JP1640255S - - Google Patents

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Publication number
JP1640255S
JP1640255S JPD2018-23399F JP2018023399F JP1640255S JP 1640255 S JP1640255 S JP 1640255S JP 2018023399 F JP2018023399 F JP 2018023399F JP 1640255 S JP1640255 S JP 1640255S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-23399F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-23399F priority Critical patent/JP1640255S/ja
Priority to US29/688,724 priority patent/USD891636S1/en
Priority to TW108302365F priority patent/TWD204229S/zh
Application granted granted Critical
Publication of JP1640255S publication Critical patent/JP1640255S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-23399F 2018-10-25 2018-10-25 Active JP1640255S (Direct)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-23399F JP1640255S (Direct) 2018-10-25 2018-10-25
US29/688,724 USD891636S1 (en) 2018-10-25 2019-04-24 Ring for a plasma processing apparatus
TW108302365F TWD204229S (zh) 2018-10-25 2019-04-24 電漿處理裝置用環

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-23399F JP1640255S (Direct) 2018-10-25 2018-10-25

Publications (1)

Publication Number Publication Date
JP1640255S true JP1640255S (Direct) 2019-09-02

Family

ID=67769555

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-23399F Active JP1640255S (Direct) 2018-10-25 2018-10-25

Country Status (3)

Country Link
US (1) USD891636S1 (Direct)
JP (1) JP1640255S (Direct)
TW (1) TWD204229S (Direct)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1659287S (Direct) * 2019-10-18 2020-05-11
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
JP1678330S (Direct) * 2020-05-27 2021-02-01
JP1704964S (ja) * 2021-04-19 2022-01-14 プラズマ処理装置用サセプタリング
JP1700629S (Direct) * 2021-04-26 2021-11-29

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8703249B2 (en) * 2002-04-17 2014-04-22 Lam Research Corporation Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
JP1438745S (Direct) 2011-09-20 2015-04-06
JP1438320S (Direct) 2011-09-20 2015-04-06
JP1438319S (Direct) 2011-09-20 2015-04-06
US9123661B2 (en) * 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US9236284B2 (en) * 2014-01-31 2016-01-12 Applied Materials, Inc. Cooled tape frame lift and low contact shadow ring for plasma heat isolation
JP5615454B1 (ja) * 2014-02-25 2014-10-29 コバレントマテリアル株式会社 フォーカスリング
JP1551512S (Direct) * 2015-06-12 2016-06-13
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
JP1584784S (Direct) * 2017-01-31 2017-08-28
JP1584146S (Direct) * 2017-01-31 2017-08-21
JP1598984S (Direct) * 2017-07-31 2018-03-05
JP1598997S (Direct) * 2017-08-31 2018-03-05

Also Published As

Publication number Publication date
TWD204229S (zh) 2020-04-21
USD891636S1 (en) 2020-07-28

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