JP1581911S - - Google Patents
Info
- Publication number
- JP1581911S JP1581911S JPD2016-23182F JP2016023182F JP1581911S JP 1581911 S JP1581911 S JP 1581911S JP 2016023182 F JP2016023182 F JP 2016023182F JP 1581911 S JP1581911 S JP 1581911S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-23182F JP1581911S (en) | 2016-10-25 | 2016-10-25 | |
| TW106301911F TWD189312S (en) | 2016-10-25 | 2017-04-13 | Sealing material for semiconductor manufacturing equipment |
| US29/601,165 USD862404S1 (en) | 2016-10-25 | 2017-04-19 | Sealing material ring for a semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-23182F JP1581911S (en) | 2016-10-25 | 2016-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1581911S true JP1581911S (en) | 2017-07-24 |
Family
ID=59351533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2016-23182F Active JP1581911S (en) | 2016-10-25 | 2016-10-25 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD862404S1 (en) |
| JP (1) | JP1581911S (en) |
| TW (1) | TWD189312S (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD881822S1 (en) * | 2017-10-06 | 2020-04-21 | Laird Technologies, Inc. | Material having an edge shape |
| USD879046S1 (en) * | 2017-10-06 | 2020-03-24 | Laird Technologies, Inc. | Material having edging |
| USD999405S1 (en) * | 2017-10-06 | 2023-09-19 | Laird Technologies, Inc. | Material having edging |
| TWD193792S (en) | 2018-02-01 | 2018-11-01 | 億川鐵工所股份有限公司 | Seal ring |
| USD909323S1 (en) | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| USD909322S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
| JP1646505S (en) * | 2018-12-07 | 2019-11-25 | ||
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD949116S1 (en) * | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
| USD971900S1 (en) * | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD971192S1 (en) | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
| USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US135712A (en) * | 1873-02-11 | Improvement in key-rings | ||
| US4225162A (en) * | 1978-09-20 | 1980-09-30 | Amp Incorporated | Liquid tight connector |
| US4447749A (en) * | 1981-07-29 | 1984-05-08 | Black & Decker Inc. | Cordless electric device having contact increasing means |
| US5302980A (en) * | 1989-04-14 | 1994-04-12 | Barrett Graham D | Lens useful as a keratoscope |
| US6879023B1 (en) * | 2000-03-22 | 2005-04-12 | Broadcom Corporation | Seal ring for integrated circuits |
| TWM270879U (en) | 2005-01-28 | 2005-07-21 | Ching-Wen Hung | Push/pull constant force enhancing vise with two needle rollers |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US8242586B2 (en) * | 2008-09-09 | 2012-08-14 | Mediatek Inc. | Integrated circuit chip with seal ring structure |
| JP1546800S (en) * | 2015-06-12 | 2016-03-28 | ||
| JP1545407S (en) * | 2015-06-16 | 2016-03-14 | ||
| JP1545406S (en) * | 2015-06-16 | 2016-03-14 | ||
| USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| JP1584241S (en) * | 2017-01-31 | 2017-08-21 | ||
| JP1584906S (en) * | 2017-01-31 | 2017-08-28 |
-
2016
- 2016-10-25 JP JPD2016-23182F patent/JP1581911S/ja active Active
-
2017
- 2017-04-13 TW TW106301911F patent/TWD189312S/en unknown
- 2017-04-19 US US29/601,165 patent/USD862404S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD862404S1 (en) | 2019-10-08 |
| TWD189312S (en) | 2018-03-21 |