ITTO20030820A1 - PROCEDURE FOR THE MANUFACTURE OF STRUCTURES OF DRIVING ELEMENTS ON A BOARD FOR PRINTED CIRCUIT. - Google Patents

PROCEDURE FOR THE MANUFACTURE OF STRUCTURES OF DRIVING ELEMENTS ON A BOARD FOR PRINTED CIRCUIT.

Info

Publication number
ITTO20030820A1
ITTO20030820A1 IT000820A ITTO20030820A ITTO20030820A1 IT TO20030820 A1 ITTO20030820 A1 IT TO20030820A1 IT 000820 A IT000820 A IT 000820A IT TO20030820 A ITTO20030820 A IT TO20030820A IT TO20030820 A1 ITTO20030820 A1 IT TO20030820A1
Authority
IT
Italy
Prior art keywords
procedure
manufacture
structures
board
printed circuit
Prior art date
Application number
IT000820A
Other languages
Italian (it)
Inventor
Leo Biener
Martin Novotny
Holger Straub
Original Assignee
Vogt Electronic Fuba Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vogt Electronic Fuba Gmbh filed Critical Vogt Electronic Fuba Gmbh
Publication of ITTO20030820A1 publication Critical patent/ITTO20030820A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT000820A 2002-10-31 2003-10-17 PROCEDURE FOR THE MANUFACTURE OF STRUCTURES OF DRIVING ELEMENTS ON A BOARD FOR PRINTED CIRCUIT. ITTO20030820A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10250725A DE10250725A1 (en) 2002-10-31 2002-10-31 Process for the production of circuit pattern structures on a circuit board

Publications (1)

Publication Number Publication Date
ITTO20030820A1 true ITTO20030820A1 (en) 2004-04-30

Family

ID=29225231

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000820A ITTO20030820A1 (en) 2002-10-31 2003-10-17 PROCEDURE FOR THE MANUFACTURE OF STRUCTURES OF DRIVING ELEMENTS ON A BOARD FOR PRINTED CIRCUIT.

Country Status (4)

Country Link
DE (1) DE10250725A1 (en)
FI (1) FI20031539A (en)
FR (1) FR2846847A1 (en)
IT (1) ITTO20030820A1 (en)

Also Published As

Publication number Publication date
FI20031539A0 (en) 2003-10-21
DE10250725A1 (en) 2004-05-13
FI20031539A (en) 2004-05-01
FR2846847A1 (en) 2004-05-07

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