JP1747764S - 半導体基板処理のための処理キットの接地リング - Google Patents

半導体基板処理のための処理キットの接地リング

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Publication number
JP1747764S
JP1747764S JP2023002017F JP2023002017F JP1747764S JP 1747764 S JP1747764 S JP 1747764S JP 2023002017 F JP2023002017 F JP 2023002017F JP 2023002017 F JP2023002017 F JP 2023002017F JP 1747764 S JP1747764 S JP 1747764S
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semiconductor substrate
substrate processing
process kit
grounding ring
grounding
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JP2023002017F
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JP2023002017F 2022-08-04 2023-02-06 半導体基板処理のための処理キットの接地リング Active JP1747764S (ja)

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US202229848745 2022-08-04

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JP1747764S true JP1747764S (ja) 2023-06-30

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JP2023002017F Active JP1747764S (ja) 2022-08-04 2023-02-06 半導体基板処理のための処理キットの接地リング

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JP (1) JP1747764S (ja)
TW (1) TWD227852S (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD954769S1 (en) 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf

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Publication number Publication date
TWD227852S (zh) 2023-10-01

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