)
TW (1) TWD242108S (show.php)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5169684A (en) * 1989-03-20 1992-12-08 Toyoko Kagaku Co., Ltd. Wafer supporting jig and a decompressed gas phase growth method using such a jig
USD515675S1 (en) * 2001-12-27 2006-02-21 Flow International Corporation Element for a superpressure static fluid seal
US7900579B2 (en) * 2007-09-26 2011-03-08 Tokyo Electron Limited Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other
USD599827S1 (en) * 2008-05-07 2009-09-08 Komatsu Ltd. Fan shroud for construction machinery
USD638522S1 (en) * 2010-07-20 2011-05-24 Wārtsilā Japan Ltd. Seal ring for stern tube
JP2014063820A (ja) 2012-09-20 2014-04-10 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法及び半導体装置の製造方法
US8807571B2 (en) * 2012-09-28 2014-08-19 Air Products And Chemicals, Inc. Wear-compensating sealing ring assembly
USD728757S1 (en) * 2013-01-04 2015-05-05 Michael Graham Gasket
KR101317942B1 (ko) * 2013-03-13 2013-10-16 (주)테키스트 반도체 제조용 척의 에지링 냉각모듈
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
JP6417052B2 (ja) * 2015-09-30 2018-10-31 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
JP1598017S (show.php) * 2017-07-21 2018-02-19
JP1598984S (show.php) * 2017-07-31 2018-03-05
USD871561S1 (en) * 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
JP1612685S (show.php) * 2018-02-08 2018-09-03
TWD194249S (zh) 2018-03-06 2018-11-21 大晟科技股份有限公司 晶圓固定環
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD974910S1 (en) * 2020-02-04 2023-01-10 Wilson Sporting Goods Co. Tennis ball container overcap
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD1055006S1 (en) * 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
JP1740585S (ja) 2022-10-26 2023-03-31 リングスペーサー

Also Published As

Publication number Publication date
USD1079661S1 (en) 2025-06-17
TWD242108S (zh) 2025-12-21

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