JP1663818S - - Google Patents
Info
- Publication number
- JP1663818S JP1663818S JPD2019-14226F JP2019014226F JP1663818S JP 1663818 S JP1663818 S JP 1663818S JP 2019014226 F JP2019014226 F JP 2019014226F JP 1663818 S JP1663818 S JP 1663818S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20180061684 | 2018-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1663818S true JP1663818S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2020-07-20 |
Family
ID=71662900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-14226F Active JP1663818S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2018-12-26 | 2019-06-26 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD937791S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JP1663818S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD993344S1 (en) * | 2021-06-24 | 2023-07-25 | Titus Gadwin Watts | Skateboard railing |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000323216A (ja) * | 1999-05-07 | 2000-11-24 | Kyoshin Kogyo Co Ltd | 接続用端子及びテーピング接続用端子 |
| DE10212495B4 (de) * | 2002-03-21 | 2004-02-26 | Schulz-Harder, Jürgen, Dr.-Ing. | Verfahren zum Herstellen eines Metall-Keramik-Substrats, vorzugsweise eines Kupfer-Keramik-Substrats |
| JP5751343B2 (ja) * | 2011-12-02 | 2015-07-22 | 株式会社村田製作所 | 高周波信号線路の製造方法 |
| TWD166332S (zh) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟之部分 |
| JP5943169B2 (ja) * | 2014-06-16 | 2016-06-29 | 株式会社村田製作所 | 伝送線路部材 |
| USD805044S1 (en) * | 2015-10-30 | 2017-12-12 | Hirata Corporation | Adhesive sheet for substrate |
| DE102016224653B4 (de) * | 2016-12-12 | 2022-07-21 | Vitesco Technologies Germany Gmbh | Leiterplattenverbund und Verfahren zu dessen Herstellung |
| USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD886073S1 (en) * | 2018-01-29 | 2020-06-02 | Gigalane Co., Ltd. | Flexible printed circuit board |
| USD888673S1 (en) * | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
| JP1641098S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2018-06-26 | 2019-09-09 | ||
| JP1638282S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2018-09-20 | 2019-08-05 |
-
2019
- 2019-06-26 JP JPD2019-14226F patent/JP1663818S/ja active Active
- 2019-06-26 US US29/696,210 patent/USD937791S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD937791S1 (en) | 2021-12-07 |