JP1656709S - - Google Patents

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Publication number
JP1656709S
JP1656709S JPD2019-11945F JP2019011945F JP1656709S JP 1656709 S JP1656709 S JP 1656709S JP 2019011945 F JP2019011945 F JP 2019011945F JP 1656709 S JP1656709 S JP 1656709S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2019-11945F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2019-11945F priority Critical patent/JP1656709S/ja
Priority to US29/710,571 priority patent/USD983759S1/en
Application granted granted Critical
Publication of JP1656709S publication Critical patent/JP1656709S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2019-11945F 2019-05-31 2019-05-31 Active JP1656709S (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2019-11945F JP1656709S (enrdf_load_stackoverflow) 2019-05-31 2019-05-31
US29/710,571 USD983759S1 (en) 2019-05-31 2019-10-24 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2019-11945F JP1656709S (enrdf_load_stackoverflow) 2019-05-31 2019-05-31

Publications (1)

Publication Number Publication Date
JP1656709S true JP1656709S (enrdf_load_stackoverflow) 2020-04-06

Family

ID=70057510

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2019-11945F Active JP1656709S (enrdf_load_stackoverflow) 2019-05-31 2019-05-31

Country Status (2)

Country Link
US (1) USD983759S1 (enrdf_load_stackoverflow)
JP (1) JP1656709S (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1713167S (ja) * 2021-11-17 2022-04-21 半導体モジュール
CA225747S (en) * 2023-05-22 2024-11-14 Semikron Danfoss Int Gmbh Semiconductor power module for vehicles
USD1078669S1 (en) * 2023-10-18 2025-06-10 Semikron Danfoss International GmbH Semiconductor power module for vehicles

Family Cites Families (34)

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US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD357671S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
EP0884781A3 (en) * 1997-06-12 1999-06-30 Hitachi, Ltd. Power semiconductor module
JP4151209B2 (ja) * 2000-08-29 2008-09-17 三菱電機株式会社 電力用半導体装置
US6906404B2 (en) * 2003-05-16 2005-06-14 Ballard Power Systems Corporation Power module with voltage overshoot limiting
WO2004105220A2 (en) * 2003-05-16 2004-12-02 Ballard Power Systems Corporation Power module system
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
JP2010147116A (ja) * 2008-12-17 2010-07-01 Mitsubishi Electric Corp 半導体装置
USD689446S1 (en) * 2010-10-28 2013-09-10 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
US9261560B2 (en) * 2013-12-31 2016-02-16 Texas Instruments Incorporated Handling slower scan outputs at optimal frequency
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
JP1536191S (enrdf_load_stackoverflow) 2014-08-19 2015-10-26
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
JP6547354B2 (ja) * 2015-03-20 2019-07-24 富士電機株式会社 半導体モジュールおよび樹脂ケース
JP6362560B2 (ja) * 2015-03-24 2018-07-25 三菱電機株式会社 半導体モジュール、電力変換装置および半導体モジュールの製造方法
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USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
JP1551316S (enrdf_load_stackoverflow) * 2015-09-30 2016-06-13
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USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1644633S (enrdf_load_stackoverflow) * 2019-03-26 2019-11-05

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