JP1727400S - semiconductor device - Google Patents

semiconductor device

Info

Publication number
JP1727400S
JP1727400S JP2022001597F JP2022001597F JP1727400S JP 1727400 S JP1727400 S JP 1727400S JP 2022001597 F JP2022001597 F JP 2022001597F JP 2022001597 F JP2022001597 F JP 2022001597F JP 1727400 S JP1727400 S JP 1727400S
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022001597F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2022001597F priority Critical patent/JP1727400S/en
Priority to US29/845,558 priority patent/USD1046800S1/en
Application granted granted Critical
Publication of JP1727400S publication Critical patent/JP1727400S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022001597F 2022-01-28 2022-01-28 semiconductor device Active JP1727400S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022001597F JP1727400S (en) 2022-01-28 2022-01-28 semiconductor device
US29/845,558 USD1046800S1 (en) 2022-01-28 2022-07-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022001597F JP1727400S (en) 2022-01-28 2022-01-28 semiconductor device

Publications (1)

Publication Number Publication Date
JP1727400S true JP1727400S (en) 2022-10-14

Family

ID=83544743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022001597F Active JP1727400S (en) 2022-01-28 2022-01-28 semiconductor device

Country Status (2)

Country Link
US (1) USD1046800S1 (en)
JP (1) JP1727400S (en)

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US5089929A (en) * 1990-03-08 1992-02-18 The United States Of America As Represented By The Secretary Of The Air Force Retrofit integrated circuit terminal protection device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH09199645A (en) * 1996-01-17 1997-07-31 Mitsubishi Electric Corp Semiconductor device and semiconductor module
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD428859S (en) * 1999-01-28 2000-08-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448739S1 (en) * 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) * 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1641098S (en) * 2018-06-26 2019-09-09
DE212020000459U1 (en) * 2019-05-27 2021-06-24 Rohm Co., Ltd. Semiconductor component
JP7088129B2 (en) * 2019-06-27 2022-06-21 三菱電機株式会社 Semiconductor device
US11600546B2 (en) * 2019-08-29 2023-03-07 Mitsubishi Electric Corporation Power semiconductor apparatus and method for manufacturing the same
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module

Also Published As

Publication number Publication date
USD1046800S1 (en) 2024-10-15

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