ITMI932630A0 - Sistema di asemblaggio modulare - Google Patents

Sistema di asemblaggio modulare

Info

Publication number
ITMI932630A0
ITMI932630A0 ITMI932630A ITMI932630A ITMI932630A0 IT MI932630 A0 ITMI932630 A0 IT MI932630A0 IT MI932630 A ITMI932630 A IT MI932630A IT MI932630 A ITMI932630 A IT MI932630A IT MI932630 A0 ITMI932630 A0 IT MI932630A0
Authority
IT
Italy
Prior art keywords
assembly system
modular assembly
modular
assembly
Prior art date
Application number
ITMI932630A
Other languages
English (en)
Inventor
Torbjorn Nils Anders Andersson
Urban Nils Hugo Fagerstedt
Bjorn Gudmund Gudmundsson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of ITMI932630A0 publication Critical patent/ITMI932630A0/it
Publication of ITMI932630A1 publication Critical patent/ITMI932630A1/it
Application granted granted Critical
Publication of IT1265279B1 publication Critical patent/IT1265279B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Enzymes And Modification Thereof (AREA)
  • Packages (AREA)
  • Manipulator (AREA)
  • Massaging Devices (AREA)
  • Surgical Instruments (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Feeding Of Articles To Conveyors (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
IT93MI002630A 1992-12-15 1993-12-15 Sistema di assemblaggio modulare IT1265279B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/990,515 US5398159A (en) 1992-12-15 1992-12-15 Modular packaging system

Publications (3)

Publication Number Publication Date
ITMI932630A0 true ITMI932630A0 (it) 1993-12-15
ITMI932630A1 ITMI932630A1 (it) 1995-06-15
IT1265279B1 IT1265279B1 (it) 1996-10-31

Family

ID=25536237

Family Applications (1)

Application Number Title Priority Date Filing Date
IT93MI002630A IT1265279B1 (it) 1992-12-15 1993-12-15 Sistema di assemblaggio modulare

Country Status (17)

Country Link
US (1) US5398159A (it)
JP (1) JPH07506222A (it)
KR (1) KR100352110B1 (it)
CN (1) CN1042387C (it)
AU (1) AU669043B2 (it)
BR (1) BR9305896A (it)
CA (1) CA2130194A1 (it)
GB (1) GB2278961B (it)
HK (1) HK1006630A1 (it)
IT (1) IT1265279B1 (it)
MX (1) MX9307922A (it)
MY (1) MY109964A (it)
NZ (1) NZ259077A (it)
SE (1) SE518372C2 (it)
SG (1) SG49350A1 (it)
TW (1) TW370333U (it)
WO (1) WO1994014308A1 (it)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5513071A (en) * 1994-11-28 1996-04-30 Philips Electronics North America Corporation Electronics housing with improved heat rejection
JP3464553B2 (ja) * 1995-03-06 2003-11-10 富士通株式会社 サブラック装置
GB2298995A (en) * 1995-03-07 1996-09-18 Motorola Ltd Base station
FR2735946B1 (fr) * 1995-06-26 1997-07-25 Aeg Schneider Automation Bac pour modules electroniques
US5772500A (en) * 1996-12-20 1998-06-30 Symbios, Inc. Compact ventilation unit for electronic apparatus
US6042474A (en) * 1997-06-04 2000-03-28 Lsi Logic Corporation Compact ventilation unit with exhaust ports for electronic apparatus
DE29714762U1 (de) * 1997-08-18 1997-12-18 Siemens Ag Gehäuse zur Aufnahme von elektrischen Baugruppen
US5947570A (en) * 1997-10-10 1999-09-07 International Business Machines Corporation Modular cabinet assembly for a computer
US6115242A (en) * 1997-10-24 2000-09-05 Advanced Micro Devices, Inc. Chip chassis including a micro-backplane for receiving and connecting a plurality of computer chips
US6067233A (en) * 1998-02-27 2000-05-23 3Com Corporation Mounting brace and cable management apparatus and method
JPH11261265A (ja) * 1998-03-12 1999-09-24 Nec Corp 密閉型装置の放熱構造
US6127663A (en) * 1998-10-09 2000-10-03 Ericsson Inc. Electronics cabinet cooling system
US6198628B1 (en) 1998-11-24 2001-03-06 Unisys Corporation Parallel cooling of high power devices in a serially cooled evironment
US6496366B1 (en) 1999-10-26 2002-12-17 Rackable Systems, Llc High density computer equipment storage system
US6850408B1 (en) 1999-10-26 2005-02-01 Rackable Systems, Inc. High density computer equipment storage systems
EP1073285A1 (en) * 1999-10-28 2001-01-31 N.V. Belgacom Mobile S.A. Unit housing cell equipment for cellular telephones
DE10004107C2 (de) * 2000-01-31 2002-04-11 Siemens Ag Architektur einer Basisstation eines Funkkommunikationssystems
US6667891B2 (en) 2000-02-18 2003-12-23 Rackable Systems, Inc. Computer chassis for dual offset opposing main boards
US6504714B1 (en) * 2000-08-16 2003-01-07 Square D Company Multi-level thermal management system and method
IT1319610B1 (it) 2000-12-22 2003-10-20 Siemens Inf & Comm Networks Procedimento e apparecchiatura per il condizionamento termico diarmadi contenenti apparecchiature elettroniche
US6563704B2 (en) * 2001-06-15 2003-05-13 Sun Microsystems, Inc. Storage device arrangement for increased cooling
US6749070B2 (en) * 2001-07-27 2004-06-15 International Business Machines Corporation Modular stacking equipment rack
US20030033463A1 (en) * 2001-08-10 2003-02-13 Garnett Paul J. Computer system storage
ITMI20011939A1 (it) 2001-09-17 2003-03-17 Siemens Inf & Comm Networks Procedimento e apparecchiatura di condizionamento termico di armadi per apparecchiature elettroniche con controllo dell'umidita' relativa
US6975509B2 (en) * 2002-05-16 2005-12-13 Sun Microsystems, Inc. Computing apparatus with cooling fan
US6650539B1 (en) * 2002-06-19 2003-11-18 Handsome Electronics Ltd. Modular backup power housing
US6765795B2 (en) * 2002-07-23 2004-07-20 Silicon Graphics, Inc. Modular fan brick and method for exchanging air in a brick-based computer system
EP1416783A1 (de) * 2002-10-30 2004-05-06 Siemens Aktiengesellschaft Anordnung zur Klimatisierung einer Basisstation
FI114759B (fi) * 2003-04-11 2004-12-15 Vacon Oyj Taajuusmuuttajien sijoitusjärjestely
JP2005019562A (ja) * 2003-06-24 2005-01-20 Hitachi Ltd 電子機器の冷却構造
US6987673B1 (en) * 2003-09-09 2006-01-17 Emc Corporation Techniques for cooling a set of circuit boards within a rack mount cabinet
US6963484B2 (en) * 2003-12-17 2005-11-08 Hewlett-Packard Development Company, L.P. Airflow blocker component that comprises a flexible flap portion
US7508663B2 (en) * 2003-12-29 2009-03-24 Rackable Systems, Inc. Computer rack cooling system with variable airflow impedance
US6927976B1 (en) * 2004-01-15 2005-08-09 Hewlett-Packard Development Company, L.P. Air baffle for managing cooling air re-circulation in an electronic system
US7123477B2 (en) * 2004-03-31 2006-10-17 Rackable Systems, Inc. Computer rack cooling system
US7236359B2 (en) * 2004-04-01 2007-06-26 Strobel Larry A Environmental control system for personal computers
US20050264995A1 (en) * 2004-05-28 2005-12-01 Lsi Logic Corporation Downdraft cooling system for in-line devices
CA2589720C (en) * 2004-11-29 2013-09-24 Sanmina-Sci Corporation Systems and methods for base station enclosures
CA2589717A1 (en) * 2004-11-29 2006-06-01 Sanmina-Sci Corporation System and method for base station heat dissipation using chimneys
EP1694084A1 (en) * 2005-02-18 2006-08-23 T-Mobile Netherlands B.V. Electrical equipment enclosure, method of installing equipment in such an enclosure, and extension device
JP4778246B2 (ja) * 2005-03-16 2011-09-21 日本電気株式会社 無線基地局装置
JP4361033B2 (ja) * 2005-04-27 2009-11-11 株式会社日立製作所 ディスクアレイ装置
CN1917752A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 具有散热装置的网络设备及其散热方法
US7365974B2 (en) * 2005-10-14 2008-04-29 Smiths Aerospace Llc Method for electronics equipment cooling having improved EMI control and reduced weight
US20080013276A1 (en) * 2006-06-29 2008-01-17 Michael Pyle Systems and methods for improved cooling of electrical components
US7520805B2 (en) * 2006-07-24 2009-04-21 D-Link Corporation Housing with hidden ventilation holes
FI122888B (fi) * 2007-10-08 2012-08-31 Vacon Oyj Tehoelektroniikkalaitteiston kotelointijärjestely
US7898117B2 (en) * 2008-05-22 2011-03-01 International Business Machines Corporation Modular racks and methods of use
US10058011B2 (en) * 2008-06-19 2018-08-21 Panduit Corp. Passive cooling systems for network cabinet
US8335081B2 (en) 2010-07-16 2012-12-18 Rockwell Automation Technologies, Inc. Heat sink cooling arrangement for multiple power electronic circuits
US8325478B2 (en) * 2010-07-16 2012-12-04 Rockwell Automation Technologies, Inc. Cooling duct attachment and sealing for a motor drive
US8325479B2 (en) * 2010-07-16 2012-12-04 Rockwell Automation Technologies, Inc. Motor drive cooling duct system and method
FR2963327B1 (fr) 2010-07-27 2012-08-24 Air Liquide Dispositif de stockage d'articles sous atmosphere controlee
US8405985B1 (en) 2010-09-08 2013-03-26 Juniper Networks, Inc. Chassis system with front cooling intake
US10492331B1 (en) * 2010-09-29 2019-11-26 Amazon Technologies, Inc. System and method for cooling power distribution units
US8767400B2 (en) * 2011-06-27 2014-07-01 The Bergquist Torrington Company Cooling module with parallel blowers
FR2980777B1 (fr) * 2011-09-30 2016-02-12 Airbus Operations Sas Systeme de ventilation et circuits de soufflage et d'extraction d'air d'un tel systeme, ainsi que baie avionique d'aeronef
US20130100610A1 (en) * 2011-10-19 2013-04-25 Danfoss A/S Air duct arrangement for cooling a group of at least two heat producing modules
US8687363B2 (en) * 2012-05-01 2014-04-01 General Electric Company Enclosure with duct mounted electronic components
US9426932B2 (en) 2013-03-13 2016-08-23 Silicon Graphics International Corp. Server with heat pipe cooling
US9612920B2 (en) 2013-03-15 2017-04-04 Silicon Graphics International Corp. Hierarchical system manager rollback
US10215431B2 (en) 2013-03-18 2019-02-26 Carrier Corporation Compact air handler with multiple fans
TWI489741B (zh) * 2013-12-20 2015-06-21 Ind Tech Res Inst 具有散熱功能之馬達驅控器及其散熱方法
CN104812184B (zh) * 2014-01-23 2018-05-04 华为技术有限公司 一种导风系统
US10306979B2 (en) 2016-05-05 2019-06-04 David Oliver Boone System and method for flat packed furniture to enable reuse of packaging materials

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562593A (en) * 1968-12-31 1971-02-09 Westinghouse Electric Corp Metal-enclosed switchgear with vertically disposed conductors
DE2211268C3 (de) * 1972-03-09 1978-10-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Lüftungsanordnung für Einschübe
GB1494679A (en) * 1974-03-28 1977-12-07 Siemens Ag Housings for telecommunications equipment or the like
US4149218A (en) * 1977-12-30 1979-04-10 International Business Machines Corporation Minimum delay module assembly
JPS5814684B2 (ja) * 1979-06-08 1983-03-22 富士通株式会社 電子機器筐体の連結構造
CA1164578A (en) * 1980-10-24 1984-03-27 Yoshihiro Takahashi Shelf unit for electronic communication devices
DE3107683A1 (de) * 1981-02-28 1982-09-16 Brown, Boveri & Cie Ag, 6800 Mannheim Schrank zur aufnahme von elektrischen und/oder elektronischen bauelementen
EP0236501B1 (en) * 1984-11-15 1992-02-26 Fujitsu Limited Cooling structure of a rack for electronic devices
ATE64808T1 (de) * 1985-12-13 1991-07-15 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
US4694484A (en) * 1986-02-18 1987-09-15 Motorola, Inc. Cellular radiotelephone land station
US4758924A (en) * 1986-05-29 1988-07-19 Honeywell Bull Inc. Electronic equipment housing
GB8910398D0 (en) * 1989-05-05 1989-06-21 Ashley & Rock Ltd Improvements in or relating to consumer units
JPH0494595A (ja) * 1990-08-10 1992-03-26 Fujitsu Ltd 電子機器の冷却構造
SE9100419L (sv) * 1991-02-13 1992-03-30 L T S I Soederkoeping Ab Anordning vid ett kylsystem foer kylning av teleteknisk utrustning

Also Published As

Publication number Publication date
SE9402633D0 (sv) 1994-08-04
SE518372C2 (sv) 2002-10-01
NZ259077A (en) 1996-11-26
SE9402633L (sv) 1994-10-03
AU669043B2 (en) 1996-05-23
GB9415177D0 (en) 1994-09-28
AU5723194A (en) 1994-07-04
GB2278961B (en) 1996-05-15
HK1006630A1 (en) 1999-03-05
SG49350A1 (en) 1998-05-18
US5398159A (en) 1995-03-14
IT1265279B1 (it) 1996-10-31
CA2130194A1 (en) 1994-06-16
WO1994014308A1 (en) 1994-06-23
KR100352110B1 (ko) 2003-01-24
CN1090460A (zh) 1994-08-03
BR9305896A (pt) 1997-08-19
MY109964A (en) 1997-10-31
GB2278961A (en) 1994-12-14
MX9307922A (es) 1994-06-30
CN1042387C (zh) 1999-03-03
ITMI932630A1 (it) 1995-06-15
TW370333U (en) 1999-09-11
KR950700678A (ko) 1995-01-16
JPH07506222A (ja) 1995-07-06

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971128