JP1632173S - - Google Patents

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Publication number
JP1632173S
JP1632173S JPD2018-12139F JP2018012139F JP1632173S JP 1632173 S JP1632173 S JP 1632173S JP 2018012139 F JP2018012139 F JP 2018012139F JP 1632173 S JP1632173 S JP 1632173S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-12139F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-12139F priority Critical patent/JP1632173S/ja
Priority to US29/669,336 priority patent/USD884662S1/en
Application granted granted Critical
Publication of JP1632173S publication Critical patent/JP1632173S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-12139F 2018-06-01 2018-06-01 Active JP1632173S (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2018-12139F JP1632173S (de) 2018-06-01 2018-06-01
US29/669,336 USD884662S1 (en) 2018-06-01 2018-11-07 Semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-12139F JP1632173S (de) 2018-06-01 2018-06-01

Publications (1)

Publication Number Publication Date
JP1632173S true JP1632173S (de) 2019-05-27

Family

ID=66635047

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-12139F Active JP1632173S (de) 2018-06-01 2018-06-01

Country Status (2)

Country Link
US (1) USD884662S1 (de)
JP (1) JP1632173S (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
JP1641098S (de) 2018-06-26 2019-09-09
JP1650295S (ja) * 2019-01-11 2020-01-20 半導体モジュール
JP1649258S (ja) * 2019-01-11 2022-12-21 半導体モジュール
JP1643025S (de) * 2019-03-15 2019-10-07
JP1659676S (de) * 2019-08-29 2020-05-18
JP1659675S (de) * 2019-08-29 2020-05-18
JP1659678S (de) * 2019-08-29 2020-05-18
JP1669329S (de) * 2020-03-13 2020-10-05
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device

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USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
JP4151209B2 (ja) * 2000-08-29 2008-09-17 三菱電機株式会社 電力用半導体装置
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6906404B2 (en) * 2003-05-16 2005-06-14 Ballard Power Systems Corporation Power module with voltage overshoot limiting
CA104841S (en) * 2003-05-19 2004-11-16 Toshiba Kk Power converter
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USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
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USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD704670S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD710391S1 (en) 2014-01-23 2014-08-05 Henry C. Chu Cap for air compressor
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
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JP6382097B2 (ja) * 2014-12-24 2018-08-29 株式会社 日立パワーデバイス 半導体パワーモジュールおよびそれを用いた電力変換装置
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
JP6362560B2 (ja) * 2015-03-24 2018-07-25 三菱電機株式会社 半導体モジュール、電力変換装置および半導体モジュールの製造方法
JP6300751B2 (ja) * 2015-03-25 2018-03-28 三菱電機株式会社 半導体装置
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
JP1551316S (de) * 2015-09-30 2016-06-13
JP1551317S (de) * 2015-09-30 2016-06-13
JP6682824B2 (ja) * 2015-11-25 2020-04-15 富士電機株式会社 半導体装置
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
JP1578686S (de) * 2016-10-31 2017-06-12
JP1585831S (de) * 2017-01-05 2017-09-11
JP1603980S (de) * 2017-09-07 2018-05-14
JP1603793S (de) * 2017-09-29 2018-05-14

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Publication number Publication date
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