JP1713190S - - Google Patents
Info
- Publication number
- JP1713190S JP1713190S JP2021021414F JP2021021414F JP1713190S JP 1713190 S JP1713190 S JP 1713190S JP 2021021414 F JP2021021414 F JP 2021021414F JP 2021021414 F JP2021021414 F JP 2021021414F JP 1713190 S JP1713190 S JP 1713190S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021021414F JP1713190S (cs) | 2021-10-01 | 2021-10-01 | |
| TW111301062F TWD230582S (zh) | 2021-10-01 | 2022-03-04 | 半導體製造裝置用分流器 |
| US29/832,777 USD1086086S1 (en) | 2021-10-01 | 2022-03-30 | Separator of substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021021414F JP1713190S (cs) | 2021-10-01 | 2021-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1713190S true JP1713190S (cs) | 2022-04-21 |
Family
ID=81209963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021021414F Active JP1713190S (cs) | 2021-10-01 | 2021-10-01 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1086086S1 (cs) |
| JP (1) | JP1713190S (cs) |
| TW (1) | TWD230582S (cs) |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| EP1006562A3 (en) * | 1998-12-01 | 2005-01-19 | Greene, Tweed Of Delaware, Inc. | Two-piece clamp ring for holding semiconductor wafer or other workpiece |
| JP4506125B2 (ja) * | 2003-07-16 | 2010-07-21 | 信越半導体株式会社 | 熱処理用縦型ボート及びその製造方法 |
| US20090197424A1 (en) * | 2008-01-31 | 2009-08-06 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD734730S1 (en) * | 2012-12-27 | 2015-07-21 | Hitachi Kokusai Electric Inc. | Boat of substrate processing apparatus |
| TWD163542S (zh) * | 2013-03-22 | 2014-10-11 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟 |
| TWD166332S (zh) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟之部分 |
| KR101760316B1 (ko) * | 2015-09-11 | 2017-07-21 | 주식회사 유진테크 | 기판처리장치 |
| KR101731488B1 (ko) * | 2015-10-27 | 2017-05-02 | 주식회사 유진테크 | 기판처리장치 및 튜브 조립체 조립방법 |
| JP1568553S (cs) * | 2016-02-12 | 2017-02-06 | ||
| JP1563649S (cs) * | 2016-02-12 | 2016-11-21 | ||
| JP6664487B2 (ja) * | 2016-07-26 | 2020-03-13 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 発熱体、基板処理装置、半導体装置の製造方法およびプログラム |
| USD846514S1 (en) * | 2018-05-03 | 2019-04-23 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| CN112740373B (zh) * | 2018-09-20 | 2024-09-10 | 株式会社国际电气 | 基板处理装置、半导体装置的制造方法及存储介质 |
| USD908103S1 (en) | 2019-02-20 | 2021-01-19 | Veeco Instruments Inc. | Transportable semiconductor wafer rack |
| JP1700776S (ja) * | 2021-03-04 | 2021-11-29 | 基板処理装置用基板載置プレート | |
| JP1700778S (ja) * | 2021-03-15 | 2021-11-29 | 基板処理装置用遮蔽具 | |
| USD1023959S1 (en) * | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
| JP1731671S (cs) * | 2022-03-15 | 2022-12-08 |
-
2021
- 2021-10-01 JP JP2021021414F patent/JP1713190S/ja active Active
-
2022
- 2022-03-04 TW TW111301062F patent/TWD230582S/zh unknown
- 2022-03-30 US US29/832,777 patent/USD1086086S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD1086086S1 (en) | 2025-07-29 |
| TWD230582S (zh) | 2024-04-01 |