JP1643124S - - Google Patents
Info
- Publication number
- JP1643124S JP1643124S JPD2018-16239F JP2018016239F JP1643124S JP 1643124 S JP1643124 S JP 1643124S JP 2018016239 F JP2018016239 F JP 2018016239F JP 1643124 S JP1643124 S JP 1643124S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-16239F JP1643124S (en) | 2018-07-25 | 2018-07-25 | |
| TW107307217D02F TWD208176S (en) | 2018-07-25 | 2018-12-11 | Wafer retainer for manufacturing semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-16239F JP1643124S (en) | 2018-07-25 | 2018-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1643124S true JP1643124S (en) | 2019-10-07 |
Family
ID=68095714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2018-16239F Active JP1643124S (en) | 2018-07-25 | 2018-07-25 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1643124S (en) |
| TW (1) | TWD208176S (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD699200S1 (en) | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| USD709537S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD699199S1 (en) | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
| USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| JP1546800S (en) | 2015-06-12 | 2016-03-28 | ||
| USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD802634S1 (en) | 2015-10-23 | 2017-11-14 | Flow International Corporation | Contour follower for a fluid jet cutting machine |
| USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD815385S1 (en) | 2016-10-13 | 2018-04-10 | Entegris, Inc. | Wafer support ring |
| USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
-
2018
- 2018-07-25 JP JPD2018-16239F patent/JP1643124S/ja active Active
- 2018-12-11 TW TW107307217D02F patent/TWD208176S/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD208176S (en) | 2020-11-11 |