JP1441120S - - Google Patents
Info
- Publication number
- JP1441120S JP1441120S JPD2010-19920F JP2010019920F JP1441120S JP 1441120 S JP1441120 S JP 1441120S JP 2010019920 F JP2010019920 F JP 2010019920F JP 1441120 S JP1441120 S JP 1441120S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2010-19920F JP1441120S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2010-08-17 | 2010-08-17 | |
| CA138032F CA138032S (en) | 2010-08-17 | 2010-11-19 | Semiconductor substrate |
| US29/379,485 USD651992S1 (en) | 2010-08-17 | 2010-11-19 | Semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2010-19920F JP1441120S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2010-08-17 | 2010-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1441120S true JP1441120S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-05-11 |
Family
ID=45419484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2010-19920F Active JP1441120S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2010-08-17 | 2010-08-17 |
Country Status (3)
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1448315S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2011-10-04 | 2015-08-03 | ||
| USD700441S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD700440S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
| USD760180S1 (en) * | 2014-02-21 | 2016-06-28 | Hzo, Inc. | Hexcell channel arrangement for use in a boat for a deposition apparatus |
| US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
| USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
| USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
| USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
| USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
| JP1497022S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2013-07-11 | 2017-05-01 | ||
| JP1497021S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2013-07-11 | 2017-05-01 | ||
| USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
| USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
| JP1534136S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2014-11-13 | 2015-09-28 | ||
| JP1534138S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2014-11-13 | 2015-09-28 | ||
| JP1534137S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2014-11-13 | 2015-09-28 | ||
| JP1563718S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2015-12-28 | 2016-11-21 | ||
| JP1563719S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2015-12-28 | 2016-11-21 | ||
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| USD808664S1 (en) | 2016-05-16 | 2018-01-30 | Ninja Brand Incorporated | Sheet with camouflage pattern |
| JP1624353S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2018-07-19 | 2019-02-12 | ||
| USD947144S1 (en) * | 2019-05-10 | 2022-03-29 | Tdk Corporation | Vibration element for a haptic actuator |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD262962S (en) * | 1978-11-03 | 1982-02-09 | Strumpell Winton C | Silicon wafer emitter electrode configuration |
| JPS6088535U (ja) * | 1983-11-24 | 1985-06-18 | 住友電気工業株式会社 | 半導体ウエハ |
| US5182233A (en) * | 1989-08-02 | 1993-01-26 | Kabushiki Kaisha Toshiba | Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
| WO2003010825A1 (fr) * | 2001-07-24 | 2003-02-06 | Seiko Epson Corporation | Procede de transfert, procede de fabrication d'un element en couche mince, procede de fabrication d'un circuit integre, substrat de circuit et son procede de fabrication, dispositif electro-optique et son procede de fabrication et carte a circuit integre et materiel electronique |
| JP2004207606A (ja) * | 2002-12-26 | 2004-07-22 | Disco Abrasive Syst Ltd | ウェーハサポートプレート |
| KR101270180B1 (ko) * | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 검사장치 및 검사방법과, 반도체장치 제작방법 |
| JP2005260154A (ja) | 2004-03-15 | 2005-09-22 | Tokyo Seimitsu Co Ltd | チップ製造方法 |
| US7622367B1 (en) * | 2004-06-04 | 2009-11-24 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
| CN101599456B (zh) * | 2004-06-24 | 2011-03-09 | 株式会社半导体能源研究所 | 制造薄膜集成电路的方法 |
| US7452786B2 (en) * | 2004-06-29 | 2008-11-18 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing thin film integrated circuit, and element substrate |
| US8084400B2 (en) * | 2005-10-11 | 2011-12-27 | Intermolecular, Inc. | Methods for discretized processing and process sequence integration of regions of a substrate |
| JP4470690B2 (ja) * | 2004-10-29 | 2010-06-02 | 住友電気工業株式会社 | 炭化珪素単結晶、炭化珪素基板および炭化珪素単結晶の製造方法 |
| US7205639B2 (en) * | 2005-03-09 | 2007-04-17 | Infineon Technologies Ag | Semiconductor devices with rotated substrates and methods of manufacture thereof |
| SG126885A1 (en) * | 2005-04-27 | 2006-11-29 | Disco Corp | Semiconductor wafer and processing method for same |
| USD589473S1 (en) * | 2007-05-30 | 2009-03-31 | Nitto Denko Corporation | Adhesive film material for use in manufacturing semiconductors |
| JP2009016602A (ja) * | 2007-07-05 | 2009-01-22 | Denso Corp | 炭化珪素半導体装置の製造方法 |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| JP5304255B2 (ja) * | 2009-01-13 | 2013-10-02 | 住友電気工業株式会社 | 炭化ケイ素基板、エピタキシャルウエハおよび炭化ケイ素基板の製造方法 |
| JP2011100922A (ja) * | 2009-11-09 | 2011-05-19 | Toshiba Corp | パターン形成方法、パターン形成システム及び半導体装置の製造方法 |
| USD638382S1 (en) * | 2010-04-09 | 2011-05-24 | Panasonic Electric Works Co., Ltd. | Electroluminescence module |
-
2010
- 2010-08-17 JP JPD2010-19920F patent/JP1441120S/ja active Active
- 2010-11-19 CA CA138032F patent/CA138032S/en not_active Expired - Lifetime
- 2010-11-19 US US29/379,485 patent/USD651992S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CA138032S (en) | 2011-11-17 |
| USD651992S1 (en) | 2012-01-10 |