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JPH0785919B2
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2008-02-05 |
Disco Corporation |
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2003-11-07 |
2008-02-12 |
Sumitomo Mitsubishi Silicon Corporation |
Heat treatment jig for semiconductor substrate
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2008-03-28 |
2009-09-15 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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2009-03-06 |
2010-05-25 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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2009-03-06 |
2010-05-18 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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2009-03-06 |
2010-05-25 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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2010-10-21 |
2012-02-28 |
Tokyo Electron Limited |
Top plate for reactor for manufacturing semiconductor
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2012-02-28 |
Tokyo Electron Limited |
Top plate for reactor for manufacturing semiconductor
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Circuit board
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Taiwan Semiconductor Manufacturing Co., Ltd. |
Method for controlling temperature of furnace in semiconductor fabrication process
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ebm-papst Lanshut GmbH |
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Asm Ip Holding B.V. |
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2024-12-17 |
Shin-Etsu Chemical Co., Ltd. |
Carrier substrate for handling
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