JP1692349S - - Google Patents
Info
- Publication number
- JP1692349S JP1692349S JPD2020-27290F JP2020027290F JP1692349S JP 1692349 S JP1692349 S JP 1692349S JP 2020027290 F JP2020027290 F JP 2020027290F JP 1692349 S JP1692349 S JP 1692349S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2020-27290F JP1692349S (fr) | 2020-12-18 | 2020-12-18 | |
US29/794,758 USD981969S1 (en) | 2020-12-18 | 2021-06-15 | Elastic membrane for semiconductor wafer polishing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2020-27290F JP1692349S (fr) | 2020-12-18 | 2020-12-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1692349S true JP1692349S (fr) | 2021-08-10 |
Family
ID=77173029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2020-27290F Active JP1692349S (fr) | 2020-12-18 | 2020-12-18 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD981969S1 (fr) |
JP (1) | JP1692349S (fr) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD364384S (en) * | 1994-05-23 | 1995-11-21 | Fuji Electric Co., Ltd. | Semi-conductor element with terminal casing |
US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
JP1494713S (fr) | 2013-05-15 | 2017-04-03 | ||
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD808349S1 (en) * | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
SG10201606197XA (en) | 2015-08-18 | 2017-03-30 | Ebara Corp | Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus |
TWD178699S (zh) * | 2016-01-08 | 2016-10-01 | ASM知識產權私人控股有	 | 用於半導體製造設備的氣體分散板 |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD859332S1 (en) | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD918161S1 (en) * | 2017-12-19 | 2021-05-04 | Ebara Corporation | Elastic membrane |
TWD197827S (zh) | 2017-12-19 | 2019-06-01 | 日商荏原製作所股份有限公 | 半導體晶圓研磨用彈性膜 |
JP1683319S (ja) | 2020-09-17 | 2021-04-12 | 半導体ウェハ研磨用弾性膜 |
-
2020
- 2020-12-18 JP JPD2020-27290F patent/JP1692349S/ja active Active
-
2021
- 2021-06-15 US US29/794,758 patent/USD981969S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD981969S1 (en) | 2023-03-28 |